IGBT module heating platform
By designing a heating platform for IGBT modules and using screw fixing and thermocouple temperature measurement control, the maintenance difficulties under traditional connection methods have been solved, enabling convenient disassembly and accurate temperature judgment, thereby improving maintenance efficiency and yield.
Patent Information
- Application Number
- CN202422642207.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-10-31
AI Technical Summary
The traditional connection method between IGBT modules and PCB boards makes maintenance difficult, disassembly inconvenient and prone to damage, affecting the maintenance yield. Existing Press-Fit connectors are difficult to disassemble after frequent disassembly, and the maintenance process is time-consuming and labor-intensive.
Design an IGBT module heating platform that uses screw fixing and thermocouple temperature measurement control. Through the heating unit and temperature measurement and control device on the heating platform, achieve precise temperature control and convenient disassembly of the IGBT module.
It improves the ease of maintenance and repair yield of IGBT modules, and can accurately determine the module temperature in dynamic and static high temperature tests, reducing maintenance damage.
Smart Images
Figure CN223552500U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electronic device technology and relates to a novel connection device between IGBT module pins and PCB board. Background Technology
[0002] IGBT is short for Insulated Gate Bipolar Transistor, a three-terminal semiconductor switching device that can be used for efficient and fast switching in a variety of electronic devices.
[0003] Traditionally, power module terminal pins are soldered to the control circuit board. For multi-pin modules and PCBs using multiple modules, module disassembly is difficult when repair is needed, and other components on the surface can obstruct replacement, making the repair process time-consuming, labor-intensive, and prone to irreversible damage, resulting in low overall PCBA repair yield and significant economic losses for companies. Currently, the alternative solution to soldering is Press-Fit. Press-Fit, commonly known as "fisheye connectors," allows for repeated assembly and disassembly within a certain number of cycles. However, in practical use, PCB design or exceeding a certain number of disassemblies can make module replacement difficult, hindering repair.
[0004] To address this issue, a novel connection device between the IGBT module pins and the PCB board was designed to overcome the aforementioned problems. Utility Model Content
[0005] The purpose of this utility model is to overcome the shortcomings of the existing technology and provide a new type of IGBT module pin connection device to the PCB board that is reasonably structured, easy to install and disassemble, and simple to maintain.
[0006] This utility model is achieved through the following technical solution: an IGBT module heating platform, comprising a heating platform and a heating unit mounted on the heating platform. A recessed placement groove is provided in the center of the top surface of the heating platform for placing an IGBT module. Screw holes are provided at the four corners of the placement groove for installing screws to fix the IGBT module placed in the placement groove. Multiple first through holes are provided on the side of the heating platform, and heating devices are installed in the first through holes for heating the heating platform and the IGBT module. At least one vertical second through hole penetrating the heating platform is also provided in the center of the placement groove for installing a temperature measurement and control device. The temperature measurement and control device is used to measure the real-time temperature of the copper substrate of the IGBT module and to control the temperature of the copper substrate.
[0007] Preferably, the temperature measurement and control device consists of a thermocouple and a temperature controller. The measuring end of the thermocouple head is higher than the bottom surface of the placement slot for measuring the copper substrate of the IGBT module. The wire at the tail of the thermocouple is inserted into and passes through the first through hole and connected to the temperature controller. The wire is fixed in the first through hole with glue. The temperature controller controls the temperature by sampling the temperature of the copper substrate measured by the thermocouple.
[0008] Preferably, the second through holes are arranged in four equidistant positions. Each second through hole horizontally penetrates the heating platform, and a heating device is inserted into the second through hole to heat the heating platform and the IGBT module.
[0009] Preferably, the temperature controller is model SLG-5000. When the thermocouple sampling temperature is lower than the set temperature, the relay of the temperature controller is activated to heat the heating platform and module; when the thermocouple sampling temperature is higher than the set temperature, the relay is deactivated to stop heating and prevent the module temperature from becoming too high.
[0010] Preferably, the heating device is a heating rod.
[0011] Preferably, the lower part of the heating platform has a comb-like structure to improve overall heat dissipation.
[0012] The beneficial effects of this utility model are as follows:
[0013] The heating platform of this invention is generally used in dynamic and static high-temperature testing. Without altering the testing platform, the chip temperature is determined by detecting the thermocouple wires (measuring the copper substrate temperature) installed on the heating platform. Compared to traditional testing that assesses the IGBT module temperature by controlling the temperature of the external heating platform, this invention can more accurately determine the IGBT module temperature. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0015] Figure 2 This is a side view of the present invention.
[0016] Figure 3 for Figure 2 AA sectional view.
[0017] Figure 4 This is a connection diagram between the temperature controller and the heating rod in this utility model.
[0018] Figure 5 This is the temperature control logic diagram of this utility model. Detailed Implementation
[0019] To enable those skilled in the art to more clearly understand the purpose, technical solution and advantages of this utility model, the present utility model will be further described below in conjunction with the accompanying drawings and embodiments.
