Combined vacuum chuck for semiconductor processing

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a combined vacuum chuck for semiconductor processing, which comprises an air inlet shell and a positioning hole, an air inlet pipe is inserted into the front surface of the air inlet shell, the surface of the air inlet pipe is connected with a limiting clamping plate in a sliding manner, and a fixed screw rod is in threaded connection with the interior of the limiting clamping plate. According to the utility model, when the connecting screw rod is taken down from the interiors of the connecting clamping plate and the positioning clamping plate by rotating the connecting screw rod, the vacuum chuck and the connecting clamping plate can be taken down from the top of the bearing ring and the top of the mounting pipe; a bearing ring and a positioning clamping plate can be taken out from the surface of a mounting pipe and the interior of a mounting bottom ring in a sliding manner, so that a worker can conveniently dismount and mount parts of the vacuum suction cup, and operation convenience is brought to use of the worker; damaged parts inside the equipment can be repaired, maintained and replaced after being used for a long time.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing especially relates to a combined vacuum chuck for semiconductor processing. BACKGROUND

[0002] The combined vacuum chuck is a key component for fixing a wafer in semiconductor processing, and it realizes non-damage fixing of the wafer through vacuum principle. In the field of semiconductor manufacturing, the technical principle of the vacuum chuck is to create a vacuum area lower than atmospheric pressure by using a vacuum pump to remove air between the vacuum chuck and the wafer, so as to use atmospheric pressure to firmly adsorb the wafer on the surface of the vacuum chuck.

[0003] The combined vacuum chuck for semiconductor processing disclosed in the above-mentioned patent document only needs to install and debug the flat vacuum chuck base at the first time of use, and the graphite chuck is used to support quartz ring products. After the graphite chuck is connected with the vacuum chuck base through the embedding mode of the connecting block into the base groove, the graphite chuck is firmly adsorbed on the vacuum chuck base by the external vacuum device. If it is necessary to replace the graphite chuck, only the base air valve needs to be closed, and the graphite chuck needs to be taken out for replacement. Since the vacuum chuck base does not increase the sealing ring that can strengthen the air tightness and increase the adsorption force during design, the surface is pure and flat, and there is no need to re-flatten and debug, so as to ensure the flatness and parallelism of the tooling, ensure that the product is fixed firmly on the tooling without shaking, and perform normal machining operation.

[0004] The combined vacuum chuck for semiconductor processing only needs to close the base air valve and take out the graphite chuck for replacement. Since the vacuum chuck base does not increase the sealing ring that can strengthen the air tightness and increase the adsorption force during design, the surface is pure and flat, and there is no need to re-flatten and debug, so as to ensure the flatness and parallelism of the tooling, ensure that the product is fixed firmly on the tooling without shaking, and perform normal machining operation. However, the overall equipment is prone to reduce the service life of the vulnerable parts and affect the service life of the overall equipment after long-term use, which is not convenient for the segmented installation and disassembly of the overall equipment by the workers. UTILITY MODEL CONTENTS

[0005] To solve the above technical problems, the utility model provides a combined vacuum chuck for semiconductor processing.

[0006] The utility model discloses the following technical scheme is realized: a combined vacuum chuck for semiconductor processing, including air inlet shell and positioning hole, the positive surface of air inlet shell is inserted with air inlet pipe, the surface sliding connection of air inlet pipe has limit stop board, the inside screw thread connection of limit stop board has fixed screw rod, the inside sliding connection of limit stop board has exhaust pipe,

[0007] The top of air inlet shell is fixedly connected with mounting bottom ring, the inside screw thread connection of mounting bottom ring has locking screw rod, the inside insertion of mounting bottom ring has installation pipe, the inside insertion of mounting bottom ring has positioning stop board, the top fixed connection of positioning stop board has bearing ring, the top insertion of bearing ring has vacuum chuck, the bottom fixed connection of vacuum chuck has connecting stop board, the inside screw thread connection of connecting stop board has connecting screw rod.

