Integrated single wafer cleaning nozzle

Abstract

The utility model relates to an integrated single wafer cleaning nozzle, and belongs to the technical field of wafer cleaning equipment. According to the integrated single wafer cleaning nozzle, the front end of the nozzle cantilever is provided with the mounting plate, and the mixing block used for mixing nitrogen and isopropanol and the nozzle assembly used for spraying out cleaning liquid or clean water are both arranged on the mounting plate. According to the integrated single wafer cleaning nozzle, nitrogen and isopropanol mixed gas and cleaning liquid or clear water can be sprayed out at the same time, meanwhile, the nitrogen and isopropanol mixed gas is close to the cleaning liquid or clear water outlet, the cleaning liquid or clear water outlet can be dried, and liquid is prevented from remaining on the nozzle assembly.

Description

Technical Field

[0001] This application belongs to the technical field of wafer cleaning equipment, and in particular relates to an integrated single-wafer cleaning nozzle. Background Technology

[0002] Chinese utility model patent document CN214624981U discloses a single-wafer cleaning device, consisting of an outer frame and an internal single-wafer cleaning mechanism. A key component of the single-wafer cleaning mechanism is the cleaning fluid nozzle mechanism. The cleaning fluid nozzles can rotate to position the nozzle above the wafer or above the cleaning fluid overflow port. There are several nozzles arranged in parallel, with three nozzles in total. Each nozzle sprays a different cleaning fluid to correspond to different cleaning steps. For example, sulfuric acid and hydrogen peroxide are used as cleaning fluids to remove organic contaminants and some metals from the wafer surface. SC1 cleaning fluid is an alkaline solution that removes particles and organic matter; SC2 cleaning fluid removes metals from the silicon wafer surface; DHF is sprayed to remove the natural oxide film on the wafer surface while inhibiting oxide film formation, removing metals such as Al, Fe, Zn, and Ni from the silicon surface, and also removing hydroxides from the natural oxide film; RCA2 is sprayed to remove metals such as Na, Fe, and Mg from the wafer surface.

[0003] Although the nozzle mechanism consists of multiple nozzles and the nozzle can be moved into the cleaning cylinder for cleaning, water residue is easily left on the nozzles. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide an integrated wafer cleaning nozzle that integrates multiple nozzles to prevent liquid residue on the cleaning fluid or clean water nozzles.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A modular wafer cleaning nozzle, comprising:

[0007] Lifting drive components;

[0008] Rotary drive component;

[0009] A rotating tube, which can be raised and lowered by a lifting drive component, and can also be rotated by a rotating drive component.

[0010] A connecting block is located at the top of the rotating tube;

[0011] The cantilever is mounted on the connecting block and is hollow in the middle.

[0012] Mounting plate, installed at the front end of the nozzle cantilever;

[0013] A mixing block is mounted on a mounting plate. The mixing block includes a body, a nitrogen inlet port and an isopropanol inlet port on the body, and a mixture outlet at the bottom of the mixing block. Nitrogen and isopropanol are mixed inside the mixing block and then sprayed out from the mixture outlet.

[0014] A nozzle assembly, used to spray cleaning fluid or clean water, is mounted on the mounting plate on one side of the mixing block.

[0015] Preferably, in the integrated wafer cleaning nozzle of this invention, the nitrogen inlet is connected to the side of the connecting block and the isopropanol inlet is connected to the top surface of the connecting block.

[0016] Preferably, in this invention, the integrated wafer cleaning nozzle, the mixing block, and the nozzle assembly are all mounted on the mounting plate by screws.

[0017] Preferably, in the integrated wafer cleaning nozzle of this utility model, a clamping block is provided inside the connecting block, and a plurality of clamping grooves are provided on the clamping block, wherein the connecting pipes of the nozzle assembly, the nitrogen inlet port and the isopropanol inlet port are clamped in the clamping grooves.

[0018] Preferably, the integrated wafer cleaning nozzle of this utility model includes a nozzle body, a nozzle installed at the bottom of the nozzle body, and a connector provided above the nozzle body.

[0019] Preferably, in the integrated wafer cleaning nozzle of this utility model, the nozzle body has an inclined surface, and the connector is disposed on the inclined surface to form an inclined arrangement.

