Heat dissipation structure and LED lighting device
By using a heat dissipation structure that connects the substrate tangentially to the cover, combined with heat dissipation gaps and channels, the heat transfer path is optimized, solving the problem of improving the heat dissipation efficiency of existing LED lighting devices, and achieving more efficient heat dissipation and cost reduction.
Patent Information
- Application Number
- CN202422745559.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-11
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-11-11
AI Technical Summary
The heat dissipation efficiency of existing LED lighting devices cannot be significantly improved without increasing the heat sink area, leading to increased costs and limiting the development of these devices.
The heat dissipation structure is tangentially connected to the substrate, and combines heat dissipation gaps and channels to achieve efficient heat dissipation through natural airflow. It includes the design of first and second heat dissipation components and a top cover to optimize the heat transfer path.
Without increasing the heat sink area, it significantly improves heat dissipation efficiency, reduces system thermal resistance and LED junction temperature, extends the lifespan of the light source module, and reduces heat dissipation costs.
Smart Images
Figure CN223550422U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of lighting equipment, specifically relating to a heat dissipation structure and an LED lighting device. Background Technology
[0002] In everyday lighting needs, LED lighting devices have become the mainstream product in the lighting industry. As the lighting power of LED lighting devices continues to increase, the heat dissipation requirements of these devices are also gradually increasing.
[0003] Most mainstream LED lighting devices currently employ a passive natural convection cooling solution. This involves directly bonding the LED light-emitting substrate, on which the LED light-emitting elements are soldered, to a reflector, and then installing a heat sink on the other side of the reflector to increase the heat dissipation area. The heat is dissipated by the natural airflow generated by temperature changes in the air, thus reducing the junction temperature of the LED light-emitting elements and ensuring the brightness and lifespan of the LED lighting device.
[0004] To improve heat dissipation efficiency, a right-angled structure with an upward-protruding reflector is often used to increase the contact area between the light-emitting substrate and the reflector, and to increase the heat dissipation power of the heat sink. However, even if the reflector covers all the non-light-emitting surfaces of the light-emitting substrate, and the power of the heat sink continues to increase, the heat dissipation efficiency does not increase linearly, and even gradually tends to stabilize, leading to increased heat dissipation costs and limiting the development of LED lighting devices. Summary of the Invention
[0005] To address the shortcomings of the prior art, this invention provides a heat dissipation structure, including a reflector, a heat dissipation component, and a top cover. By tangentially connecting the reflector to the substrate, the light-emitting component can quickly transfer heat from the substrate to the reflector. Furthermore, a heat dissipation gap is provided between the sidewall and the second mounting surface, and the top cover has a heat dissipation channel communicating with the outside, significantly improving the overall heat dissipation efficiency. Using this heat dissipation structure, LED lighting devices can achieve better heat dissipation performance even with smaller heat dissipation components.
[0006] The technical effects to be achieved by this utility model are specifically realized through the following technical aspects:
[0007] In a first aspect, this utility model provides a heat dissipation structure, comprising:
[0008] A reflector includes a substrate and a cover disposed outside the substrate. The substrate and the cover surround each other to form a light-emitting cavity. The substrate has a first mounting surface and a second mounting surface facing each other. The first mounting surface is provided with a light-emitting component.
[0009] A heat dissipation assembly includes a first heat dissipation component and a second heat dissipation component. The first heat dissipation component is disposed on the substrate and includes a first end and a second end, the second end being adjacent to the upper edge of the cover. The second heat dissipation component is fitted and connected to the second mounting surface.
[0010] The top cover includes a cover plate and a side wall disposed on the outside of the cover plate, the cover plate being disposed above the second heat sink;
[0011] The cover is tangentially connected to the substrate, a heat dissipation gap is provided between the side wall and the second mounting surface, and a heat dissipation channel communicating with the outside is provided on the top cover.
[0012] In some embodiments, the first heat sink protrudes from the second mounting surface in a direction away from the light emission cavity, and the first heat sink is provided with a flow guide hole, through which part of the heat generated by the light-emitting component is dissipated to the outside.
