Electronic device

Abstract

The utility model discloses an electronic device. The electronic device comprises a heat dissipation bottom plate, a metal bearing piece arranged on the heat dissipation bottom plate, a plurality of first heat conduction pads installed on the metal bearing piece, and a second heat conduction pad installed on the metal bearing piece. A containing space is formed in the metal bearing piece, and a hard disk can be installed in the containing space. Wherein a memory module and at least one interface card are connected to the metal bearing piece through a plurality of first heat conduction pads. The metal bearing piece or the hard disk is connected to the heat dissipation bottom plate through the second heat conduction pad. Wherein the hard disk, the memory module and the at least one interface card are subjected to heat dissipation through the combination of the first heat conduction pad, the metal bearing piece, the second heat conduction pad and the heat dissipation bottom plate.

Description

Technical Field

[0001] This utility model relates to an electronic device, and more particularly to an electronic device with a heat dissipation structure. Background Technology

[0002] In existing technologies, because the interface cards in current electronic devices are designed by various manufacturers, the size and height of the interface cards are inconsistent, making them unsuitable for every system. Furthermore, although copper and aluminum sheets are added to the aforementioned interface cards during development to increase heat dissipation, the size of these copper and aluminum sheets limits their ability to provide efficient heat storage space and heat dissipation area.

[0003] Therefore, the inventor of this utility model believed that the above-mentioned defects could be improved. So he devoted himself to research and combined with the application of scientific principles, and finally proposed a utility model with a reasonable design that effectively improves the above-mentioned defects. Utility Model Content

[0004] The purpose of this utility model embodiment is to provide an electronic device that can effectively improve the defects that may occur in existing electronic devices.

[0005] This utility model discloses an electronic device suitable for heat dissipation of at least one of a hard disk, a memory module, and at least one interface card. The electronic device includes a heat dissipation base plate; a metal carrier disposed on the heat dissipation base plate and forming an accommodating space for mounting the hard disk therein; wherein the metal carrier includes a first surface and a second surface located on opposite sides of the accommodating space; a plurality of first thermal pads mounted on the first surface of the metal carrier; wherein the memory module and at least one interface card are connected to the metal carrier through the plurality of first thermal pads; and a second thermal pad mounted on the second surface, wherein the metal carrier or the hard disk is connected to the heat dissipation base plate through the second thermal pad; wherein the hard disk, the memory module, and at least one interface card are cooled by a combination of the first thermal pad, the metal carrier, the second thermal pad, and the heat dissipation base plate.

[0006] According to one embodiment of the present invention, the first surface includes a first portion and a second portion adjacent to the first portion. The first portion is used to carry the memory module, and the second portion is used to carry at least one interface card. The first surface also includes a third portion, the second portion being located between the first portion and the third portion. The at least one interface card includes a first interface card having a first size and a second interface card having a second size, the first size being different from the second size. The first interface card is disposed in the second portion, and the second interface card is disposed in the third portion.

[0007] According to one embodiment of the present invention, the electronic device includes a circuit board disposed above the heat dissipation base plate, a fan is mounted on the top side of the circuit board, and the memory module and at least one interface card are mounted on the bottom side of the circuit board.

[0008] According to one embodiment of the present invention, the memory module is a small form factor dual in-line memory module, and at least one of the interface cards is an M.2 interface card.

[0009] According to one embodiment of the present invention, the memory module includes a first memory and a second memory stacked on the first memory. The first memory and the second memory are arranged in parallel and disposed on the first surface. The first surface includes a first step and a second step connected to the first step and at a different height. The first step is used to support the first memory, and the second step is used to connect the second memory. The first memory and the second memory are respectively heat-conducted through the first step and the second step.

[0010] According to one embodiment of the present invention, the metal support member has a front section and a rear section, and the hard disk is inserted into the accommodating space with its front edge and is disposed adjacent to the front section, wherein the first step and the second step are disposed in the front section.

[0011] According to one embodiment of the present invention, the electronic device is a handheld electronic device, which includes a housing that covers the heat dissipation base plate. The heat dissipation base plate has an outer surface that is away from the metal support member and exposed outside the handheld electronic device.

