Vapor chamber

Abstract

The utility model relates to a vapor chamber. The vapor chamber comprises a lower substrate, an upper cover plate, a liquid absorbing core, a plurality of radiating fins and a working medium, the upper cover plate covers the lower substrate to form a sealed accommodating space, and the liquid absorbing core and the working medium are arranged in the accommodating space; the upper side face of the side, away from the lower base plate, of the upper cover plate is provided with a plurality of installation grooves, the extending directions of the installation grooves are parallel, and the cooling fins are inserted into the installation grooves. According to the vapor chamber, the connection design of the heat dissipation fins and the upper cover plate is improved, so that the vapor chamber has the advantages that different heat dissipation fins can be replaced according to actual use requirements, and the application scene is wider.

Description

Technical Field

[0001] This utility model relates to the field of radiators, and in particular to a heat spreader. Background Technology

[0002] As electronic technology is rapidly developing towards miniaturization, high power consumption, and lightweighting, the heat flux density of electronic components is constantly increasing, and the heat generated is also increasing. The field of thermal management of electronic devices, i.e. heat dissipation and heat transfer, is facing a major technical challenge.

[0003] As a passive heat exchange device for liquid phase change heat transfer, a vapor chamber possesses excellent heat dissipation capabilities, strong temperature uniformity, and requires no external power drive, effectively improving the thermal management of electronic devices. However, due to its relatively flat surface, the convective heat transfer efficiency between the vapor chamber and the cold source is relatively low. Therefore, heat dissipation fins are typically installed on the heat exchange side to enhance convective heat transfer efficiency through air cooling.

[0004] In existing heat spreaders, the connection between the heat dissipation fins and the heat spreader is usually made as a single piece for easy production. However, the single-piece structure lacks flexibility and cannot replace the heat dissipation fins of different shapes or sizes according to the needs, resulting in a limited application scenario for the heat spreader. Utility Model Content

[0005] Therefore, the purpose of this utility model is to provide a heat spreader.

[0006] A heat spreader includes: a lower substrate, an upper cover plate, a liquid absorber, a plurality of heat dissipation fins, and a working fluid; the upper cover plate covers the lower substrate to form a sealed accommodating space, and the liquid absorber and the working fluid are disposed within the accommodating space;

[0007] The upper side of the upper cover plate away from the lower substrate has several parallel mounting grooves extending in the same direction, and the heat dissipation fins are inserted into the mounting grooves.

[0008] The heat spreader described in this utility model has the advantage of being able to replace different heat dissipation fins according to actual usage needs, and thus having a wider range of applications, through the improved connection design between the heat dissipation fins and the upper cover plate.

[0009] Furthermore, the heat dissipation fins include a connecting portion and a heat dissipation portion, the connecting portion being located within the mounting groove, and the heat dissipation portion protruding above the upper cover plate.

[0010] Through the above technical solution, the heat dissipation fins are connected to the upper cover plate through the cooperation of the connecting part and the mounting groove, and the heat dissipation part accelerates the heat dissipation of the heat dissipation plate.

[0011] Furthermore, the cross-section of the mounting groove is arc-shaped, and a weld seam area extending along the mounting groove is provided at the connection between the heat dissipation part and the upper cover plate.

[0012] Through the above technical solution, the arc-shaped mounting groove and the connecting part achieve a precise fit, and the low heat input laser welding avoids material deformation to reduce thermal resistance.

[0013] Furthermore, the cross-section of the mounting groove is rectangular, and a brazing layer is provided between the connecting part and the bottom surface of the mounting groove.

[0014] Through the above technical solution, the rectangular mounting groove and the connecting part achieve precise fit, and the metallurgical bond is achieved by brazing at a lower temperature to reduce contact thermal resistance.

[0015] Furthermore, the connecting portion is provided with a snap head extending along the mounting groove, and the mounting groove engages with the snap head.

[0016] Through the above technical solution, the inverted T-shaped buckle head and the mounting groove achieve a precise fit, and the connection is achieved through interference fit. The connection method is simple and easy to produce.