[0013] In some embodiments, the second heat sink includes a base plate and a heat sink disposed on the base plate, and the cover plate is suspended above the heat sink. Part of the heat generated by the light-emitting component is dissipated to the outside through the substrate and the second heat sink and from the heat dissipation gap and heat dissipation channel.
[0014] In some embodiments, the second heat sink further includes heat dissipation fins located inside the heat sink and arranged radially with the center of the base plate as the center.
[0015] In some embodiments, the top cover further includes a cantilever, which is radially disposed on the outer side of the sidewall. The cantilever includes a support block, a latch, and a flow guide groove, with the flow guide groove disposed between the support block and the latch.
[0016] In some embodiments, the flow channel is located above the first heat sink, the latch is located outside the second end, and the end of the support block abuts against the first end.
[0017] In some embodiments, the distance between the cover plate and the second mounting surface is H1, and the heights of the sidewall and the heat dissipation gap are H2 and H3, respectively, with the following relationship: H1 = H2 + H3.
[0018] In some embodiments, the heat dissipation channel includes a first heat dissipation groove and a second heat dissipation groove, wherein the first heat dissipation groove is formed in the side wall; the second heat dissipation groove is formed in the cover plate, and the second heat dissipation groove has an arc-shaped structure.
[0019] In some embodiments, a plurality of the first ends surround to form a ring, the ring being located on the outer periphery of the heat dissipation gap; and the diameter of the ring is larger than the diameter of the cover plate.
[0020] Secondly, this utility model also provides an LED lighting device, including a light source module, a lens and a bracket, as well as the aforementioned heat dissipation structure. The light source module is disposed on the first mounting surface, and the light source module includes a light source substrate and LED beads disposed on the light source substrate. The lens covers the LED beads. The bracket is fixedly connected to the top cover.
[0021] In summary, this utility model has at least the following advantages:
[0022] 1. The heat dissipation structure provided by this utility model has a cover tangentially connected to the substrate, which allows heat transferred from the first mounting surface to the substrate to be quickly directed to the cover and then transferred outward, thus improving the heat conduction efficiency. Moreover, the heat dissipation gap and heat dissipation channel reduce the natural airflow resistance of the second heat dissipation component caused by the pressure difference between hot and cold air, effectively improving the heat dissipation efficiency without increasing the heat dissipation area of the second heat dissipation component.
[0023] 2. The heat dissipation structure provided by this utility model uses a reflector that is tangent to the substrate, a second heat dissipation component with a smaller heat dissipation area, and a smaller top cover, which effectively reduces the heat dissipation cost and component material cost of the lighting device.
[0024] 3. The LED lighting device provided by this utility model, after adopting the heat dissipation structure, will significantly reduce the system thermal resistance and LED junction temperature under the same heat dissipation power, thus ensuring the service life of the light source module. Attached Figure Description
[0025] Figure 1 This is an overall view of the heat dissipation structure of Embodiment 1 of this utility model.
[0026] Figure 2 for Figure 1 AA sectional view.
[0027] Figure 3 for Figure 2 A schematic diagram of the airflow at point B in the diagram.
[0028] Figure 4 for Figure 2 A magnified view of section C in the image.
[0029] Figure 5 This is an axial view of the second heat sink in Embodiment 1 of this utility model.
[0030] Figure 6 This is an overall view of the single-sided cantilever portion of Embodiment 1 of this utility model.
[0031] Figure 7 for Figure 2A magnified view of point B in the image.
[0032] Figure 8 This is an axonometric view of the top cover after being cut in section according to Embodiment 1 of this utility model.
[0033] Figure 9 for Figure 2 The axonometric view after AA sectioning.
[0034] Figure 10 This is an exploded view of the LED lighting device of Embodiment 2 of this utility model.
