Photoresist supply system

Abstract

The utility model provides a photoresist supply system which comprises a nozzle, a cleaning container and a driving structure, and the nozzle is used for spraying photoresist; the cleaning container is used for storing a photoresist diluent; the driving end of the driving structure is movably arranged, and the driving end of the driving structure is in driving connection with the nozzle so as to drive the nozzle to move to a cleaning position opposite to the cleaning container or a spraying position for spraying; when the nozzle is in the cleaning position, the nozzle extends into the cleaning container and is soaked in the photoresist diluent. According to the technical scheme provided by the utility model, the problem that in the prior art, the photoresist is greatly wasted in a manner of preventing the photoresist at the nozzle from being solidified by adopting pre-spraying can be solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and more specifically, to a photoresist supply system. Background Technology

[0002] Currently, in the semiconductor field, photoresist coating and development processes are widely used in wafer fabrication and are a crucial step in the manufacturing process. In this process, the wafer undergoes coating, development, and stripping to form a photoresist pattern, which is then further etched into circuit patterns. Coating is the process used by semiconductor manufacturing photolithography engineers to apply photoresist to the wafer surface. A common spin coating method involves dropping a certain amount of photoresist onto the wafer to form an initial thin film. The wafer is then accelerated to a predetermined speed, and under centrifugal force, the photoresist flows radially outwards, causing the liquid film thickness to continuously decrease until a uniform film is formed on the wafer surface.

[0003] However, since the nozzles used for coating are not constantly in operation, the photoresist at the nozzles will solidify over time when the nozzles are not coating. Current technology often uses timed pre-coating of the nozzles, typically every two hours, which results in significant photoresist waste. Utility Model Content

[0004] The main objective of this invention is to provide a photoresist supply system to solve the problem that the existing method of pre-spraying to prevent photoresist from solidifying at the nozzle easily leads to a large waste of photoresist.

[0005] To achieve the above objectives, this utility model provides a photoresist supply system, comprising: a nozzle, a cleaning container, and a driving structure. The nozzle is used for spraying photoresist; the cleaning container is used for storing photoresist diluent; the driving end of the driving structure is movably disposed and is drivenly connected to the nozzle to move the nozzle to a cleaning position opposite to the cleaning container or a spraying position for spraying; when the nozzle is in the cleaning position, the nozzle extends into the cleaning container and is immersed in the photoresist diluent.

[0006] Furthermore, the photoresist supply system also includes a wafer carrier tray, which is spaced apart from the cleaning container; when the nozzle is in the spraying position, the nozzle moves to a position opposite to the wafer carrier tray;

[0007] The driving end of the driving structure is movably arranged along the spacing direction of the cleaning container and the wafer carrier disk, and the nozzle is vertically and vertically arranged on the driving end of the driving structure.

[0008] Furthermore, the photoresist supply system also includes a guide rail and a position detection device. The guide rail extends along the spacing arrangement direction of the cleaning container and the wafer carrier disk, and the driving end is movably disposed on the guide rail.

[0009] A position detection element is mounted on the guide rail and is used to detect the position of the nozzle.

[0010] Furthermore, the photoresist supply system also includes an image acquisition unit, the acquisition head of which is positioned toward the nozzle to acquire an image of the nozzle;

[0011] The image acquisition device and the driving structure are both signal-connected to the control device, and the control device is used to send control signals to the driving structure according to the image signals acquired by the image acquisition device.

[0012] Furthermore, the photoresist supply system also includes a waste discharge container, which is spaced apart from the cleaning container;

[0013] The nozzle also has a pre-spray position opposite to the waste discharge container; when the nozzle is in the third preset position, the nozzle performs a pre-spray operation.

[0014] Furthermore, the photoresist supply system also includes a wafer carrier tray, which is spaced apart from the cleaning container; when the nozzle is in the cleaning position, the nozzle moves to a position opposite to the wafer carrier tray;

[0015] The waste discharge container is disposed between the cleaning container and the wafer carrier disk.

[0016] Furthermore, the photoresist supply system also includes a supply pipeline and a liquid level regulating component, wherein the supply pipeline is connected to the nozzle to supply photoresist to the nozzle;

[0017] A liquid level regulator is installed on the supply pipeline, and the pressure of the liquid level regulator is adjustable to adjust the liquid level of the photoresist in the nozzle.

