Device for testing heat dissipation performance of heat dissipation module

By designing a heat dissipation module testing device with a lifting and fixing plate, a buffer module, and a floating module, the problem of testing inaccuracy caused by slight deformation of the heat dissipation module in the existing technology is solved, and higher testing accuracy and device protection are achieved.

CN223551346UActive Publication Date: 2025-11-14KUNSHAN YINGFAN PRECISION METAL
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Patent Information

Application Number
CN202423135274.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-19
Publication Date
2025-11-14
Estimated Expiration
2034-12-19

AI Technical Summary

Technical Problem

Existing heat dissipation module testing devices cannot effectively maintain contact with the surface under test, which affects the accuracy of the test, especially when the heat dissipation module is slightly deformed.

Method used

A testing device was designed, comprising a lifting and fixing plate, a buffer module, a floating module, and a heating module. The buffer module reduces impact through guide columns and buffer springs, and the floating module adapts to surface deformation through floating springs, ensuring that the heating module is in close contact with the surface to be tested.

Benefits of technology

It improves the accuracy and reliability of heat dissipation module testing, reduces shock and vibration during the testing process, and protects the testing equipment and heat dissipation module.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a heat dissipation performance testing device for a heat dissipation module, which comprises a lifting fixing plate, a buffer module, a floating module and a heating module, the buffer module, the floating module and the heating module are sequentially arranged below the lifting fixing plate from top to bottom, and the heating module is in contact with the surface to be tested of the heat dissipation module; the floating module comprises a floating cover and a floating base, the floating cover plate is connected with the buffer module, the floating base is connected with the heating module, and a plurality of floating springs are evenly distributed between the floating cover plate and the floating base. According to the structure, through the design of the floating spring, the testing device can adapt to slight deformation of a to-be-tested surface, so that the testing accuracy is ensured; and through the cooperative design of the buffer module and the floating spring, the stability of the test is further improved, and impact and vibration in the test process are reduced, so that the test device and the heat dissipation module are protected.
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Description

Technical Field

[0001] This utility model relates to the field of heat dissipation module testing technology, and specifically to a heat dissipation module heat dissipation performance testing device. Background Technology

[0002] With the widespread use of electronic devices, the crucial role of heat dissipation modules in these devices is becoming increasingly prominent. Therefore, accurate testing of the heat dissipation performance of heat dissipation modules is particularly important. However, changes in heat pipe length, number, and bending increase the weight of the heat dissipation module and the probability of slight deformation. This means that existing heat dissipation module testing devices cannot effectively maintain contact with the test surface when faced with slight deformation, thus affecting the accuracy of the test. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides a heat dissipation performance testing device for heat dissipation modules.

[0004] The technical solution of this utility model is as follows: it includes a lifting and fixing plate, and a buffer module, a floating module and a heating module are arranged sequentially below the lifting and fixing plate. The heating module is in contact with the test surface of the heat dissipation module. The floating module includes a floating cover and a floating base. The floating cover is connected to the buffer module and the floating base is connected to the heating module. Several floating springs are evenly distributed between the floating cover and the floating base.

[0005] A further technical solution is as follows: the buffer module includes an upper fixed plate and a lower fixed plate that can move relative to each other, a number of guide posts are provided between the upper fixed plate and the lower fixed plate, and a number of buffer springs are sleeved on the outer side of the number of guide posts in a corresponding manner, with the two ends of the buffer springs respectively abutting against the opposite end faces of the upper fixed plate and the lower fixed plate.

[0006] A further technical solution is that the lower end of the guide post is fixedly connected to the lower fixed plate, and the upper end of the guide post is slidably connected to the upper fixed plate through a guide bushing.

[0007] A further technical solution is that each guide post is provided with a limiting member at its upper end, and the limiting member forms a stop on the upper end face of the guide bushing to restrict the guide post from coming out of the guide bushing.

[0008] A further technical solution is that the floating cover plate and the floating base are provided with spring grooves for accommodating floating springs on their opposite end faces.