[0008] Through the above technical scheme, the number of installation pipes is set to four, which facilitates the cooperation of the plurality of locking components on the surface to transport the airflow of the installed vacuum chuck.

[0009] As a further improvement of the above scheme, the number of connecting stop boards is set to four, and the four connecting stop boards are distributed in a circumferential symmetry around the vacuum chuck.

[0010] As a further improvement of the above scheme, the connecting screw rod extends through the connecting stop board to the inside of the positioning stop board, and the number of connecting screw rods is set to four, and the four connecting screw rods are distributed in a circumferential symmetry around the vacuum chuck.

[0011] Through the above technical scheme, the number of vacuum chucks is set to four, which has the characteristics of fast and accurate grabbing of various parts, improving production efficiency, and being easy to operate, safe and reliable.

[0012] As a further improvement of the above scheme, the bottom surface of the installation pipe contacts the air inlet shell, and the locking screw rod extends through the mounting bottom ring and the positioning stop board to the inside of the installation pipe and the positioning hole.

[0013] As a further improvement of the above scheme, the number of positioning holes is set to four, and the four positioning holes are distributed in a circumferential symmetry around the installation pipe.

[0014] As a further improvement of the above scheme, the number of locking screw rods is set to four, and the four locking screw rods are distributed in a circumferential symmetry around the mounting bottom ring.

[0015] As a further improvement of the above scheme, the bottom surface of the vacuum chuck is in contact with a bearing ring, the bottom of the positioning clamping plate is in contact with the surface of the air inlet shell, and the fixing screw extends through the limiting clamping plate to the inside of the air inlet shell.

[0016] Compared with the prior art, the utility model has the beneficial effects that:

[0017] When the connecting screw is rotated to be removed from the inside of the connecting clamping plate and the positioning clamping plate, the vacuum chuck and the connecting clamping plate can be removed from the top of the bearing ring and the mounting pipe, and when the locking screw is rotated to be removed from the inside of the mounting bottom ring and the positioning clamping plate, the bearing ring and the positioning clamping plate can be slid out from the surface of the mounting pipe and the inside of the mounting bottom ring, which facilitates the disassembly and installation of the vacuum chuck by the staff, brings operation convenience to the staff, and improves the maintenance and replacement of the damaged internal fragile parts after long-term use.

[0018] When the fixing screw is removed from the inside of the limiting clamping plate, the staff can conveniently remove the air inlet pipe and the exhaust pipe from the front of the air inlet shell, and the limiting clamping plate on the surface of the air inlet pipe and the exhaust pipe can provide good support stability for the installed air inlet pipe and exhaust pipe. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 It is a schematic diagram of the front dissection structure of the utility model;

[0021] Figure 3 It is a schematic diagram of the vacuum chuck structure of the utility model;

[0022] Figure 4 It is a schematic diagram of the explosion structure of the utility model;

[0023] Figure 5 It is a schematic diagram of the right view structure of the utility model.

[0024] MAIN SYMBOL EXPLANATION:

[0025] 1, air inlet shell; 2, air inlet pipe; 3, limiting clamping plate; 4, fixing screw; 5, exhaust pipe; 6, mounting bottom ring; 7, locking screw; 8, mounting pipe; 9, positioning clamping plate; 10, vacuum chuck; 11, connecting clamping plate; 12, connecting screw; 13, positioning hole; 14, bearing ring. DETAILED DESCRIPTION

[0026] The utility model is further described below in combination with the drawings and specific embodiments, and it should be noted that the embodiments described below or the technical features can be combined to form new embodiments without conflict.

