Perovskite etching equipment

Abstract

The utility model provides perovskite etching equipment, which is used for etching a perovskite sheet and comprises a portal frame, a moving mechanism arranged on the portal frame, an etching mechanism, a camera assembly, a bearing jig and a Y-axis moving assembly for driving the bearing jig to move below the etching mechanism, the bearing jig comprises a base, a screen printing plate, a baffle arranged on one side of the base and a clamp assembly arranged on the other side of the base, and the clamp assembly comprises a push plate and a driving part for driving the push plate to horizontally move in the direction towards or away from the baffle. The push plate and the baffle plate abut against the side edge of the screen printing plate and detachably fix the screen printing plate on the base, and the perovskite sheet is arranged on the screen printing plate. Through the arrangement, the processing precision and efficiency of the perovskite sheet are greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment, and in particular to a perovskite etching device. Background Technology

[0002] With the development of photoelectric conversion technology, perovskite materials have attracted widespread attention due to their excellent photoelectric properties and low-cost preparation methods. In the manufacturing process of perovskite solar cells, light-emitting diodes (LEDs), lasers, and other optoelectronic devices, precise control of the size and shape of perovskite wafers is crucial. Traditional mechanical cutting or chemical etching methods often fail to achieve high-precision and high-efficiency processing and may damage the perovskite material, affecting its photoelectric properties. Therefore, developing equipment capable of precisely and efficiently etching perovskite wafers has become an urgent industry need.

[0003] Therefore, it is necessary to design a perovskite etching device to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a perovskite etching device to solve the problems of low processing precision, low efficiency, and easy material damage in the existing perovskite sheet processing technology.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a perovskite etching apparatus for etching perovskite sheets, comprising a gantry, a moving mechanism mounted on the gantry, an etching mechanism, a camera assembly, a support fixture, and a Y-axis moving assembly that drives the support fixture to move below the etching mechanism. The support fixture includes a base, a screen, a baffle plate on one side of the base, and a clamping assembly on the other side of the base. The clamping assembly includes a push plate and a driving part that drives the push plate to translate toward or away from the baffle plate. The push plate and the baffle plate abut against the side of the screen and detachably fix the screen to the base. The perovskite sheet is disposed on the screen.

[0006] As a further improvement of the present invention, the drive unit includes a mounting base, a handle, a crank, a push rod, and a push rod sleeve. The handle is mounted on the mounting base via a pivot, and the handle rotates horizontally around the pivot. One end of the crank is hinged to the handle, and the other end of the crank is hinged to one end of the push rod. The push rod passes through the push rod sleeve, and the push rod sleeve is fixed to the base.

[0007] As a further improvement of the present invention, the handle is also provided with a limiting post, which is adjacent to the hinge axis between the crank and the handle and is located on the side of the crank protrusion.

[0008] As a further improvement of the present invention, the clamping assembly further includes a guide portion, which includes a guide rod disposed on the push plate and a guide sleeve disposed on the base, with the guide rod passing through the guide sleeve.

[0009] As a further improvement of this utility model, there are two guide parts, which are respectively located on both sides of the drive part.

[0010] As a further improvement of the present invention, the baffle is L-shaped, and there are two baffles, which abut against the two adjacent corners of the screen respectively.

[0011] As a further improvement of the present invention, the supporting fixture is further provided with a light source controller and a light source, which are located below the screen.

[0012] As a further improvement of the present invention, the etching mechanism includes a laser generator, an optical path control component, a collimation component, and a galvanometer arranged in sequence.

[0013] As a further improvement of the present invention, the camera assembly includes a CCD camera and a light source, and the camera assembly and the galvanometer are arranged side by side on the moving mechanism.

[0014] As a further improvement of this utility model, the laser generator and the optical path control component are mounted on the gantry.

[0015] As can be seen from the above technical solution, the perovskite etching equipment of this utility model achieves high-precision, non-destructive etching of perovskite wafers by integrating a gantry structure, a moving mechanism, an etching mechanism, a real-time monitoring camera assembly, and an innovatively designed support fixture and Y-axis moving assembly. The perovskite etching equipment of this utility model has the following specific advantages:

[0016] 1. High-precision positioning and etching: Through precise control of the moving mechanism and real-time monitoring by the camera component, the accuracy of the etching path is ensured, thus improving the processing precision.

