Ultra-thin circuit board lead board
By designing an ultra-thin circuit board lead plate and utilizing the matching precision of the L-shaped board body and the inner clamping teeth, the problems of board jamming, stacking, and bending of ultra-thin circuit boards in horizontal line transmission were solved, thereby improving manufacturing quality and production efficiency.
Patent Information
- Application Number
- CN202423064083.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-12-12
AI Technical Summary
In existing technologies, ultra-thin circuit boards are prone to problems such as jamming, stacking, and bending during horizontal conveying, resulting in poor manufacturing quality.
Design an ultra-thin circuit board lead plate, including an L-shaped board body and inner locking teeth, with the thickness matching the accuracy of the horizontal line. The ultra-thin circuit board is horizontally transported by pulling the locking teeth, avoiding problems such as board jamming, stacking, and bending.
It improves the manufacturing quality of ultra-thin circuit boards in horizontal production scenarios, reduces the frequency of problems such as board jamming, board stacking, and board bending, and improves production efficiency.
Smart Images
Figure CN223547099U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of printed circuit board technology, and in particular to an ultra-thin circuit board lead plate. Background Technology
[0002] As electronic products become thinner, smaller, and faster, circuit boards in these products are also trending towards higher density and higher performance. The number of layers on circuit boards is increasing, and the inner layers are becoming thinner. In related technologies, circuit boards with a thickness of less than 0.2 mm can be called ultra-thin circuit boards.
[0003] Circuit board manufacturing processes can be divided into horizontal and vertical lines. Horizontal lines are more suitable for processing thin circuit boards, and the horizontal transport of thin circuit boards is extremely critical. However, because the transport precision of horizontal lines is usually greater than that of ultra-thin circuit boards—for example, when the transport precision of a horizontal line is 0.5mm—ultra-thin circuit boards, due to limitations in production line equipment precision and other factors, are difficult to adapt to horizontal transport. This often results in problems such as board jamming, stacking, and bending, leading to poor manufacturing quality of ultra-thin circuit boards. Utility Model Content
[0004] The purpose of this utility model embodiment is to provide an ultra-thin circuit board lead plate to improve the manufacturing quality of ultra-thin circuit boards in horizontal production scenarios. The specific technical solution is as follows:
[0005] This utility model provides an ultra-thin circuit board lead plate, including an L-shaped board body 100;
[0006] The thickness of the L-shaped plate 100 is precisely matched with the horizontal line of the ultra-thin circuit board.
[0007] The L-shaped plate 100 is provided with snap-fit teeth 110 on its inner side;
[0008] The ultra-thin circuit board to be transferred is snapped into the inner side of the L-shaped plate 100 by the snap-fit teeth 110.
[0009] Furthermore, the L-shaped plate 100 has a first number of locking teeth 110 on its longitudinal inner side; the L-shaped plate 100 has a second number of locking teeth 110 on its transverse inner side; the first number and the second number are integers not less than 3.
[0010] Furthermore, the thickness of the L-shaped plate 100 is 0.5mm-1.0mm.
[0011] Furthermore, the width of the snap-fit tooth 110 is 20mm; the height of the snap-fit tooth 110 is 20mm-25mm; and the interval between adjacent snap-fit teeth 110 is 20mm-50mm.
[0012] Furthermore, the shape of the snap-fit tooth 110 includes a polygon.
[0013] In this embodiment of the utility model, since the thickness of the ultra-thin circuit board lead plate matches the precision of the horizontal line, the process of the ultra-thin circuit board being horizontally transported by the ultra-thin circuit board lead plate after being snapped into the inner side of the L-shaped ultra-thin circuit board lead plate can meet the transmission precision requirements of the horizontal line. This avoids problems such as board jamming, board stacking, and board bending that occur due to the ultra-thin circuit board's inability to adapt to the precision of the horizontal line, thereby improving the manufacturing quality of the ultra-thin circuit board in the horizontal line production scenario. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 A schematic diagram of the first structure of the ultra-thin circuit board lead plate provided in an embodiment of this utility model;
[0016] Figure 2 A schematic diagram of a second structure of the ultra-thin circuit board lead plate provided in an embodiment of this utility model;
[0017] Figure 3 A schematic diagram of horizontal transmission provided for an embodiment of this utility model;
[0018] Figure 4 A schematic diagram of a third structure of the ultrathin circuit board lead plate provided in an embodiment of this utility model;
[0019] Figure 5 This is a schematic diagram of the ultra-thin circuit board lead plate snapping onto the ultra-thin circuit board according to an embodiment of the present invention. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art based on the present utility model are within the protection scope of the present utility model.