[0018] Furthermore, the liquid level regulating component is a pneumatically controlled valve; and / or,

[0019] The photoresist supply system further includes a storage container for storing photoresist, and a first liquid level detection element is provided at one end of the supply pipeline near the storage container; and / or,

[0020] The photoresist supply system also includes a pressure device, which is connected to the supply pipeline.

[0021] Furthermore, the photoresist supply system also includes:

[0022] A liquid supply tank is used to store photoresist diluent, and the cleaning container is connected to the liquid supply tank.

[0023] Furthermore, the photoresist supply system also includes:

[0024] A drain pipe is located at the bottom of the cleaning container and communicates with the cleaning container; and / or,

[0025] A second liquid level detection device is installed inside the cleaning container to detect the liquid level of the photoresist diluent inside the cleaning container.

[0026] By applying the technical solution of this utility model, the nozzle can be switched to a cleaning position or a spraying position under the action of the driving structure. When photoresist solidifies at the nozzle, the driving structure moves the nozzle to the cleaning position, where the nozzle is immersed in the photoresist thinner in the cleaning container. Immersion in the photoresist completely dissolves it, removing the solidified photoresist. Subsequently, the driving structure moves the nozzle back to the spraying position. This process effectively prevents photoresist solidification at the nozzle, thus solving the problem of significant photoresist waste caused by pre-spraying to prevent solidification at the nozzle in existing technologies. Attached Figure Description

[0027] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0028] Figure 1 A schematic diagram of the nozzle of a photoresist supply system provided according to an embodiment of the present invention in the cleaning position is shown.

[0029] Figure 2 A schematic diagram of the structure of a photoresist supply system according to an embodiment of the present invention with the nozzle in the spraying position is shown.

[0030] Figure 3 A schematic diagram of the structure of a photoresist supply system provided according to an embodiment of the present invention with the nozzle in the pre-spray position is shown;

[0031] Figure 4 A schematic diagram of the control principle of the photoresist supply system according to the present invention is shown.

[0032] The above figures include the following reference numerals:

[0033] 1. Nozzle; 2. Cleaning container; 3. Drive structure; 301. Drive end; 4. Wafer carrier; 5. Guide rail; 6. Image acquisition component; 7. Control component; 8. Waste discharge container; 9. Supply pipeline; 10. Liquid level adjustment component; 11. Storage container; 12. Pressurization component; 13. Liquid supply tank; 14. Drain pipe. Detailed Implementation

[0034] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0035] like Figure 1 , Figure 2 As shown, an embodiment of this utility model provides a photoresist supply system, which includes a nozzle 1, a cleaning container 2, and a drive structure 3. The nozzle 1 is used to spray photoresist; the cleaning container 2 is used to store photoresist diluent; the drive end 301 of the drive structure 3 is movably disposed, and the drive end 301 of the drive structure 3 is drivenly connected to the nozzle 1 to drive the nozzle 1 to a cleaning position opposite to the cleaning container 2 or a spraying position for spraying; when the nozzle 1 is in the cleaning position, the nozzle 1 extends into the cleaning container 2 and is immersed in the photoresist diluent.

[0036] By applying the technical solution of this utility model, nozzle 1 can switch to either a cleaning position or a spraying position under the action of drive structure 3. When photoresist solidifies at nozzle 1, drive structure 3 moves nozzle 1 to the cleaning position, where nozzle 1 extends into the photoresist thinner in cleaning container 2 to thoroughly dissolve and remove the solidified photoresist. Subsequently, drive structure 3 moves nozzle 1 back to the spraying position. Through the above process, photoresist solidification at nozzle 1 can be effectively avoided, thus solving the problem that the existing method of pre-spraying to prevent photoresist solidification at the nozzle easily leads to significant photoresist waste.

[0037] Specifically, nozzle 1 is designed with a precision structure to uniformly spray photoresist onto the wafer. The nozzle 1 has a glue tip at its end, which is prone to solidification when the nozzle 1 is not used for an extended period. The cleaning container 2 is designed to accommodate the full insertion of nozzle 1 to ensure sufficient contact between the gel and the thinner. Specifically, nozzle 1 can be immersed in the photoresist thinner for 1 minute to ensure complete dissolution of the photoresist.

