Jet equipment for resistor electroplating

Abstract

The jet flow equipment comprises a treatment bin, one end of a threaded installation ring is communicated with a nozzle, a reset rotating shaft is installed at the upper end of the inner wall of the nozzle, a one-way sealing plate is installed on one side of the reset rotating shaft, and a servo motor is installed on the edge of the lower end of the front side of the treatment bin in an inserted mode. And the output end of the servo motor is connected with one end of the jet pipe. According to the jet flow equipment for resistor electroplating, efficient circulating filtration can be carried out through the symmetrical circulating pipes, the filter box and the water pump, filtration objects can be conveniently and rapidly treated by disassembling and assembling the filter blocks, inclined movable jet flow can be carried out through the nozzles and the servo motor, the jet flow effect is good, and the practicability is high. And the electric push rod can drive the anode bag to perform lifting adjustment, clamping and rapid dismounting can be conveniently performed through the mounting base and the clamping plate, the nozzle can be rapidly dismounted through the threaded mounting ring, and one-way opening and closing can be performed through the reset rotating shaft and the one-way closing plate, so that blockage is avoided.

Description

Technical Field

[0001] This utility model relates to the field of resistor electroplating jet technology, specifically to a jet device for resistor electroplating. Background Technology

[0002] Barrel plating is a method in which small parts are placed inside a special barrel and a metal or alloy coating is deposited on the surface of the parts through indirect electrical conduction while the parts are rolling.

[0003] Existing equipment performs barrel plating using a non-jet-flow circulation method in a nickel-tin barrel plating bath. However, this method only involves simple filtration and circulation, resulting in poor fluidity and reduced dispersion of the plating solution, which affects the quality of the plating layer and leads to unsatisfactory performance. Therefore, a jet-flow device for resistor electroplating is needed to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a jetting device for resistor electroplating, in order to solve the problems mentioned in the background art, such as the device having only simple filtration and circulation, poor fluidity of the plating solution, reduced dispersion ability of the plating solution, affecting the quality of the plating layer, and poor performance.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a jetting device for resistor electroplating, comprising a processing chamber, jetting pumps installed on the upper ends of both sides of the processing chamber, and an anode bag placed on the inner wall of the processing chamber. A filter box is installed at the lower end of the front and rear of the processing chamber, and filter blocks are inserted into the lower end of the inner wall of the filter box. A circulation pipe is connected to the upper and lower ends of the filter box, and a water pump is connected to the circulation pipe. The circulation pipe is connected to the processing chamber, and an electric push rod is inserted into the edge of the inner wall of the processing chamber. A mounting base is installed on one side of the output end of the electric push rod, and a connecting hinge is installed on one side of the upper end of the mounting base. A clamping plate is installed on the other side of the connecting hinge, and the inner wall of the clamping plate... A locking knob is vertically inserted on one side. Positioning slots are provided at the upper end of the mounting base and the lower end of the clamping plate. A connecting rod is inserted into the inner wall of the positioning slot. The lower end of the connecting rod is connected to the anode bag. A guide pipe is connected to one side of the jet pump, and a jet pipe is rotatably installed at one end of the guide pipe. A water outlet is connected to one side of the jet pipe, and a threaded mounting ring is rotatably installed at one end of the water outlet. A nozzle is connected to one end of the threaded mounting ring, and a reset shaft is installed on the upper end of the inner wall of the nozzle. A one-way sealing plate is installed on one side of the reset shaft. A servo motor is inserted into the lower edge of the front side of the treatment chamber, and the output end of the servo motor is connected to one end of the jet pipe.

[0006] Preferably, the filter box is connected to the treatment chamber via a circulation pipe and a water pump in a suction circulation manner, and the filter box and circulation pipe are symmetrically distributed in front of and behind the treatment chamber. The filter block has a groove structure and is installed by interlocking with the filter box.

[0007] Preferably, the jet pipe is connected to the anode bag in a jet communication manner through a jet pump and a guide pipe, and the jet pipe and nozzle are connected to the processing chamber in a reset rotational manner through a servo motor, and the guide pipe is integrated with a regulating valve.

[0008] Preferably, the anode bag is connected to the processing chamber in a lifting and lowering motion via an electric push rod.

[0009] Preferably, the anode bag is installed by fastening and splicing with the mounting base through a connecting rod and a positioning buckle groove, and the connecting rod is fixedly installed by clamping the mounting base and a clamping plate, and the clamping plate is fixedly connected to the mounting base by a locking knob.

[0010] Preferably, the position of the nozzle matches the position of the anode bag, and the nozzle is rotatably spliced ​​to the outlet via a threaded mounting ring, and the one-way sealing plate is connected to the nozzle via a reset rotating shaft in a reset flip connection.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: the jetting device for resistor electroplating can achieve efficient circulation filtration through symmetrical circulation pipes, filter boxes and water pumps, and can be disassembled and assembled through filter blocks for convenient and rapid processing of filtered materials. It can also be tilted and jetted through nozzles and servo motors, resulting in excellent jetting effect. Furthermore, the anode bag can be raised and lowered by an electric push rod, and can be clamped and quickly disassembled through mounting bases and clamps. The nozzles can be quickly disassembled and assembled through threaded mounting rings, and can be opened and closed in one direction through a reset shaft and a one-way sealing plate to avoid clogging. Attached Figure Description

[0012] Figure 1 This is a front view of a jetting device for resistor electroplating according to this utility model;

[0013] Figure 2 This is a schematic diagram of the internal structure of a jetting device for resistor electroplating according to the present invention.