[0027] Embodiment:

[0028] Please combine Figures 1-5 The utility model discloses a combined vacuum chuck for semiconductor processing, including air inlet shell 1 and positioning hole 13, the positive surface of air inlet shell 1 is inserted with air inlet pipe 2, the surface of air inlet pipe 2 is slidably connected with limiting batten 3, the inside of limiting batten 3 is threadedly connected with fixed screw 4, the inside of limiting batten 3 is slidably connected with exhaust pipe 5;

[0029] The top of air inlet shell 1 is fixedly connected with installation bottom ring 6, the inside of installation bottom ring 6 is threadedly connected with locking screw 7, the inside of installation bottom ring 6 is inserted with installation pipe 8, the inside of installation bottom ring 6 is inserted with positioning batten 9, the top of positioning batten 9 is fixedly connected with bearing ring 14, the top of bearing ring 14 is inserted with vacuum chuck 10, the bottom of vacuum chuck 10 is fixedly connected with connecting batten 11, the inside of connecting batten 11 is threadedly connected with connecting screw 12, when being taken off from the inside of connecting batten 11 and positioning batten 9 by rotating connecting screw 12, vacuum chuck 10 and connecting batten 11 can be taken off from the top of bearing ring 14 and installation pipe 8, when being taken out from the inside of installation bottom ring 6 and positioning batten 9 by rotating locking screw 7, bearing ring 14 and positioning batten 9 can be slidably taken out from the surface of installation pipe 8 and the inside of installation bottom ring 6, which facilitates the disassembly and installation of the parts of vacuum chuck 10, brings operation convenience for the use of staff, and improves the maintenance, repair and replacement of the damaged internal fragile parts after long time use.

[0030] The number of installation pipe 8 is four, which facilitates the cooperation of the surface of multiple locking parts to convey the air flow of the installed vacuum chuck 10.

[0031] The number of connecting batten 11 is four, and the four connecting battens 11 are distributed in a circumferential symmetry around the vacuum chuck 10, and the bottom surface of the vacuum chuck 10 contacts the installation pipe 8.

[0032] The connecting screw 12 extends to the inside of the positioning batten 9 through the connecting batten 11, and the number of the connecting screw 12 is four, and the four connecting screws 12 are distributed in a circumferential symmetry around the vacuum chuck 10.

[0033] The number of vacuum chuck 10 is four, which can quickly and accurately grasp various parts, improve production efficiency, and has the characteristics of simple operation, safety and reliability.

[0034] The bottom surface of the mounting pipe 8 is in contact with the air inlet shell 1, and the locking screw 7 extends to the inside of the mounting pipe 8 and the positioning hole 13 through the mounting bottom ring 6 and the positioning clamping plate 9.

[0035] The number of the positioning holes 13 is four, the four positioning holes 13 are distributed in a circumferential symmetry around the mounting pipe 8, the surface of the mounting pipe 8 is in contact with the positioning clamping plate 9, the vacuum chuck 10 is worked in cooperation with the air inlet shell 1 after the air inlet pipe 2 is connected with the air inlet equipment, the air inlet pipe 2 and the exhaust pipe 5 are conveniently taken out from the front of the air inlet shell 1 by the worker when the fixing screw 4 is taken out from the inside of the limiting clamping plate 3, and the air inlet pipe 2 and the exhaust pipe 5 after being mounted can be well supported and stabilized by the limiting clamping plate 3 arranged on the surface of the air inlet pipe 2 and the exhaust pipe 5.

[0036] The number of the locking screw 7 is four, the four locking screws 7 are distributed in a circumferential symmetry around the mounting bottom ring 6, and the inner wall surface of the bearing ring 14 is in contact with the mounting pipe 8.

[0037] The bottom surface of the vacuum chuck 10 is in contact with the bearing ring 14, the bottom of the positioning clamping plate 9 is in contact with the surface of the air inlet shell 1, and the fixing screw 4 extends to the inside of the air inlet shell 1 through the limiting clamping plate 3.