[0038] Specifically, the photoresist supply system also includes a wafer carrier 4, which is spaced apart from the cleaning container 2. When the nozzle 1 is in the spraying position, the nozzle 1 moves to a position opposite to the wafer carrier 4. The drive end 301 of the drive structure 3 is movably arranged along the spacing between the cleaning container 2 and the wafer carrier 4, and the nozzle 1 is vertically mounted on the drive end 301 of the drive structure 3. This structural arrangement facilitates the smooth movement of the nozzle 1 from the drive end 301 of the drive structure 3 to the spraying or cleaning position. When the nozzle 1 is in the cleaning position, its vertical movement allows it to easily enter or exit the cleaning container 2, ensuring smooth overall operation of the nozzle 1.

[0039] Specifically, the wafer carrier 4 is used to hold the wafer to be processed and is spaced a certain distance from the cleaning container 2 to ensure that the process corresponding to the spraying position of the nozzle 1 does not interfere with the process corresponding to the cleaning position. Specifically, the drive structure 3 drives the nozzle 1 to move above the wafer carrier 4 and above the cleaning container 2. When the nozzle 1 is in the spraying position, the nozzle 1 is located at the center above the wafer on the wafer carrier 4 and drops a certain amount of photoresist onto the wafer to form an initial thin film. Then the wafer is accelerated to a predetermined speed, and under the action of centrifugal force, the photoresist flows outward radially, and the thickness of the liquid film continuously decreases, eventually forming a uniform film on the wafer surface.

[0040] Specifically, the photoresist supply system also includes a guide rail 5 and a position detection component. The guide rail 5 extends along the spacing direction of the cleaning container 2 and the wafer carrier 4. The drive end 301 is movably disposed on the guide rail 5 to provide stable guidance for the movement of the drive end 301. The position detection component is disposed on the guide rail 5 and is used to detect the position of the nozzle 1 to ensure that the nozzle 1 can move to a predetermined position, which can be a spraying position or a cleaning position.

[0041] Specifically, the position detection component employs photoelectric sensing, which accurately detects the position of the drive end 301 on the slide rail. The use of photoelectric sensing improves the accuracy and speed of position detection, making it suitable for production environments requiring frequent adjustments to the position of nozzle 1, such as the production of multilayer circuit boards. Photoelectric sensing not only improves detection accuracy but also simplifies the detection process and reduces detection time, making it suitable for multilayer circuit board production environments with high requirements for nozzle 1 position control. This ensures precise adhesive application to each layer of the circuit board, improving manufacturing quality and efficiency.

[0042] Specifically, the drive structure 3 is a structure with a shaft slide rail design. Its drive end 301 is connected to the nozzle 1 and can move along the spacing direction of the cleaning container 2 and the wafer carrier 4 on the guide rail 5. At the same time, the nozzle 1 can be raised and lowered to precisely control the immersion depth of the nozzle 1 in the cleaning container 2 and the spraying height on the wafer carrier 4.

[0043] Specifically, the photoresist supply system also includes an image acquisition unit 6 and a control unit 7. The acquisition head of the image acquisition unit 6 is positioned facing the nozzle 1 to acquire images of the nozzle 1. Both the image acquisition unit 6 and the driving structure 3 are signal-connected to the control unit 7. The control unit 7 is used to send control signals to the driving structure 3 based on the image signals acquired by the image acquisition unit 6. With this structural arrangement, the control unit 7 can make judgments based on the image signals acquired by the image acquisition unit 6, and determine and issue instructions for the next step. If the control unit 7 determines from the acquired image signals that there is solidified photoresist at the nozzle 1, the control unit 7 issues an instruction to the driving end 301 to move the nozzle 1 to a cleaning position for immersion cleaning of the nozzle 1.

[0044] Specifically, the image acquisition unit 6 is a camera device. The camera of the camera device is set towards the nozzle 1 to take pictures of the rubber head of the nozzle 1 and simultaneously upload the acquired images to the control unit 7.

[0045] In the above embodiments, the image acquisition unit 6 and the control unit 7 employ deep learning algorithms to automatically identify the gel residue on the surface of the glue head. The introduction of deep learning algorithms makes image recognition more accurate, adaptable to different lighting conditions and changes in glue head shape, and suitable for highly automated production environments requiring real-time monitoring, such as unattended 24-hour continuous production lines.