[0009] A further technical solution is that the heating module includes a heating block, the heating block has a heating hole, and a heating rod is detachably inserted into the heating hole.

[0010] A further technical solution is that the floating base has a recessed receiving groove on the end face opposite to the floating cover, and the floating cover is closed in the receiving groove.

[0011] The beneficial technical effects of this utility model are: the floating spring design enables the testing device to adapt to slight deformation of the surface to be tested, thereby improving the accuracy and reliability of the test; the combination of the buffer module and the floating spring further reduces the impact and vibration during the test, thus protecting the testing device and the heat dissipation module. Attached Figure Description

[0012] Figure 1 This is a schematic diagram showing the positional relationship between this utility model and the heat dissipation module;

[0013] Figure 2 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 3 This is a cross-sectional view of the buffer module of this utility model;

[0015] Figure 4 This is a schematic diagram of the specific structure of the floating module of this utility model;

[0016] Figure 5 This is a cross-sectional view of the floating module of this utility model;

[0017] The components include: 1. Lifting and fixing plate; 2. Buffer module; 21. Upper fixing plate; 22. Lower fixing plate; 23. Guide column; 24. Buffer spring; 25. Limiting component; 3. Floating module; 31. Floating base; 32. Floating cover; 33. Floating spring; 4. Heating module; 41. Heating block; 42. Heating hole. Detailed Implementation

[0018] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0019] like Figure 1 As shown, the heat dissipation performance testing device for a heat dissipation module according to this utility model includes a lifting and fixing plate 1, and a buffer module 2, a floating module 3, and a heating module 4 arranged sequentially below the lifting and fixing plate 1. The lifting and fixing plate 1 is used to fix and adjust the position of the entire testing device; the buffer module 2 is used to reduce the impact of the heating module 4 on the heat dissipation module during the test; the floating module 3 can be finely adjusted according to the shape of the surface to be tested to maintain a tight fit between the heating module 4 and the surface to be tested; the heating module 4 contacts the surface to be tested of the heat dissipation module to heat the heat dissipation module in order to test its heat dissipation performance.

[0020] Specifically, such as Figure 2 and Figure 3 As shown, the buffer module 2 includes an upper fixed plate 21 and a lower fixed plate 22. A plurality of guide posts 23 are provided between the upper fixed plate 21 and the lower fixed plate 22. A plurality of buffer springs 24 are sleeved on the outer side of the plurality of guide posts 23 respectively. The two ends of the buffer springs 24 abut against the opposite end faces of the upper fixed plate 21 and the lower fixed plate 22 respectively.

[0021] In this embodiment, the lower end of the guide post 23 is fixedly connected to the lower fixing plate 22, and the upper end of the guide post 23 is slidably connected to the upper fixing plate 21 through the guide bushing. Moreover, each guide post 23 is provided with a limiting member 25 at its upper end, which is used to restrict the guide post 23 from coming out of the guide bushing.

[0022] Specifically, the limiting member 25 is a screw, the upper end face of the guide post 23 is provided with a countersunk hole, the screw is threaded into the countersunk hole, and the head of the screw forms a stop part on the upper end face of the guide bushing.

[0023] This structure allows the upper fixed plate 21 to float up and down relative to the lower fixed plate 22, and to make elastic contact with the heat dissipation module under the elastic force of the buffer spring 24, preventing excessive pressure from damaging the heat dissipation module. At the same time, by sliding the guide post 23 with the guide bushing, the stability of the floating module 3 and the heating module 4 as they move up and down with the lower fixed plate 22 is ensured.

[0024] like Figure 4 and Figure 5 The floating module 3 includes a floating base 31 and a floating cover 32. The floating cover 32 is fixedly connected to the lower fixed plate 22, and the floating base 31 is connected to the heating module 4.