[0035] Marked in the image:
[0036] 100 - Heat dissipation structure;
[0037] 200-LED lighting fixtures;
[0038] 1-Reflector, 11-Substrate, 111-First mounting surface, 112-Second mounting surface, 12-Cover body
[0039] 13-Light exit cavity;
[0040] 2-Heat dissipation assembly, 21-First heat sink, 210-Ring body, 211-First end, 212-Second end,
[0041] 213-Airflow guide hole, 22-Second heat sink, 221-Base plate, 222-Heat sink, 223-Heat sink fin;
[0042] 3-Top cover, 31-Cover plate, 32-Side wall, 33-Heat dissipation gap, 34-Heat dissipation channel, 341-First heat dissipation slot, 342-Second heat dissipation slot, 35-Cantilever, 351-Support block, 352-Claw, 353-Guide channel;
[0043] 4-Light source module, 41-Light source substrate, 42-LED beads;
[0044] 5-lens;
[0045] 6-Staff;
[0046] H1: Distance between the cover plate and the second mounting surface;
[0047] H2: Height of the sidewall;
[0048] H3: Height of the heat dissipation gap; Detailed Implementation
[0049] To facilitate understanding of this utility model, a more comprehensive description will be given below with reference to the accompanying drawings and specific embodiments. The drawings illustrate preferred embodiments of this utility model. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.
[0050] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.
[0051] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
[0053] Example 1
[0054] Reference Figures 1-9 This embodiment provides a heat dissipation structure 100, mainly used in LED lighting devices. For example... Figure 1 As shown, the heat dissipation structure 100 includes a reflector 1, a heat dissipation component 2, and a top cover 3, with the heat dissipation component 2 and the top cover 3 positioned above the reflector 1.
[0055] See Figure 2The reflector 1 includes a substrate 11 and a cover 12 disposed outside the substrate 11. The substrate 11 and the cover 12 surround each other to form a light-emitting cavity 13. The substrate 11 has a first mounting surface 111 and a second mounting surface 112 facing each other. The first mounting surface 111 is used to mount the light-emitting component. The cover 12 is tangentially connected to the substrate 11. The light-emitting component is disposed on the first mounting surface 111, that is, below the substrate 11. Heat is conducted to the substrate 11 through the first mounting surface 111 and spreads towards the cover 12. Since the cover 12 is tangentially connected to the substrate 11, heat can be smoothly deposited downwards to the transition area between the cover 12 and the substrate 11, allowing heat to quickly enter the cover 12 and dissipate to both sides of the cover 12, thereby improving heat dissipation efficiency.
[0056] Compared to the existing technical solution where the connection between the substrate and the cover has an upwardly protruding right-angle structure, this embodiment uses a method where the cover 12 is tangentially connected to the substrate 11, resulting in better heat dissipation for the same light-emitting component and reflector 1 area. Verification shows that the temperature of the light-emitting component base plate is reduced by 1.47°C compared to the existing technical solution where the connection between the substrate and the cover has an upwardly protruding right-angle structure.
[0057] Continue reading Figure 2 The heat dissipation assembly 2 includes a first heat dissipation component 21 and a second heat dissipation component 22. The first heat dissipation component 21 is disposed on the substrate 11 and includes a first end 211 and a second end 212, with the second end 212 adjacent to the upper edge of the cover 12. The second heat dissipation component 22 is fitted and connected to the second mounting surface 112. The top cover 3 includes a cover plate 31 and a sidewall 32 disposed outside the cover plate 31, with the cover plate 31 positioned above the second heat dissipation component 22. By providing the first heat dissipation component 21 and the second heat dissipation component 22, the heat dissipation area of the substrate 11 on the second mounting surface 112 is increased, thereby improving the overall heat dissipation efficiency of the heat dissipation structure 100. The top cover 3 is used to connect the heat dissipation structure 100 to an external fixing structure, and by being positioned above the second heat dissipation component 22, the top cover 3 also provides protection for the second heat dissipation component 22.
[0058] Specifically, a heat dissipation gap 33 is provided between the side wall 32 and the second mounting surface 112, and the top cover 3 is provided with a heat dissipation channel 34 communicating with the outside. Figure 3 As shown, heat is transferred to the substrate 11, and the temperature of the substrate 11 should gradually decrease from the center to both sides. The second heat sink 22 is located in the center of the substrate 11 and undertakes the main heat dissipation work. Its overall temperature during operation is higher than that of the first heat sink 21. When the temperature around the second heat sink 22 rises, the gas expands and flows into the heat dissipation channel 34 and is discharged to the outside. Since the air temperature near the first heat sink 21 is lower than that near the second heat sink 22, the cool airflow will flow from the heat dissipation gap 33 to the second heat sink 22 and form a natural airflow. As the temperature of the second heat sink 22 increases, the airflow velocity also gradually increases.