[0012] According to one embodiment of the present invention, the electronic device further includes at least one metal heat sink, and at least one of the metal heat sink is used to connect at least one of the memory module and at least one of the interface cards, wherein the memory module or at least one of the interface cards is cooled sequentially through at least one of the metal heat sink and one of the plurality of first thermal pads.

[0013] According to one embodiment of the present invention, the metal support is an aluminum extrusion or a sheet metal part.

[0014] According to one embodiment of the present invention, the metal support is an aluminum extrusion, and the electronic device further includes at least one metal heat sink, wherein the aluminum extrusion and the at least one metal heat sink are integrally formed single-piece structures.

[0015] In summary, the electronic device disclosed in this utility model embodiment, through the structural configuration of the heat dissipation base plate, the metal carrier, the plurality of first thermal pads and the plurality of second thermal pads, facilitates the electronic device to be compatible with electronic components (such as memory modules or interface cards) from different brands, and can provide a larger heat storage space and heat dissipation area, thereby achieving a better heat dissipation effect.

[0016] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, these descriptions and drawings are only used to illustrate this utility model and are not intended to limit the scope of protection of this utility model in any way. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the electronic device according to Embodiment 1 of this utility model.

[0018] Figure 2 for Figure 1 A schematic diagram of its breakdown.

[0019] Figure 3 for Figure 1 A schematic cross-sectional view along section line III-III.

[0020] Figure 4 for Figure 1 An exploded view of the electronic device, omitting the outer casing.

[0021] Figure 5 for Figure 1 An exploded view of the electronic device, omitting the casing, fan, and circuit board.

[0022] Figure 6 for Figure 5 A breakdown diagram from another perspective.

[0023] Figure 7 This is a cross-sectional schematic diagram of the electronic device according to Embodiment 2 of this utility model.

[0024] Figure 8 This is an exploded view of the electronic device according to Embodiment 2 of this utility model, omitting the outer casing.

[0025] Figure 9 This is an exploded view of the electronic device according to Embodiment 2 of the present invention, omitting the outer casing, fan, and circuit board.

[0026] Figure 10 for Figure 9 A breakdown diagram from another perspective.

[0027] The attached figures are labeled as follows:

[0028] 100: Electronic devices

[0029] 1: Hard drive

[0030] 11: Past Life

[0031] 2: Memory module

[0032] 21: First Memory

[0033] 22: Second memory

[0034] 3: Interface Card

[0035] 31: First interface card

[0036] 32: Second Interface Card

[0037] 4: Heat dissipation base plate

[0038] 41: Bracket

[0039] 42: Outer surface

[0040] 43: Inner surface

[0041] 44: Screw hole

[0042] 45: First screw

[0043] 46: Second screw

[0044] 5: Metal load-bearing components

[0045] 5a: Aluminum extrusion

[0046] 5b: Sheet metal parts

[0047] 51: First part

[0048] 52: The latter part

[0049] 53: Positioning Piece

[0050] 54: Screw hole

[0051] 55: Third screw

[0052] 56: First Surface

[0053] 561: Part One

[0054] 5611: First Step

[0055] 5612: Second Step

[0056] 562: Part Two

[0057] 563: Part Three

[0058] 57: Second Surface

[0059] 58: Fourth screw

[0060] 6: First thermal pad

[0061] 7: Second thermal pad

[0062] 8: Circuit board

[0063] 9: Outer shell

[0064] F: Fan

[0065] H: Metal heat sink

[0066] S: Storage space Detailed Implementation

[0067] The following specific embodiments illustrate the implementation of the "electronic device" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0068] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.

[0069] [Example 1]

[0070] Please see Figures 1 to 6 As shown, this is one embodiment of the present invention. This embodiment discloses an electronic device 100, which is suitable for heat dissipation of at least one or a combination of a hard disk drive (HDD), a memory module 2, and at least one interface card 3. It should be noted that the hard disk drive 1, the memory module 2, and at least one interface card 3 may be internal components of the electronic device 100 in this embodiment.

