Substrate convex grinding device for crystal oscillator processing

Abstract

The utility model relates to the field of crystal oscillator processing, in particular to a substrate convex grinding device for crystal oscillator processing, which comprises a bearing table, and four groups of supporting legs are mounted below the bearing table. According to the crystal oscillator substrate grinding device, a crystal oscillator substrate is placed in the rubber frame, the arc-shaped rubber plate is attached to the limiting plate through the conveying belt, the crystal oscillator substrate is clamped by the two sets of rubber push plates and ground through the convex grinding machine, and after grinding is completed, the arc-shaped rubber plate will be disengaged from one side of the limiting plate; at the moment, the springs enable the two sets of rubber push plates to be reset and separated from one side of the crystal oscillator substrate, the crystal oscillator substrate can be taken out of the rubber frame, the crystal oscillator substrate can be continuously ground through the structure, the grinding efficiency is improved, fixing and clamping of the crystal oscillator substrate can be automatically completed in the grinding process, and the crystal oscillator substrate can be fixed and clamped by rotating the bolts. And the position of the limiting plate is adjusted, so that the clamping distance of the rubber push plate is changed, and the rubber push plate can be adjusted according to the size of the crystal oscillator substrate.

Description

Technical Field

[0001] This utility model relates to the field of crystal oscillator chip processing, specifically to a substrate convex grinding device for crystal oscillator chip processing. Background Technology

[0002] Crystal oscillators are derived from polyhedral quartz rods, which are first cut into shiny hexahedral rods. After repeated cutting and grinding, the quartz rods are finally made into a bunch of thin discs. During the processing, due to the small size of the crystal oscillators, a convex grinding process is generally used to polish them.

[0003] A search revealed a utility model patent with publication number CN220408328U, which discloses a grinding device for crystal oscillator production and processing. The device includes a base, a placement platform fixedly connected to the top center of the base, and a clamping assembly on the top of the placement platform. The clamping assembly includes clamping plates, arranged symmetrically in two pairs. Each clamping plate has a bolt on one side, with one end of the bolt passing through one side of the clamping plate and extending to the other side where a washer is fixedly connected. The bolt and clamping plate are threaded together. Symmetrically shaped movement grooves are formed inside the clamping plates, and each movement groove contains a button. A return spring is symmetrically fixedly connected to the side of the button near the inner wall of the movement groove. This clamping assembly effectively prevents the pressure plate on top of the crystal oscillator from being compressed solely by the spring. During grinding, insufficient fixing force on the top of the crystal oscillator could cause the bottom of the crystal oscillator to slide against the placement platform, thus improving the stability of the device.

[0004] The aforementioned patent uses a clamping assembly to prevent the crystal oscillator placement platform from sliding, thus improving the stability of the equipment. However, the crystal oscillator production process involves many grinding steps, and the grinding method in the aforementioned patent is only one of the coarser grinding steps. The more refined grinding process in the crystal oscillator production process is the convex grinding process. However, because the grinding process is more refined, existing convex grinding devices can only grind the crystal oscillator substrates sequentially. Since the amount of crystal oscillator substrates to be ground is large, the convex grinding production efficiency of the crystal oscillator substrates is relatively slow.

[0005] Therefore, it is necessary to invent a substrate convex grinding device for crystal oscillator wafer processing to solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a substrate grinding device for crystal oscillator wafer processing. By bonding the arc-shaped rubber plate and the limiting plate and adjusting the position of the limiting plate, the device can achieve continuous automatic clamping and grinding of the crystal oscillator wafer substrate and adjust the clamping distance according to the size of the crystal oscillator wafer substrate, thereby solving the problem of low efficiency in the existing crystal oscillator wafer substrate grinding process.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a substrate grinding device for crystal oscillator processing, comprising: a support platform, four sets of support legs installed below the support platform, a support arm installed above the support platform, and a grinding machine installed below the support arm, the grinding machine being used to grind the crystal oscillator substrate;

[0008] A conveying assembly, mounted on the surface of the support platform, is used to convey the crystal oscillator substrate;

[0009] A fixing component, located above the conveying component, is used to fix the crystal oscillator substrate;

[0010] Adjustment components are mounted on the surface of the support platform.

[0011] Preferably, the conveying assembly includes: a fixed frame, the fixed frame is installed on the surface of the support platform, two sets of fixed frames are symmetrically installed on the surface of the support platform, a motor is installed on one side of one set of fixed frames, a roller is fixedly connected to the output end of the motor, and a conveyor belt is attached between the two sets of rollers.

[0012] Preferably, the fixing component includes: a rubber pad, which is installed on the surface of the conveyor belt and several sets of rubber pads are installed. A rubber frame is fixedly connected above the rubber pad. Three sets of connecting holes are symmetrically opened on the inner wall of the rubber frame, and a connecting rod is connected through the connecting holes.

[0013] Preferably, a spring is sleeved on the connecting rod, and an arc-shaped rubber plate is attached to one side of the spring. The arc-shaped rubber plate is fixedly connected to three sets of connecting rods on one side. A rubber push plate is fixedly connected to the side of the three sets of connecting rods away from the arc-shaped rubber plate, and the rubber push plate is set inside the rubber frame.

