Cooling device for semiconductor chip production

Abstract

The utility model relates to the field of semiconductor chip production, in particular to a cooling device for semiconductor chip production, which comprises a workbench, a mounting frame arranged on the upper surface of the workbench, a plurality of supporting seats uniformly distributed on one side of the mounting frame, a placing plate horizontally placed on the supporting seats, and a cooling mechanism mounted on a frame body of the mounting frame. The cooling mechanism is located over the placement plate, the cooling mechanism comprises a fan, the fan is located over the placement plate, a connecting plate is arranged at the top of the outer wall of the fan, and the connecting plate is installed on the installation frame. In this way, the fan does not need to be manually held by hands for cooling, and a plurality of semiconductor chip main bodies can be rapidly cooled at a time through the arrangement of the placing plate, so that the cooling efficiency is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip manufacturing technology, and in particular to a cooling device for semiconductor chip manufacturing. Background Technology

[0002] A semiconductor chip is an electronic device manufactured on semiconductor materials. It possesses unique electrical properties, allowing its conductivity to change under different voltage and temperature conditions. Semiconductor chips are typically made of materials such as silicon, germanium, or gallium arsenide.

[0003] In semiconductor chip manufacturing, some semiconductor chips need to be cooled down immediately after processing. Most of these cooling methods use fans to blow air onto the semiconductor chips to quickly cool them down, ensuring that semiconductor chips with excessively high temperatures after processing can be cooled down quickly. However, this cooling method is inefficient, as the fan can only cool one semiconductor chip at a time, requiring frequent replacement of the semiconductor chip. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a cooling device for semiconductor chip manufacturing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A cooling device for semiconductor chip manufacturing includes a workbench, on the upper surface of which a mounting frame is provided, and multiple support seats are evenly distributed on one side of the mounting frame. A placement plate is horizontally placed on the support seats, and a cooling mechanism is installed on the mounting frame, with the cooling mechanism located directly above the placement plate.

[0007] The cooling mechanism includes a fan located directly above the mounting plate. A connecting plate is provided on the top of the outer wall of the fan and is mounted on the mounting bracket.

[0008] In addition, a preferred structure is that the top of the mounting bracket is provided with a mounting plate, and the lower surface of the mounting plate is uniformly provided with a plurality of mounting feet for mounting the connecting plate.

[0009] In addition, a preferred structure is that the support base includes a first mounting plate, which is mounted on the upper surface of the workbench. A fixing column is vertically arranged on the top of the first mounting plate, and a second mounting plate is arranged on the top of the fixing column.

[0010] In addition, in a preferred configuration, a second rubber pad is attached to the inner surface of the second mounting plate, and the four corners of the placement plate are placed on the inner surface of the second mounting plate and in contact with the second rubber pad.

[0011] In addition, a preferred structure is that multiple card plates are evenly arranged on the top surface of the placement plate, and a first rubber pad is attached to one side wall of the card plate.

[0012] Furthermore, in a preferred configuration, a semiconductor chip body is horizontally placed on the upper surface of the placement plate and between the plates, with the sidewall of the semiconductor chip body in contact with the first rubber pad.

[0013] The beneficial effects of this utility model are as follows: This utility model achieves cooling of the semiconductor chip body through a cooling mechanism installed on the mounting bracket, thus eliminating the need for manual handheld fans for cooling. Furthermore, through the set placement plate, multiple semiconductor chip bodies can be rapidly cooled at one time, which effectively improves the cooling efficiency. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the cooling device.

[0015] Figure 2 This is a schematic diagram of the structure after the mounting bracket and cooling mechanism have been disassembled;

[0016] Figure 3 This is a schematic diagram of the structure after the placement plate and support base have been separated.

[0017] Figure 4 This is a schematic diagram of the structure after the placement plate and support base have been separated.

[0018] Figure 5 This is a schematic diagram of the support structure;

[0019] Figure 6 This is a partially enlarged structural diagram of the placement plate.

[0020] In the diagram: 1. Workbench, 2. Mounting rack, 21. Mounting plate, 22. Mounting foot, 3. Support base, 31. First mounting plate, 32. Fixing post, 33. Second mounting plate, 4. Placement plate, 41. Clamping plate, 42. First rubber pad, 5. Cooling mechanism, 51. Connecting plate, 52. Fan, 6. Semiconductor chip body, 7. Second rubber pad. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figure 1-6A cooling device for semiconductor chip manufacturing includes a workbench 1, a mounting frame 2 on the upper surface of the workbench 1, multiple support seats 3 evenly distributed on one side of the mounting frame 2, a placement plate 4 horizontally placed on the support seats 3, a cooling mechanism 5 mounted on the mounting frame 2, the cooling mechanism 5 being located directly above the placement plate 4, the cooling mechanism 5 including a fan 52, the fan 52 being located directly above the placement plate 4, a connecting plate 51 being provided on the top of the outer wall of the fan 52, the connecting plate 51 being mounted on the mounting frame 2, the connecting plate 51 enabling the fan 52 to be mounted on the mounting frame 2.