[0071] Please see Figures 1 to 3As shown, the electronic device 100 in this embodiment is a portable electronic device or a handheld electronic device (e.g., a handheld industrial computer), and the electronic device 100 includes a heat dissipation base plate 4, a metal carrier 5 disposed on the heat dissipation base plate 4, a plurality of first thermal conductive pads 6 mounted on the metal carrier 5, a second thermal conductive pad 7 mounted between the heat dissipation base plate 4 and the metal carrier 5, a circuit board 8 mounted above the heat dissipation base plate 4, a fan F mounted on the top side of the circuit board 8, a memory module 2 and at least one interface card 3 mounted on the bottom side of the circuit board 8, a hard disk 1 disposed within the metal carrier 5, and a housing 9 covering the heat dissipation base plate 4. However, this utility model is not limited thereto. For example, in other embodiments of this utility model not shown, the fan F, the circuit board 8, and the housing 9 may be adjusted or omitted according to actual needs.

[0072] Please see Figures 4 to 6 As shown, the outer casing 9 is mounted on the heat dissipation base plate 4 to enclose the remaining components of the electronic device 100 therein. The heat dissipation base plate 4 is generally a flat rectangular structure and has an outer surface 42 and an inner surface 43 located on opposite sides. The outer surface 42 is away from the metal support member 5 and exposed outside the portable electronic device, while the inner surface 43 is provided with the metal support member 5.

[0073] Furthermore, the heat dissipation base plate 4 has multiple brackets 41 at its four corners, allowing the circuit board 8 to be secured to it with multiple second screws 46. The two longer sides of the heat dissipation base plate 4 each have two screw holes 44, allowing the metal support member 5 to be secured to the heat dissipation base plate 4 with multiple first screws 45. Therefore, the metal support member 5 is located between the heat dissipation base plate 4 and the circuit board 8. The number of brackets 41, screw holes 44, first screws 45, and second screws 46 can be adjusted according to actual needs, and this invention does not impose any limitations.

[0074] Furthermore, such as Figure 5As shown, the inner side of the metal carrier 5 forms an accommodating space S for mounting the hard disk 1 therein. More specifically, the metal carrier 5 has a front section 51 and a rear section 52 opposite to the front section 51, and the hard disk 1 is inserted into the accommodating space S with its leading edge 11 and adjacent to the front section 51. Each side of the metal carrier 5 has a plurality of protruding positioning pieces 53 for the first screw 45 to lock the metal carrier 5 to the heat sink base plate 4. Furthermore, each side of the metal carrier 5 is provided with two screw holes 54 for a plurality of third screws 55 to lock the hard disk 1 into the accommodating space S of the metal carrier 5. The number of the plurality of positioning pieces 53, the plurality of screw holes 54, and the plurality of third screws 55 can be set according to actual needs, and this utility model does not limit this.

[0075] The electronic device 100 further includes at least one metal heat sink H. In this embodiment, the metal support 5 is an aluminum extrusion 5a, and the metal support 5 and the at least one metal heat sink H are integrally formed single-piece structures. In other words, in this embodiment, the metal support 5 and the at least one metal heat sink H are extruded together as an aluminum extrusion structure during manufacturing and cannot be separated. The metal support 5 also includes a first surface 56 and a second surface 57 located on opposite sides of the accommodating space S, respectively. The first surface 56 is adjacent to the circuit board 8, and the second surface 57 is adjacent to the heat dissipation base plate 4. In other embodiments, the metal support 5 and the at least one metal heat sink H may also be two separate and independent components, with the metal heat sink H disposed on the metal support 5.

[0076] like Figure 4 As shown, the memory module 2 and at least one interface card 3 are fixed to the circuit board 8 on the side away from at least one metal heat sink H. Therefore, when the circuit board 8 is mounted on the heat sink base plate 4, the memory module 2 and at least one interface card 3 can conduct and dissipate heat through multiple first thermal pads 6 and the metal heat sink H. The multiple first thermal pads 6 are rectangular sheets of different sizes, and the multiple first thermal pads 6 are mounted on the first surface 56 of the metal carrier 5.

