Micro-bubble spray head device for silicon wafer cleaning

Abstract

The utility model provides a microbubble nozzle device for cleaning a silicon wafer. The device comprises a plurality of groups of spray head mounting racks arranged in an array, spray head assemblies are arranged on the spray head mounting racks, the spray head assemblies are quickly matched with the spray head mounting racks through arc-shaped mounting grooves, and the micro-bubble spray heads are fixedly mounted on the spray head mounting racks through mounting toggle clips. The utility model relates to the field of cleaning equipment.

Description

Technical Field

[0001] This utility model relates to the field of cleaning equipment, and in particular to a microbubble nozzle device for cleaning silicon wafers. Background Technology

[0002] Microbubble silicon wafer cleaning technology is an advanced cleaning method that utilizes tiny bubbles to improve cleaning efficiency and effectiveness. This technology typically involves specialized microbubble generators capable of producing microbubbles with a diameter of less than 50 micrometers. These microbubbles form a microbubble cleaning solution in a liquid, used to clean sensitive materials such as silicon wafers. Microbubble cleaning technology effectively removes particulate matter from the substrate surface through the principle of like charges repelling each other, while reducing environmental impact and lowering operating costs. In contrast, conventional microbubble cleaning devices are complex in structure, have high maintenance costs, and are inconvenient to use. Utility Model Content

[0003] In view of the problems existing in the prior art, this utility model proposes a microbubble nozzle device with good cleaning effect, convenient disassembly and assembly, and convenient maintenance.

[0004] To achieve the above objectives, a microbubble nozzle device for silicon wafer cleaning is provided, which includes several arrayed nozzle mounting frames. A nozzle assembly is provided on the nozzle mounting frame. The nozzle assembly quickly engages with the nozzle mounting frame through an arc-shaped mounting groove, and the microbubble nozzle is fixedly mounted on the nozzle mounting frame by a mounting clip.

[0005] Based on the above, the nozzle mounting bracket has several sets of nozzle assemblies arranged in an array. These sets of nozzle assemblies can simultaneously generate microbubbles to clean the silicon semiconductor wafers from all angles, improving the cleaning effect. The arc-shaped mounting groove allows for quick positioning and installation of the nozzle assemblies, and the mounting clips securely hold the nozzle assemblies in place. Each set of nozzle assemblies is installed independently, facilitating replacement and maintenance, and reducing maintenance costs.

[0006] Furthermore, the nozzle assembly includes four symmetrically arranged nozzles and a water supply pipe. The nozzles are threaded into the water supply pipe, and a connector for connecting to the main pipe is provided in the middle of the water supply pipe.

[0007] Based on the above, the nozzle assembly includes four independent and detachable nozzles, which increases the number of nozzles in a limited space, effectively utilizes space, and improves cleaning ability.

[0008] Furthermore, the nozzle includes a hollow, cylindrical nozzle housing, an input cavity coaxially arranged with the nozzle housing and fixedly fitted at its end, and a first through hole for communicating with the inside and outside of the input cavity is provided on the side wall of the end inserted into the nozzle housing. A first pressure relief chamber is formed in the region of the input cavity near the first through hole. A plurality of second through holes for communicating with the inside and outside of the nozzle housing are provided on the wall surface of the nozzle housing. A second pressure relief chamber is formed in the region of the nozzle housing near the second through holes.

[0009] Based on the above, the gas-liquid mixture is sequentially passed through the first pressure chamber and the second pressure chamber for liquid separation, generating more microbubbles and improving cleaning ability.

[0010] Furthermore, nuts are symmetrically arranged on the left and right sides of the arc-shaped mounting groove, and the mounting clips are fixedly installed on the nozzle mounting bracket by screws cooperating with the nuts.

[0011] Based on the above, the mounting clip can be installed in conjunction with the nut to fix the nozzle assembly on the nozzle mounting bracket, providing good fixation and easy disassembly.

[0012] To more clearly illustrate the above-mentioned features of this utility model and the objectives it aims to achieve, the present utility model will be further described below in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0013] Figure 1 : This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 : This is a schematic diagram of the nozzle assembly;

[0015] Figure 3 : A schematic diagram of the structure of the nozzle mounting bracket and the mounting clips.

[0016] Figure 4 : This is a cross-sectional view of the nozzle.

