Semiconductor valve with multiple sealing structures

Abstract

The utility model relates to the field of semiconductor valves, in particular to a semiconductor valve with a multi-sealing structure, which comprises a semiconductor valve body, a main body for fluid circulation, and an external mounting valve disc arranged at two ends of the semiconductor valve body and used for external pipeline connection. The semiconductor valve is provided with the valve clack, the embedded groove, the diaphragm frame, the diaphragm body, the outer connecting block, the pushing plate, the second damping telescopic spring and the closing valve plate, when the semiconductor valve is used, the outer connecting block and the pushing plate synchronously descend along with falling of the valve clack, the second damping telescopic spring is pressed, and therefore the pushing plate pushes the closing valve plate to slide downwards; the closing valve plates close the semiconductor valve front and back in the semiconductor valve body, then the diaphragm body is extruded by the valve clack to be normally closed in the middle of the semiconductor valve, and therefore the semiconductor valve is closed in a triple sealing mode, and the semiconductor valve is provided with a multi-sealing structure.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor valves, specifically to a semiconductor valve with a multi-seal structure. Background Technology

[0002] Semiconductor valves are one of the core components of semiconductor equipment, mainly used to control the direction, pressure, and flow rate of fluids in fluid systems. There are many types of semiconductor valves, which can be mainly divided into diaphragm valves, bellows valves, vacuum valves, ball valves, butterfly valves, gate valves, angle valves, Teflon gate valves, etc. Among them, vacuum valves and diaphragm valves are the main types of semiconductor valves, which are widely used in the semiconductor industry and have a large market demand. Semiconductor valves are mainly used in vacuum systems and fluid systems in the wafer manufacturing process, covering processes such as chemical vapor deposition, photolithography, ion implantation, physical vapor deposition, rapid thermal processing, and wet etching.

[0003] A search revealed a semiconductor valve with an anti-backflow tube, disclosed in announcement number CN217463336U. This valve includes a semiconductor valve body, an anti-backflow pipe, a first flow-blocking column, a first flow-blocking orifice, a movable plate, a sliding block, and a sliding groove. The anti-backflow pipe is connected to the lower end face of the semiconductor valve body. A first sealing gasket is provided inside the semiconductor valve body, and a return spring is fixed between the first sealing gasket and the semiconductor valve body. A first flow-blocking block is fixed to the right end face of the first sealing gasket. A first flow-blocking column is fixed in the middle position inside the semiconductor valve body, and a first flow-blocking orifice is opened inside the first flow-blocking column. A second flow-blocking column is fixed inside the anti-backflow pipe, and a sliding groove is opened inside the second flow-blocking column. A sliding block is provided in the sliding groove, and a movable plate is welded between the sliding blocks. A movable rod is fixed to the lower end face of the movable plate, and a second sealing gasket is fixed to the lower end face of the movable rod. This design can prevent liquid backflow after the semiconductor valve body is closed, thus preventing it from affecting the valve's service life.

[0004] In the use of existing semiconductor valves, since semiconductor valves are often used in the semiconductor industry to prevent fluid leakage, the lack of multiple sealing structures in semiconductor valves will greatly reduce the sealing performance of the valves, leading to an increased risk of leakage. Moreover, the semiconductor valves in the comparative case mentioned above also lacked multiple sealing structures. Under such long-term use, valve leakage could lead to safety accidents and pose a threat to employees and the environment.

[0005] Therefore, it is necessary to invent a semiconductor valve with a multi-seal structure to solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a semiconductor valve with a multi-seal structure. This multi-seal structure is achieved through a valve disc, an inner groove, a diaphragm frame, a diaphragm body, an outer connecting block, a push plate, a second damping telescopic spring, and a closing valve plate. These three independent sealing points work together to ensure a complete seal, significantly reducing the risk of leakage. This is particularly beneficial when handling high-purity, high-pressure, or corrosive media, maintaining a clean and stable internal environment. Furthermore, the multi-seal structure allows the semiconductor valve to exhibit higher reliability and durability under harsh conditions such as high temperature, high pressure, and strong corrosion. Even if one sealing point fails or wears out, the other sealing points can still maintain their sealing effect, thereby extending the overall service life of the valve. This also reduces the probability of valve leakage, ensuring the safety of employees and the environment. This addresses the problem in existing semiconductor valves where, due to their common use in the semiconductor industry to prevent fluid leakage, the lack of multiple sealing structures significantly reduces their sealing performance, increasing the risk of leakage. Furthermore, the semiconductor valves in the comparative case mentioned above also lacked multiple sealing structures. Therefore, long-term leakage could lead to safety accidents, threatening employees and the environment.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor valve with a multi-seal structure, including a semiconductor valve body and a main body for fluid flow;

[0008] An externally mounted valve disc is located at both ends of the semiconductor valve body for connecting to external pipelines. A fixing bolt passes through the top of the semiconductor valve body, and a valve seat is bolted to the front end of the fixing bolt. A threaded push rod is threaded to the internal thread of the valve seat.