[0077] like Figure 6As shown, the second thermal pad 7 is generally a rectangular sheet, and its dimensions are approximately the same as the second surface 57 of the metal carrier 5. The second thermal pad 7 is mounted on the second surface 57 of the metal carrier 5; therefore, the metal carrier 5 is positioned on the heat dissipation base plate 4 via the second thermal pad 7. The size and shape of the plurality of first thermal pads 6 and the plurality of second thermal pads 7 can be configured according to actual needs, and this invention does not impose any limitations on these aspects.

[0078] Accordingly, the memory module 2 and at least one interface card 3 can conduct heat to the metal carrier 5 through the adjacent first thermal pad 6, and the metal carrier 5 can conduct heat to the heat dissipation base plate 4 through the second thermal pad 7. Therefore, the memory module 2 and at least one interface card 3 can conduct heat to the heat dissipation base plate 4 through the first thermal pad 6, the metal carrier 5 and the second thermal pad 7, and then dissipate heat to the external space through the heat dissipation base plate 4.

[0079] It is worth noting that when the electronic device 100 further includes at least one metal heat sink H, the memory module 2 or at least one interface card 3 sequentially dissipates heat through a plurality of first thermal pads 6 and the metal heat sink H.

[0080] like Figure 4 As shown, the first surface 56 of the metal carrier 5 includes a first portion 561 and a second portion 562 adjacent to the first portion 561. Furthermore, the first surface 56 also includes a third portion 563, with the second portion 562 located between the first portion 561 and the third portion 563, and the area of ​​the first portion 561 being slightly larger than the area of ​​either the second portion 562 or the third portion 563.

[0081] The first portion 561 is used to connect the memory module 2, which can be a small outline dual in-line memory module (SODIMM), but this invention is not limited thereto. Furthermore, the memory module 2 also includes a first memory 21 and a second memory 22 stacked on the first memory 21. The first memory 21 and the second memory 22 are arranged in parallel and located on the first portion 561 of the first surface 56. The first memory 21 is closer to the metal carrier 5 than the second memory 22.

[0082] More specifically, such as Figure 4As shown, the first portion 561 of the first surface 56 further includes a first step 5611 and a second step 5612 connected to the first step 5611 but at a different height. The second step 5612 is slightly higher than the first step 5611, and the first thermal pad 6 is disposed on the first step 5611 and the second step 5612. Furthermore, the first step 5611 and the second step 5612 are disposed on the front section 51 of the metal carrier, and the first portion 561 is adjacent to the second portion 562 via the second step 5612.

[0083] The first step 5611 is used to connect the first memory 21, and the second step 5612 is used to connect the second memory 22. The first memory 21 and the second memory 22 are respectively heated by the first thermal pad 6 disposed on the first step 5611 and the second step 5612.

[0084] The second portion 562 and the third portion 563 are used to connect at least one of the interface cards 3, and the at least one interface card 3 can be an M.2 interface card (e.g., an M.2 SSD). Further, the at least one interface card 3 may include a first interface card 31 having a first size and a second interface card 32 having a second size, and the first size is different from the second size. In this embodiment, the first size is smaller than the second size, but the present invention is not limited thereto. The first interface card 31 is disposed in the second portion 562, and the second interface card 32 is disposed in the third portion 563.

[0085] As described above, the hard disk 1, the memory module 2, and at least one interface card 3 dissipate heat through a combination of the first thermal pad 6, the metal carrier 5, the second thermal pad 7, and the heat dissipation base plate 4, thereby enabling the electronic device 100 to provide a larger heat storage space and heat dissipation area, and thus achieve a better heat dissipation effect.

[0086] [Example 2]

[0087] Please see Figures 7 to 10 As shown, this is Embodiment Two of the present invention. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The main difference between this embodiment and Embodiment One lies in the metal support member 5 and the metal heat sink H, which are roughly described below:

[0088] In this embodiment, the metal support member 5 is a sheet metal member 5b, and the sheet metal member 5b is further provided with the metal heat sink H. The sheet metal member 5b and the metal heat sink H are two separate and independent components. The sheet metal member 5b also includes a first surface 56 and a second surface 57 located on opposite sides of the accommodating space S, respectively. The first surface 56 is adjacent to the circuit board 8, and the second surface 57 is adjacent to the heat sink base plate 4.