[0017] 2. Flexible adjustment and strong adaptability: The design of the fixture assembly allows for quick replacement of screens and perovskite sheets of different specifications, adapting to diverse production needs and improving the versatility and flexibility of the equipment.

[0018] 3. Non-destructive processing: Non-contact etching technology (such as laser etching) is used to reduce physical damage to perovskite materials and maintain their photoelectric properties.

[0019] 4. Improved efficiency: The Y-axis moving component drives the load-bearing fixture to move smoothly, which, together with the automated control system, significantly improves processing efficiency and output.

[0020] 5. Ease of operation and safety: The overall design takes into account the ease of operation and safety of users, reduces the difficulty of operation, and has safety protection measures to ensure the safety of operators. Attached Figure Description

[0021] Figure 1 This is a perspective view of a perovskite etching apparatus according to an embodiment of the present invention.

[0022] Figure 2 for Figure 1 A three-dimensional view of the load-bearing fixture.

[0023] Figure 3 for Figure 2 Exploded view of the load-bearing fixture.

[0024] Figure 4 for Figure 2 A perspective view of the drive unit of the clamping assembly.

[0025] Figure 5 This is a schematic diagram showing the different states of the drive unit during operation. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] Please refer to Figure 1 As shown, this utility model provides a perovskite etching apparatus for etching perovskite thin films. The perovskite etching apparatus includes a base 10, a gantry 20 mounted on the base 10, a moving mechanism mounted on the gantry 20, an etching mechanism and a camera assembly 64, a support fixture 70, and a Y-axis moving assembly 80 that moves the support fixture 70 below the etching mechanism.

[0028] The moving mechanism specifically includes an X-axis moving component 30 and a Z-axis moving component 50 disposed on the X-axis moving component 30. The X-axis moving component 30 and the Z-axis moving component 50 can be selected from existing linear modules, as long as linear movement is achieved in the required direction, and there are no restrictions here.

[0029] The etching mechanism generates and controls a laser beam to etch the perovskite wafer. It includes a laser generator 40, an optical path control assembly 61, a collimation assembly 62, and a galvanometer 63, arranged sequentially. The laser generator 40 and the optical path control assembly 61 are mounted on a gantry 20. The camera assembly 64 includes a CCD camera and a light source. The camera assembly 64 and the galvanometer 63 are arranged side-by-side on the Z-axis movement assembly 50 for real-time monitoring and recording of the perovskite wafer etching process, allowing for evaluation and adjustment of the etching effect.

[0030] The support fixture 70 is used to hold the perovskite sheet, ensuring its stability during etching. Please refer to... Figure 2 and Figure 3 As shown, the support fixture 70 includes a base 71, a screen 75, a baffle 711 disposed on one side of the base 71, and a clamping assembly disposed on the other side of the base 71. The clamping assembly includes a push plate 73, a drive part 72 for driving the push plate 73 to translate toward or away from the baffle 711, and a guide part. The push plate 73 and the baffle 711 abut against the side of the screen 75 and detachably fix the screen 75 to the base 71. The perovskite sheet is disposed on the screen 75.

[0031] Please refer to Figure 4 and Figure 5 As shown, the drive unit 72 includes a mounting base 721, a handle 722, a crank 723, a push rod 724, and a push rod sleeve 727. The handle 722 is mounted on the mounting base 721 via a pivot 725, and rotates horizontally about the pivot 725. One end of the crank 723 is hinged to the handle 722, and the other end is hinged to one end of the push rod 724. The push rod 724 passes through the push rod sleeve 727, which is fixed to the base 71. When the handle 722 is rotated, it moves the crank 723, which in turn moves the push rod 724 along the push rod sleeve 727, thereby moving the push plate 73 at the front end of the push rod 724. A limiting post 726 is also provided on the handle 722, adjacent to the hinge axis between the crank 723 and the handle 722, and located on the protruding side of the crank 723. Please refer to... Figure 5 As shown, when the protruding side of the crank 723 contacts the limiting post 726, the front end of the crank 723 is located at point A1. At this time, A1 is farthest from point O (i.e., the center point of the shaft 725, which is a fixed point), meaning the distance between the push plate 73 and the baffle 711 is the shortest. When the handle 722 is rotated counterclockwise by 180 degrees, the concave side of the crank 723 contacts the shaft 725. At this time, the front end of the crank 723 is located at point A3. At this time, A3 is closest to point O, meaning the distance between the push plate 73 and the baffle 711 is the farthest.