[0014] Figure 3 This is a schematic diagram showing the connection between the mounting base and the clamping plate of a jetting device for resistor electroplating according to this utility model.

[0015] Figure 4 This utility model relates to a jetting device for resistor electroplating. Figure 2 Enlarged view of point A in the middle;

[0016] Figure 5 This utility model relates to a jetting device for resistor electroplating. Figure 2 Enlarged view at point B in the middle;

[0017] Figure 6 This utility model relates to a jetting device for resistor electroplating. Figure 3 Enlarged view of point C in the middle.

[0018] In the diagram: 1. Treatment chamber, 2. Circulation pipe, 3. Filter box, 4. Jet pump, 5. Mounting base, 6. Connecting rod, 7. Water pump, 8. Servo motor, 9. Jet pipe, 10. Electric push rod, 11. Anode bag, 12. Guide pipe, 13. Locking knob, 14. Clamping plate, 15. Connecting hinge, 16. Nozzle, 17. Reset shaft, 18. One-way sealing plate, 19. Water outlet, 20. Threaded mounting ring, 21. Filter block, 22. Positioning slot. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-6 This utility model provides a technical solution: a jetting device for resistor electroplating, comprising a treatment chamber 1, a circulation pipe 2, a filter box 3, a jetting pump 4, a mounting base 5, a connecting rod 6, a water pump 7, a servo motor 8, a jetting pipe 9, an electric push rod 10, an anode bag 11, a guide pipe 12, a locking knob 13, a clamping plate 14, a connecting hinge 15, a nozzle 16, a reset shaft 17, a one-way sealing plate 18, a water outlet 19, a threaded mounting ring 20, a filter block 21, and a positioning slot 22. The jetting pump 4 is installed on the upper ends of both sides of the treatment chamber 1, and an anode bag 11 is placed on the inner wall of the treatment chamber 1. The anode bag 11 is connected to the treatment chamber 1 via the electric push rod 10 in a lifting and movable manner, which facilitates the lifting and adjustment of the anode bag 11 and its disassembly and assembly. The anode bag 11 is connected to the treatment chamber 1 via the connecting rod. The connecting rod 6 and the positioning slot 22 are snapped together with the mounting base 5, and the connecting rod 6 is clamped and fixed by the mounting base 5 and the clamping plate 14. The clamping plate 14 is locked and fixed to the mounting base 5 by the locking knob 13. This makes it easy to install and remove the anode bag 11 stably, and the installation is stable and the performance is good. The front and rear of the treatment chamber 1 are equipped with filter boxes 3 at the lower end, and filter blocks 21 are inserted and installed on the lower end of the inner wall of the filter box 3. The filter box 3 is connected to the treatment chamber 1 through the circulation pipe 2 and the water pump 7 in a suction circulation connection. The filter box 3 and the circulation pipe 2 are symmetrically distributed in the front and rear of the treatment chamber 1. The filter blocks 21 have a groove structure and are inserted and spliced ​​with the filter box 3. This makes it easy for the filter box 3 to carry out efficient circulation and guide, and can quickly process and filter impurities, making it convenient to use.

[0021] A circulation pipe 2 is connected to the upper and lower ends of the filter box 3, and a water pump 7 is connected to the circulation pipe 2. The circulation pipe 2 is connected to the treatment chamber 1, and an electric push rod 10 is inserted and installed on the inner wall edge of the treatment chamber 1. A mounting base 5 is installed on one side of the output end of the electric push rod 10, and a connecting hinge 15 is installed on one side of the upper end of the mounting base 5. A clamping plate 14 is installed on the other side of the connecting hinge 15, and a locking knob 13 is vertically inserted and installed on one side of the inner wall of the clamping plate 14. Positioning slots 22 are opened at the upper end of the mounting base 5 and the lower end of the clamping plate 14. A connecting rod 6 is inserted into the inner wall of the positioning slot 22. The lower end of the connecting rod 6 is connected to the anode bag 11. A guide pipe 12 is connected to one side of the jet pump 4, and a jet pipe 9 is rotatably installed at one end of the guide pipe 12. The jet pipe 9 is connected to the anode bag 11 in a jet communication through the jet pump 4 and the guide pipe 12. The jet pipe 9 and the nozzle 16 are connected to the processing chamber 1 in a reset rotational connection through the servo motor 8. An adjustment valve is integrated on the guide pipe 12, which makes it easy for the jet pipe 9 to reset and rotate, resulting in a good jetting effect.

