Protection device of semiconductor chip microelectronic assembly

Abstract

The utility model relates to the technical field of semiconductor chip protection devices, in particular to a protection device of a semiconductor chip microelectronic assembly, which comprises a protection box, a plurality of groups of placing grooves are arranged at the bottom end of the inner side of the protection box, first air cushions are mounted on the inner sides of the placing grooves, and a protection cover is connected to the top end of the protection box in a sliding manner. A breaking-moving groove is formed in the position, located on one side of the containing groove, of the inner wall of the protection box, multiple sets of second air cushions corresponding to the containing groove are arranged and installed at the bottom end of the protection cover, the protection cover is connected with the protection box in a clamped mode through a locking mechanism, and the locking mechanism comprises a splicing assembly, a torsion assembly and a closing assembly. The device is simple in structure and rapid to operate, personnel can conveniently and rapidly lock each group of semiconductor packaging boxes, locking and unlocking can be carried out by pressing and rotating twice, the situation that box bodies or parts are damaged when the semiconductor packaging boxes are taken and placed is avoided, and the practicability of the device is further improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip protection device technology, and specifically to a protection device for semiconductor chip microelectronic components. Background Technology

[0002] Semiconductor devices, which perform specific functions, are made by etching and wiring on semiconductor wafers. These devices are not limited to silicon chips; common semiconductor materials include gallium arsenide and germanium. Semiconductor devices have a wide range of applications and are the core of modern electronic technology, influencing all aspects of people's daily lives and work. The development of semiconductor device technology has not only driven the exponential growth of computer processing speed but also made modern devices such as smartphones, smart TVs, and electric vehicles possible. Furthermore, the applications of semiconductors in communications, medical care, and industrial automation are constantly expanding, having a profound impact on modern society. Currently, most semiconductor chip microelectronic components are packaged and transported in independent spaces. However, during transportation, the component packaging boxes may shake due to vibration, causing collisions with the storage boxes and easily leading to component damage.

[0003] To address the aforementioned technical problems, Chinese Patent No. CN217295421U discloses a protective device for semiconductor chip microelectronic components. The device includes a main body, a top cover movably mounted on the upper end of the main body, a handle fixedly mounted on the upper end of the top cover, an embedded plate fixedly mounted on the outer lower end of the top cover, an embedded groove fixedly provided on the outer upper end of the main body, a protective inner box fixedly mounted in the middle of the main body, a partition plate installed in the middle of the protective inner box, protective grooves fixedly provided at the front and rear ends of the partition plate, limit blocks fixedly mounted at the left and right ends of the middle of the protective groove, and a protective base plate fixedly mounted at the front and rear ends of the lower lower end of the protective groove.

[0004] While the aforementioned existing technical solution prevents collisions with the inner wall of the protective tank during transportation, effectively improving the protective capability, it uses suction cups to adsorb semiconductor packaging boxes. If the suction cups age, deform, or become weak, they cannot effectively position the semiconductor packaging boxes. If the suction cups are strong, workers need to forcefully pry open the adsorption point when taking out the semiconductor packaging boxes, which can easily cause damage to the semiconductor packaging boxes during the prying process, affecting the practicality of the device. Utility Model Content

[0005] The purpose of this utility model is to provide a protective device for semiconductor chip microelectronic components, in order to solve the problems mentioned in the background art, which use suction cups to adsorb semiconductor packaging boxes. If the suction cups are aged and deformed and the suction power is insufficient, they cannot effectively position the semiconductor packaging boxes. If the suction cups have strong suction power, the staff will need to forcefully pry open the adsorption point when taking out the semiconductor packaging boxes. During the prying and pulling process, the semiconductor packaging boxes are easily damaged, which affects the practicality of the device.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A protective device for a semiconductor chip microelectronic component includes a protective box. Multiple placement slots are arranged on the bottom inner side of the protective box. A first air cushion is installed inside each placement slot. A protective cover is slidably connected to the top of the protective box. A prying groove is provided on one side of the placement slot on the inner wall of the protective box. Multiple second air cushions corresponding to the placement slots are arranged on the bottom of the protective cover. The protective cover is engaged with the protective box via a locking mechanism. The locking mechanism includes a splicing component, a torsion component, and a sealing component. The splicing component is used to splice the protective cover onto the protective box. The sealing component is used to seal the operating parts on the torsion component. The torsion component is used to release the lock between the protective cover and the protective box.