[0046] Specifically, such as Figure 3 As shown, the photoresist supply system also includes a waste discharge container 8, which is spaced apart from the cleaning container 2. The nozzle 1 also has a pre-spray position opposite to the waste discharge container 8. When the nozzle 1 is in a third preset position, the nozzle 1 performs a pre-spray operation. When the nozzle 1 is in the cleaning position, the photoresist thinner dissolves the solidified photoresist at the nozzle tip. However, photoresist thinner remains inside the nozzle 1. Therefore, in the photoresist supply system, assuming a pre-spray position, a waste discharge container 8 is located below the pre-spray position of the nozzle 1. After cleaning, the photoresist nozzle 1 waste discharge container 8 moves upwards to perform a pre-spray. The purpose is to ensure that the residual photoresist thinner at the nozzle tip is carried away, effectively preventing photoresist thinner residue from causing coating abnormalities.

[0047] Specifically, the photoresist supply system also includes a wafer carrier 4, spaced apart from the cleaning container 2. When the nozzle 1 is in the cleaning position, the nozzle 1 moves to a position opposite to the wafer carrier 4. A waste discharge container 8 is positioned between the cleaning container 2 and the wafer carrier 4. A pre-spray position is provided between the spraying and cleaning positions, spaced apart to prevent interference between processes at different positions. Furthermore, by placing the waste discharge container 8 between the cleaning container 2 and the wafer carrier 4, pre-spraying can be performed through the nozzle 1 after cleaning, and then the nozzle 1 can return to the cleaning position, ensuring the smoothness of the entire movement path of the nozzle 1 and eliminating the need for repeated back-and-forth movement.

[0048] During the process of completing a full cleaning of nozzle 1, the drive end 301 drives nozzle 1 to move sequentially to the spray position, the cleaning position, the coating position, and finally back to the spray position from the coating position.

[0049] Specifically, the photoresist supply system also includes a supply line 9 and a level regulator 10. The supply line 9 is connected to the nozzle 1 to supply photoresist to the nozzle 1. The level regulator 10 is disposed on the supply line 9, and its pressure is adjustable to adjust the photoresist level in the nozzle 1. The supply line 9 provides a continuous supply of photoresist to the nozzle 1. The level regulator 10, disposed on the supply line 9, controls the photoresist level in the nozzle 1 by adjusting the pressure. The level regulator 10 can adjust the pressure according to system instructions to increase the photoresist level in the nozzle during the cleaning process, so that the gel at the nozzle 1 and the photoresist in the nozzle 1 have a predetermined height gap difference. At the same time, it restores the level to the initial state before the spraying operation begins, ensuring the uniformity and stability of photoresist spraying.

[0050] Specifically, the liquid level regulator 10 is a pneumatic control valve to regulate the liquid level of the photoresist in the supply pipeline 9. During use, the liquid level regulator 10 controls the backflow height of the photoresist in the pipeline, sets an appropriate air volume, and avoids defects caused by the photoresist falling due to gravity at the end of the spraying process. Simultaneously, during the wetting process of the nozzle 1, the pneumatic control valve increases the backflow height, causing the gel and photoresist to separate and create a gap, preventing waste caused by contact between the photoresist and photoresist thinner. After the photoresist pre-spraying is completed, the pneumatic control valve returns to its initial state, and the backflow height returns to its initial position. The control unit 7 can set the initial liquid level position and the corresponding air volume for the liquid level backflow increase (the operator can adjust the corresponding air volume on the control unit 7). The execution actions of the liquid level backflow increase before wetting and the liquid level restoration after pre-spraying are both sent by the control unit 7.

[0051] Specifically, the photoresist supply system also includes a storage container 11, which is used to store photoresist. A first liquid level detector is provided at one end of the supply pipe 9 near the storage container 11 to detect the liquid level of the photoresist and determine whether there is sufficient photoresist in the storage container 11. The storage container 11 is used to store photoresist. One end of the supply pipe 9 is connected to the nozzle 1, and the other end is connected to the storage container 11. The first liquid level detector is provided at the end of the supply pipe 9 near the storage container 11 to monitor the liquid level of the photoresist in real time, ensure stable supply, prevent pipe blockage or leakage, and adjust the supply pressure in real time to ensure that the coating layer on the wafer is uniform and defect-free. An alarm from the first liquid level detector indicates that the storage container 11 is empty and needs to be replaced.

[0052] Specifically, the photoresist supply system also includes a pressure unit 12, which is connected to the supply pipeline 9. The pressure unit 12, connected to the supply pipeline 9, provides the necessary pressure during photoresist delivery to ensure the photoresist can smoothly pass through the pipeline to the nozzle 1. Specifically, the pressure unit 12 can be a nitrogen cylinder containing high-pressure nitrogen.

