Inductor and point power supply module thereof
By designing a through-hole magnetic core in the inductor and setting a trapezoidal support on the copper foil, the problems of unstable copper foil position and uneven adhesive distribution are solved, improving the production efficiency and product yield of the inductor, and enhancing the stability and heat dissipation performance of the module.
Patent Information
- Application Number
- CN202423054437.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-12-11
AI Technical Summary
Existing inductor processing technology suffers from problems such as unstable copper foil position, the need for additional pressure, and uneven adhesive distribution, resulting in low production efficiency and low product yield.
Design an inductor that employs a magnetic core with a through hole and a support portion with a trapezoidal structure on a copper foil. The protruding portion contacts the magnetic core, and the recessed portion is used to accommodate adhesive. The width of the copper foil is smaller than the width of the through hole. Multiple support portions are symmetrically arranged to restrict the movement of the copper foil and uniformly distribute the adhesive.
This improves the processing efficiency and product yield of inductors, ensures that no additional pressure is required during the high-temperature curing process of copper foil, and ensures uniform distribution of adhesive, thereby enhancing the stability of the inductor and the heat dissipation performance of the module.
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Figure CN223539429U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of point power supply packaging, and in particular to an inductor and its point power supply module. Background Technology
[0002] POL power modules are generally buck, boost, or buck-boost topologies. All of these topologies contain inductors, which typically account for a large proportion of the total power and generate heat due to losses. Therefore, the placement of inductors is very important.
[0003] The current inductor processing technology is as follows: A tooling is fabricated, with the tooling and the encapsulated body having completely identical hole positions to ensure front-to-back and left-to-right consistency; the copper foil of the inductor is inserted into the tooling, and after the copper foil is weighed down, glue is applied to ensure top-to-bottom consistency; it is then placed in a high-temperature chamber for high-temperature heating; after heating, the magnetic core and the inductor become one unit, and the inductor processing is complete.
[0004] However, the adhesive curing process generates a tensile force on the copper foil, which is much greater than the copper foil's weight. This causes the copper foil to be pulled upwards and may even cause it to tilt, resulting in defective inductors. A heavy object needs to be placed on the copper foil to counteract the tensile force; furthermore, the adhesive application process is cumbersome and uneven. The entire process results in low production efficiency and a low yield. Utility Model Content
[0005] The main technical problem solved by this utility model embodiment is to provide an inductor and its power supply module, which can solve some of the problems existing in the existing inductor processing technology.
[0006] To solve the above-mentioned technical problems, the present invention provides an inductor comprising: a magnetic core having a through hole; a copper foil passing through the through hole; and a plurality of supporting portions on the copper foil, the supporting portions including protruding portions and recessed portions.
[0007] In some embodiments, the supporting portion has a trapezoidal structure, and the top surface of the protruding portion contacts the magnetic core.
[0008] In some embodiments, the recessed portion forms a space for accommodating the adhesive.
[0009] In some embodiments, the height of the abutment portion is adapted to the height of the through hole.
[0010] In some embodiments, the width of the copper foil is smaller than the width of the through hole.
[0011] In some embodiments, the copper foil has a first surface on which one or more of the abutment portions are provided.
[0012] In some embodiments, a supporting portion is provided on the first surface, the supporting portion is disposed at the geometric center of the first surface, and the length direction of the supporting portion is parallel to the length direction of the first surface.
[0013] In some embodiments, a plurality of the abutting portions are provided on the first surface, and the plurality of abutting portions are arranged symmetrically about the geometric center of the first surface.
[0014] To solve the above-mentioned technical problems, another technical solution adopted by this utility model is to provide a point power module, including: the inductor as described above; and a plastic encapsulation body, wherein the magnetic core is connected to the substrate of the plastic encapsulation body through the copper foil.
[0015] In some embodiments, the molding compound has slots or openings corresponding to the copper foil.
[0016] The beneficial effects of this utility model embodiment are as follows: Unlike the prior art, this utility model embodiment restricts the up-and-down movement of the copper foil in the through hole by the supporting part, without applying additional pressure to the copper foil, and the recessed part is used to accommodate the adhesive, so as to improve the processing efficiency and product yield of the power module. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the structure of an inductor provided in an embodiment of the present invention;
[0018] Figure 2 This is another structural schematic diagram of an inductor provided in an embodiment of the present invention;
[0019] Figure 3 This is a schematic diagram of the structure of a copper foil provided in an embodiment of the present invention;
[0020] Figure 4 This is another structural schematic diagram of a copper foil provided in an embodiment of the present utility model;
[0021] Figure 5 This is a schematic diagram of another inductor structure provided in this embodiment of the present invention;
[0022] Figure 6 This is a schematic diagram of another structure of an inductor provided in another embodiment of the present invention;
[0023] Figure 7 This is a schematic diagram of another copper foil structure provided in this embodiment of the present invention;
[0024] Figure 8 This is another structural schematic diagram of a copper foil provided in an embodiment of the present invention. Detailed Implementation
[0025] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this specification are for illustrative purposes only.