[0025] Specifically, the upper surface of the floating base 31 is provided with a recessed receiving groove, and the floating cover 32 is closed within the receiving groove. A plurality of floating springs 33 are evenly distributed between the floating cover 32 and the floating base 31. The two ends of the plurality of floating springs 33 respectively abut against the opposite end faces of the floating cover 32 and the floating base 31, so as to evenly distribute the externally applied force on the floating base 31. The receiving groove can provide a relatively enclosed space for the floating springs 33 to protect them; at the same time, the inner sidewall of the receiving groove cooperates with the floating cover 32, which also guides the extension and contraction of the floating springs 33. When the floating module 3 is subjected to external force, the deformation direction of the floating springs 33 is easier to control.

[0026] Furthermore, the floating cover 32 and the floating base 31 have spring grooves on their opposite end faces for mounting the floating spring 33.

[0027] The heating module 4 includes a heating block 41, which has a heating hole 42. A heating rod is detachably inserted into the heating hole 42. The heating hole 42 is located on the side of the heating block 41 and extends through its interior. In this embodiment, the heating block 41 is a pure copper block. After the heating rod heats the heating block 41, the heat is conducted to the heat dissipation module to simulate the working state of the heat source. This is then used in conjunction with a simulation system to simulate and analyze the heat dissipation performance of the heat dissipation module.

[0028] In this embodiment, when the lifting and fixing plate 1 moves the buffer module 2, the floating module 3, and the heating module 4 to the position to be tested on the heat dissipation module, the heating block 41 elastically contacts the heat dissipation module under the elastic force of the buffer spring 24. When the heating block 41 and the heat dissipation module are in a pressed state, due to the presence of the floating spring 33, the heating block 41 and the floating base 31 adaptively adjust according to the surface shape and unevenness of the position to be tested on the heat dissipation module. That is, when an external force is applied, each floating spring 33 will be compressed accordingly according to its position and the force applied, thereby better fitting the surface of the position to be tested on the heat dissipation module.

[0029] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A device for testing the heat dissipation performance of a heat dissipation module, characterized in that: The device includes a lifting and fixing plate (1), a buffer module (2), a floating module (3), and a heating module (4) arranged sequentially below the lifting and fixing plate (1). The heating module (4) is in contact with the surface to be tested of the heat dissipation module. The floating module (3) includes a floating cover (32) and a floating base (31). The floating cover (32) is connected to the buffer module (2), and the floating base (31) is connected to the heating module (4). Several floating springs (33) are evenly distributed between the floating cover (32) and the floating base (31).

2. The heat dissipation performance testing device for a heat dissipation module according to claim 1, characterized in that: The buffer module (2) includes an upper fixed plate (21) and a lower fixed plate (22) that can move relative to each other. A plurality of guide posts (23) are provided between the upper fixed plate (21) and the lower fixed plate (22). A plurality of buffer springs (24) are sleeved on the outer side of the plurality of guide posts (23) respectively. The two ends of the buffer springs (24) abut against the opposite end faces of the upper fixed plate (21) and the lower fixed plate (22) respectively.

3. The heat dissipation performance testing device for a heat dissipation module according to claim 2, characterized in that: The lower end of the guide post (23) is fixedly connected to the lower fixing plate (22), and the upper end of the guide post (23) is slidably connected to the upper fixing plate (21) through the guide bushing.

4. The heat dissipation performance testing device for a heat dissipation module according to claim 3, characterized in that: Each guide post (23) is provided with a limiting member (25) at its upper end. The limiting member (25) forms a stop on the upper end face of the guide bushing to restrict the guide post (23) from coming out of the guide bushing.

5. The heat dissipation performance testing device for a heat dissipation module according to claim 1, characterized in that: The floating cover (32) and the floating base (31) are provided with spring grooves for mounting the floating springs (33) on their opposite end faces.

6. The heat dissipation performance testing device for a heat dissipation module according to claim 1, characterized in that: The heating module (4) includes a heating block (41), and the heating block (41) has a heating hole (42) inside, and the heating rod is detachably inserted into the heating hole (42).

7. The heat dissipation performance testing device for a heat dissipation module according to claim 1, characterized in that: The floating base (31) and the floating cover (32) have a recessed receiving groove on their opposite end faces, and the floating cover (32) covers the receiving groove.