[0017] Furthermore, the surface of the heat dissipation part is provided with a concave-convex structure.

[0018] By using the above technical solutions, the surface area of ​​the heat dissipation part is increased, thereby enhancing the heat dissipation capacity.

[0019] Furthermore, the heat spreader also includes support columns extending from the upper cover plate to the lower substrate, and the array of support columns is arranged within the accommodating space.

[0020] Through the above technical solution, the support column plays a supporting role, enabling the heat spreader to maintain a stable shape and structure during operation, and preventing collapse or damage caused by thermal deformation or external pressure.

[0021] Furthermore, the liquid-absorbing core has a through hole extending parallel to the extension direction of the support column, and the through hole penetrates the liquid-absorbing core.

[0022] The above technical solution allows the support column to pass through the through hole and directly contact the upper cover plate and the lower base plate, avoiding damage to the liquid suction core caused by the support column pressing against it.

[0023] Furthermore, the lower substrate, upper cover plate, and heat dissipation fins are made of metal or ceramic.

[0024] The above technical solutions ensure that the heat spreader has high strength and high thermal conductivity.

[0025] Furthermore, the liquid-absorbing core is provided with a wire mesh structure, a groove structure, or a powder sintering structure.

[0026] The above technical solution optimizes the liquid circulation of the working medium and improves heat dissipation efficiency. Attached Figure Description

[0027] Figure 1 An exploded view of the heat spreader provided in Embodiment 1 of this utility model;

[0028] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0029] Figure 3 A three-dimensional structural diagram of the heat spreader provided in Embodiment 1 of this utility model;

[0030] Figure 4 A partially enlarged view of the heat spreader plate provided in Embodiment 1 of this utility model, projected along the horizontal direction.

[0031] Figure 5 A three-dimensional structural diagram of the heat dissipation fins provided in Embodiment 1 of this utility model;

[0032] Figure 6 A partially enlarged view of the horizontal projection of the heat spreader provided in Embodiment 2 of this utility model;

[0033] Figure 7 This is a partially enlarged view of the heat spreader plate provided in Embodiment 3 of this utility model, projected along the horizontal direction. Detailed Implementation

[0034] To address the shortcomings of existing heat spreaders, the inventors have provided a heat spreader that improves the connection design of the heat dissipation fins, changing the traditional one-piece structure of the heat dissipation fins and heat spreader. This allows for flexible selection of different heat dissipation fins to be installed on the heat spreader as needed, while also reducing the thermal resistance of the heat dissipation fins and improving the heat dissipation efficiency of the heat spreader. The following are some specific embodiments of the heat spreader of this invention:

[0035] Example 1

[0036] Please refer to Figures 1 to 5 , Figure 1 An exploded view of the heat spreader provided in Embodiment 1 of this utility model; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 A three-dimensional structural diagram of the heat spreader provided in Embodiment 1 of this utility model; Figure 4 A partially enlarged view of the heat spreader plate provided in Embodiment 1 of this utility model, projected along the horizontal direction. Figure 5 A three-dimensional structural diagram of the heat dissipation fins provided in Embodiment 1 of this utility model;

[0037] This utility model provides a heat spreader, including a lower substrate 1, an upper cover plate 2, a liquid absorber 3, and a plurality of heat dissipation fins 4. The upper cover plate 2 covers the lower substrate 1, and the outer peripheries of the upper cover plate 2 and the lower substrate 1 are connected to form a sealed accommodating space (not labeled) between them. The liquid absorber 3 and a working fluid are disposed within the accommodating space. The liquid absorber 3 is laid on the inner surface of the lower substrate 1 to promote the liquid circulation of the working fluid, and the liquid absorber 3 is separated from the inner surface of the upper cover plate 2 by a certain distance to accommodate the gaseous working fluid.

[0038] The upper side of the upper cover plate 2 away from the lower base plate 1 has a plurality of parallel mounting grooves 21 extending in the same direction. The heat dissipation fins 4 are spaced apart from each other and inserted into the mounting grooves in parallel.

