Chip type virtual display packaging body

Abstract

The utility model provides a chip type virtual display packaging body, which comprises a packaging substrate, an LED chip and packaging glue, and is characterized in that the packaging substrate is provided with a bonding wire electrode and a glue ring which surrounds the periphery of the bonding wire electrode and is higher than the bonding wire electrode; the LED chip is fixed on the substrate, a bonding wire is welded on a chip electrode of the LED chip, the other end of the bonding wire is welded on a bonding wire electrode, and black wire fixing glue is filled in the glue ring so as to fix and seal a welding structure of the bonding wire and the bonding wire electrode; the packaging glue is fixedly sealed on the surface of the substrate so as to at least cover the LED chips and the bonding wires. When the method is applied to a virtual display screen, the contrast is improved, namely the resolution and definition are effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of LED packaging, in particular to a chip type virtual display package. BACKGROUND

[0002] Virtual display is a kind of display that people watch images through the optical system in it. The display is composed of array distributed chip type virtual display package. Resolution and definition are important indicators of the display. In the prior art, the substrate of the LED package is provided with a metal pad (i.e. wire electrode), and the wire electrode has a light reflecting property, thereby reducing the overall resolution and definition. Therefore, it is necessary to design a package that can effectively improve the resolution and definition. SUMMARY

[0003] To solve the above problems, the present application provides a chip type virtual display package.

[0004] To achieve the above purpose, the technical scheme provided by the present application is as follows:

[0005] A chip type virtual display package, comprising a packaging substrate, an LED chip and a packaging glue, wherein the packaging substrate is provided with a wire electrode and a glue ring surrounding the periphery of the wire electrode and being higher than the wire electrode; the LED chip is fixed on the substrate, the chip electrode of the LED chip is welded with a wire, the other end of the wire is welded on the wire electrode, the glue ring is filled with black wire fixing glue to fix and seal the welding structure of the wire and the wire electrode; and the packaging glue is fixed and sealed on the surface of the substrate to cover at least the LED chip and the wire.

[0006] Further, the glue ring and the substrate are integrally formed.

[0007] Further, the color of the substrate and the glue ring is black.

[0008] Further, the substrate is further provided with a die bonding pad, and the LED chip is fixed on the die bonding pad.

[0009] Further, the number of the LED chips is four, which are one blue light LED chip, one red light LED chip and two green light LED chips.

[0010] Further, the four LED chips are fixed at four corner positions of the substrate, and the two green light LED chips are diagonally arranged.

[0011] A preparation method of a chip type virtual display package, comprising the following steps:

[0012] S1, providing an LED chip and a packaging substrate, the packaging substrate is provided with a wire electrode and a glue ring surrounding the periphery of the wire electrode and being higher than the wire electrode; fixing the LED chip on the substrate; welding one end of the wire on the chip electrode of the LED chip and the other end of the wire on the wire electrode;

[0013] S2, filling the wire fixing glue in the glue ring and curing to seal the welding structure of the wire and the wire electrode and cover the surface of the wire electrode;

[0014] S3, plastic packaging of the product obtained in S2, that is, plastic packaging of the packaging glue on the surface of the substrate, the packaging glue covering at least the LED chip and the wire.

[0015] Further, the color of the substrate and the glue ring is black.

[0016] Further, the number of the LED chips is four, which are one blue light LED chip, one red light LED chip and two green light LED chips.

[0017] Further, the four LED chips are fixed at the four end corner positions of the substrate, and the two green light LED chips are diagonally arranged.

[0018] The technical scheme provided by the application has the following beneficial effects:

[0019] 1. The glue ring higher than the wire electrode is arranged in the periphery of the wire electrode, after the wire is welded, the wire fixing glue in the glue ring is filled with black, on the one hand, the welding structure of the wire and the wire electrode is sealed, which effectively avoids the fracture of the welding position and improves the waterproofness of the wire electrode, on the other hand, the surface of the wire electrode is covered with the black wire fixing glue, the subsequent light will not be reflected by the wire electrode, when applied to a virtual display screen, the contrast is improved, that is, the resolution and the clarity are effectively improved.

[0020] 2. Since the problem of reflection of the wire electrode is solved, the packaging glue for subsequent plastic packaging can adopt high-transparency material, so that the brightness of the product can be effectively improved.

