Semiconductor processing bonding tool

Abstract

The utility model relates to the technical field of semiconductors, in particular to a semiconductor processing bonding tool which comprises a base, supporting side plates are symmetrically and fixedly connected to the two sides of the top of the base, a supporting top plate is fixedly connected to the tops of the supporting side plates, a positioning groove is formed in the top of the base, a positioning assembly is arranged in the positioning groove, and the supporting top plate is fixedly connected with the positioning assembly. A hydraulic cylinder is fixedly connected to the center of the top of the supporting top plate in a penetrating mode, and a lifting supporting plate is fixedly connected to the output end of the hydraulic cylinder. According to the semiconductor part bonding device, the positioning capacity of semiconductor parts is good, and therefore when the semiconductor parts are bonded, the semiconductor parts are not prone to position deviation or falling off; in addition, the buffering capacity is good, so that the semiconductor parts are not prone to being damaged due to the fact that the pressing force is too large when the semiconductor parts are pressed after being glued, and therefore the bonding quality of the semiconductor parts cannot be affected.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a semiconductor processing bonding fixture. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. The conductivity of semiconductors can be controlled by external conditions such as temperature, light, and doping, which makes them widely used in electronic devices. The semiconductor industry is an important part of the electronic information industry and belongs to the hardware industry. In the semiconductor processing, adhesive tooling is required. Adhesive tooling is a tooling used for applying adhesive to semiconductor equipment parts. In the semiconductor processing, adhesive tooling plays a crucial role. It can complete the adhesive application work by one person, saving time and labor and improving production efficiency.

[0003] While traditional bonding fixtures possess the ability to apply adhesives to semiconductor components, they also have some shortcomings. For example, their positioning ability for semiconductor components is poor, which can easily cause them to shift or fall off during bonding, thus affecting the bonding effect and efficiency. In addition, their cushioning ability is poor, so excessive pressing force can easily damage the semiconductor components during the pressing process after applying adhesive, thereby affecting the bonding quality. Therefore, a semiconductor processing bonding fixture is proposed to address the above problems. Utility Model Content

[0004] The purpose of this utility model is to provide a semiconductor processing bonding fixture with better positioning capability for semiconductor components. Therefore, it is not easy to cause positional displacement or falling off during bonding, thereby avoiding affecting the bonding effect and efficiency of semiconductor components. In addition, it has better buffering capability, so it is not easy to damage semiconductor components due to excessive pressing force when pressing after applying adhesive, thus not affecting the bonding quality of semiconductor components, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A semiconductor processing bonding fixture includes a base, with supporting side plates symmetrically and fixedly connected to the top two sides of the base, and a supporting top plate fixedly connected to the top of the supporting side plates. A positioning groove is formed on the top of the base, and a positioning component is provided in the positioning groove. A hydraulic cylinder is penetrated and fixedly connected to the center of the top of the supporting top plate. A lifting support plate is fixedly connected to the output end of the hydraulic cylinder. An adhesive pressing block is provided below the lifting support plate, and the adhesive pressing block is connected to the lifting support plate via an installation component. Buffer components are symmetrically provided on both sides of the lifting support plate, and the buffer components are connected to the ends of the lifting support plate via connecting components.

[0007] Preferably, the positioning component includes a fixing rod whose bottom end is fixedly connected to the bottom wall of the positioning groove, a fixing suction cup whose top end is fixedly connected to the fixing rod, the fixing suction cup being positioned corresponding to the adhesive block, a miniature negative pressure pump on one side of the fixing rod, an air suction nozzle on the miniature negative pressure pump, an air exhaust nozzle on one side of the air suction nozzle, one end of the air suction nozzle and the air exhaust nozzle being connected to the miniature negative pressure pump, and the other end of each being connected to a connecting hose, the ends of the two connecting hoses away from the air suction nozzle and the air exhaust nozzle being connected to the fixing suction cup.

[0008] Preferably, the bottom of the adhesive block is provided with a protective pad of matching specifications, the top of the protective pad is provided with a number of snap-fit ​​blocks arranged at equal intervals and fixedly connected, and the bottom of the adhesive block is provided with a number of snap-fit ​​slots that are equal in number, corresponding in position and matching in specifications to the snap-fit ​​blocks.