[0039] The heat dissipation fins 4 extend along a direction perpendicular to the surface of the upper cover plate 2, and include a connecting part 41 and a heat dissipation part 42. The connecting part 41 is located in the mounting groove 21, and the heat dissipation part 42 protrudes above the upper cover plate 2 to dissipate heat from the upper cover plate 2 through air-cooled convection heat exchange.

[0040] Preferably, the lower substrate 1, the upper cover plate 2, the liquid-absorbing core 3, and the heat dissipation fins 4 can be any one of copper, copper alloy, aluminum, aluminum alloy, stainless steel, or ceramic parts to ensure high strength and high thermal conductivity.

[0041] Preferably, the liquid-absorbing core 3 has a wire mesh structure, a powder sintering structure, a groove structure, or other combinations thereof, for optimizing the liquid circulation and heat absorption efficiency of the working medium. The wire mesh structure includes continuous liquid channels formed by woven metal wires; the powder sintering structure includes pores formed by sintering highly thermally conductive metal powder; and the groove structure includes microchannels formed by etching or machining to accelerate liquid absorption.

[0042] Preferably, the surface of the heat dissipation part 42 is provided with a concave-convex structure in the shape of a wave, rectangle or triangle, etc., to increase the surface area of ​​the heat dissipation part 42 and enhance the heat dissipation capacity.

[0043] Preferably, the heat spreader further includes support columns 5, which are arranged in an array within the accommodating space. The extension direction of the support columns 5 is from the upper cover plate 2 to the lower substrate 1, so that the heat spreader can maintain a stable shape and structure during operation and prevent collapse or damage caused by thermal deformation or external pressure.

[0044] Preferably, the liquid-absorbing core 3 is provided with through holes 31 extending in a direction parallel to the extension direction of the support column 5. The through holes 31 penetrate the liquid-absorbing core 3, and the support column 5 passes through the through holes 31 and directly abuts against the inner surfaces of the lower substrate 1 and the upper cover plate 4, so as to avoid damaging the liquid-absorbing core 3 by pressure.

[0045] In this embodiment, the mounting groove 21 is projected along its extension direction. The cross-section of the mounting groove 21 is an arc protruding towards the lower substrate 1. The heat dissipation part 42 and the upper cover plate 2 are respectively provided with weld seam areas 43 extending along the mounting groove 21 at their connection points. The connecting part 31 is precisely matched with the mounting groove 21. A high-precision, low-heat-input laser is used for welding along the weld seam area 43 to achieve a firm connection between the heat dissipation fins 4 and the upper cover plate 2, avoiding material deformation and reducing thermal resistance.

[0046] When it is necessary to replace the heat dissipation fin 4, it can be removed from the mounting groove 21 by mechanical separation. Specifically, by using mechanical equipment (pliers, cutting tools, etc.) to apply force evenly around the weld, the heat dissipation fin 4 can be separated from the mounting groove 21 without damaging the heat dissipation fin 4 or the mounting groove 21.

[0047] Example 2

[0048] Please refer to Figure 6 , Figure 6 This is a partially enlarged view of the heat spreader plate provided in Embodiment 2 of this utility model, projected along the horizontal direction.

[0049] The heat spreader provided in this embodiment has a basically the same structure as the heat spreader provided in Embodiment 1, the difference being:

[0050] Projected along the extending direction of the mounting groove 21, the cross-section of the mounting groove 21 is rectangular. A brazing layer 6 is also provided between the connecting part 41 and the bottom surface of the mounting groove 21. The connecting part 41 and the mounting groove 21 are precisely connected together through the brazing layer 6, achieving metallurgical bonding at a lower temperature to reduce contact thermal resistance and thus ensure efficient heat conduction.

[0051] When it is necessary to replace the heat dissipation fins 4, the heat dissipation fins 4 can be removed from the mounting groove 21 by chemical stripping. Specifically, the brazing layer 6 at the weld seam is dissolved by using a chemical agent, thereby achieving the removal of the heat dissipation fins 4. This method allows for accurate separation of the heat dissipation fins 4 without damaging the mounting groove 21.