[0021] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0022] Printed Circuit Board (PCB), often referred to as the "mother of electronic products," is an indispensable and crucial component of electronic devices. As electronic products become increasingly thinner, smaller, and faster, circuit boards are also trending towards higher density and higher performance, with more layers and thinner inner layers.
[0023] In related technologies, horizontal line processing is commonly used to manufacture thin circuit boards. However, for ultra-thin circuit boards with even smaller thicknesses, limitations in equipment precision can easily lead to problems such as board jamming, stacking, and bending. For example, when the accuracy of the horizontal line equipment in conveying circuit boards is 0.5mm, for ultra-thin circuit boards with a thickness of less than 0.5mm, such as 0.1mm, a gap will exist between the equipment (transfer gears) and the ultra-thin circuit board during the transfer process. Consequently, due to factors such as vibration during transfer and deformation of the ultra-thin circuit board, the ultra-thin circuit board may get stuck between the transfer gears, resulting in a board jamming problem that affects the manufacturing quality of the ultra-thin circuit board.
[0024] To solve the above problems, such as Figure 1 As shown, this utility model embodiment provides an ultra-thin circuit board lead plate, which may include: an L-shaped board body 100;
[0025] The thickness of the L-shaped plate 100 is matched with the precision of the horizontal line for conveying the ultra-thin circuit board; the inner side of the L-shaped plate 100 is provided with locking teeth 110; the ultra-thin circuit board to be conveyed is locked into the inner side of the L-shaped plate 100 by the locking teeth 110.
[0026] In this embodiment of the utility model, since the thickness of the ultra-thin circuit board lead plate matches the precision of the horizontal line, the process of the ultra-thin circuit board being horizontally transported by the ultra-thin circuit board lead plate after being snapped into the inner side of the L-shaped ultra-thin circuit board lead plate can meet the transmission precision requirements of the horizontal line. This avoids problems such as board jamming, board stacking, and board bending that occur due to the ultra-thin circuit board's inability to adapt to the precision of the horizontal line, thereby improving the manufacturing quality of the ultra-thin circuit board in the horizontal line production scenario.
[0027] This utility model embodiment provides a detailed description of the ultra-thin circuit board lead plate.
[0028] The ultra-thin circuit board guide provided in this embodiment of the utility model may include an L-shaped board body 100. The thickness of the L-shaped board body 100 is matched with the precision of the horizontal line for conveying the ultra-thin circuit board. This means that the horizontal line of the ultra-thin circuit board with this precision can normally convey the L-shaped board body with this thickness. It can also be understood that the horizontal line of the ultra-thin circuit board with this precision is less likely to cause problems such as board jamming, board stacking, or board bending when conveying the L-shaped board body with this thickness.
[0029] Specifically, the inner side of the L-shaped plate 100, both its transverse and longitudinal inner sides, may be provided with snap-fit teeth 110. The longitudinal inner side of the L-shaped plate 100 may have a first number of snap-fit teeth 110; the transverse inner side of the L-shaped plate 100 may have a second number of snap-fit teeth 110; both the first and second numbers are integers not less than 3. (Refer to...) Figure 1 The dashed lines on the inner transverse and inner longitudinal sides of the L-shaped plate 100 indicate snap-fit teeth (not shown).