[0008] As a preferred embodiment of this utility model, the splicing assembly includes a sliding rod embedded and slidably connected inside the protective cover. A positioning block is installed at one end of the sliding rod. A splicing groove is formed in the center of the inner wall of the protective box. An installation groove is formed on one side of the splicing groove inside the protective box. Carding plates are installed at both ends of the outer side of the positioning block. The side cross-section of the carding plate is L-shaped. The positioning block and the carding plate are slidably connected to the splicing groove. Card slots are formed on both sides of the inner wall of the installation groove near the splicing groove port. The carding plate and the card slot are engaged.

[0009] As a preferred embodiment of this utility model, a first spring is installed at both ends of the inner side of the mounting groove, and a docking plate is installed at the other end of the first spring. The docking plate is slidably connected to the mounting groove. A movable seat is rotatably connected inside the docking plate. A positioning groove is opened on one side of the movable seat. The positioning groove is engaged with the positioning block. The splicing groove is a cross groove. The sliding rod is slidably connected to the center of the cross of the splicing groove. The diameter of the sliding rod is greater than the width of the longitudinal and transverse openings of the splicing groove.

[0010] As a preferred embodiment of this utility model, the torsion assembly includes an extrusion groove located inside the protective cover and outside the sliding rod. An extrusion plate is installed on the outside of the sliding rod. Second springs are installed between the two ends of one side of the extrusion plate and the inner wall of the extrusion groove. An extension groove is provided on the other side of the protective cover. A pull ring is rotatably connected to one end of the sliding rod that extends into the extension groove. A recycling groove is provided on the side of the protective cover near the protective box.

[0011] As a preferred embodiment of this utility model, the sealing component includes a drag groove formed on one side of the protective cover, the inner side of the drag groove is connected to the inner side of the extension groove, a drag plate is slidably connected to the inner side of the drag groove, and connecting grooves extending to the inner wall of the extension groove are formed on both sides of the inner wall of the drag groove. Connecting blocks that are slidably connected to the connecting grooves are installed at both ends of the drag plate.

[0012] As a preferred embodiment of this utility model, a snap-on groove is provided on one side of the pull plate, a first fixing member is embedded in one end of the pull plate, and a second fixing member corresponding to the first fixing member is embedded in one side of the inner wall of the extension groove.

[0013] As a preferred embodiment of this utility model, both the first fixing member and the second fixing member are magnetic members, and the magnetic properties of the first fixing member and the second fixing member are opposite and attract each other.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] In this invention, the protective cover is spliced ​​onto the protective box by a splicing component, the sealing component seals the operating parts on the twisting component, and the twisting component releases the lock between the protective cover and the protective box. The structure is simple and the operation is quick, making it easy for personnel to quickly lock each group of semiconductor packaging boxes. Locking and unlocking can be performed by pressing and twisting, avoiding damage to the box or components when picking up and putting down semiconductor packaging boxes, and further improving the practicality of the device. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a partial three-dimensional structural diagram of the protective box of this utility model;

[0018] Figure 3 This is a partial cross-sectional view of the locking mechanism of this utility model.