[0020] Preferably, in the integrated wafer cleaning nozzle of this invention, a corrugated tube is sleeved on the rotating tube.

[0021] Preferably, the lifting drive component of the integrated wafer cleaning nozzle of this utility model is a cylinder.

[0022] Preferably, the rotating drive component of the integrated wafer cleaning nozzle of this invention is a motor.

[0023] The beneficial effects of this utility model are:

[0024] The present invention relates to a modular wafer cleaning nozzle, wherein a mounting plate is installed at the front end of the nozzle cantilever. A mixing block for mixing nitrogen and isopropanol and a nozzle assembly for spraying cleaning fluid or water are both mounted on the mounting plate. This allows the modular wafer cleaning nozzle of the present invention to simultaneously spray a mixture of nitrogen and isopropanol gas and cleaning fluid or water. At the same time, the nitrogen and isopropanol gas is close to the cleaning fluid or water outlet, which can also dry the outlet of the cleaning fluid or water and prevent residual liquid on the nozzle assembly. Attached Figure Description

[0025] The technical solution of this application will be further described below with reference to the accompanying drawings and embodiments.

[0026] Figure 1 This is a schematic diagram of the structure of the integrated wafer cleaning nozzle according to an embodiment of this application;

[0027] Figure 2 This is a schematic diagram of the structure of the cantilever front end according to an embodiment of this application;

[0028] Figure 3 This is a schematic diagram of the structure of the mixing block and nozzle assembly according to an embodiment of this application;

[0029] Figure 4 This is a schematic diagram of the clamping block according to an embodiment of this application;

[0030] Figure 5 This is a schematic diagram of the mixing block and nozzle assembly from another direction according to an embodiment of this application;

[0031] The attached figures are labeled as follows:

[0032] 1. Lifting drive component;

[0033] 2. Rotary drive component;

[0034] 3. Rotating tube;

[0035] 4. Connecting blocks;

[0036] 5. Cantilever;

[0037] 6. Mounting plate;

[0038] 7. Mixed blocks;

[0039] 8. Nozzle assembly;

[0040] 9. Corrugated pipe;

[0041] 41. Clamping block;

[0042] 71 ontology;

[0043] 72 Nitrogen inlet port;

[0044] 73. Isopropanol inlet;

[0045] 74 Mixture outlet;

[0046] 81 Nozzle body;

[0047] 82 connector;

[0048] 83 Nozzle. Detailed Implementation

[0049] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0050] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0051] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0052] The technical solution of this application will now be described in detail with reference to the accompanying drawings and embodiments.

[0053] Example

[0054] This embodiment provides a modular wafer cleaning nozzle, such as... Figure 1 As shown, it includes:

[0055] Lifting drive component 1;

[0056] Rotary drive component 2;

[0057] The rotating tube 3 can be raised and lowered by the lifting drive 1, and can also be rotated by the rotating drive 2.

[0058] Connecting block 4 is located at the top of rotating tube 3;

[0059] Cantilever 5 is mounted on connecting block 4 and is hollow in the middle;

[0060] Mounting plate 6 is installed at the front end of nozzle cantilever 5;

[0061] Mixing block 7 is disposed on mounting plate 6. Mixing block 7 includes body 71, nitrogen inlet 72 and isopropanol inlet 73 disposed on body 71, and the bottom of mixing block 7 is a mixture outlet 74. Nitrogen and isopropanol are mixed in mixing block 7 and then sprayed out from mixture outlet 74.

[0062] The nozzle assembly 8, used to spray cleaning fluid or clean water, is mounted on the mounting plate 6 on one side of the mixing block 7.

[0063] In this embodiment, the integrated wafer cleaning nozzle has a mounting plate 6 installed at the front end of the nozzle cantilever 5. The mixing block 7 for mixing nitrogen and isopropanol and the nozzle assembly 8 for spraying cleaning fluid or clean water are both mounted on the mounting plate 6. This allows the integrated wafer cleaning nozzle of this embodiment to spray nitrogen and isopropanol mixed gas and cleaning fluid or clean water simultaneously. At the same time, the nitrogen and isopropanol mixed gas is close to the cleaning fluid or clean water outlet, which can also dry the outlet of the cleaning fluid or clean water and prevent residual liquid on the nozzle assembly 8.

