Welding device for integrated circuit shell

Abstract

The utility model relates to the field of integrated circuit manufacturing, in particular to an integrated circuit shell welding device which comprises an outer cover, an upper mold and a bottom plate, a lower mold base body is arranged at the top of the bottom plate, a circuit shell is arranged at the top of the lower mold base body, and the upper mold is arranged at the top of the circuit shell. A welding flux is arranged between the circuit shell and the upper die, an outer cover is arranged at the top of the bottom plate, and the upper die and the lower die which are assembled in a partitioning mode are designed in a slotting mode, so that the problems of displacement caused by thermal expansion and cold contraction and insufficient welding seam sealing performance are effectively solved, and the welding quality and stability are remarkably improved through the design of the outer cover with efficient heat conduction and airflow blocking. And the internal welding environment is effectively protected, the oxidation discoloration phenomenon is avoided, and the attractiveness and durability of a welded product are ensured.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing, and in particular to a welding device for integrated circuit casings. Background Technology

[0002] In the field of integrated circuit manufacturing, soldering the integrated circuit casing is a crucial step in ensuring stable connection and protection of circuit components. Currently, a widely used soldering device mainly consists of a fixed base, an upper die, and solder. Heating melts the solder, thereby achieving a sealed soldering between the circuit casing and the circuit board. However, this traditional soldering device has the following drawbacks:

[0003] 1. Defects in the inverted shell design: In the traditional device, the inverted shell design causes the metal shell to expand thermally at high temperatures during the welding process, making it easy for it to come into contact with the main body and cause surface carburization. This not only makes the metal shell black, but may also cause pitting, which seriously affects the processing quality and aesthetics of subsequent processes.

[0004] 2. Thermal expansion and contraction displacement problem: The upper mold part is usually a one-piece design, which makes it difficult to effectively resist the thermal expansion and contraction effect caused by temperature changes, resulting in a decrease in welding precision and affecting welding quality.

[0005] 3. Insufficient weld sealing: The lower mold design lacks flexibility, and the weld joint is not tight enough after the solder melts, making it difficult to achieve the ideal sealing effect.

[0006] 4. Oxidation and discoloration problem: During the welding process, the lack of effective protective measures makes the internal welding environment susceptible to external airflow, leading to oxidation and discoloration, which affects the welding quality and stability. Utility Model Content

[0007] The purpose of this invention is to provide a welding device for integrated circuit casings to solve the problems mentioned in the background art.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a welding device for an integrated circuit housing, comprising an outer cover, an upper mold, and a base plate, wherein a lower mold base is disposed on the top of the base plate, a circuit housing is disposed on the top of the lower mold base, an upper mold is disposed on the top of the circuit housing, solder is disposed between the circuit housing and the upper mold, and an outer cover is disposed on the top of the base plate.

[0009] Preferably, the outer cover is provided with a handle.

[0010] Preferably, a handle is provided on the outside of the base plate.

[0011] In summary, this application includes the following beneficial technical effects:

[0012] 1. Improve welding quality: The modular assembly upper mold design and lower mold slot design effectively solve the problems of thermal expansion and contraction displacement and insufficient weld sealing, significantly improving welding quality and stability.

[0013] 2. Prevents oxidation and discoloration: The outer casing design, which features efficient heat conduction and airflow blocking, effectively protects the internal welding environment, prevents oxidation and discoloration, and ensures the aesthetics and durability of the welded products.

[0014] 3. Enhanced adaptability: By adjusting the upper mold segmentation and the lower mold draft angle, this utility model can adapt to the welding requirements of integrated circuit shells of different specifications and shapes, thus improving the versatility and flexibility of the device.

[0015] 4. Improved production efficiency: The optimized welding process and efficient heat conduction design shorten the welding cycle, improve production efficiency, and reduce production costs. Attached Figure Description

[0016] Figure 1 This is the front view of the present invention;

[0017] Figure 2 This is a top view of the present invention;

[0018] Figure 3 This is a front cross-sectional view of the present invention;

[0019] Figure 4 This is a side sectional view of the present invention.

[0020] Figure 5 This is a schematic diagram of the lower mold base of this utility model.

[0021] In the diagram: 1. Outer cover; 2. Upper mold; 3. Solder; 4. Circuit housing; 5. Lower mold base; 6. Base plate. Detailed Implementation

[0022] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0023] A welding apparatus for an integrated circuit housing includes an outer cover 1, an upper mold 2, and a base plate 6. A lower mold base 5 is disposed on the top of the base plate 6, a circuit housing 4 is disposed on the top of the mold base 5, the upper mold 2 is disposed on the top of the circuit housing 4, solder 3 is disposed between the circuit housing 4 and the upper mold 2, and the outer cover 1 is disposed on the top of the base plate 6.

[0024] Furthermore, a handle is provided on the outside of the outer cover 1.

[0025] Furthermore, a handle is provided on the outside of the base plate 6.

[0026] The implementation principle of the welding device for the integrated circuit shell in this application embodiment is as follows:

[0027] Modular assembly upper mold 2 design: The upper mold 2 adopts a modular assembly design. The blocks are precisely matched to effectively resist thermal expansion and contraction displacement caused by temperature changes, ensuring stability and precision during the welding process.

[0028] The lower mold has a slotted design and a controllable draft angle: The top of the lower mold base 5 is designed with a slot and a controllable draft angle. This design allows the solder 3 to adhere more tightly to the surface of the circuit shell 4 after melting, which significantly improves the sealing and density of the weld.

[0029] High-efficiency heat conduction and airflow blocking outer cover 1: The outer cover 1 is made of a material with high thermal conductivity, which can not only effectively conduct heat and accelerate the welding process, but also effectively block external airflow, protect the internal welding environment from oxidation, and ensure welding quality and stability.

[0030] Optimized layout of circuit housing 4 and solder 3: The circuit housing 4 is precisely placed on the lower mold base 5, and the solder 3 is evenly distributed between it and the upper mold 2. By precisely controlling the heating temperature and time, the solder 3 is uniformly melted, achieving the best sealing welding effect.

[0031] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0032] The foregoing description, with reference to preferred embodiments, illustrates an exemplary implementation of the welding apparatus for an integrated circuit housing provided by this disclosure. However, those skilled in the art will understand that various modifications and alterations can be made to the above specific embodiments without departing from the spirit of this disclosure, and various combinations can be made to the various technical features and structures proposed in this disclosure without exceeding the protection scope of this disclosure, the protection scope of which is determined by the appended claims.

Claims

1. A welding apparatus for an integrated circuit casing, comprising an outer cover (1), an upper mold (2), and a base plate (6), characterized in that: The bottom plate (6) is provided with a lower mold base (5) on top, the lower mold base (5) is provided with a circuit shell (4) on top, the circuit shell (4) is provided with an upper mold (2) on top, solder (3) is provided between the circuit shell (4) and the upper mold (2), and the bottom plate (6) is provided with an outer cover (1).

2. The welding apparatus for an integrated circuit casing according to claim 1, characterized in that: The outer cover (1) is provided with a handle on the outside.

3. The welding apparatus for an integrated circuit casing according to claim 1, characterized in that: The base plate (6) is provided with a handle on the outside.

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