[0059] In existing technologies, the top cover is entirely covered on the substrate, forming a closed cavity structure. This application, however, employs a structure with heat dissipation gaps 33 and heat dissipation channels 34, achieving a significant improvement in heat dissipation efficiency without increasing the heat dissipation area or components. In a heat dissipation verification experiment, under identical test conditions, the heat dissipation structure 100 with heat dissipation gaps 33 and heat dissipation channels 34 reduced the temperature of the light-emitting component's base plate by 1.01°C compared to existing technologies.
[0060] In some embodiments, a first heat sink 21 protrudes from the second mounting surface 112 in a direction away from the light-emitting cavity 13. The first heat sink 21 is provided with a flow guide hole 213, through which part of the heat generated by the light-emitting component is dissipated to the outside. Figure 4 As shown, the first heat sink 21 consists of multiple protrusions evenly distributed around the upper edge of the cover 12 and around the center of the substrate 11. The protruding first heat sink 21 increases the heat dissipation area of the substrate 11, improving the heat dissipation efficiency of the substrate 11 near the upper edge of the cover 12. The presence of flow guide holes 213 further enhances the heat dissipation efficiency and increases the airflow. In some embodiments, the first heat sink 21 can be directly protruded onto the substrate 11 by stamping to form the flow guide holes 213; in other embodiments, it can also be obtained by punching and then welding the material. In this embodiment, to maximize the heat dissipation area and considering process implementation, the cross-section of the first heat sink 21 is an isosceles trapezoid. In other embodiments, the cross-section of the first heat sink 21 can be arc-shaped, triangular, etc.
[0061] Please continue reading. Figure 3 The second heat sink 22 includes a base plate 221 and a heat sink 222 disposed on the base plate 221. The cover plate 31 is suspended above the heat sink 222. Part of the heat generated by the light-emitting component is dissipated to the outside through the heat dissipation gap 33 and heat dissipation channel 34 via the substrate 11 and the second heat sink 22. The second heat sink 22 is the main heat dissipation device of the heat dissipation structure 100. It conducts the heat of the substrate 11 to the base plate 221 and the heat sink 222 in sequence, so that the transferred heat has a sufficiently large area to contact the outside air and be carried away by natural airflow.
[0062] exist Figure 3 Based on the above, refer to Figure 5To improve the heat conversion efficiency between natural airflow and the second heat sink 22, the second heat sink 22 also includes heat dissipation fins 223. The heat dissipation fins 223 are located inside the heat sink 222 and are arranged radially with the center of the base plate 221 as the center. After the airflow flows into the second heat sink 22, it is blocked by the radially arranged heat dissipation fins 223 located at the center of the base plate 221, forming turbulence, reducing the flow velocity of the incoming airflow, and ensuring sufficient contact with the heat sink 222 and heat dissipation fins 223, thereby achieving efficient heat exchange. Compared to neatly arranged heat sinks 222, the heat dissipation structure 100 with heat dissipation fins 223 has a superior heat dissipation effect for the same heat dissipation area.
[0063] It should be noted that the top cover 3 also includes a cantilever 35, which is radially disposed on the outer side of the side wall 32. The cantilever 35 includes a support block 351, a latch 352, and a flow guide 353, with the flow guide 353 located between the support block 351 and the latch 352. Figure 6 As shown, the top cover 3 is fixed to the base plate 11 by the cantilever 35, specifically by the support block 351 fixedly connected to the base plate 11. In this embodiment, the screw locking method is used, but in other embodiments, welding, snap-fit connection or other methods can also be used.
[0064] Specifically, the flow channel 353 is located above the first heat sink 21, the latch 352 is located on the outside of the second end 212, and the end of the support block 351 abuts against the first end 211. To further improve heat dissipation efficiency, the top cover 3 is made of a thermally conductive metal material, allowing the substrate 11 to transfer some heat through the support block 351 and the latch 352, and dissipate heat outward through the flow channel 353. In some embodiments, the support block 351 and the latch 352 can also form a snap-fit, fastening to the first heat sink 21, allowing the top cover 3 to be connected to the substrate 11 without additional accessories, thus achieving quick installation and disassembly.