[0009] Preferably, the mounting assembly includes a mounting strip fixedly connected to the center of the top of the adhesive block, and a mounting slot with a corresponding position and matching specifications is provided at the center of the bottom of the lifting support plate. The front wall of the mounting strip has a plurality of mounting screw holes arranged at equal intervals, and the front side of the mounting slot has a plurality of mounting bolts that are equal in number, corresponding in position, and matching in specifications to the mounting screw holes.

[0010] Preferably, the buffer assembly includes a connecting support plate, on which movable support rods are symmetrically passed through. A connecting top plate is fixedly connected to the top of the movable support rod, and a buffer support plate is fixedly connected to the bottom of the movable support rod. A buffer spring is sleeved on the outside of the movable support rod, and the two ends of the buffer spring are fixedly connected to the top of the connecting support plate and the bottom of the connecting top plate, respectively.

[0011] Preferably, the connecting assembly includes a connecting bracket that is fixedly connected to one end of the connecting support plate and matches the end specifications of the lifting support plate. A connecting bolt passes through the connecting bracket, and the end of the lifting support plate has a connecting screw hole that corresponds to the position of the connecting bolt and matches its specifications.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] In this invention, the base, supporting side plates, and supporting top plate provide excellent support and structural stability. The positioning groove provides space for the positioning components, which in turn provide excellent positioning capabilities for the semiconductor components. Therefore, during bonding, it is less likely for the components to shift or fall off, thus avoiding any impact on the bonding effect and efficiency. The hydraulic cylinder can move the bonding block downwards via the lifting support plate, allowing for pressing the semiconductor components after adhesive application. The mounting components provide a good connection between the bonding block and the lifting support plate, ensuring excellent performance during normal use. It ensures the connection strength between the adhesive pressing block and the lifting support plate, and allows for disassembly when the adhesive pressing block needs to be replaced, reducing the difficulty of later maintenance. The buffer component provides good cushioning when the adhesive pressing block is pressed down, so it is not easy to damage the semiconductor components due to excessive pressing force when pressing after applying glue, thus not affecting the bonding quality of the semiconductor components. The connection component provides good connection between the buffer component and the lifting support plate, so it not only ensures the connection strength between the buffer component and the lifting support plate during normal use, but also allows for disassembly when the buffer component needs to be replaced, reducing the difficulty of later maintenance. Attached Figure Description

[0014] Figure 1 This is the front view of the present invention;

[0015] Figure 2 This is a schematic diagram of the structure of this utility model;

[0016] Figure 3 This is a schematic diagram of the positioning groove of this utility model;

[0017] Figure 4 This is a schematic diagram of the adhesive pressing block structure of this utility model. Figure 1 ;

[0018] Figure 5 This is a schematic diagram of the adhesive pressing block structure of this utility model. Figure 2 ;

[0019] Figure 6 This is a schematic diagram of the structure of the buffer component of this utility model. Figure 1 ;

[0020] Figure 7 This is a schematic diagram of the structure of the buffer component of this utility model. Figure 2 .

[0021] In the diagram: 1. Base; 2. Support side plate; 3. Support top plate; 4. Positioning groove; 5. Positioning assembly; 501. Fixing rod; 502. Fixing suction cup; 503. Miniature negative pressure pump; 504. Air extraction nozzle; 505. Exhaust nozzle; 506. Connecting hose; 6. Hydraulic cylinder; 7. Lifting support plate; 8. Adhesive block; 801. Protective pad; 802. Snap-fit ​​block; 803. Snap-fit ​​slot; 9. Mounting assembly; 901. Mounting strip; 902. Mounting slot; 903. Mounting screw hole; 904. Mounting bolt; 10. Buffer assembly; 1001. Connecting support plate; 1002. Movable support rod; 1003. Connecting top plate; 1004. Buffer support plate; 1005. Buffer spring; 11. Connecting assembly; 1101. Connecting bracket; 1102. Connecting bolt; 1103. Connecting screw hole. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0024] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0025] Please see Figure 1-7 This utility model provides a technical solution:

[0026] A semiconductor processing bonding fixture includes a base 1, with supporting side plates 2 symmetrically and fixedly connected to the top two sides of the base 1, and a supporting top plate 3 fixedly connected to the top of the supporting side plates 2. A positioning groove 4 is provided on the top of the base 1, and a positioning component 5 is provided in the positioning groove 4. A hydraulic cylinder 6 is passed through and fixedly connected to the center of the top of the supporting top plate 3. A lifting support plate 7 is fixedly connected to the output end of the hydraulic cylinder 6. An adhesive pressing block 8 is provided below the lifting support plate 7, and the adhesive pressing block 8 is connected to the lifting support plate 7 through an installation component 9. Buffer components 10 are symmetrically provided on both sides of the lifting support plate 7, and the buffer components 10 are connected to the ends of the lifting support plate 7 through a connecting component 11.

[0027] The positioning component 5 includes a fixing rod 501 whose bottom end is fixedly connected to the bottom wall of the positioning groove 4. A fixing suction cup 502 is fixedly connected to the top end of the fixing rod 501. The fixing suction cup 502 and the adhesive pressing block 8 are positioned correspondingly. A miniature negative pressure pump 503 is provided on one side of the fixing rod 501. The miniature negative pressure pump 503 is provided with an air suction nozzle 504. An air exhaust nozzle 505 is provided on one side of the air suction nozzle 504. One end of both the air suction nozzle 504 and the air exhaust nozzle 505 is connected to the miniature negative pressure pump 503, and the other end of both is connected to a connecting hose 506. The ends of both connecting hoses 506 away from the air suction nozzle 504 and the air exhaust nozzle 505 are connected to the fixing suction cup 502. The positioning component 5 can provide good positioning for semiconductor components. The adhesive block 8 has good positioning capabilities, so it is not easy to cause positional displacement or fall off during bonding, thus avoiding affecting the bonding effect and efficiency of semiconductor components. The bottom of the adhesive block 8 is provided with a protective soft pad 801 of matching specifications. The top of the protective soft pad 801 is provided with several snap-fit ​​blocks 802 arranged at equal intervals and fixedly connected. The bottom of the adhesive block 8 is provided with several snap-fit ​​slots 803 that are equal in number, corresponding in position and matching in specifications to the snap-fit ​​blocks 802. The adhesive block 8 can press the semiconductor components after they are coated with adhesive by the downward movement of the hydraulic cylinder 6 and the lifting support plate 7. The mounting assembly 9 includes a mounting strip 901 fixedly connected to the center of the top of the adhesive block 8. The bottom center of the lifting support plate 7 is provided with a mounting slot 902 that corresponds to the position and matches the specifications of the mounting strip 901. The front wall of the mounting strip 901 has several mounting screw holes 903 arranged at equal intervals. Several mounting bolts 904, equal in number, corresponding in position, and matching in specifications, pass through the front side of the mounting slot 902. The mounting assembly 9 provides a good connection between the adhesive block 8 and the lifting support plate 7, thus ensuring the connection strength between the adhesive block 8 and the lifting support plate 7 during normal use, and allowing for disassembly of the adhesive block 8 when it needs replacement, reducing the difficulty of later maintenance. The buffer assembly 10 includes a connecting support plate 100. 1. A movable support rod 1002 is symmetrically passed through the connecting support plate 1001. A connecting top plate 1003 is fixedly connected to the top of the movable support rod 1002, and a buffer support plate 1004 is fixedly connected to the bottom of the movable support rod 1002. A buffer spring 1005 is sleeved on the outside of the movable support rod 1002, and the two ends of the buffer spring 1005 are fixedly connected to the top of the connecting support plate 1001 and the bottom of the connecting top plate 1003, respectively. The buffer assembly 10 can provide good buffering capacity when the adhesive block 8 is pressed down. Therefore, when the semiconductor components are pressed after applying adhesive, it is not easy to damage the semiconductor components due to excessive pressing force, so as not to affect the bonding quality of the semiconductor components.The connecting assembly 11 includes a connecting bracket 1101 fixedly connected to one end of the connecting support plate 1001 and matching the specifications of the end of the lifting support plate 7. A connecting bolt 1102 passes through the connecting bracket 1101. The end of the lifting support plate 7 has a connecting screw hole 1103 corresponding to the position and matching the specifications of the connecting bolt 1102. The connecting assembly 11 provides a good connection between the buffer assembly 10 and the lifting support plate 7, thus ensuring the connection strength between the buffer assembly 10 and the lifting support plate 7 during normal use, and allowing for disassembly of the buffer assembly 10 when it needs replacement, reducing the difficulty of later maintenance.