[0023] The mounting bracket 2 has a mounting plate 21 on its top. The lower surface of the mounting plate 21 is evenly provided with a plurality of mounting feet 22 for mounting the connecting plate 51. The mounting feet 22 are used to connect the cooling mechanism 5.

[0024] Furthermore, the support base 3 includes a first mounting plate 31, which is mounted on the upper surface of the workbench 1. A fixing post 32 is vertically arranged on the top of the first mounting plate 31, and a second mounting plate 33 is arranged on the top of the fixing post 32. A second rubber pad 7 is attached to the inner surface of the second mounting plate 33. The four corners of the placement plate 4 are placed on the inner surface of the second mounting plate 33 and in contact with the second rubber pad 7. The second rubber pad 7 can increase the friction with the placement plate 4.

[0025] In addition, multiple card plates 41 are evenly arranged on the top surface of the placement plate 4. A first rubber pad 42 is attached to one side wall of the card plate 41. A semiconductor chip body 6 is horizontally placed on the upper surface of the placement plate 4 and between the card plates 41. The side wall of the semiconductor chip body 6 is in contact with the first rubber pad 42. The first rubber pad 42 can increase the friction with the semiconductor chip body 6.

[0026] In this embodiment, when cooling the semiconductor chip body 6 after production, the semiconductor chip body 6 is first installed on the placement plate 4, and the semiconductor chip body 6 is clipped between the clip plates 41. The first rubber pad 42 can prevent the semiconductor chip body 6 from falling off easily. Then, the placement plate 4 filled with semiconductor chip bodies 6 is placed on the support base 3, and the four corners of the placement plate 4 are clipped into the inner wall of the second mounting plate 33. Then, the fan 52 can be turned on to blow air downwards onto the semiconductor chip body 6. Continuously blowing air onto the semiconductor chip body 6 can achieve physical cooling of the semiconductor chip body 6, so that the semiconductor chip body 6 with a high temperature after processing can be cooled down quickly.

[0027] In this invention, the cooling mechanism 5 installed on the mounting bracket 2 is used to cool the semiconductor chip body 6, thus eliminating the need for manual handheld fans for cooling. Furthermore, the placement plate 4 allows for rapid cooling of multiple semiconductor chip bodies 6 at once, effectively improving cooling efficiency.

[0028] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A cooling apparatus for semiconductor chip manufacturing, comprising a worktable (1), characterized in that, The workbench (1) is provided with a mounting frame (2) on its upper surface. Multiple support seats (3) are evenly distributed on one side of the mounting frame (2). A placement plate (4) is placed horizontally on the support seat (3). A cooling mechanism (5) is installed on the frame of the mounting frame (2). The cooling mechanism (5) is located directly above the placement plate (4). The cooling mechanism (5) includes a fan (52), which is located directly above the placement plate (4). A connecting plate (51) is provided on the top of the outer wall of the fan (52), and the connecting plate (51) is mounted on the mounting bracket (2).

2. The cooling device for semiconductor chip manufacturing according to claim 1, characterized in that, The mounting bracket (2) is provided with a mounting plate (21) on the top, and a plurality of mounting feet (22) for mounting the connecting plate (51) are evenly provided on the lower surface of the mounting plate (21).

3. The cooling device for semiconductor chip manufacturing according to claim 1, characterized in that, The support base (3) includes a first mounting plate (31), which is installed on the upper surface of the workbench (1). A fixing column (32) is vertically arranged on the top of the first mounting plate (31), and a second mounting plate (33) is arranged on the top of the fixing column (32).

4. The cooling device for semiconductor chip manufacturing according to claim 3, characterized in that, The inner surface of the second mounting plate (33) is covered with a second rubber pad (7), and the four corners of the placement plate (4) are placed on the inner surface of the second mounting plate (33) and in contact with the second rubber pad (7).

5. The cooling device for semiconductor chip manufacturing according to claim 4, characterized in that, Multiple card plates (41) are evenly arranged on the top surface of the placement plate (4), and a first rubber pad (42) is attached to one side wall of the card plate (41).

6. The cooling device for semiconductor chip manufacturing according to claim 5, characterized in that, A semiconductor chip body (6) is horizontally placed on the upper surface of the placement plate (4) and between the card plates (41), and the sidewall of the semiconductor chip body (6) is in contact with the first rubber pad (42).

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