[0019] In the diagram: 1. Protective box; 2. First air cushion; 3. Protective cover; 4. Second air cushion; 5. Sliding rod; 6. Positioning block; 7. Clamping plate; 8. First spring; 9. Connecting plate; 10. Movable seat; 11. Second spring; 12. Pull ring; 13. Pulling plate; 14. Connecting groove; 15. First fixing component; 16. Bending groove; 17. Squeezing plate. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0021] Example: Please refer to Figures 1-3 This utility model provides a technical solution:

[0022] A protective device for semiconductor chip microelectronic components includes a protective box 1. Multiple placement slots are arranged on the inner bottom of the protective box 1. A protective cover 3 is engaged with the protective box 1 via a locking mechanism. The locking mechanism includes a splicing component, a twisting component, and a sealing component. The splicing component is used to splice the protective cover 3 onto the protective box 1. The sealing component is used to seal the operating parts on the twisting component. The twisting component is used to release the lock between the protective cover 3 and the protective box 1. In use, the protective cover 3 can be spliced ​​onto the protective box 1 via the splicing component, the operating parts on the twisting component can be sealed via the sealing component, and the lock between the protective cover 3 and the protective box 1 can be released via the twisting component. The device has a simple structure and quick operation, allowing personnel to quickly lock each semiconductor packaging box. Locking and unlocking can be performed with a simple press and two turns, avoiding damage to the box or components when handling semiconductor packaging boxes, further improving the practicality of the device.

[0023] In this embodiment, as Figure 1 , Figure 2 and Figure 3As shown, the splicing assembly includes a sliding rod 5 embedded and slidably connected inside the protective cover 3. A positioning block 6 is installed at one end of the sliding rod 5. A splicing groove is opened in the center of the inner wall of the protective box 1. An installation groove is opened on one side of the splicing groove inside the protective box 1. A locking plate 7 is installed at both ends of the outer side of the positioning block 6. The side cross section of the locking plate 7 is L-shaped. The positioning block 6 and the locking plate 7 are slidably connected to the splicing groove. A locking slot is opened on both sides of the inner wall of the installation groove near the splicing groove port. The locking plate 7 is engaged with the locking slot. First, the semiconductor packaging box is placed on the first air cushion 2 inside the placement groove. Then, the protective cover 3 is attached to the protective box 1, so that the second air cushion 4 contacts the other side of the semiconductor packaging box. Then, the sliding rod 5 is pressed to drive the extrusion plate 17 to move. The extrusion plate 17 is squeezed to compress the two sets of second springs 11, so that the locking plate 7 and the positioning block 6 extend out of the recycling groove and slide into the splicing groove to complete the initial splicing and docking.

[0024] In this embodiment, as Figure 1 , Figure 2 and Figure 3 As shown, a first spring 8 is installed at both ends of the inner side of the mounting groove, and a docking plate 9 is installed at the other end of the first spring 8. The docking plate 9 is slidably connected to the mounting groove. A movable seat 10 is rotatably connected inside the docking plate 9. A positioning groove is opened on one side of the movable seat 10. The positioning groove is engaged with the positioning block 6. The splicing groove is a cross groove. The sliding rod 5 is slidably connected to the center of the cross of the splicing groove. The diameter of the sliding rod 5 is greater than the width of the longitudinal and transverse openings of the splicing groove. Then, after the clamping plate 7 and the positioning block 6 are fully inserted into the inner side of the mounting groove, the positioning block 6 engages with the positioning groove. The docking plate 9 drives the two sets of first springs 8 to retract. Then, the pull ring 12 is twisted to cooperate with the movable seat 10 to drive the clamping plate 7 to rotate to the transverse direction. Then, the pull ring 12 is slowly released to make the clamping plate 7 engage with the inner side of the clamping groove for locking installation.

[0025] In this embodiment, as Figure 1 , Figure 2 and Figure 3 As shown, the torsion assembly includes a compression groove located inside the protective cover 3 and outside the sliding rod 5. A compression plate 17 is installed on the outside of the sliding rod 5. A second spring 11 is installed between both ends of one side of the compression plate 17 and the inner wall of the compression groove. An extension groove is provided on the other side of the protective cover 3. A pull ring 12 is rotatably connected to one end of the sliding rod 5 that extends into the extension groove. A recycling groove is provided on the side of the protective cover 3 near the protective box 1. Further, the pull ring 12 is fastened again to compress the sliding rod 5. Then the clamping plate 7 is rotated to the longitudinal direction again. Then the clamping plate 7 is released to allow it to slide out along the splicing groove. Then it is reset to the inside of the recycling groove. At this time, the protective cover 3 can be removed and the semiconductor packaging box on the first air cushion 2 can be taken out.