[0028] Workflow: First, power on all electrical appliances and connect them to external controllers. Base 1, supporting side plates 2, and supporting top plate 3 provide good support and structural stability for the whole structure. Positioning groove 4 provides space for positioning component 5. Positioning component 5 provides good positioning capability for semiconductor components, so it is not easy to cause positional displacement or falling off when bonding them, thus avoiding affecting the bonding effect and efficiency of semiconductor components. When positioning semiconductor components, simply place the semiconductor components on the fixed suction cup 502 supported by the fixing rod 501, and then start the micro negative pressure pump 503. The circular motion of its motor causes the diaphragm inside the pump to reciprocate through the mechanical device, thereby compressing and stretching the pump. The air inside the cavity forms a negative pressure, creating a pressure difference between the suction nozzle 504 and the external atmospheric pressure. Under the action of this pressure difference, gas is drawn into the pump cavity through the connecting hose 506 and then discharged from the exhaust nozzle 505 through the connecting hose 506. This allows the semiconductor components to be vacuum-adsorbed by the fixed suction cup 502. Similarly, when removing them, the hydraulic cylinder 6 can move the adhesive pressing block 8 downwards via the lifting support plate 7, thus pressing the semiconductor components after adhesive application. The protective pad 801 protects the bottom of the adhesive pressing block 8 while buffering the downward pressure. The flexible structure of the protective pad 801 makes it easy to disassemble and replace when damaged. During installation, first place it under the adhesive block 8, then insert the snap-fit ​​blocks 802 on it one by one into the snap-fit ​​slots 803 at the corresponding positions on the bottom of the adhesive block 8 for snap-fit ​​installation. Disassembly is similar. The installation component 9 provides a good connection between the adhesive block 8 and the lifting support plate 7, thus ensuring the connection strength between the adhesive block 8 and the lifting support plate 7 during normal use, and allowing for disassembly when the adhesive block 8 needs replacement, reducing the difficulty of later maintenance. When installing the adhesive block 8 with the lifting support plate 7, first place it under the lifting support plate 7, then insert the mounting strip 901 on it into the mounting slot 902 at the bottom of the lifting support plate 7 for positioning. At this time, the mounting screw hole 903 and the mounting screw... The positions of bolts 904 correspond one-to-one. Finally, screw the mounting bolts 904 into the mounting screw holes 903. The same applies to disassembly. The buffer assembly 10 can provide good buffering capacity when the adhesive block 8 is pressed down. Therefore, when pressing the semiconductor components after applying adhesive, it is not easy to damage the semiconductor components due to excessive pressing force, thus not affecting the bonding quality of the semiconductor components. When the lifting support plate 7 drives the adhesive block 8 to press down, it will also drive the connecting support plate 1001 to move down. The buffer support plate 1004 will first contact the top of the base 1. When the adhesive block 8 continues to press down, it will drive the connecting support plate 1001 to move up and down on the movable support rod 1002. At the same time, the stationary connecting top plate 1003 will stretch the buffer spring 1005.The buffer spring 1005 cushions the downward pressure of the adhesive block 8 through its own rebound force. The connecting component 11 provides a good connection between the buffer component 10 and the lifting support plate 7. Therefore, it not only ensures the connection strength between the buffer component 10 and the lifting support plate 7 during normal use, but also allows for disassembly of the buffer component 10 when it needs to be replaced, reducing the difficulty of later maintenance. When installing the buffer component 10, first, place the connecting bracket 1101 onto the end of the lifting support plate 7, align the connecting bolt 1102 with the connecting screw hole 1103, and finally screw the connecting bolt 1102 into the connecting screw hole 1103. Disassembly is performed in the same way.