[0065] More specifically, the distance between the cover plate 31 and the second mounting surface 112 is H1, and the heights of the side wall 32 and the heat dissipation gap 33 are H2 and H3 respectively, with the following relationship: H1 = H2 + H3. In practical applications, such as... Figure 7 As shown, H1 can be determined by the height of the second heat sink 22. Only after sufficient space is provided for the heat dissipation channel 34 can the dimensions of H2 and H3 be determined. The design must consider the load-bearing capacity and structural stability of the top cover 3 structure, the minimum space required for actual heat dissipation airflow, and the cost of manufacturing parts. The optimal values for H2 and H3 are calculated in practical applications to find the best values. Due to different heat dissipation requirements, the actual values of H2 and H3 vary depending on the specific situation and are not calculated here. Based on current experiments, H2 should be greater than H3, and H3 should be within the range of 0.33 to 0.5 times the value of H1 for optimal heat dissipation.
[0066] In some embodiments, the heat dissipation channel 34 includes a first heat dissipation groove 341 and a second heat dissipation groove 342. The first heat dissipation groove 341 is formed in the side wall 32, and the second heat dissipation groove 342 is formed in the cover plate 31, and the second heat dissipation groove 342 has an arc-shaped structure. Figure 8 As shown, airflow can quickly enter and exit the heat dissipation channel 34 through the first heat dissipation slot 341. When a large amount of heat dissipation is required, the hot airflow can be quickly discharged through the first heat dissipation slot 341 without affecting the entry of the cold airflow through the heat dissipation gap 33. When the heat dissipation requirement is not high, the first heat dissipation slot 341 can further reduce the resistance of the cold airflow, thereby allowing it to enter the heat dissipation channel 34. The second heat dissipation slot 342 mainly discharges the hot airflow to the outside. The second heat dissipation slot 342 is arranged in an arc shape on the edge of the cover plate 31, so that the cover plate 31 has a larger airflow channel with sufficient structural strength, thereby obtaining a better heat dissipation effect.
[0067] In this embodiment, multiple first ends 211 surround to form a ring 210, which is located on the outer periphery of the heat dissipation gap 33; and the diameter of the ring 210 is larger than the diameter of the cover plate 31. Figure 9 As shown, the first heat sink 21 and the heat dissipation gap 33 are at a certain distance, ensuring that the hot airflow generated by the first heat sink 21 does not easily enter the heat dissipation gap 33 and flow into the heat dissipation channel 34, so that the second heat sink 22 and the cold airflow have sufficient temperature difference to achieve heat exchange. Due to the improved heat dissipation efficiency, the actual space occupied by the second heat sink 22 is reduced, and the main body of the top cover 3 does not need to have a large size to cover the second mounting surface 112, thereby reducing the heat dissipation cost of the lighting equipment, reducing the use of manufacturing materials and the overall weight.
[0068] In summary, the heat dissipation structure provided in this embodiment, with the cover tangentially connected to the substrate, allows heat transferred from the first mounting surface to the substrate to be quickly directed to the cover and then transferred outwards, improving the thermal conductivity of the reflector. By setting heat dissipation gaps and channels, the natural airflow resistance generated by the pressure difference between hot and cold air during heat dissipation is reduced. Without increasing the heat dissipation area of the second heat sink, the overall heat dissipation efficiency of the heat dissipation structure is effectively improved, while simultaneously reducing the heat dissipation cost and component material cost of the lighting device.
[0069] Example 2
[0070] exist Figure 1-9 Based on this, refer to Figure 10This embodiment provides an LED lighting device 200, including a light source module 4, a lens 5, and a bracket 6, as well as the heat dissipation structure 100 described in Embodiment 1. The light source module 4 is disposed on a first mounting surface 111, and includes a light source substrate 41 and LED beads 42 disposed on the light source substrate 41. The lens 5 covers the LED beads 42. During the operation of the LED lighting device 200, the LED beads 42 emit light towards the lens 5 and generate heat. The generated heat is transferred to the heat dissipation structure 100 through the light source substrate 41, specifically conducted through the substrate 11 to the cover 12 for heat dissipation, or conducted to the first heat sink 21 and the second heat sink 22. The heat dissipation is completed by the natural airflow formed by the temperature difference.