[0009] A movable bushing is disposed between the threaded push rod and the valve disc, and the movable bushing is rotatably connected to the threaded push rod. An embedded groove is provided above the semiconductor valve body. A diaphragm frame is fixedly installed inside the embedded groove. A diaphragm body is fixedly installed inside the diaphragm frame. An external connecting block is fixedly installed outside the valve disc. A push plate is fixedly installed outside the external connecting block. Second damping telescopic springs are provided on both sides below the push plate. A closing valve plate is fixedly connected to the bottom of the push plate.

[0010] Preferably, an anti-theft head is fixedly installed on the top of the threaded push rod, an anti-theft groove is provided above the anti-theft head, an anti-theft block is embedded inside the anti-theft groove, and a handwheel is fixedly installed above the anti-theft block.

[0011] Preferably, the anti-theft block fixedly installed at the bottom of the handwheel is engaged with the anti-theft groove opened above the anti-theft head, and the anti-theft block and the anti-theft groove are used together.

[0012] Preferably, an outer fixing plate is fixedly installed on the outside of the threaded push rod, and a first damping telescopic spring is fixedly installed below the outer fixing plate.

[0013] Preferably, the closing valve plate is slidably connected to the semiconductor valve body, and the push plate is symmetrically arranged about the central axis of the valve disc.

[0014] Preferably, the semiconductor valve body has an internal sliding groove, a crescent valve ring is fixedly installed on both sides of the inside of the semiconductor valve body, and an internal closing protrusion is fixedly installed inside the semiconductor valve body.

[0015] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0016] 1. This utility model includes a valve disc, an inner groove, a diaphragm frame, a diaphragm body, an outer connecting block, a push plate, a second damping telescopic spring, and a closing valve plate. When using this semiconductor valve, as the valve disc falls, the outer connecting block and the push plate descend synchronously, pressing the second damping telescopic spring, which in turn causes the push plate to push the closing valve plate downwards. The closing valve plate then closes the semiconductor valve by moving back and forth inside the semiconductor valve body. The diaphragm body, pressed by the valve disc, closes normally in the middle of the semiconductor valve. This achieves triple sealing closure of the semiconductor valve, giving it a multi-seal structure. The valve's complete seal is ensured by three independent sealing points, which greatly reduces the risk of leakage. Especially when handling high-purity, high-pressure, or corrosive media, it can maintain the cleanliness and stability of the valve's internal environment. Moreover, the presence of multiple sealing structures enables this semiconductor valve to exhibit higher reliability and durability when facing harsh operating conditions such as high temperature, high pressure, and strong corrosion. Even if one sealing point fails or wears out, the other sealing points can still maintain the sealing effect, thereby extending the overall service life of the valve and reducing the probability of valve leakage, thus ensuring the safety of employees and the environment.

[0017] 2. This utility model is equipped with an externally mounted valve disc, fixing bolts, valve seat, threaded push rod, anti-theft head, anti-theft groove, anti-theft block, and handwheel. When using this semiconductor valve, the handwheel can be turned by external auxiliary equipment to cause the threaded push rod to drive the valve disc to descend, thus completing the opening and closing operation of the semiconductor valve. This avoids the handwheel being directly removed through the anti-theft head and anti-theft groove when the valve is not in use, preventing unauthorized personnel from operating the valve at will and reducing the risk of misoperation. At the same time, the anti-theft design can also prevent malicious damage or theft, protecting the integrity and security of the valve. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the handwheel structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the valve disc structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the closed valve plate structure of this utility model;

[0023] Figure 5 This is a schematic diagram of the crescent valve ring structure of this utility model.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. Semiconductor valve body; 2. External mounting valve disc; 3. Fixing bolt; 4. Valve seat; 5. Threaded push rod; 6. Anti-theft head; 7. Anti-theft groove; 8. Anti-theft block; 9. Handwheel; 10. External fixed plate; 11. First damping telescopic spring; 12. Movable bushing; 13. Valve disc; 14. Embedded groove; 15. Diaphragm frame; 16. Diaphragm body; 17. External connecting block; 18. Push plate; 19. Second damping telescopic spring; 20. Closing valve plate; 21. Inner sliding groove; 22. Crescent valve ring; 23. Inner closing protrusion. Detailed Implementation

[0026] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0027] This utility model provides, for example Figure 1-5 The semiconductor valve shown has a multi-seal structure, including a semiconductor valve body 1, which is the main body for fluid flow.