[0017] Reference numerals: 1. Nozzle mounting bracket; 2. Nozzle assembly; 3. Arc-shaped mounting groove; 4. Mounting clip; 5. Nozzle; 6. Water supply pipe; 7. Connector; 8. Housing; 9. Inlet cavity; 10. First through hole; 11. First pressure relief chamber; 12. Second through hole; 13. Second pressure relief chamber; 14. Nut. Detailed Implementation

[0018] like Figures 1 to 4As shown, a microbubble nozzle 5 device for silicon wafer cleaning includes several arrayed nozzle mounting frames 1. A nozzle assembly 2 is mounted on each nozzle mounting frame 1. The nozzle assembly 2 quickly engages with the nozzle mounting frame 1 via an arc-shaped mounting groove 3, and the microbubble nozzle 5 is fixedly mounted on the nozzle mounting frame 1 using mounting clips 4. The nozzle assembly 2 includes four symmetrically arranged microbubble nozzles 5 and a water supply pipe 6. The microbubble nozzle 5 is threaded into the water supply pipe 6, and a connector 7 for connecting to a main pipe is located in the middle of the water supply pipe 6. Nuts 14 are symmetrically arranged on both sides of the arc-shaped mounting groove 3. The nuts 14 are fixed to the nozzle mounting frame 1 by welding, and the mounting clips 4 are fixed to the nozzle mounting frame 1 by screws engaging with the nuts 14.

[0019] During cleaning, several sets of nozzle assemblies 2 can simultaneously generate microbubbles to thoroughly clean the silicon semiconductor wafers, improving the cleaning effect. Furthermore, the arc-shaped mounting groove 3 allows for quick positioning and installation of the nozzle assemblies 2, and the mounting clips 4 securely fasten and fix the nozzle assemblies 2. Additionally, each set of nozzle assemblies 2 can be installed independently, facilitating replacement and maintenance, and reducing maintenance costs.

[0020] The microbubble nozzle 5 includes a hollow, cylindrical microbubble nozzle shell 8 and an input cavity 9 coaxially arranged with the shell 8 and fixedly fitted at its end. A first through hole 10 is provided on the side wall of the end inserted into the shell 8, connecting the inside and outside of the input cavity 9. A first pressure relief chamber 11 is formed in the region of the input cavity 9 near the first through hole 10. A plurality of second through holes 12 are provided on the wall surface of the shell 8, connecting the inside and outside of the shell 8. A second pressure relief chamber 13 is formed in the region of the shell 8 near the second through holes 12. The gas-liquid mixture sequentially passes through the first and second pressure chambers for liquid separation, generating more microbubbles and improving cleaning ability.

[0021] The specific implementation of this embodiment is as follows: During cleaning, several arrayed nozzle assemblies 2 simultaneously spray microbubbles. When the microbubbles burst in the liquid, they generate ultrasonic waves and instantaneous high temperatures. These physical effects can peel off stains adhering to the surface of the object being cleaned, achieving a cleaning effect. When installing or replacing the nozzle assembly 2, the nozzle assembly 2 is quickly positioned using the arc-shaped mounting groove 3, and clamped and fixed using the mounting clip 4. This eliminates the need for manual adjustment of the distance between each group of nozzle assemblies 2, reducing installation and adjustment time and saving labor costs. Furthermore, each group of nozzle assemblies 2 is independently connected, facilitating maintenance and replacement, and reducing maintenance costs.

[0022] The above description is only the optimal solution embodiment of this utility model and is not intended to limit this utility model. Various modifications or substitutions made by those skilled in the art to this utility model without departing from the essence and protection scope of this utility model should also be within the protection scope of this utility model.

Claims

1. A microbubble nozzle device for cleaning silicon wafers, characterized in that, The device includes several arrays of nozzle mounting brackets (1), on which nozzle assemblies (2) are provided. The nozzle assemblies (2) are quickly positioned with the nozzle mounting brackets (1) through arc-shaped mounting grooves (3), and the microbubble nozzles (5) are fixedly mounted on the nozzle mounting brackets (1) through mounting clips (4).

2. The microbubble nozzle device for silicon wafer cleaning according to claim 1, characterized in that: The nozzle assembly (2) includes four symmetrically arranged microbubble nozzles (5) and a water supply pipe (6). The microbubble nozzles (5) are threaded together with the water supply pipe (6), and a connector (7) for connecting to the main pipe is provided in the middle of the water supply pipe (6).

3. The microbubble nozzle device for silicon wafer cleaning according to claim 2, characterized in that: The microbubble nozzle (5) includes a hollow, cylindrical nozzle housing (8), an input cavity (9) coaxially arranged with the nozzle housing (8) and fixed at the end, and a first through hole (10) is provided on the side wall of one end inserted into the nozzle housing (8) to conduct the inside and outside of the input cavity (9). A first pressure relief chamber (11) is formed in the area of ​​the input cavity (9) near the first through hole (10). A plurality of second through holes (12) are provided on the wall surface of the nozzle housing (8) to conduct the inside and outside of the nozzle housing (8). A second pressure relief chamber (13) is formed in the area of ​​the nozzle housing (8) near the second through holes (12).

4. The microbubble nozzle device for silicon wafer cleaning according to claim 1, characterized in that: Nuts (14) are symmetrically arranged on the left and right sides of the arc-shaped mounting groove (3), and the mounting clips (4) are fixedly installed on the nozzle mounting bracket (1) by screws cooperating with the nuts (14).

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