[0089] Furthermore, the metal heat sink H comprises multiple heat sinks of different heights and is secured to the sheet metal part 5b by multiple fourth screws 58. On the side of the metal heat sink H away from the sheet metal part 5b, multiple first thermal pads 6 are provided, allowing the first thermal pads 6 to connect to the memory module 2 and at least one interface card 3 for heat dissipation.

[0090] [Technical Effects of the Embodiments of this Utility Model]

[0091] In summary, the electronic device disclosed in this utility model embodiment, through the structural configuration of the heat dissipation base plate, the metal carrier, the plurality of first thermal pads and the plurality of second thermal pads, facilitates the electronic device to be compatible with electronic components (such as memory modules or interface cards) from different brands, and can provide a larger heat storage space and heat dissipation area, thereby achieving a better heat dissipation effect.

[0092] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the patent scope of the present utility model. Therefore, all equivalent technical changes made based on the contents of the present utility model specification and drawings are included in the patent scope of the present utility model.

Claims

1. An electronic device suitable for dissipating heat from at least one of a hard disk, a memory module, and at least one interface card; characterized in that, The electronic device includes: A heat dissipation base plate; A metal support member is disposed on the heat dissipation base plate and forms an accommodating space for mounting the hard drive therein; wherein the metal support member includes a first surface and a second surface located on opposite sides of the accommodating space; Multiple first thermal pads are mounted on the first surface of the metal carrier; wherein the memory module and at least one interface card are connected to the metal carrier via the multiple first thermal pads; and A second thermal pad is installed on the second surface, and the metal carrier or the hard disk is connected to the heat dissipation base plate through the second thermal pad; The hard disk, the memory module, and at least one interface card are cooled by a combination of the first thermal pad, the metal carrier, the second thermal pad, and the heat dissipation base plate.

2. The electronic device as claimed in claim 1, characterized in that, The first surface includes a first portion and a second portion adjacent to the first portion. The first portion is used to carry the memory module, and the second portion is used to carry at least one interface card. The first surface also includes a third portion, the second portion being located between the first portion and the third portion. The at least one interface card includes a first interface card having a first size and a second interface card having a second size, the first size being different from the second size. The first interface card is disposed in the second portion, and the second interface card is disposed in the third portion.

3. The electronic device as claimed in claim 1, characterized in that, The electronic device includes a circuit board disposed above the heat sink base plate, a fan mounted on the top side of the circuit board, and the memory module and at least one interface card mounted on the bottom side of the circuit board.

4. The electronic device as claimed in claim 1, characterized in that, The memory module is a small form factor dual in-line memory module, and at least one of the interface cards is an M.2 interface card.

5. The electronic device as claimed in claim 4, characterized in that, The memory module includes a first memory and a second memory stacked on the first memory. The first memory and the second memory are arranged in parallel and disposed on the first surface. The first surface includes a first step and a second step connected to the first step at a different height. The first step is used to support the first memory, and the second step is used to connect the second memory. The first memory and the second memory are heat-conducted through the first step and the second step, respectively.

6. The electronic device as claimed in claim 5, characterized in that, The metal support member has a front section and a rear section, and the hard disk is inserted into the accommodating space with its front edge and is adjacent to the front section, and the first step and the second step are disposed in the front section.

7. The electronic device as claimed in claim 1, characterized in that, The electronic device is a handheld electronic device, which includes a housing that covers the heat dissipation base plate. The heat dissipation base plate has an outer surface that is away from the metal support and exposed outside the handheld electronic device.

8. The electronic device as claimed in claim 1, characterized in that, The electronic device further includes at least one metal heat sink, and at least one of the metal heat sink is used to connect the memory module and at least one of the interface cards, wherein the memory module or at least one of the interface cards is cooled sequentially through at least one of the metal heat sink and one of the plurality of first thermal pads.

9. The electronic device as claimed in claim 1, characterized in that, The metal support component is an aluminum extrusion or a sheet metal component.

10. The electronic device as claimed in claim 1, characterized in that, The metal support is an aluminum extrusion, and the electronic device also includes at least one metal heat sink, wherein the aluminum extrusion and the at least one metal heat sink are integrally formed single-piece structures.

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