[0053] Specifically, the photoresist supply system also includes a supply tank 13, which is used to store photoresist diluent. The cleaning container 2 is connected to the supply tank 13. The supply tank 13 is connected to the cleaning container 2 via a liquid path and is used to store and replenish the photoresist diluent.

[0054] Specifically, the photoresist supply system also includes a drain pipe 14, which is located at the bottom of the cleaning container 2 and connected to it. The drain pipe 14 is located at the bottom of the cleaning container 2 and connected to it. It is used to drain the used photoresist diluent after cleaning to avoid contamination, and to replenish the photoresist diluent in a timely manner through the replenishment pipeline to ensure that its liquid level meets the cleaning requirements.

[0055] Specifically, the photoresist supply system also includes a second liquid level detection device, which is installed inside the cleaning container 2 to detect the liquid level of the photoresist diluent within the cleaning container 2. Specifically, the second liquid level detection device can be a float-type liquid level sensor or an ultrasonic liquid level sensor. The second liquid level detection device is installed inside the cleaning container 2 and is used to monitor and control the liquid level of the photoresist diluent in real time, ensuring that the photoresist diluent does not overflow and contaminate the machine, while also ensuring that the liquid level is not too high or too low, affecting the cleaning effect or causing diluent waste. It also ensures a stable supply of diluent, avoids the risk of interruption during production, and improves the efficiency and yield of large-scale semiconductor chip production.

[0056] In the above embodiments, such as Figures 1 to 3As shown, the photoresist supply system is connected by a supply pipe 9 connecting the storage container 11 and the photoresist nozzle 1. A first liquid level detection element is fixed to one end of the pipe near the storage container 11. A liquid level regulating element 10 is installed on the supply pipe 9. The photoresist nozzle 1 and at least a portion of the supply pipe 9 are fixed to the drive end 301. The supply tank 13, drain pipe 14, and image acquisition element 6 are independent of the entire device, located directly below the drive end 301 and at the same horizontal plane as the nozzle 1. Figure 4 The diagram shown illustrates the control principle of the photoresist supply system.

[0057] Specifically, the photoresist supply system operates as follows:

[0058] Step 1: Before the photoresist supply system starts working, check that the photoresist diluent has been added to the appropriate position in the cleaning container 2 and that the image acquisition unit 6 can clearly observe the condition of the nozzle 1. After confirming that there are no abnormalities, the machine can start issuing work instructions.

[0059] Step 2: The operation terminal of the photoresist supply system issues a work instruction, and the photoresist supply system machine starts gel processing. The image acquisition unit 6 takes a picture of the gel head and uploads it to the operation terminal of the control unit 7. The machine performs image recognition processing on the received picture and determines that there is no gel at the gel head. The machine receives the image recognition result and starts the wafer picking operation.

[0060] Step 3: If the gel machine performs the photoresist removal operation, the nozzle 1 will draw back to increase the photoresist level and create a certain gap with the gel. After the nozzle 1 moves above the cleaning container 2, the nozzle 1 will start to descend and stop when the photoresist diluent level reaches the gap. After soaking for 1 minute, the nozzle 1 will return to the initial position. The image acquisition unit 6 will take a picture of the current state of the nozzle 1 and upload it to the control unit 7 for image recognition processing to determine that the gel has been removed. At this time, the nozzle 1 will pre-spray once to remove the photoresist diluent at the front end of the nozzle 1 and draw back to restore the photoresist level to the initial position, and the wafer unloading operation will begin.

[0061] Step 4: If the gel is not completely removed, repeat step 3 until the gel is completely removed. Then the machine will perform the subsequent actions and officially begin the film removal operation.

[0062] Step 5: After the above steps, the gel cleaning of nozzle 1 is completed. During the coating process, the drain pipe 14 of the waste container 8 is automatically opened. After the waste liquid is drained, it is closed. The replenishment pipe is replenished with photoresist diluent to the predetermined position to prepare for the next gel removal operation.