[0052] Example 3

[0053] Please refer to Figure 7 , Figure 7 This is a partially enlarged view of the heat spreader plate provided in Embodiment 3 of this utility model, projected along the horizontal direction.

[0054] The heat spreader provided in this embodiment has a basically the same structure as the heat spreader provided in Embodiment 1, the difference being:

[0055] Projecting along the extending direction of the mounting groove 21, the connecting part 41 is provided with a snap head 411 extending along the mounting groove 21. The cross-section of the snap head 411 is inverted T-shaped. The mounting groove 21 is a snap groove that mates with the snap head 411. The snap head 411 and the mounting groove 21 are mechanically connected by an interference fit, which not only ensures the connection strength between the heat dissipation fins 4 and the upper cover plate 2, but also reduces the workload caused by welding.

[0056] When it is necessary to replace the heat sink fin 4, select an appropriate tool (screwdriver, pliers, or other disassembly tools) and gently tap one side of the clip head 411 to gradually disengage it from the fixed position, thereby separating the heat sink fin 4 from the mounting groove 21 without damaging the heat sink fin 4 or the mounting groove 21.

[0057] Compared with the prior art, the heat spreader provided by this utility model has the following advantages:

[0058] (1) This utility model improves the structural design and process of welding between heat dissipation fins and heat spreader, effectively reducing the contact thermal resistance between heat dissipation fins and heat spreader, thereby improving thermal conductivity.

[0059] (2) The heat dissipation plate provided by this utility model can be replaced with suitable heat dissipation fins according to specific needs, and the disassembly and assembly method is simple and will not damage the heat dissipation fins and heat dissipation plate.

[0060] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and this utility model also intends to include these modifications and variations.

Claims

1. A heat spreader, characterized in that, include: The lower substrate (1), upper cover plate (2), liquid absorber (3), several heat dissipation fins (4) and working fluid; the upper cover plate (2) covers the lower substrate (1) to form a sealed accommodating space, and the liquid absorber (3) and the working fluid are disposed in the accommodating space; The upper cover plate (2) has several mounting grooves (21) with parallel extending directions on its upper side away from the lower substrate (1), and the heat dissipation fins (4) are inserted into the mounting grooves (21).

2. The heat spreader according to claim 1, characterized in that: The heat dissipation fins (4) include a connecting part (41) and a heat dissipation part (42). The connecting part (41) is located in the mounting groove (21), and the heat dissipation part (42) protrudes above the upper cover plate (2).

3. The heat spreader according to claim 2, characterized in that: The cross-section of the mounting groove (21) is arc-shaped, and a weld area (43) extending along the mounting groove (21) is provided at the connection between the heat dissipation part (42) and the upper cover plate (2).

4. The heat spreader according to claim 2, characterized in that: The cross-section of the mounting groove (21) is rectangular, and a brazing layer (6) is provided between the connecting part (41) and the bottom surface of the mounting groove (21).

5. The heat spreader according to claim 2, characterized in that: The connecting part (41) is provided with a snap head (411) extending along the mounting groove (21), and the mounting groove (21) engages with the snap head (411).

6. The heat spreader according to any one of claims 3-5, characterized in that: The surface of the heat dissipation part (42) is provided with a concave-convex structure.

7. The heat spreader according to claim 1, characterized in that: It also includes support columns (5) extending from the upper cover plate (2) to the lower substrate (1), and the support columns (5) are arranged in an array within the accommodating space.

8. The heat spreader according to claim 7, characterized in that: The liquid-absorbing core (3) has a through hole (31) extending in a direction parallel to the extension direction of the support column (5), and the through hole (31) penetrates the liquid-absorbing core (3).

9. The heat spreader according to claim 1, characterized in that: The lower substrate (1), upper cover plate (2) and heat dissipation fins (4) are metal or ceramic parts.

10. The heat spreader according to claim 9, characterized in that: The liquid-absorbing core (3) is provided with a wire mesh structure, a groove structure or a powder sintering structure.

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