Tunnel type curing device for solder resist of circuit board

By designing a tunnel-type curing device for circuit board solder resist, using a bracket, drive unit, tray and UVLED surface light source assembly, a production line curing is achieved, solving the problems of low work efficiency and high labor intensity in the existing technology, and improving the curing efficiency and work adaptability of circuit board solder resist.

CN223530782UActive Publication Date: 2025-11-11GUANNAN YAN MING ELECTRONICS CO LTD
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Patent Information

Application Number
CN202422890957.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-26
Publication Date
2025-11-11
Estimated Expiration
2034-11-26

AI Technical Summary

Technical Problem

Existing solder resist curing boxes require frequent opening and closing of the box door by staff, resulting in low work efficiency and high labor intensity, making it difficult to achieve efficient solder resist curing of circuit boards.

Method used

Design a tunnel curing device for circuit board solder resist, which adopts a support, a drive unit, a tray, a tunnel frame and a UVLED surface light source assembly to achieve assembly line curing. The support has waiting areas at both ends, the drive unit is set up vertically, the UVLED surface light source assembly is movable, and the height of the tray is adjustable to adapt to different working postures.

Benefits of technology

It improves the curing efficiency of circuit board solder resist, reduces the labor intensity of workers, is highly adaptable, is suitable for double-sided curing of circuit boards, adapts to different installation environments, and reduces the complexity of operation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a circuit board solder resist tunnel type curing device, which belongs to the technical field of circuit board processing, and comprises a support, a driving device, a tray, a tunnel frame and a UVLED (Ultraviolet Light Emitting Diode) area light source assembly, the UVLED area light source assembly comprises a light source plate and a host, the support is provided with a first waiting area and a second waiting area, the driving device drives the tray to pass below the light source plate when moving between the first waiting area and the second waiting area. According to the utility model, the solder resist of the circuit board on the tray can be cured in an assembly line manner, and the working efficiency is high; circuit boards can be placed or taken out from two ends without opening and closing a box door, so that the labor intensity of workers is reduced, and the working efficiency is improved; the device is suitable for double-sided curing work of the circuit board and has good adaptability to different mounting environments; the UVLED area light source assembly can move up and down so that the UVLED area light source assembly can keep a proper working distance from the tray on each layer. The height of the tray can be adjusted to adapt to standing postures or sitting postures of workers, and labor intensity is reduced.
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Description

Technical Field

[0001] This utility model belongs to the field of circuit board processing technology, and specifically relates to a tunnel curing device for circuit board solder resist. Background Technology

[0002] Solder mask is a layer of material on a circuit board used to delineate areas that need to be soldered and areas that don't. It prevents solder bridges from forming in the covered areas, allowing more delicate components to be soldered onto precision pads. Without solder mask, copper traces would adhere to the solder paste. This happens in many hand-assembled circuits and can lead to short circuits, affecting functionality and reliability. Solder mask also serves other functions, such as insulation, temperature and corrosion resistance, circuit protection, oxidation prevention, and thickness matching. Solder mask is generally used on rigid circuit boards, where it is cured and firmly adhered to the board to form the solder mask layer.

[0003] The applicant previously researched solder resist curing boxes and applied for related patents. However, the solder resist curing boxes require staff to open the box door, place the tray, and then close the box door. After the solder resist on the circuit board has cured, the box door needs to be opened again to remove the circuit board from the tray, which is cumbersome and inefficient. Utility Model Content

[0004] The technical problem solved by this utility model is to provide a tunnel curing device for solder resist on circuit boards to improve the curing efficiency of solder resist on circuit boards and reduce the labor intensity of workers.

[0005] Technical solution: To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] A circuit board solder resist tunnel curing device includes a support, a drive device connected to the support, a tray disposed on the drive device, a tunnel frame disposed on the support, and a UVLED surface light source assembly disposed on the tunnel frame. The UVLED surface light source assembly includes a light source board and a main unit. The support is provided with a first waiting area and a second waiting area symmetrical to the first waiting area. When the drive device drives the tray to move between the first waiting area and the second waiting area, it passes under the light source board.

[0007] Furthermore, the driving device includes two opposing displacement components, each displacement component including a base, a lead screw rotatably connected to the base, a slide movably connected to the lead screw, and a drive motor connected to the lead screw.

[0008] Furthermore, the slide is provided with a limiting block, and the tray is provided with a limiting through hole corresponding to the limiting block. When the tray is placed on the slide, the limiting block is inserted into the limiting through hole.

[0009] Furthermore, the bottom of the tray is provided with multiple rollers, which roll on the base.

[0010] Furthermore, the light source board is movably connected to the tunnel frame via a first lifting rod.

[0011] Furthermore, the bracket is provided with multiple second telescopic legs.