[0038] The implementation principle of the combined vacuum chuck for semiconductor processing in the embodiment is as follows: the vacuum chuck 10 and the connecting clamping plate 11 can be taken out from the top of the bearing ring 14 and the mounting pipe 8 when the connecting screw 12 is rotated to be taken out from the inside of the connecting clamping plate 11 and the positioning clamping plate 9, the bearing ring 14 and the positioning clamping plate 9 can be slid out from the surface of the mounting pipe 8 and the inside of the mounting bottom ring 6 when the locking screw 7 is rotated to be taken out from the inside of the mounting bottom ring 6 and the positioning clamping plate 9, the worker is facilitated to disassemble and mount the parts of the vacuum chuck 10, the operation convenience is brought to the worker, the damage of the internal vulnerable parts of the equipment after being used for a long time is repaired, maintained and replaced, the vacuum chuck 10 is worked in cooperation with the air inlet shell 1 after the air inlet pipe 2 is connected with the air inlet equipment, the air inlet pipe 2 and the exhaust pipe 5 are conveniently taken out from the front of the air inlet shell 1 by the worker when the fixing screw 4 is taken out from the inside of the limiting clamping plate 3, and the air inlet pipe 2 and the exhaust pipe 5 after being mounted can be well supported and stabilized by the limiting clamping plate 3 arranged on the surface of the air inlet pipe 2 and the exhaust pipe 5.

[0039] The above-mentioned embodiment is only a preferred embodiment of the present application, and cannot be used to limit the range of protection of the present application, and any non-substantial change and replacement made by the person skilled in the art on the basis of the present application belongs to the range of protection required by the present application.

Claims

1. A combined vacuum chuck for semiconductor processing, characterized by The utility model provides an air inlet shell (1) and positioning hole (13) are included, the front surface of air inlet shell (1) inserts air pipe (2), the surface of air pipe (2) is connected with the limiting card board (3) of sliding, the inside threaded connection of limiting card board (3) has fixed screw rod (4), the inside sliding connection of limiting card board (3) has exhaust pipe (5); The top fixed connection of air inlet shell (1) has installation bottom ring (6), the inside threaded connection of installation bottom ring (6) has locking screw rod (7), the inside insertion of installation bottom ring (6) has installation pipe (8), the inside insertion of installation bottom ring (6) has positioning card board (9), the top fixed connection of positioning card board (9) has bearing ring (14), the top insertion of bearing ring (14) has vacuum chuck (10), the bottom fixed connection of vacuum chuck (10) has connecting card board (11), the inside threaded connection of connecting card board (11) has connecting screw rod (12).

2. The modular vacuum chuck for semiconductor processing as claimed in claim 1, wherein: The number of connecting card board (11) is set to four, four connecting card board (11) is distributed in circumferential symmetry with vacuum chuck (10) as center, the bottom surface of vacuum chuck (10) contacts installation pipe (8).

3. The modular vacuum chuck for semiconductor processing as recited in claim 1, wherein: The connecting screw rod (12) extends to the inside of positioning card board (9) through connecting card board (11), the number of connecting screw rod (12) is set to four, four connecting screw rod (12) is distributed in circumferential symmetry with vacuum chuck (10) as center.

4. A modular vacuum chuck for semiconductor processing as defined in claim 3, wherein: The bottom surface of installation pipe (8) contacts air inlet shell (1), locking screw rod (7) extends to the inside of installation pipe (8) and positioning hole (13) through installation bottom ring (6) and positioning card board (9).

5. The modular vacuum chuck for semiconductor processing as claimed in claim 1, wherein: The number of positioning hole (13) is set to four, four positioning hole (13) is distributed in circumferential symmetry with installation pipe (8) as center, the surface of installation pipe (8) contacts positioning card board (9).

6. A modular vacuum chuck for semiconductor processing as defined in claim 5, wherein: The number of locking screw rod (7) is set to four, four locking screw rod (7) is distributed in circumferential symmetry with installation bottom ring (6) as center, the inner wall surface of bearing ring (14) contacts installation pipe (8).

7. A modular vacuum chuck for semiconductor processing as defined in claim 6, wherein: The bottom surface of vacuum chuck (10) contacts bearing ring (14), the bottom of positioning card board (9) contacts the surface of air inlet shell (1), fixed screw rod (4) extends to the inside of air inlet shell (1) through limiting card board (3).

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