[0020] In the description of this utility model, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", "horizontal", and "vertical" are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0021] The present invention will now be described in detail with reference to the accompanying drawings: Figure 1 As shown, an IGBT module heating platform includes a heating platform 1 and a heating unit mounted on the heating platform 1. A recessed placement groove 2 is provided in the center of the top surface of the heating platform 1 for placing the IGBT module. Screw holes 3 are provided at the four corners of the placement groove 2 for installing screws to fix the IGBT module placed in the placement groove 2. Multiple first through holes 4 are provided on the sides of the heating platform 1, and heating devices are installed in the first through holes 4 for heating the heating platform and the IGBT module. At least one vertical second through hole 5 is also provided in the center of the placement groove 2, penetrating the heating platform, for installing a temperature measurement and control device. The temperature measurement and control device is used to measure the real-time temperature of the copper substrate of the IGBT module and to control the temperature of the copper substrate. The heating device is a heating rod 9.
[0022] The temperature measurement and control device consists of a thermocouple 6 and a temperature controller 7. The measuring end of the thermocouple 6 is higher than the bottom of the placement slot and is used to measure the temperature by closely adhering to the copper substrate of the IGBT module. The wire 8 at the tail of the thermocouple 6 is inserted into and passes through the first through hole and is connected to the temperature controller 7. The wire 8 is fixed in the first through hole 4 with glue. The temperature controller 7 controls the temperature by sampling the temperature of the copper substrate measured by the thermocouple 6.
[0023] The second through holes 5 are arranged in four equidistant positions. Each second through hole 5 horizontally penetrates the heating platform 1 and a heating device is inserted into the second through hole 5 to heat the heating platform 1 and the IGBT module in the placement slot 2.
[0024] like Figure 4-5As shown, the temperature controller 7 is model SLG-5000. When the temperature sampled by thermocouple 6 is lower than the set temperature, the relay of the temperature controller is activated, realizing the heating platform 1 and the IGBT module; when the temperature sampled by thermocouple 6 is higher than the set temperature, the relay is deactivated, stopping the heating and preventing the IGBT module from overheating. The lower part of the heating platform 1 has a comb-like structure 10 to improve overall heat dissipation.
[0025] The heating platform of this invention is generally used in dynamic and static high-temperature testing. Without altering the testing platform, the chip temperature is determined by detecting the thermocouple wires (measuring the copper substrate temperature) installed on the heating platform. Compared to traditional testing that assesses the IGBT module temperature by controlling the temperature of the external heating platform, this invention can more accurately determine the IGBT module temperature.
[0026] The specific embodiments described herein are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.
Claims
1. An IGBT module heating platform, comprising a heating platform (1) and a heating unit mounted on the heating platform (1), characterized in that: The heating platform (1) has a recessed placement groove (2) in the middle of its top surface for placing IGBT modules. Screw holes (3) are provided at the four corners of the placement groove (2) for installing screws to fix the IGBT modules placed in the placement groove (2). Multiple first through holes (4) are provided on the side of the heating platform (1). A heating device is installed in the first through hole (4) for heating the heating platform and the IGBT modules. At least one vertical second through hole (5) is also provided in the middle of the placement groove (2) for installing a temperature measurement and control device. The temperature measurement and control device is used to measure the real-time temperature of the copper substrate of the IGBT module and to control the temperature of the copper substrate.
2. The IGBT module heating platform according to claim 1, characterized in that: The temperature measurement and control device consists of a thermocouple (6) and a temperature controller (7). The measuring end of the thermocouple (6) is higher than the bottom surface of the placement slot and is used to measure the copper substrate of the IGBT module in close contact. The wire (8) at the tail of the thermocouple (6) is inserted and passes through the first through hole and connected to the temperature controller (7). The wire (8) is fixed in the first through hole (4) with glue. The temperature controller (7) controls the temperature by sampling the temperature of the copper substrate measured by the thermocouple (6).
3. The IGBT module heating platform according to claim 1, characterized in that: The second through hole (5) consists of four equally spaced holes. Each second through hole (5) passes horizontally through the heating platform (1) and a heating device is inserted into the second through hole (5) to heat the heating platform (1) and the IGBT module in the placement slot (2).
4. The IGBT module heating platform according to claim 2, characterized in that: The temperature controller (7) is model SLG-5000. When the temperature sampled by the thermocouple (6) is lower than the set temperature, the relay of the temperature controller is activated to heat the heating platform (1) and the IGBT module. When the temperature sampled by the thermocouple (6) is higher than the set temperature, the relay is deactivated to stop heating and prevent the IGBT module from overheating.
5. The IGBT module heating platform according to claim 3, characterized in that: The heating device is a heating rod (9).
6. The IGBT module heating platform according to claim 1, characterized in that: The lower part of the heating platform (1) is a comb-tooth structure (10) to improve overall heat dissipation.