[0030] In one possible embodiment, the first quantity can be the same as the second quantity, that is, the same number of snap-fit teeth 110 are provided on the inner side of the L-shaped plate 100 in both the transverse and longitudinal directions. For example, the first quantity and the second quantity can both be 3, and 3 snap-fit teeth are provided on the inner side of the L-shaped plate 100 in both the transverse and longitudinal directions.
[0031] In another possible embodiment, the first quantity may also be different from the second quantity; that is, the number of snap-fit teeth provided on the transverse inner side and the longitudinal inner side of the L-shaped plate may be different. For example, the first quantity may be 4; the second quantity may be 3. (Refer to...) Figure 2 That is, four locking teeth can be provided on the longitudinal inner side of the L-shaped plate, and three locking teeth can be provided on the transverse inner side of the L-shaped plate.
[0032] In practical applications, the number of snap-fit teeth provided on the inner side of the horizontal and vertical sides of the L-shaped plate can be determined by technicians based on actual conditions, such as the size of the ultra-thin circuit board and the conveying width of the horizontal line equipment. This utility model embodiment does not impose any restrictions.
[0033] In this embodiment of the invention, the thickness of the ultra-thin circuit board lead plate, or the L-shaped board 100, can be 0.5mm-1.0mm. This allows the thickness of the ultra-thin circuit board lead plate to match the accuracy of the horizontal line used for conveying thin circuit boards in related technologies. This ensures that after the ultra-thin circuit board is snapped into the inner side of the L-shaped ultra-thin circuit board lead plate, the process of horizontally conveying the ultra-thin circuit board by the lead plate meets the accuracy requirements of the horizontal line, improving the manufacturing quality of the ultra-thin circuit board in horizontal line production scenarios. For example, Figure 3 As shown, a schematic diagram of horizontal transmission is provided. The ultra-thin circuit board guide plate 302 pulls the ultra-thin circuit board 301 for horizontal transmission. This means that when the ultra-thin circuit board 301 with the ultra-thin circuit board guide plate 302 is being horizontally transmitted, the right-angle position of the ultra-thin circuit board guide plate 302 is located at the foremost end of the horizontal transmission direction.
[0034] In this embodiment of the invention, the width of the snap-fit teeth 110 located inside the L-shaped plate 100 can be 20mm; the height of the snap-fit teeth 110 can be 20mm-25mm; and the interval between adjacent snap-fit teeth 110 can be 20mm-50mm. For any snap-fit tooth, the width refers to the width occupied by the snap-fit tooth parallel to the inner horizontal or vertical side of the L-shaped plate; the height refers to the height occupied by the snap-fit tooth perpendicular to the inner horizontal or vertical side of the L-shaped plate. This ensures the firmness of the snap-fit connection between the ultra-thin circuit board and the ultra-thin circuit board lead plate.
[0035] Reference Figure 4 This utility model embodiment provides an ultra-thin circuit board lead plate, the thickness of the L-shaped board body can be 1mm; the longitudinal inner side and the transverse inner side of the L-shaped board body can each be provided with 3 locking teeth, namely locking teeth 401, locking teeth 402, locking teeth 403, locking teeth 404, locking teeth 405 and locking teeth 406. The width of each snap-fit tooth can be 20mm; the height of snap-fit teeth 401, 402, and 403 can be 20mm; the height of snap-fit teeth 404, 405, and 406 can be 25mm; the distance between snap-fit teeth 401 and 402, and between snap-fit teeth 402 and 403 can be 40mm; the distance between snap-fit teeth 404 and 405, and between snap-fit teeth 405 and 406 can be 30mm; the distance between snap-fit tooth 403 and the transverse inner side of the L-shaped plate can be 20mm; and the distance between snap-fit tooth 404 and the longitudinal inner side of the L-shaped plate can be 50mm.
[0036] In one possible embodiment, the snap-fit teeth 110 located on the longitudinal inner side of the L-shaped plate 100 may have the same width, height and spacing; the snap-fit teeth 110 located on the transverse inner side of the L-shaped plate 100 may have the same width, height and spacing.