[0032] The guide section includes a guide rod 731 mounted on the push plate 73 and a guide sleeve 74 mounted on the base 71. The guide rod 731 passes through the guide sleeve 74 to ensure smooth movement of the push plate 73. There are two guide sections, located on opposite sides of the drive section 72. Two L-shaped baffles 711 are provided, each abutting against adjacent corners of the screen 75.

[0033] The support fixture 70 is also equipped with a light source controller 77 and a light source 76, which are located below the screen 75 to provide illumination to help control and monitor the etching process. The Y-axis moving component 80 is used to move the support fixture 70 in the Y direction to achieve full etching of the perovskite wafer. In this embodiment, the Y-axis moving component 80 can be an existing linear module, as long as linear movement is achieved in the desired direction; there is no limitation on this.

[0034] The terms used herein, such as “upper,” “lower,” “front,” and “back,” indicating relative spatial positions, are for illustrative purposes to describe the relationship of one feature relative to another, as shown in the accompanying drawings. It is understood that, depending on the product's placement, these terms may be intended to include different orientations besides those shown in the figures, and should not be construed as limiting the claims.

[0035] Furthermore, the above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art. Although the present utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present utility model. All technical solutions and improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.

Claims

1. A perovskite etching apparatus for etching perovskite thin films, characterized in that: The device includes a gantry frame, a moving mechanism mounted on the gantry frame, an etching mechanism, a camera assembly, a support fixture, and a Y-axis moving assembly that moves the support fixture below the etching mechanism. The support fixture includes a base, a screen, a baffle on one side of the base, and a clamping assembly on the other side of the base. The clamping assembly includes a push plate and a driving part that drives the push plate to translate toward or away from the baffle. The push plate and the baffle abut against the side of the screen and detachably fix the screen to the base. The perovskite sheet is disposed on the screen.

2. The perovskite etching equipment as described in claim 1, characterized in that: The drive unit includes a mounting base, a handle, a crank, a push rod, and a push rod sleeve. The handle is mounted on the mounting base via a pivot and rotates horizontally around the pivot. One end of the crank is hinged to the handle, and the other end of the crank is hinged to one end of the push rod. The push rod passes through the push rod sleeve, and the push rod sleeve is fixed to the base.

3. The perovskite etching equipment as described in claim 2, characterized in that: The handle is also provided with a limiting post, which is adjacent to the hinge axis between the crank and the handle and is located on the side of the crank protrusion.

4. The perovskite etching equipment as described in claim 2, characterized in that: The clamping assembly further includes a guide portion, which includes a guide rod disposed on the push plate and a guide sleeve disposed on the base, with the guide rod passing through the guide sleeve.

5. The perovskite etching equipment as described in claim 4, characterized in that: There are two guide parts, which are located on both sides of the drive part.

6. The perovskite etching equipment as described in claim 1, characterized in that: The baffle is L-shaped, and there are two baffles, which abut against two adjacent corners of the screen.

7. The perovskite etching equipment as described in claim 1, characterized in that: The support fixture is also equipped with a light source controller and a light source, which are located below the screen.

8. The perovskite etching equipment as described in claim 1, characterized in that: The etching mechanism includes a laser generator, an optical path control component, a collimation component, and a galvanometer arranged in sequence.

9. The perovskite etching apparatus as described in claim 8, characterized in that: The camera assembly includes a CCD camera and a light source, and the camera assembly and the galvanometer are arranged side by side on the moving mechanism.

10. The perovskite etching apparatus as described in claim 8, characterized in that: The laser generator and the optical path control assembly are mounted on the gantry.

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