[0022] A water outlet 19 is connected to one side of the jet pipe 9, and a threaded mounting ring 20 is rotatably installed at one end of the water outlet 19. A nozzle 16 is connected to one end of the threaded mounting ring 20, and a reset shaft 17 is installed on the upper end of the inner wall of the nozzle 16. The position of the nozzle 16 matches the position of the anode bag 11, and the nozzle 16 is rotatably spliced ​​with the water outlet 19 through the threaded mounting ring 20. The one-way sealing plate 18 is connected to the nozzle 16 through the reset shaft 17 in a reset flip connection. This makes it easy to quickly disassemble and replace the nozzle 16, and it can be opened and closed in one direction to avoid blockage. The one-way sealing plate 18 is installed on one side of the reset shaft 17. A servo motor 8 is inserted and installed at the lower edge of the front side of the treatment chamber 1, and the output end of the servo motor 8 is connected to one end of the jet pipe 9.

[0023] Working principle: When using the jetting equipment for resistor electroplating, first assemble and install the device, then connect the device to the power supply, then inject the plating solution into the processing chamber 1, then flip the clamping plate 14 open, then fasten the anode bag 11 to the mounting base 5 through the connecting rod 6 and the positioning buckle groove 22, then flip the clamping plate 14 closed and lock it in place through the locking knob 13, then drive the anode bag 11 to descend through the electric push rod 10, then spray air through the jetting pump 4 and spray it out through the nozzle 16, then drive the nozzle 16 to reciprocate and rotate through the servo motor 8. During the jetting, the plating solution can be introduced into the filter box 3 through the filter block 21 and guided back to the processing chamber 1 for circulation filtration. This is the operation process of the jetting equipment for resistor electroplating.

[0024] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A jetting device for resistor electroplating, comprising a processing chamber (1), wherein jetting pumps (4) are installed on the upper ends of both sides of the processing chamber (1), and an anode bag (11) is placed on the inner wall of the processing chamber (1), characterized in that: The processing chamber (1) has a filter box (3) installed at the lower end of the front and rear sides, and a filter block (21) is inserted into the lower end of the inner wall of the filter box (3). The upper and lower ends of the filter box (3) are connected by a circulation pipe (2), and a water pump (7) is connected to the circulation pipe (2). The circulation pipe (2) is connected to the processing chamber (1), and an electric push rod (10) is inserted into the edge of the inner wall of the processing chamber (1). A mounting base (5) is installed on one side of the output end of the electric push rod (10), and a connecting hinge (15) is installed on one side of the upper end of the mounting base (5). A clamping plate (14) is installed on the other side of the connecting hinge (15), and a locking knob (13) is vertically inserted into one side of the inner wall of the clamping plate (14). A positioning slot (22) is opened at the upper end of the mounting base (5) and the lower end of the clamping plate (14). A connecting rod (6) is inserted into the inner wall of the positioning groove (22). The lower end of the connecting rod (6) is connected to the anode bag (11). A guide pipe (12) is connected to one side of the jet pump (4). A jet pipe (9) is rotatably installed at one end of the guide pipe (12). A water outlet (19) is connected to one side of the jet pipe (9). A threaded mounting ring (20) is rotatably installed at one end of the water outlet (19). A nozzle (16) is connected to one end of the threaded mounting ring (20). A reset shaft (17) is installed on the upper end of the inner wall of the nozzle (16). A one-way sealing plate (18) is installed on one side of the reset shaft (17). A servo motor (8) is inserted into the lower edge of the front side of the treatment chamber (1). The output end of the servo motor (8) is connected to one end of the jet pipe (9).

2. The jetting equipment for resistor electroplating according to claim 1, characterized in that: The filter box (3) is connected to the treatment chamber (1) in a suction circulation manner through the circulation pipe (2) and the water pump (7). The filter box (3) and the circulation pipe (2) are symmetrically distributed in front and behind the treatment chamber (1). The filter block (21) has a groove structure and is installed by inserting and splicing with the filter box (3).

3. The jetting equipment for resistor electroplating according to claim 2, characterized in that: The jet pipe (9) is connected to the anode bag (11) via the jet pump (4) and the guide pipe (12) in a jet communication manner, and the jet pipe (9) and the nozzle (16) are connected to the processing chamber (1) in a reset rotation manner via the servo motor (8). The guide pipe (12) is integrated with a regulating valve.

4. The jetting device for resistor electroplating according to claim 3, characterized in that: The anode bag (11) is connected to the processing chamber (1) in a lifting and lowering motion via an electric push rod (10).

5. The jetting device for resistor electroplating according to claim 4, characterized in that: The anode bag (11) is connected to the mounting base (5) by a connecting rod (6) and a positioning buckle groove (22), and the connecting rod (6) is clamped and fixed by the mounting base (5) and the clamping plate (14). The clamping plate (14) is locked and fixedly connected to the mounting base (5) by a locking knob (13).

6. The jetting device for resistor electroplating according to claim 5, characterized in that: The position of the nozzle (16) matches the position of the anode bag (11), and the nozzle (16) is installed in a rotating splice with the outlet (19) through the threaded mounting ring (20). The one-way sealing plate (18) is connected to the nozzle (16) in a reset flip connection through the reset rotating shaft (17).

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