[0037] In another possible embodiment, each snap-fit tooth may have a different height and width, and the spacing between adjacent snap-fit teeth may also vary. This embodiment of the invention is not limited in scope.
[0038] In this embodiment of the invention, one corner of the ultra-thin circuit board is aligned with the inner corner of the L-shaped lead plate. The two adjacent sides of the ultra-thin circuit board to be snapped in are tightly snapped into the inner side of the L-shaped lead plate by interlocking the snapping teeth vertically. "Interlocking vertically" means that between adjacent snapping teeth located on the upper side of the ultra-thin circuit board, there is a snapping tooth located on the lower side of the ultra-thin circuit board, or between adjacent snapping teeth located on the lower side of the ultra-thin circuit board, there is a snapping tooth located on the upper side of the ultra-thin circuit board.
[0039] like Figure 5The diagram shown illustrates a method for attaching a thin circuit board lead plate to an ultra-thin circuit board. Figure 5 In this process, the ultra-thin circuit board is inserted vertically between the locking teeth in such a way that between the adjacent locking teeth 501, 504, and 507 located on the upper side of the ultra-thin circuit board, there are locking teeth 502, 503, 505, and 506 located on the lower side of the ultra-thin circuit board.
[0040] In another possible embodiment, after the ultra-thin circuit board is snapped into the inside of the L-shaped lead plate by the snap-fit teeth, there can be a small gap between the edge of the ultra-thin circuit board and the inside of the L-shaped lead plate. In this way, the snap-fit process does not need to be precise, thus improving the snap-fit efficiency.
[0041] In this embodiment of the invention, the shape of the snap-fit tooth 110 may include a polygon, such as a rectangle, trapezoid, etc. Figure 1 The image shows a "rectangular sawtooth" snap-fit tooth.
[0042] In one possible embodiment, the shape of the snap-fit teeth may also include semi-circles, irregular shapes, etc., and the specific shape is not limited in this embodiment of the present invention.
[0043] In this embodiment of the utility model, because the thickness of the L-shaped plate is precisely matched with the horizontal line of the conveyed ultra-thin circuit board, the ultra-thin circuit board is pulled by the ultra-thin circuit board lead plate and conveyed in the horizontal conveying direction of the ultra-thin circuit board after being snapped into the ultra-thin circuit board lead plate. This reduces the occurrence of problems such as jamming, stacking, and bending of ultra-thin circuit boards in horizontal line production scenarios, thereby reducing the frequency of scratches and damage to ultra-thin circuit boards, reducing the scrap rate of ultra-thin circuit board products, and improving production efficiency.
[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.
[0045] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on its differences from other embodiments. The embodiments described above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and improvements made to the technical solutions of this utility model by those skilled in the art without departing from the spirit of this utility model should fall within the protection scope defined by the claims of this utility model.
Claims
1. An ultra-thin circuit board lead plate, characterized in that, Includes L-shaped plate (100); The thickness of the L-shaped plate (100) is precisely matched with the horizontal line of the ultra-thin circuit board. The L-shaped plate (100) is provided with snap-fit teeth (110) on its inner side; The ultra-thin circuit board to be transferred is snapped into the inner side of the L-shaped plate (100) by the snap-fit teeth (110).
2. The ultra-thin circuit board lead plate according to claim 1, characterized in that, The L-shaped plate (100) has a first number of locking teeth (110) on its longitudinal inner side; the L-shaped plate (100) has a second number of locking teeth (110) on its transverse inner side; the first number and the second number are integers not less than 3.
3. The ultra-thin circuit board lead plate according to claim 1, characterized in that, The thickness of the L-shaped plate (100) is 0.5mm-1.0mm.
4. The ultra-thin circuit board lead plate according to claim 1, characterized in that, The width of the snap-fit tooth (110) is 20mm; the height of the snap-fit tooth (110) is 20mm-25mm; and the interval between adjacent snap-fit teeth (110) is 20mm-50mm.
5. The ultra-thin circuit board lead plate according to claim 1, characterized in that, The shape of the snap-fit teeth (110) includes polygons.