[0021] 3. The chip type virtual display packaging body is obtained by packaging one blue light LED chip, one red light LED chip and two green light LED chips, and further preferably, the four LED chips are fixed at the four end corner positions of the substrate, and the two green light LED chips are diagonally arranged; the resolution perception, color performance and brightness uniformity are effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a three-dimensional structure schematic diagram of the packaging substrate in the embodiment;

[0023] Figure 2A top view of the packaging substrate in the embodiment is shown;

[0024] Figure 3 A top view of the packaging substrate in the embodiment is shown Figure 2 A sectional view along line A-A in the embodiment is shown;

[0025] Figure 4 A schematic view of the connection between the LED chip and the packaging substrate in the embodiment is shown;

[0026] Figure 5 A sectional view of the chip-type virtual display package in the embodiment is shown. DETAILED DESCRIPTION

[0027] To further illustrate the embodiments, the present application provides accompanying drawings. These drawings are part of the disclosure of the present application, which mainly serve to illustrate the embodiments, and can be used to explain the operating principles of the embodiments in conjunction with the related descriptions in the specification. Those of ordinary skill in the art should be able to understand other possible implementations and advantages of the present application in conjunction with these. The components in the drawings are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0028] In the description of the present application, the terms "upper", "lower", "left", "right", "front", "back", and other orientation or position relationships are based on the orientation or position relationships shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0029] The present application will be further described in conjunction with the drawings and specific embodiments.

[0030] Referring to Figures 1 to 5 As shown, the present embodiment provides a chip-type virtual display package, which comprises a packaging substrate 11, an LED chip 20, and a packaging glue 40, wherein the packaging substrate 11 is provided with a wire electrode 12 and a glue ring 13 surrounding the periphery of the wire electrode 12 and higher than the wire electrode 12; the LED chip 20 is fixed on the substrate 11, the chip electrode of the LED chip 20 is welded with a wire 21, the other end of the wire 21 is welded on the wire electrode 12, and the glue ring 13 is filled with black wire fixing glue 30 to fix and seal the welding structure of the wire 21 and the wire electrode 12; in this way, after the wire is welded, the glue ring 13 is filled with black wire fixing glue 30, which on the one hand fixes and seals the welding structure of the wire 21 and the wire electrode 12, effectively avoiding the fracture of the welding part and improving the waterproofness of the wire electrode 12, and on the other hand, the black wire fixing glue 30 can cover the surface of the wire electrode 12, and the subsequent light will not be reflected by the wire electrode 12, which when applied to a virtual display screen, improves the contrast, i.e. effectively improves the resolution and clarity.

[0031] The encapsulation glue 40 is solidly sealed on the surface of the substrate to cover at least the LED chip 20 and the wire 21, and in particular, the encapsulation glue 40 covers the entire surface of the substrate 11 to cover the LED chip 20 and the wire 21 entirely, thereby achieving solid sealing protection.

[0032] In particular, the encapsulation glue 40 and the wire fixing glue 30 use the same glue, such as both using epoxy resin or silica gel, and the only difference is that the wire fixing glue 30 is added with more black pigment than the encapsulation glue 40, so that the wire fixing glue 30 appears black. By using the same glue, the encapsulation glue 40 and the wire fixing glue 30 are firmly combined after the encapsulation glue 40 is completed, and are not easy to separate. Of course, in other embodiments, the encapsulation glue 40 and the wire fixing glue 30 can also use different types of glue.

[0033] At the same time, since the problem of reflection of the wire electrode 12 is solved, the encapsulation glue 40 in subsequent molding can use high-transparency material, thereby effectively improving the brightness of the product.

[0034] The glue ring 13 and the substrate 11 are integrally formed structures and are both black, such as the glue ring 13 and the substrate 11 being integrally formed by injection molding, which is simple and fast to prepare, and are both black, thereby further improving the resolution and clarity of the product. Of course, in other embodiments, the glue ring 13 can also be obtained by subsequent coating, or the color of the glue ring 13 and the substrate 11 can use other colors such as brown and gray.

[0035] In particular, in the present embodiment, the number of the LED chips 20 is four, and in order to facilitate die bonding, the substrate 11 is further provided with die bonding pads 14, and the number of the die bonding pads 14 is also four. The four LED chips 20 are respectively fixed on the four die bonding pads 14. Further, one is a blue light LED chip, one is a red light LED chip, and two are green light LED chips. The four LED chips 20 are fixed at four corner positions of the substrate 11, and the two green light LED chips are diagonally arranged (such as being arranged at the upper left corner and the lower right corner of the substrate 11 in FIG. 1, respectively). Figure 4 In this way, a virtual pixel encapsulation body of R(red)G(green)B(blue)G(green) is formed. In combination with the provision of the encapsulation substrate 11 and the black wire fixing glue 30 described above, the resolution perception, color performance, and brightness uniformity are effectively improved. The specific description is as follows:

[0036] 1. By combining four physical pixels into one virtual pixel, the resolution in vision can be improved without increasing the number of physical pixels, so that the image looks more delicate and clear.