[0028] An externally mounted valve disc 2 is located at both ends of the semiconductor valve body 1 for connecting to external pipelines. A fixing bolt 3 passes through the top of the semiconductor valve body 1. A valve seat 4 is bolted to the front end of the fixing bolt 3. A threaded push rod 5 is threaded inside the valve seat 4.

[0029] A movable bushing 12 is disposed between the threaded push rod 5 and the valve disc 13, and the movable bushing 12 is rotatably connected to the threaded push rod 5. An embedded groove 14 is provided above the semiconductor valve body 1. A diaphragm frame 15 is fixedly installed inside the embedded groove 14, and a diaphragm body 16 is fixedly installed inside the diaphragm frame 15. An external connecting block 17 is fixedly installed outside the valve disc 13, and a push plate 18 is fixedly installed outside the external connecting block 17. Second damping telescopic springs 19 are provided on both sides below the push plate 18. The bottom of the push plate 18 is fixedly connected to... With the closing valve plate 20 connected, as the valve disc 13 falls, the outer connecting block 17 and the push plate 18 descend synchronously, and press the second damping extension spring 19, thereby causing the push plate 18 to push the closing valve plate 20 down, so that the closing valve plate 20 closes the semiconductor valve one after the other inside the semiconductor valve body 1. Then, the diaphragm body 16 is squeezed by the valve disc 13 in the middle of the semiconductor valve to close normally. In this way, the semiconductor valve achieves triple sealing closure, and also gives the semiconductor valve a multi-seal structure.

[0030] like Figure 1 , Figure 2 and Figure 3 As shown, an anti-theft head 6 is fixedly installed on the top of the threaded push rod 5. An anti-theft groove 7 is opened above the anti-theft head 6. An anti-theft block 8 is embedded inside the anti-theft groove 7. A handwheel 9 is fixedly installed above the anti-theft block 8. The handwheel 9 can be rotated by an external auxiliary device to cause the threaded push rod 5 to drive the valve disc 13 down, thus completing the opening and closing operation of the semiconductor valve. The anti-theft block 8 fixedly installed at the bottom of the handwheel 9 is engaged with the anti-theft groove 7 opened above the anti-theft head 6. The anti-theft block 8 and the anti-theft groove 7 work together to allow the handwheel 9 to be removed directly through the anti-theft head 6 and the anti-theft groove 7, which can prevent unauthorized personnel from operating the valve at will and reduce the risk of misoperation.

[0031] like Figure 1 , Figure 4 and Figure 5As shown, an outer fixed plate 10 is fixedly installed on the outside of the threaded push rod 5. A first damping telescopic spring 11 is fixedly installed below the outer fixed plate 10. When the threaded push rod 5 descends, the outer fixed plate 10 presses the first damping telescopic spring 11, which allows the threaded push rod 5 to steadily drive the valve disc 13 down, maintaining the stability of the semiconductor valve when it is opened and closed. The closing valve plate 20 is slidably connected to the semiconductor valve body 1. The push plate 18 is symmetrically arranged with respect to the central axis of the valve disc 13. The presence of this multi-seal structure of the closing valve plate 20 and the diaphragm body 16 enables the semiconductor valve to exhibit higher reliability and durability when facing harsh working conditions such as high temperature, high pressure, and strong corrosion. An inner sliding groove 21 is opened inside the semiconductor valve body 1. Half-moon valve rings 22 are fixedly installed on both sides inside the semiconductor valve body 1. An inner closing protrusion 23 is fixedly installed inside the semiconductor valve body 1. The half-moon valve rings 22 are used to cooperate with the closing valve plate 20 to close the front and rear ends of the semiconductor valve body 1 and improve the sealing performance.