[0014] Preferably, the adjustment component includes: a connecting frame, which is installed on the surface of the support platform, a portion of the conveyor belt is connected through the connecting frame, and two sets of through holes are symmetrically opened on the inner wall of the connecting frame, with push rods connected through the through holes.

[0015] Preferably, a limiting plate is fixedly connected to both sets of push rods. The limiting plate is set inside the connecting frame. A bolt is rotatably connected to one side of the limiting plate. A threaded hole is opened on the inner wall of the connecting frame, and the threaded hole is threadedly connected to the bolt.

[0016] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0017] By placing the crystal oscillator substrate into a rubber frame, a conveyor belt brings the arc-shaped rubber plate into contact with the limiting plate, allowing two sets of rubber push plates to clamp the crystal oscillator substrate. The substrate is then ground using a convex grinding machine. After grinding, the arc-shaped rubber plate detaches from one side of the limiting plate. At this point, a spring resets the two sets of rubber push plates, causing them to detach from one side of the crystal oscillator substrate, allowing the substrate to be removed from the rubber frame. This structure allows for continuous grinding of the crystal oscillator substrate, improving grinding efficiency. Furthermore, the grinding process automatically secures and clamps the crystal oscillator substrate. By rotating the bolts, the position of the limiting plate can be adjusted, thereby changing the clamping distance of the rubber push plates, allowing it to be adjusted according to the size of the crystal oscillator substrate. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a top view cross-sectional structural diagram of the rubber pad of this utility model;

[0021] Figure 3 This is a top view cross-sectional structural diagram of the connecting frame of this utility model.

[0022] Explanation of reference numerals in the attached figures:

[0023] 001, Support platform; 101, Support leg; 102, Support arm; 103, Grinding mill; 002, Conveying assembly; 201, Fixing frame; 202, Motor; 203, Roller; 204, Conveyor belt; 003, Fixing assembly; 301, Rubber pad; 302, Rubber frame; 303, Connecting hole; 304, Connecting rod; 305, Spring; 306, Arc-shaped rubber plate; 307, Rubber push plate; 004, Adjusting assembly; 401, Connecting frame; 402, Limiting plate; 403, Push rod; 404, Through hole; 405, Bolt; 406, Threaded hole. Detailed Implementation

[0024] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0025] This utility model provides, for example Figure 1-3The device shown is a substrate grinding device for processing crystal oscillator wafers, including: a support platform 001, four sets of support legs 101 installed below the support platform 001, a support arm 102 installed above the support platform 001, and a grinding machine 103 installed below the support arm 102. The grinding machine 103 is used to grind the crystal oscillator wafer substrate.

[0026] The conveying assembly 002 is mounted on the surface of the support platform 001 and is used to convey the crystal oscillator substrate;

[0027] The fixing component 003 is disposed above the conveying component 002 and is used to fix the crystal oscillator substrate;

[0028] Adjustment component 004 is mounted on the surface of support platform 001.

[0029] like Figure 1 As shown, the conveying assembly 002 includes: a fixed frame 201, which is installed on the surface of the support platform 001. Two sets of fixed frames 201 are symmetrically installed on the surface of the support platform 001. A motor 202 is installed on one side of one set of fixed frames 201. A roller 203 is fixedly connected to the output end of the motor 202. A conveyor belt 204 is attached between the two sets of rollers 203. The motor 202 drives the rollers 203 to rotate, thereby driving the conveyor belt 204 to move.

[0030] like Figure 1 and Figure 2 As shown, the fixing component 003 includes: a rubber pad 301, which is installed on the surface of the conveyor belt 204 and has several sets. A rubber frame 302 is fixedly connected above the rubber pad 301. Three sets of connecting holes 303 are symmetrically opened on the inner wall of the rubber frame 302. A connecting rod 304 is connected through the connecting hole 303. The conveyor belt 204 can drive the rubber pad 301 to move. Due to the material of the rubber pad 301, the conveyor belt 204 can transport normally.

[0031] like Figure 1 and Figure 2 As shown, a spring 305 is sleeved on the connecting rod 304. An arc-shaped rubber plate 306 is attached to one side of the spring 305. The arc-shaped rubber plate 306 is fixedly connected to three sets of connecting rods 304 on one side. A rubber push plate 307 is fixedly connected to the side of the three sets of connecting rods 304 away from the arc-shaped rubber plate 306. The rubber push plate 307 is set inside the rubber frame 302. Through the connecting rod 304, the arc-shaped rubber plate 306 can push the rubber push plate 307 to move, thereby squeezing the spring 305 with the arc-shaped rubber plate 306, and the spring 305 can reset the rubber push plate 307.

[0032] like Figure 3As shown, the adjustment component 004 includes: a connecting frame 401, which is installed on the surface of the support platform 001. A portion of the conveyor belt 204 is connected through the connecting frame 401. Two sets of through holes 404 are symmetrically opened on the inner wall of the connecting frame 401. A push rod 403 is connected through the through holes 404. Through the through connection of the two sets of through holes 404 and the push rod 403, the limiting plate 402 can run smoothly within the connecting frame 401.