[0063] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0064] This invention has wide applications in high-precision fields such as semiconductor manufacturing and microelectronics processing. It can significantly improve production efficiency and product quality, reduce the uncertainty caused by human operation, and significantly improve the stability and efficiency of equipment operation after implementation. Especially in large-scale production environments, it automates the handling of photoresist head solidification, avoids the risk of production interruption, ensures continuous operation of the production line, and saves the semiconductor industry a lot of time and costs. Compared with the traditional method of timed pre-spraying to prevent photoresist head solidification at nozzle 1, it saves on the use of photoresist. Through an intelligent monitoring and control system, the processing of photoresist head solidification at nozzle 1 is automated and precise, effectively preventing nozzle head clogging and photoresist waste, improving production efficiency and product quality. Real-time monitoring and adjustment ensure a stable supply of photoresist and photoresist diluent, improving the reliability and stability of the equipment. The introduction of this device not only meets the current high-precision requirements of semiconductor manufacturing but also adapts to future technological developments, providing support for more advanced microelectronics processing technologies, such as nanoscale chip manufacturing and three-dimensional integrated circuits, and has broad market prospects and application value.

[0065] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0066] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0067] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0068] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0069] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0070] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A photoresist supply system, characterized in that, include: Nozzle (1), the nozzle (1) being used to spray photoresist; Cleaning container (2) for storing photoresist diluent; The driving structure (3) has a driving end (301) that is movably provided. The driving end (301) of the driving structure (3) is driven to the nozzle (1) to drive the nozzle (1) to move to a cleaning position or a spraying position that is opposite to the cleaning container (2). When the nozzle (1) is in the cleaning position, the nozzle (1) extends into the cleaning container (2) and is immersed in the photoresist diluent.

2. The photoresist supply system according to claim 1, characterized in that, The photoresist supply system also includes: A wafer carrier (4) is spaced apart from the cleaning container (2); when the nozzle (1) is in the spraying position, the nozzle (1) moves to a position opposite to the wafer carrier (4); The driving end (301) of the driving structure (3) is movably arranged along the spacing direction of the cleaning container (2) and the wafer carrier disk (4), and the nozzle (1) is movably arranged on the driving end (301) of the driving structure (3).

3. The photoresist supply system according to claim 2, characterized in that, The photoresist supply system also includes: Guide rail (5) extends along the spacing arrangement direction of the cleaning container (2) and the wafer carrier disk (4), and the drive end (301) is movably disposed on the guide rail (5); A position detection element is disposed on the guide rail (5) and is used to detect the position of the nozzle (1).

4. The photoresist supply system according to claim 1, characterized in that, The photoresist supply system also includes: An image acquisition device (6) is provided, with its acquisition head facing the nozzle (1) to acquire an image of the nozzle (1); The control unit (7) is connected to the image acquisition unit (6) and the driving structure (3) by signal. The control unit (7) is used to send control signals to the driving structure (3) according to the image signals acquired by the image acquisition unit (6).

5. The photoresist supply system according to claim 1, characterized in that, The photoresist supply system also includes: Waste discharge container (8) is provided at an interval from the cleaning container (2); The nozzle (1) also has a pre-spray position that is opposite to the waste discharge container (8); when the nozzle (1) is in the pre-spray position, the nozzle (1) performs a pre-spray operation.

6. The photoresist supply system according to claim 5, characterized in that, The photoresist supply system also includes: A wafer carrier (4) is spaced apart from the cleaning container (2); when the nozzle (1) is in the cleaning position, the nozzle (1) moves to a position opposite to the wafer carrier (4); The waste discharge container (8) is disposed between the cleaning container (2) and the wafer carrier disk (4).

7. The photoresist supply system according to claim 1, characterized in that, The photoresist supply system also includes: A supply line (9) is connected to the nozzle (1) to provide photoresist to the nozzle (1); A liquid level regulator (10) is provided on the supply line (9), and the pressure of the liquid level regulator (10) is adjustable to adjust the liquid level height of the photoresist in the nozzle (1).

8. The photoresist supply system according to claim 7, characterized in that, The liquid level regulating component (10) is a pneumatically controlled valve; and / or, The photoresist supply system further includes a storage container (11) for storing photoresist, and a first liquid level detection element is provided at one end of the supply pipeline (9) near the storage container (11); and / or, The photoresist supply system also includes a pressure unit (12), which is connected to the supply pipeline (9).

9. The photoresist supply system according to claim 1, characterized in that, The photoresist supply system also includes: A liquid supply tank (13) is used to store photoresist diluent, and the cleaning container (2) is connected to the liquid supply tank (13).

10. The photoresist supply system according to claim 1, characterized in that, The photoresist supply system also includes: A drain pipe (14) is disposed at the bottom of the cleaning container (2) and communicates with the cleaning container (2); and / or, A second liquid level detection device is installed inside the cleaning container (2) to detect the liquid level of the photoresist diluent inside the cleaning container (2).

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