[0064] Furthermore, the nitrogen inlet 72 is connected to the side of the connecting block 4 and the isopropanol inlet 73 is connected to the top surface of the connecting block 4.

[0065] Furthermore, both the mixing block 7 and the nozzle assembly 8 are mounted on the mounting plate 6 by screws.

[0066] Furthermore, the connecting pipes of the nozzle assembly 8, nitrogen inlet 72 and isopropanol inlet 73 pass through the cantilever 5, connecting block 4 and rotating pipe 3 and exit from the bottom of rotating pipe 3.

[0067] Furthermore, such as Figure 4 As shown, a clamping block 41 is provided inside the connecting block 4, and a plurality of clamping grooves are provided on the clamping block 41. The connecting pipes of the nozzle assembly 8, the nitrogen inlet port 72 and the isopropanol inlet port 73 are clamped in the clamping grooves.

[0068] Furthermore, such as Figure 3 As shown, the nozzle assembly 8 includes a nozzle body 81, a nozzle 83 installed at the bottom of the nozzle body 81, and a connector 82 provided above the nozzle body 81.

[0069] Furthermore, the nozzle body 81 has a bevel, and the connector 82 is disposed on the bevel to form an inclined configuration. The beveled connector 82 facilitates the routing of the pipeline.

[0070] Furthermore, a bellows 9 is fitted onto the rotating tube 3. The bellows 9 is expandable and contractible to accommodate the raising and lowering of the rotating tube 3, and the bellows 9 ensures that the rotating tube 3 is protected from corrosion by the cleaning fluid.

[0071] Furthermore, the lifting drive component 1 is a cylinder. Furthermore, the rotation drive component 2 is a motor.

[0072] Based on the above-described preferred embodiments according to this application, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this application. The technical scope of this application is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A type of integrated monolithic wafer cleaning nozzle, characterized in that, include: Lifting drive component (1); Rotary drive component (2); The rotating tube (3) can be raised and lowered by the lifting drive (1) and can also be rotated by the rotating drive (2). Connecting block (4) is set at the top of rotating tube (3); The cantilever (5) is mounted on the connecting block (4) and is hollow in the middle; Mounting plate (6) is installed at the front end of nozzle cantilever (5); A mixing block (7) is mounted on a mounting plate (6). The mixing block (7) includes a body (71), a nitrogen inlet (72) and an isopropanol inlet (73) on the body (71), and a mixture outlet (74) at the bottom of the mixing block (7). Nitrogen and isopropanol are mixed in the mixing block (7) and then sprayed out from the mixture outlet (74). The nozzle assembly (8), used to spray cleaning fluid or clean water, is mounted on the mounting plate (6) on one side of the mixing block (7).

2. The integrated monolithic wafer cleaning nozzle according to claim 1, characterized in that, Nitrogen inlet (72) is connected to the side of the connecting block (4) and isopropanol inlet (73) is connected to the top surface of the connecting block (4).

3. The integrated monolithic wafer cleaning nozzle according to claim 1, characterized in that, Both the mixing block (7) and the nozzle assembly (8) are mounted on the mounting plate (6) by screws.

4. The integrated monolithic wafer cleaning nozzle according to claim 1, characterized in that, The connecting block (4) is provided with a clamping block (41), and the clamping block (41) is provided with several clamping grooves. The connecting pipes of the nozzle assembly (8), nitrogen inlet (72) and isopropanol inlet (73) are clamped in the clamping grooves.

5. The integrated monolithic wafer cleaning nozzle according to claim 1, characterized in that, The nozzle assembly (8) includes a nozzle body (81), a nozzle (83) installed at the bottom of the nozzle body (81), and a connector (82) provided above the nozzle body (81).

6. The integrated monolithic wafer cleaning nozzle according to claim 5, characterized in that, The nozzle body (81) has an inclined surface, and the connector (82) is disposed on the inclined surface to form an inclined arrangement.

7. The integrated monolithic wafer cleaning nozzle according to claim 1, characterized in that, A corrugated pipe (9) is fitted onto the rotating tube (3).

8. The integrated monolithic wafer cleaning nozzle according to claim 1, characterized in that, The lifting drive component (1) is a cylinder.

9. The integrated monolithic wafer cleaning nozzle according to claim 1, characterized in that, The rotary drive component (2) is a motor.

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