[0037] 2. The RGBG arrangement contains two green pixels, which can better restore the green in nature and enhance the richness and authenticity of the color.

[0038] 3. Virtual pixel technology allows for better control over color uniformity and reduces color differences in transition areas.

[0039] 4. The two green pixels in the RGBG arrangement can better balance the brightness and reduce uneven brightness, especially in high-brightness scenes.

[0040] 5. The two green pixels in the RGBG arrangement can better capture and reproduce high dynamic range (HDR) content, enhancing the contrast and detail of the image.

[0041] In this embodiment, there are six wire bonding electrodes 12, which are used to bond the wires of four LED chips 20. Each of the six wire bonding electrodes 12 is surrounded by a rubber ring 13. Of course, in other embodiments, the number of wire bonding electrodes 12 can be increased or decreased according to the actual situation, and their positions can also be adjusted according to the actual situation.

[0042] This embodiment provides a method for preparing the chip-type virtual display package described above, including the following steps:

[0043] S1, an LED chip 20 and a packaging substrate 11 are provided. The packaging substrate 11 is provided with a wire bonding electrode 12 and a glue ring 13 surrounding the wire bonding electrode 12 and higher than the wire bonding electrode 12. The LED chip 20 is fixed on the substrate 11. One end of the wire bonding 21 is soldered to the chip electrode of the LED chip 20, and the other end of the wire bonding 21 is soldered to the wire bonding electrode 12.

[0044] Specifically, such as Figure 3 As shown, four LED chips 20 are fixed on four die bond pads 14 of the packaging substrate 11, and then the four LED chips 20 (RGBG) are soldered to achieve the circuit connection of the four LED chips 20.

[0045] S2, black wire-fixing adhesive 30 is filled into the adhesive ring 13 and cured to seal the welding structure of the bonding wire 21 and the bonding electrode 12 and cover the surface of the bonding electrode 12. On the one hand, sealing the welding structure of the bonding wire 21 and the bonding electrode 12 effectively prevents the welding joint from breaking and improves the waterproofness of the bonding electrode 12. On the other hand, the black wire-fixing adhesive 30 can cover the surface of the bonding electrode 12, so that subsequent light will not be reflected by the bonding electrode 12, thereby improving the contrast, that is, effectively improving the resolution and clarity.

[0046] S3, the product obtained in S2 is molded, that is, encapsulating adhesive 40 is molded onto the surface of the packaging substrate 11, the encapsulating adhesive 40 at least covering the LED chip 20 and the bonding wire 21. Thus, the chip-type virtual display package is obtained.

[0047] While this application has been particularly shown and described with references to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details can be made therein without departing from the spirit and scope of the application as defined by the appended claims.

Claims

1. A chip-type virtual display package, comprising a package substrate, an LED chip, and a package adhesive, characterized in that: The packaging substrate is provided with a wire electrode and a glue ring surrounding the periphery of the wire electrode and being higher than the wire electrode; the LED chip is fixed on the substrate, a chip electrode of the LED chip is welded with a wire, the other end of the wire is welded on the wire electrode, the glue ring is filled with black wire fixing glue to fix and seal the welding structure of the wire and the wire electrode; the packaging glue is fixed on the surface of the substrate to cover at least the LED chip and the wire.

2. The chip-type virtual display package of claim 1, wherein: The glue ring and the substrate are integrally formed.

3. The chip-type virtual display package according to claim 1 or 2, characterized in that: The color of the substrate and the glue ring is black.

4. The chip-type virtual display package of claim 1, wherein: The substrate is further provided with a die bonding pad, and the LED chip is fixed on the die bonding pad.

5. The chip-type virtual display package of claim 1, wherein: The number of the LED chips is four, which are one blue light LED chip, one red light LED chip and two green light LED chips.

6. The chip-type virtual display package of claim 5, wherein: The four LED chips are fixed at four corner positions of the substrate, and the two green light LED chips are diagonally arranged.

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