[0026] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0027] Please see Figures 1-4 This embodiment discloses an inductor structure for a point power module. This structure solves the technical problems of unstable copper foil position and the need to apply additional pressure in the existing inductor processing through an innovative support part design, thereby improving production efficiency and product yield.
[0028] In its implementation, the inductor comprises three key components: a magnetic core 110 with a through hole, a copper foil 120 passing through the through hole, and a supporting portion 121 on the copper foil. The through hole of the magnetic core 110 is precisely designed so that its height matches the overall height of the copper foil 120 and the supporting portion 121. This adaptive design is necessary because: firstly, excessively large gaps can cause the copper foil to wobble during installation, affecting positioning accuracy; secondly, excessively small gaps would increase installation difficulty and may even damage the copper foil or the magnetic core. This precise dimensional matching ensures both ease of installation and component stability.
[0029] The width of the copper foil 120 is designed to be smaller than the width of the through hole, taking into account two aspects: firstly, to provide necessary operating space during installation and avoid damage to the copper foil during installation; secondly, to take into account the possible thermal expansion of the copper foil during high-temperature curing, reserving an appropriate gap can prevent stress concentration. A support portion 121 with a special structure is provided on the first surface of the copper foil, which is the core innovation of this embodiment.
[0030] The supporting portion 121 adopts a trapezoidal structure design, including a protruding portion 1211 and a recessed portion 1212. The top surface of the protruding portion 1211 is in direct contact with the magnetic core 110, providing stable mechanical support and preventing the copper foil from moving in the vertical direction. The recessed portion 1212 forms a space for accommodating the adhesive. The advantage is that after the adhesive melts upon heating, it can naturally flow under gravity and fill the recessed space, achieving uniform distribution without manual intervention. The supporting portion 121 is located at the geometric center of the first surface of the copper foil, and its length direction is parallel to the length direction of the first surface. The selection of the geometric center position is based on mechanical balance considerations to ensure uniform force distribution and effectively prevent the copper foil from tilting or shifting during installation and use.
[0031] During operation, when the copper foil 120 is inserted into the through hole of the magnetic core 110, the supporting part 121, through its special structural design, naturally restricts the movement of the copper foil in the vertical direction without the need for additional pressure. At the same time, the adhesive in the recessed part 1212 is evenly distributed and solidified under the action of gravity during the high-temperature curing process, forming a reliable connection.
[0032] This implementation successfully solves the problems of applying weights to copper foil and uneven adhesive distribution in existing technologies, significantly improving the processing efficiency and product yield of inductors. The entire design fully considers the requirements of the processing technology and the reliability of product use, making it particularly suitable for the manufacturing of point power modules with high requirements for precision and stability.
[0033] Please see Figures 5-8 This embodiment provides an improved inductor structure for a point power module, which further enhances the stability of the structure and the reliability of the manufacturing process through the symmetrical arrangement of multiple supporting parts.
[0034] This embodiment also comprises three basic components: a magnetic core 110 with a through hole, a copper foil 120 passing through the through hole, and a plurality of abutment portions 122 disposed on the copper foil. The through hole design of the magnetic core 110 maintains the same basic principle as the previous embodiment, namely, its size needs to be adapted to the overall structure of the copper foil and the abutment portions. Adaptability design is particularly important in structures with multiple abutment portions, because the presence of multiple support points requires more precise dimensional control to ensure that each abutment portion can function simultaneously.
[0035] In the design of copper foil 120, its width is also kept smaller than the width of the through hole. This design is of greater significance in structures with multiple abutments: firstly, it provides sufficient operating space for the simultaneous assembly of multiple abutments; secondly, considering the cumulative tolerances that may result from multiple abutments, an appropriate gap design can effectively prevent installation difficulties.
[0036] The core innovation of this embodiment lies in the arrangement of the supporting parts 122. Unlike the first embodiment which uses a single supporting part, this embodiment employs multiple supporting parts 122, which are symmetrically arranged about the geometric center of the first surface of the copper foil. The reason for choosing a symmetrical arrangement is that, on the one hand, multiple support points can provide more stable mechanical support, reducing the risk of deformation of the copper foil during use; on the other hand, the symmetrical arrangement ensures uniform force distribution and avoids local stress concentration.
[0037] Each abutment 122 maintains a trapezoidal structural design, including protruding and recessed portions. The contact area between the protruding portion and the magnetic core is optimized to ensure stable support; the recessed portion provides multiple distribution points for the adhesive, allowing the adhesive to be more evenly distributed between the copper foil and the magnetic core. The presence of multiple recessed portions not only improves the reliability of the bond but also improves the flowability of the adhesive during high-temperature curing. It should be noted that the number of abutment portions 122 is multiple.