[0012] Furthermore, there are two or more drive devices, arranged one above the other.

[0013] Beneficial effects: Compared with the prior art, the present invention has the following advantages:

[0014] 1. By setting up a bracket, drive unit, tray, tunnel frame and UVLED surface light source assembly, the solder resist on the circuit board on the tray can be cured in an assembly line manner, with high work efficiency;

[0015] 2. The bracket is equipped with a first waiting area and a second waiting area at both ends. Circuit boards can be placed or removed at both ends without the need for opening and closing the box door, which reduces the labor intensity of the staff and improves work efficiency.

[0016] 3. Two or more drive units can be installed vertically. The tray can return to its original position via the original drive unit or other drive units. It is suitable for double-sided curing of circuit boards and has good adaptability to different installation environments.

[0017] 4. The UVLED surface light source assembly can be moved up and down to maintain a suitable working distance with the trays on each layer;

[0018] 5. Equipped with a second telescopic leg, the tray height is adjustable to accommodate the standing or sitting posture of the staff, reducing labor intensity. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the curing device structure according to an embodiment of the present invention;

[0020] Figure 2 This is a side view of the curing device in the embodiment.

[0021] Figure 3 yes Figure 2 Enlarged view of point A in the middle;

[0022] Figure 4 This is a schematic diagram of another working state of the curing device in the embodiment;

[0023] Figure 5 This is a schematic diagram of another working state of the light source board in the embodiment. Detailed Implementation

[0024] The present invention will be further illustrated below with reference to specific embodiments. The embodiments are implemented based on the technical solution of the present invention. It should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention.

[0025] like Figure 1 and Figure 2 As shown, this utility model discloses a circuit board solder resist tunnel curing device, comprising a support 1, a drive device, a tray 3, a tunnel frame 4, a UVLED surface light source assembly 5, a first lifting rod 6, and a second telescopic leg 7. The support 1 includes two symmetrically arranged side frames, with the two ends of each side frame connected to a first support leg 13 via connecting rods. The support 1 supports the drive device, which has two components arranged vertically on the inner sides of the two side frames. The tunnel frame 4 is inverted U-shaped, spanning the tops of the two side frames of the support 1 and located in the middle of the two side frames. A tunnel is formed below the tunnel frame 4. The upper left end of the support 1 is a first waiting area 11, and the right end is a second waiting area 12. The first waiting area 11 is located on the left side of the tunnel frame 4, and the second waiting area 12 is located on the right side of the tunnel frame 4. The tray 3 is mounted on the drive device. When the drive device operates, it moves the tray 3 between the first and second waiting areas, allowing the tray 3 to pass under the tunnel frame 4.

[0026] like Figure 1 , Figure 2 and Figure 3As shown, the driving device includes two opposing displacement components 2, which are respectively mounted on the side frame of the support 1 and are at the same height. Each displacement component 2 includes a base 21, a slide 22, a drive motor 23, and a lead screw. The two ends of the base 21 are connected to the first support legs 13 at both ends of the support 1, and the side wall of the middle part of the base 21 is connected to the middle part of the support 1. The lead screw is mounted on the base 21 (the lead screw is inside the base 21 and is not shown in the figure) and is rotatably connected to the base 21. The drive motor 23 is mounted on one end of the base 21 and is connected to the lead screw. The slide 22 is movably connected to the lead screw. When the drive motor 23 is working, it drives the lead screw to rotate, thereby driving the slide 22 to slide on the base 21. In this embodiment, the displacement component 2 adopts an existing electric lead screw slide, so that the slide 22 slides back and forth along the base 21 under the drive of the drive motor 23. The slide table 22 is equipped with a limiting block 221, and the tray 3 is equipped with a limiting through hole 32, which corresponds to the limiting block 221. When the two sides of the tray 3 are placed on a displacement component 2 respectively, the limiting block 221 is inserted into the limiting through hole 32, thereby connecting the tray 3 with the two slide tables 22. Under the drive of the slide tables 22, the tray 3 can move back and forth. The bottom of the tray 3 is equipped with multiple rollers 31, which are symmetrically arranged at the bottom of the tray 3. The rollers 31 roll on the base 21, so that when the slide table 22 drives the tray 3 to move back and forth, the rollers 31 also roll with the tray 3 and provide support for the tray 3. The tray 3 is used to place multiple circuit boards with solder resist. The solder resist is applied to the circuit boards by spraying before the circuit boards are placed on the tray 3. Since the two drive devices are set up vertically, the two trays 3 are also placed vertically when the tray 3 is placed.