[0032] The working principle of this practical application is as follows: First, take out the semiconductor valve at the location where fluid flow needs to be controlled. Connect the semiconductor valve to the external pipeline through the external mounting valve disc 2. Then, align the anti-theft block 8 of the handwheel 9 with the anti-theft groove 7 of the anti-theft head 6. This allows the threaded push rod 5 to be rotated. Depending on the current usage requirements, the handwheel 9 can be rotated via external auxiliary equipment or directly. Next, the threaded push rod 5 and the valve disc 13 rotate, causing the valve disc 13 to fall steadily. The external connecting block 17 and the push plate 18 descend synchronously, pressing the second damping extension spring 19, which in turn causes the push plate 18 to push the closing valve plate 20 down. Subsequently, the closing valve plate 20 covers the crescent valve ring 22 inside the semiconductor valve body 1, allowing the semiconductor valve to close sequentially inside the semiconductor valve body 1. Then, the diaphragm 16 is pressed by the valve disc 13 in the middle of the semiconductor valve for normal closure. This allows the semiconductor valve to achieve triple sealing closure, giving it a multi-seal structure. Next, when using this semiconductor valve, the complete seal is ensured by three independent sealing points. This design greatly reduces the risk of leakage, especially when handling high-purity, high-pressure, or corrosive media. It can maintain the cleanliness and stability of the valve's internal environment. Moreover, the presence of the multiple sealing structure allows the semiconductor valve to exhibit higher reliability and durability when facing harsh working conditions such as high temperature, high pressure, and strong corrosion. Even if one sealing point fails or wears out, the other sealing points can still maintain the sealing effect. Subsequently, when the valve is not in use, the handwheel 9 can be directly removed through the anti-theft head 6 and anti-theft groove 7, which can prevent unauthorized personnel from operating the valve at will and reduce the risk of misoperation. At the same time, the anti-theft design can also prevent malicious damage or theft, protecting the integrity and security of the valve. Finally, after completing all the installation and use of the semiconductor valve according to the above operations, routine maintenance of the valve is required. In this way, the use of the semiconductor valve with multiple sealing structure is completed.

[0033] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A semiconductor valve with a multi-seal structure, characterized in that: include Semiconductor valve body (1), the main body for fluid flow; An externally mounted valve disc (2) is set at both ends of the semiconductor valve body (1) for connecting to external pipelines. A fixing bolt (3) passes through the top of the semiconductor valve body (1). A valve seat (4) is bolted to the front end of the fixing bolt (3). A threaded push rod (5) is threaded inside the valve seat (4). A movable bushing (12) is disposed between the threaded push rod (5) and the valve disc (13), and the movable bushing (12) is rotatably connected to the threaded push rod (5). An embedded groove (14) is provided above the semiconductor valve body (1). A diaphragm frame (15) is fixedly installed inside the embedded groove (14). A diaphragm body (16) is fixedly installed inside the diaphragm frame (15). An external connecting block (17) is fixedly installed outside the valve disc (13). A push plate (18) is fixedly installed outside the external connecting block (17). A second damping telescopic spring (19) is provided on both sides below the push plate (18). A closing valve plate (20) is fixedly connected to the bottom of the push plate (18).

2. A semiconductor valve with a multiple sealing structure according to claim 1, characterized in that: An anti-theft head (6) is fixedly installed on the top of the threaded push rod (5). An anti-theft groove (7) is provided above the anti-theft head (6). An anti-theft block (8) is embedded inside the anti-theft groove (7). A handwheel (9) is fixedly installed above the anti-theft block (8).

3. A semiconductor valve with a multiple sealing structure according to claim 2, characterized in that: The anti-theft block (8) fixedly installed at the bottom of the handwheel (9) engages with the anti-theft groove (7) opened above the anti-theft head (6), and the anti-theft block (8) and the anti-theft groove (7) are used together.

4. A semiconductor valve with a multiple sealing structure according to claim 1, characterized in that: An outer fixed plate (10) is fixedly installed on the outside of the threaded push rod (5), and a first damping telescopic spring (11) is fixedly installed below the outer fixed plate (10).

5. A semiconductor valve with a multiple sealing structure according to claim 1, characterized in that: The closing valve plate (20) is slidably connected to the semiconductor valve body (1), and the push plate (18) is symmetrically arranged about the central axis of the valve disc (13).

6. A semiconductor valve with a multiple sealing structure according to claim 1, characterized in that: The semiconductor valve body (1) has an inner sliding groove (21) inside, and a half-moon valve ring (22) is fixedly installed on both sides inside the semiconductor valve body (1). An inner closing protrusion (23) is fixedly installed inside the semiconductor valve body (1).

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