[0071] The bracket 6 is fixedly connected to the top cover 3. The heat dissipation structure 100, on which the light source module 4 and lens 5 are installed, can be fixed to the mounting base through the bracket 6, thereby realizing the installation of the LED lighting device 200. In this embodiment, the bracket 6 is set by directly or indirectly suspending it from the building beam.
[0072] The LED lighting device provided in this embodiment adopts a heat dissipation structure with good heat dissipation efficiency. Under the same heat dissipation power, the system thermal resistance and LED junction temperature will be significantly reduced, ensuring the service life of the light source module.
[0073] The above description is merely an example and illustration of the structure of this utility model, and while the description is quite specific and detailed, it should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these obvious substitutions all fall within the protection scope of this utility model.
Claims
1. A heat dissipation structure, characterized in that, include: A reflector includes a substrate and a cover disposed outside the substrate. The substrate and the cover surround each other to form a light-emitting cavity. The substrate has a first mounting surface and a second mounting surface facing each other. The first mounting surface is provided with a light-emitting component. The heat dissipation assembly includes a first heat dissipation component and a second heat dissipation component. The first heat dissipation component is disposed on the substrate and includes a first end and a second end. The second end is adjacent to the upper edge of the cover. The second heat dissipation component is attached to the second mounting surface. as well as The top cover includes a cover plate and a side wall disposed on the outside of the cover plate, the cover plate being disposed above the second heat sink; The cover is tangentially connected to the substrate, a heat dissipation gap is provided between the side wall and the second mounting surface, and a heat dissipation channel communicating with the outside is provided on the top cover.
2. The heat dissipation structure according to claim 1, characterized in that, The first heat sink protrudes from the second mounting surface in a direction away from the light emission cavity. The first heat sink is provided with a flow guide hole, through which part of the heat generated by the light-emitting component is dissipated to the outside.
3. The heat dissipation structure according to any one of claims 1 or 2, characterized in that, The second heat sink includes a base plate and a heat sink fin disposed on the base plate. The cover plate is suspended above the heat sink fin. Part of the heat generated by the light-emitting component is dissipated to the outside through the substrate and the second heat sink and from the heat dissipation gap and heat dissipation channel.
4. The heat dissipation structure according to claim 3, characterized in that, The second heat sink further includes heat dissipation fins, which are located inside the heat sink and are arranged radially with the center of the base plate as the center.
5. The heat dissipation structure according to claim 3, characterized in that, The top cover also includes a cantilever, which is radially disposed on the outer side of the side wall. The cantilever includes a support block, a latch, and a flow guide groove, with the flow guide groove disposed between the support block and the latch.
6. The heat dissipation structure according to claim 5, characterized in that, The flow channel is located above the first heat sink, the latch is located on the outside of the second end, and the end of the support block abuts against the first end.
7. The heat dissipation structure according to claim 6, characterized in that, The distance between the cover plate and the second mounting surface is H1, and the heights of the side wall and the heat dissipation gap are H2 and H3, respectively, with the following relationship: H1 = H2 + H3.
8. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation channel includes a first heat dissipation groove and a second heat dissipation groove. The first heat dissipation groove is formed on the side wall; the second heat dissipation groove is formed on the cover plate, and the second heat dissipation groove has an arc-shaped structure.
9. The heat dissipation structure according to claim 1, characterized in that, Multiple first ends surround to form a ring, which is located on the outer periphery of the heat dissipation gap; and the diameter of the ring is larger than the diameter of the cover plate.
10. An LED lighting device, characterized in that, The device includes a light source module, a lens, and a bracket, as well as a heat dissipation structure as described in any one of claims 1-9. The light source module is disposed on the first mounting surface, and the light source module includes a light source substrate and LED beads disposed on the light source substrate. The lens covers the LED beads. The bracket is fixedly connected to the top cover.