[0026] In this embodiment, as Figure 1 , Figure 2 and Figure 3 As shown, the enclosure includes a drag groove on one side of the protective cover 3, the inner side of the drag groove is connected to the inner side of the extension groove, a drag plate 13 is slidably connected to the inner side of the drag groove, and connecting grooves 14 extending to the inner wall of the extension groove are provided on both sides of the inner wall of the drag groove. Connecting blocks that are slidably connected to the connecting grooves 14 are installed at both ends of the drag plate 13. A snap-on groove is provided on one side of the drag plate 13, and a first fixing member 15 is embedded in one end of the drag plate 13. A second fixing member corresponding to the first fixing member 15 is embedded in one side of the inner wall of the extension groove. Both the first fixing member 15 and the second fixing member are magnetic. The first fixing member 15 and the second fixing member have opposite magnetic properties and attract each other. Furthermore, the snap-on groove on the drag plate 13 can be used to slide along the direction of the connecting groove 14, so that the first fixing member 15 on the drag plate 13 is close to the second fixing member. After adsorption, the pull ring 12 can be covered inside the extension groove to prevent subsequent personnel from accidentally touching it.

[0027] In this embodiment, as Figure 1 , Figure 2 and Figure 3 As shown, a first air cushion 2 is installed inside the placement slot, and a protective cover 3 is slidably connected to the top of the protective box 1. A shifting groove 16 is opened on one side of the inner wall of the protective box 1 located in the placement slot. Multiple sets of second air cushions 4 corresponding to the placement slot are arranged at the bottom of the protective cover 3. Furthermore, after the semiconductor packaging box is placed, it is placed between the first air cushion 2 and the second air cushion 4. The first air cushion 2 and the second air cushion 4 wrap around and protect the semiconductor packaging box, preventing it from colliding with the inner wall of the placement slot, and can also absorb some of the impact force when the box shakes.

[0028] The implementation principle of a protective device for semiconductor chip microelectronic components in this application embodiment is as follows: First, place the semiconductor packaging box on the first air cushion 2 inside the placement slot, then attach the protective cover 3 to the protective box 1, so that the second air cushion 4 contacts the other side of the semiconductor packaging box. Next, press the sliding rod 5 to drive the extrusion plate 17 to move. The extrusion plate 17 compresses the two sets of second springs 11, causing the card plate 7 and positioning block 6 to extend out of the recycling slot. The card plate 7 and positioning block 6 slide into the splicing slot to complete the initial splicing and docking. After the card plate 7 and positioning block 6 are fully inserted into the installation slot, the positioning block 6 engages with the positioning slot. The docking plate 9 drives the two sets of first springs 8 to retract. Then, twist the pull ring 12 to cooperate with the movable seat 10 to drive the card plate 7 to rotate to the side. Then, slowly release the pull ring 12 to make the card plate 7 engage. Inside the slot, lock the installation, snap the pull ring 12 again to squeeze the sliding rod 5, then rotate the clamping plate 7 to the longitudinal direction again, then release the clamping plate 7 to let it slide out along the splicing slot, and then return it to the inside of the recycling slot. At this time, the protective cover 3 can be removed, and the semiconductor packaging box on the first air cushion 2 can be taken out. After installation, the pull groove on the pull plate 13 can be snapped and the connecting block can be slid along the direction of the connecting slot 14, so that the first fixing part 15 on the pull plate 13 is close to the second fixing part. After adsorption, the pull ring 12 can be covered inside the extension slot to prevent subsequent personnel from accidentally touching it. After the semiconductor packaging box is placed, it is placed between the first air cushion 2 and the second air cushion 4. The first air cushion 2 and the second air cushion 4 wrap and protect the semiconductor packaging box, preventing it from colliding with the inner wall of the placement slot, and can also absorb some of the impact force when the box shakes.