[0029] Contents not described in detail in this specification are existing technologies known to those skilled in the art. Standard parts used in this invention can all be purchased commercially, and irregularly shaped parts can be custom-made according to the description and drawings. The specific connection methods for each part all employ conventional methods such as bolts, rivets, and welding, which are already mature technologies. The machinery, parts, and equipment all use conventional models from the prior art, and the circuit connections also employ conventional connection methods from the prior art, which will not be detailed here.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the scope and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor processing bonding fixture, comprising a base (1), characterized in that: The base (1) has symmetrical and fixed support side plates (2) on both sides of its top. The support side plates (2) have a fixed support top plate (3) on their top. The base (1) has a positioning groove (4) on its top. The positioning groove (4) has a positioning component (5). The top center of the support top plate (3) has a hydraulic cylinder (6) that is fixedly connected through it. The output end of the hydraulic cylinder (6) has a lifting support plate (7) fixedly connected to it. The lifting support plate (7) has an adhesive block (8) below it, and the adhesive block (8) is connected to the lifting support plate (7) by an installation component (9). The lifting support plate (7) has symmetrical buffer components (10) on both sides, and the buffer components (10) are connected to the ends of the lifting support plate (7) by a connecting component (11).

2. The semiconductor processing bonding fixture according to claim 1, characterized in that: The positioning component (5) includes a fixing rod (501) whose bottom end is fixedly connected to the bottom wall of the positioning groove (4). A fixing suction cup (502) is fixedly connected to the top end of the fixing rod (501). The fixing suction cup (502) is positioned corresponding to the adhesive block (8). A miniature negative pressure pump (503) is provided on one side of the fixing rod (501). An air suction nozzle (504) is provided on the miniature negative pressure pump (503). An air exhaust nozzle (505) is provided on one side of the air suction nozzle (504). One end of the air suction nozzle (504) and the air exhaust nozzle (505) are both connected to the miniature negative pressure pump (503), and the other end of each is connected to a connecting hose (506). The ends of the two connecting hoses (506) away from the air suction nozzle (504) and the air exhaust nozzle (505) are both connected to the fixing suction cup (502).

3. The semiconductor processing bonding fixture according to claim 1, characterized in that: The bottom of the adhesive block (8) is provided with a protective pad (801) of matching specifications. The top of the protective pad (801) is provided with a number of snap-fit ​​blocks (802) arranged at equal intervals and fixedly connected. The bottom of the adhesive block (8) is provided with a number of snap-fit ​​slots (803) that are equal in number, corresponding in position and matching in specifications to the snap-fit ​​blocks (802).

4. The semiconductor processing bonding fixture according to claim 1, characterized in that: The mounting assembly (9) includes a mounting strip (901) fixedly connected to the top center of the adhesive block (8). The bottom center of the lifting support plate (7) is provided with a mounting slot (902) that corresponds to the position of the mounting strip (901) and matches its specifications. The front wall of the mounting strip (901) is provided with a plurality of mounting screw holes (903) arranged at equal intervals. The front side of the mounting slot (902) is provided with a plurality of mounting bolts (904) that are equal in number, correspond in position and match the specifications of the mounting screw holes (903).

5. The semiconductor processing bonding fixture according to claim 1, characterized in that: The buffer assembly (10) includes a connecting support plate (1001), on which movable support rods (1002) are symmetrically passed. A connecting top plate (1003) is fixedly connected to the top of the movable support rod (1002), and a buffer support plate (1004) is fixedly connected to the bottom of the movable support rod (1002). A buffer spring (1005) is sleeved on the outside of the movable support rod (1002), and the two ends of the buffer spring (1005) are fixedly connected to the top of the connecting support plate (1001) and the bottom of the connecting top plate (1003), respectively.

6. The semiconductor processing bonding fixture according to claim 5, characterized in that: The connecting assembly (11) includes a connecting bracket (1101) that is fixedly connected to one end of the connecting support plate (1001) and matches the end specifications of the lifting support plate (7). A connecting bolt (1102) passes through the connecting bracket (1101), and a connecting screw hole (1103) that corresponds to the position and matches the specifications of the connecting bolt (1102) is opened at the end of the lifting support plate (7).

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