[0033] like Figure 3 As shown, a limiting plate 402 is fixedly connected to two sets of push rods 403. The limiting plate 402 is set inside the connecting frame 401. A bolt 405 is rotatably connected to one side of the limiting plate 402. A threaded hole 406 is opened on the inner wall of the connecting frame 401. The threaded hole 406 is threadedly connected to the bolt 405. By rotating the bolt 405 along the threaded hole 406, the bolt 405 can push the limiting plate 402 to move inside the connecting frame 401.

[0034] The working principle of this practical application is as follows:

[0035] Refer to the instruction manual appendix Figure 1-3 By placing the crystal oscillator substrate into the rubber frame 302, the motor 202 is started. The motor 202 drives the roller 203 to rotate, and the roller 203 drives the conveyor belt 204 to move. The conveyor belt 204 moves the rubber frame 302 into the connecting frame 401, causing the arc-shaped rubber plate 306 to move to one side of the limiting plate 402. The arc-shaped rubber plate 306 pushes the connecting rod 304 to move along the connecting hole 303, and the arc-shaped rubber plate 306 compresses the spring 305, causing the connecting rod 304 to push the rubber push plate 307. The two sets of rubber push plates 307 clamp the crystal oscillator substrate and move it below the convex grinding machine 103, so that the convex grinding machine 103 can grind the crystal oscillator substrate. During the grinding process, the conveyor belt 204 continues to move, causing the arc-shaped rubber plate 306 to move away from the limiting plate 402. This allows the spring 305 to push the arc-shaped rubber plate 306 back to its original position, thereby causing the two sets of rubber push plates 307 to detach from both sides of the crystal oscillator substrate and remove the crystal oscillator substrate from the rubber frame 302, completing the convex grinding process. Depending on the size of the crystal oscillator substrate, the bolt 405 can be rotated. The bolt 405 pushes the limiting plate 402 through the threaded hole 406, causing the limiting plate 402 to drive the push rod 403 to move along the through hole 404, thereby changing the distance that the limiting plate 402 pushes the arc-shaped rubber plate 306 and thus changing the clamping distance of the two sets of rubber push plates 307.

[0036] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A substrate protrusion grinding device for processing crystal oscillator wafers, characterized in that: include: A support platform (001) is provided, with four sets of support legs (101) installed below the support platform (001), a support arm (102) installed above the support platform (001), and a convex grinding machine (103) installed below the support arm (102). A conveying assembly (002) is mounted on the surface of the support platform (001) for conveying the crystal oscillator substrate; A fixing component (003) is disposed above the conveying component (002) and is used to fix the crystal oscillator substrate; Adjustment component (004) is mounted on the surface of support platform (001).

2. The substrate convex grinding device for crystal oscillator wafer processing according to claim 1, characterized in that: The conveying assembly (002) includes: a fixed frame (201), which is installed on the surface of the support platform (001). Two sets of fixed frames (201) are symmetrically installed on the surface of the support platform (001). A motor (202) is installed on one side of one set of fixed frames (201). A roller (203) is fixedly connected to the output end of the motor (202). A conveyor belt (204) is attached between the two sets of rollers (203).

3. The substrate convex grinding device for crystal oscillator wafer processing according to claim 1, characterized in that: The fixing component (003) includes: a rubber pad (301), which is installed on the surface of the conveyor belt (204) and has several sets thereon. A rubber frame (302) is fixedly connected above the rubber pad (301). Three sets of connecting holes (303) are symmetrically opened on the inner wall of the rubber frame (302), and a connecting rod (304) is passed through the connecting hole (303).

4. The substrate convex grinding device for crystal oscillator wafer processing according to claim 3, characterized in that: A spring (305) is sleeved on the connecting rod (304). An arc-shaped rubber plate (306) is attached to one side of the spring (305). The arc-shaped rubber plate (306) is fixedly connected to three sets of connecting rods (304) on one side. A rubber push plate (307) is fixedly connected to the side of the three sets of connecting rods (304) away from the arc-shaped rubber plate (306). The rubber push plate (307) is set inside the rubber frame (302).

5. The substrate convex grinding device for crystal oscillator wafer processing according to claim 1, characterized in that: The adjustment component (004) includes: a connecting frame (401), which is installed on the surface of the support platform (001). A portion of the conveyor belt (204) is connected through the connecting frame (401). Two sets of through holes (404) are symmetrically opened on the inner wall of the connecting frame (401), and a push rod (403) is connected through the through hole (404).

6. The substrate convex grinding device for crystal oscillator wafer processing according to claim 5, characterized in that: Limiting plates (402) are fixedly connected to the two sets of push rods (403). The limiting plates (402) are set inside the connecting frame (401). A bolt (405) is rotatably connected to one side of the limiting plate (402). A threaded hole (406) is opened on the inner wall of the connecting frame (401). The threaded hole (406) is threadedly connected to the bolt (405).

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