[0029] The control method of this utility model is through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The power supply is also common knowledge in the field. Since this utility model is used to protect mechanical devices, the control method and circuit connection will not be explained in detail.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A protection device for a semiconductor chip microelectronic component, comprising a protection box (1), characterized in that: The protective box (1) has multiple sets of placement slots arranged on the bottom inner side. A first air cushion (2) is installed inside the placement slot. A protective cover (3) is slidably connected to the top of the protective box (1). A prying groove (16) is opened on one side of the placement slot on the inner wall of the protective box (1). Multiple sets of second air cushions (4) corresponding to the placement slot are arranged at the bottom of the protective cover (3). The protective cover (3) is engaged with the protective box (1) through a locking mechanism. The locking mechanism includes a splicing component, a torsion component, and a closing component. The splicing component is used to splice the protective cover (3) onto the protective box (1). The closing component is used to close the operating parts on the torsion component. The torsion component is used to release the lock between the protective cover (3) and the protective box (1).

2. The protection device for a semiconductor chip microelectronic component according to claim 1, characterized in that: The splicing assembly includes a sliding rod (5) embedded in the protective cover (3) and slidably connected inside. A positioning block (6) is installed at one end of the sliding rod (5). A splicing groove is provided in the center of the inner wall of the protective box (1). An installation groove is provided inside the protective box (1) on one side of the splicing groove. A card plate (7) is installed at both ends of the outer side of the positioning block (6). The side cross section of the card plate (7) is L-shaped. The positioning block (6) and the card plate (7) are slidably connected to the splicing groove. Card slots are provided on both sides of the inner wall of the installation groove near the splicing groove port. The card plate (7) is engaged with the card slot.

3. The protection device for a semiconductor chip microelectronic component according to claim 2, characterized in that: Both ends of the inner side of the mounting groove are equipped with a first spring (8), and the other end of the first spring (8) is equipped with a docking plate (9). The docking plate (9) is slidably connected to the mounting groove. The docking plate (9) is rotatably connected to a movable seat (10). A positioning groove is opened on one side of the movable seat (10). The positioning groove is engaged with the positioning block (6). The splicing groove is a cross groove. The sliding rod (5) is slidably connected to the center of the cross of the splicing groove. The diameter of the sliding rod (5) is greater than the width of the longitudinal and transverse openings of the splicing groove.

4. The protection device for a semiconductor chip microelectronic component according to claim 3, characterized in that: The torsion assembly includes an extrusion groove located inside the protective cover (3) and outside the sliding rod (5). An extrusion plate (17) is installed on the outside of the sliding rod (5). A second spring (11) is installed between the two ends of one side of the extrusion plate (17) and the inner wall of the extrusion groove. An extension groove is provided on the other side of the protective cover (3). A pull ring (12) is rotatably connected to one end of the sliding rod (5) that extends to the inside of the extension groove. A recycling groove is provided on the side of the protective cover (3) near the protective box (1).

5. The protection device for a semiconductor chip microelectronic component according to claim 4, characterized in that: The enclosure includes a drag groove on one side of the protective cover (3), the inner side of the drag groove is connected to the inner side of the extension groove, a drag plate (13) is slidably connected to the inner side of the drag groove, and a connecting groove (14) extending to the inner wall of the extension groove is provided on both sides of the inner wall of the drag groove. A connecting block that is slidably connected to the connecting groove (14) is installed at both ends of the drag plate (13).

6. The protection device for a semiconductor chip microelectronic component according to claim 5, characterized in that: The pull plate (13) has a pull groove on one side, and a first fixing member (15) is embedded in one end of the pull plate (13). A second fixing member corresponding to the first fixing member (15) is embedded in one side of the inner wall of the extension groove.

7. The protection device for a semiconductor chip microelectronic component according to claim 6, characterized in that: Both the first fixing member (15) and the second fixing member are magnetic components, and the magnetic properties of the first fixing member (15) and the second fixing member are opposite and attract each other.

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