[0038] In actual operation, the multiple supporting parts 122 work together to form a more reliable positioning mechanism. When the copper foil 120 is inserted into the through hole of the magnetic core 110, each supporting part functions simultaneously, not only restricting the vertical movement of the copper foil but also effectively preventing the copper foil from tilting or twisting. The multi-point support method significantly improves the stability of the component, especially during the high-temperature curing process, where the adhesive in the multiple recessed parts can cure more evenly, forming a more reliable connection.
[0039] Compared to the previous embodiment, this solution, through the symmetrical arrangement of multiple supporting parts, further enhances the structural stability and manufacturing process reliability while maintaining the original advantages. Through this design, this embodiment not only inherits the advantages of the previous embodiment in solving the copper foil positioning and bonding problems, but also provides higher process reliability through multi-point support, further improving the overall product performance and production efficiency.
[0040] Based on the two embodiments described above, this embodiment provides a complete solution for a point power module, the structural diagram of which is shown below. Figure 1 and Figure 2 ,or Figure 5 and Figure 6 As shown, this solution not only incorporates an innovative inductor structure design, but also optimizes the overall module packaging structure, thereby achieving more efficient heat dissipation and more reliable electrical connections.
[0041] In terms of overall structural design, the point power module of this embodiment mainly includes two core parts: an inductor and a molding compound 200 as described in any of the previous embodiments. The inductor adopts the technical solution described in the aforementioned embodiments, including a magnetic core 110 with a through hole, a copper foil 120 passing through the through hole, and a supporting portion 121 or 122 disposed on the copper foil. The molding compound 200 serves as the basic support structure of the entire module, providing not only mechanical protection but also playing a crucial role in heat dissipation.
[0042] Regarding the inductor structure, this embodiment can flexibly adopt a design scheme of a single supporting part 121 or multiple symmetrically distributed supporting parts 122. For example... Figure 1 and Figure 2 As shown, when a single supporting part 121 is used, it is positioned at the geometric center of the first surface of the copper foil. This arrangement ensures uniform force distribution and effectively prevents tilting and displacement. Figure 5 and Figure 6 As shown, when multiple supporting parts 122 are used, the multiple supporting parts 122 are symmetrically distributed about the geometric center of the first surface of the copper foil, which further enhances the stability of the structure. It should be noted that the number of supporting parts 122 is multiple.
[0043] A key innovation in this implementation method regarding module packaging is the design of the molding compound 200. The molding compound 200 features slots or openings specifically designed to correspond to the copper foil 120. The purpose is twofold: firstly, to provide an accurate positioning reference for the copper foil, ensuring precise mounting of the inductor within the module; and secondly, to optimize the heat conduction path and improve the module's heat dissipation efficiency. The magnetic core 110 forms a reliable connection with the substrate of the molding compound 200 via the copper foil 120, guaranteeing both electrical performance and good mechanical strength.
[0044] During operation, the inductor maintains a stable position within the molding compound 200 through its supporting structure. The design of the copper foil 120 not only provides a reliable electrical connection but also forms an effective heat conduction path. When the power module is operating, the heat generated by the inductor can be efficiently dissipated through the copper foil 120 and the molding compound 200, significantly improving the module's reliability and lifespan.
[0045] Compared with existing technologies, the point power module of this embodiment achieves innovation in the following aspects: First, the innovative design of the support part solves the positioning and fixing problem in the inductor installation process; second, the special structural design of the plastic encapsulation body optimizes the heat dissipation performance of the module; finally, the overall structural design fully considers the feasibility of the manufacturing process, significantly improving production efficiency and product yield.
[0046] It should be noted that while the preferred embodiments of this utility model are provided in the specification and accompanying drawings, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of this utility model; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this utility model specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.
Claims
1. An inductor, characterized in that, include: A magnetic core with a through hole; Copper foil inserted through the through hole; The copper foil is provided with several supporting portions, which include protruding portions and recessed portions.
2. The inductor according to claim 1, characterized in that, The supporting part has a trapezoidal structure, and the top surface of the protruding part is in contact with the magnetic core.
3. The inductor according to claim 1, characterized in that, The recessed portion forms a space for accommodating the adhesive.
4. The inductor according to claim 1, characterized in that, The height of the supporting part is adapted to the height of the through hole.
5. The inductor according to claim 1, characterized in that, The width of the copper foil is smaller than the width of the through hole.
6. The inductor according to claim 1, characterized in that, The copper foil has a first surface, on which one or more of the abutment portions are provided.
7. The inductor according to claim 6, characterized in that, The first surface is provided with one abutment portion, which is located at the geometric center of the first surface, and the length direction of the abutment portion is parallel to the length direction of the first surface.
8. The inductor according to claim 6, characterized in that, The first surface is provided with a plurality of abutting portions, which are arranged symmetrically about the geometric center of the first surface.
9. A point power supply module, characterized in that, include: The inductor as described in any one of claims 1-8; as well as The magnetic core is connected to the substrate of the encapsulation via the copper foil.
10. The point power module according to claim 9, characterized in that, The encapsulation body has slots or openings corresponding to the copper foil.