[0027] like Figure 1 , Figure 2 and Figure 5As shown, the UVLED surface light source assembly 5 is mounted on the tunnel frame 4. The UVLED surface light source assembly 5 includes a light source board 51 and a main unit 52. The main unit 52 is connected to an external power source via a power cord. The light source board 51 is movably connected to the tunnel frame 4 via a first lifting rod 6. The first lifting rod 6 is an existing electric telescopic rod, including a first cylinder 61 and a first piston rod 62. The first piston rod 62 moves up and down, thereby driving the light source board 51 to move up and down within the tunnel frame 4. The UVLED surface light source assembly 5 uses an existing Futanxi brand ultraviolet UVLED surface light source. The wavelength and effective irradiation area can be customized. The power is 1000W, and the cooling method can be air cooling or water cooling. Because it is a cold light source, it has no heat radiation and does not require preheating, resulting in low energy consumption and a long service life. As the tray 3 moves under the light source board 51 when it passes under the tunnel frame 4, the light source board 51 is kept at a suitable height. The circuit board on the tray 3 slowly moves through the irradiation area under the light source board 51 to complete the curing work. The curing work is completed when the tray 3 moves from the first waiting area 11 to the second waiting area, or it can be completed when the tray 3 moves from the second waiting area to the first waiting area 11.

[0028] like Figure 1 , Figure 4 and Figure 5 As shown, two trays 3 with circuit boards laid flat are placed on corresponding drive devices. The drive device above moves the corresponding trays 3 (from the first waiting area 11 to the second waiting area 12 or from the second waiting area to the first waiting area 11). When passing under the light source board 51, the solder resist is cured, and the trays 3 continue to move until they reach the other end (e.g., Figure 4 As shown, the distance between the two symmetrical displacement components 2 at the same height is greater than the width of the light source board 51. After the circuit board on the upper tray 3 is cured, the first lifting rod 6 drives the light source board 51 downward until it is at a suitable distance from the lower tray 3. The two symmetrical displacement components 2 on the upper layer are located on both sides of the light source board 51. The driving device on the lower layer drives the corresponding tray 3 to move. When the circuit board on the lower tray 3 passes under the light source board 51, the solder resist is cured. Since the first waiting area 11 and the second waiting area 12 on the bracket 1 can both place and remove the tray 3, the staff can work at both ends of the device. After the solder resist on one side of the circuit board is cured, it can be flipped over and returned to its original position by the same driving device or another driving device. During the return process, the solder resist on the other side of the circuit board is cured. The whole device has good adaptability to the installation environment.

[0029] like Figure 1 , Figure 2 and Figure 4As shown, each of the four first support legs 13 of the bracket 1 is connected to a second telescopic leg 7. The second telescopic leg 7 is an electric cylinder, including a second cylinder body 71 and a second piston rod 72. When the second piston rod 72 moves up and down, it drives the bracket 1 to move up and down as a whole, thereby changing the height of the bracket 1 and thus changing the height of the tray 3. Different tray 3 heights allow the staff to adopt a standing or sitting posture, improving the comfort of the staff during long-term work.

[0030] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. A tunnel curing device for solder resist on circuit boards, characterized in that, The device includes a support (1), a drive unit connected to the support (1), a tray (3) disposed on the drive unit, a tunnel frame (4) disposed on the support (1), and a UVLED surface light source assembly (5) disposed on the tunnel frame (4). The UVLED surface light source assembly (5) includes a light source plate (51) and a main unit (52). The support (1) is provided with a first waiting area (11) and a second waiting area (12) symmetrical to the first waiting area (11). When the drive unit drives the tray (3) to move between the first waiting area (11) and the second waiting area, it passes under the light source plate (51).

2. The circuit board solder resist tunnel curing device according to claim 1, characterized in that, The drive device includes two opposing displacement components (2), each displacement component (2) including a base (21), a lead screw rotatably connected to the base (21), a slide (22) movably connected to the lead screw, and a drive motor (23) connected to the lead screw.

3. The circuit board solder resist tunnel curing device according to claim 2, characterized in that, The slide (22) is provided with a limiting block (221), and the tray (3) is provided with a limiting through hole (32) corresponding to the limiting block (221). When the tray (3) is placed on the slide (22), the limiting block (221) is inserted into the limiting through hole (32).

4. The circuit board solder resist tunnel curing device according to claim 2, characterized in that, The bottom of the tray (3) is provided with a plurality of rollers (31), which roll on the base (21).

5. The circuit board solder resist tunnel curing device according to claim 1, characterized in that, The light source board (51) is movably connected to the tunnel frame (4) via the first lifting rod (6).

6. The circuit board solder resist tunnel curing device according to claim 1, characterized in that, The bracket (1) is provided with multiple second telescopic legs (7).

7. The circuit board solder resist tunnel curing device according to claim 1, characterized in that, The drive device is provided in two or more parts, which are arranged one above the other.