Diode module base plate

Abstract

The utility model discloses a diode module base plate, relates to the technical field of diodes, and aims to solve the problem of short creepage distance caused by the fact that an existing base plate is insulated from a diode module by means of a ceramic chip, the diode module base plate comprises a mounting base plate, the upper surface of the mounting base plate is provided with an annular groove, and the upper surface of the mounting base plate is provided with the annular groove. An annular groove is formed in the upper surface of the base, an installation part is arranged in the middle of the annular groove, a ceramic chip is coaxially installed on the installation part, the diameter of the ceramic chip is larger than that of the installation part, a diode module is installed on the upper surface of the ceramic chip, the annular groove is filled with isolation rubber, and the edge of the ceramic chip makes contact with the isolation rubber.

Description

Technical Field

[0001] This utility model relates to the technical field of diodes, and specifically to a diode module base plate. Background Technology

[0002] The diode module base plate is a key structural component in power semiconductor modules. It not only provides mechanical support for the module but also plays an important role in heat dissipation, electrical insulation, and mechanical connection.

[0003] Existing module base plates are usually flat structures. The diode modules are mounted on the base plate and insulated between them using ceramic sheets. There are no other treatments to enhance the insulation.

[0004] However, considering the installation space of the diode module, the overall volume is made as small as possible. This also means that each component needs to be as small as possible. Therefore, the thickness of the ceramic sheet used for the insulating base plate and the diode module is also relatively small.

[0005] Thin ceramic sheets shorten the creepage distance between the diode module and the base plate, and shorter creepage distances can easily lead to problems such as leakage current, tracking, and flashover. Utility Model Content

[0006] To address the aforementioned problem—namely, the short creepage distance resulting from existing base plates relying on ceramic sheets for insulation between the base plate and the diode module—this invention proposes a diode module base plate. The base plate includes a mounting plate with an annular groove on its upper surface. A mounting portion is positioned in the center of the annular groove, and a ceramic sheet is coaxially mounted on the mounting portion. The diameter of the ceramic sheet is larger than the diameter of the mounting portion. A diode module is mounted on the upper surface of the ceramic sheet. An insulating adhesive is filled within the annular groove, and the edge of the ceramic sheet contacts the insulating adhesive.

[0007] A further feature of this invention is that a groove is recessed on the surface of the annular groove near the mounting side to enhance the strength of the adhesive.

[0008] A further feature of this invention is that a high-fiber insulating coating is provided between the mounting portion and the ceramic sheet, and the high-fiber insulating coating is provided on the side surface of the annular groove near the mounting portion and inside the slot.

[0009] A further feature of this invention is that the diode module includes an anode electrode, the anode electrode is disposed on the upper surface of the ceramic sheet, a chip is disposed on the upper surface of the anode electrode, a cathode electrode with a T-shaped cross-section is disposed on the upper surface of the chip, a disc spring is sleeved on the cathode electrode, a pressure plate is pressed onto the disc spring, and the pressure plate is connected to the mounting base plate by bolts.

[0010] A further feature of this invention is that the anode electrode is configured as a right angle, with one panel arranged parallel to the mounting base plate and the other panel arranged perpendicular to the mounting base plate.

[0011] The beneficial effects of this utility model are as follows:

[0012] 1. By setting the insulating adhesive in the annular groove, the edge of the ceramic sheet can come into contact with the insulating adhesive, thereby increasing the creepage distance between the diode module and the base plate and improving the insulation capability between the diode module and the base plate.

[0013] 2. A high-fiber insulating coating is placed between the ceramic plate and the annular groove to prevent short-distance creepage of current due to poor contact between the ceramic plate and the insulating adhesive, thus further ensuring the insulation capability of the diode module. Attached Figure Description

[0014] Figure 1 A schematic diagram of the structure of this utility model is shown.

[0015] Figure 2 A cross-sectional view along the AA direction is shown.

[0016] Figure 3 It shows Figure 2 A magnified view of a portion of point A in the middle.

[0017] Reference numerals: 1. Mounting base plate; 11. Annular groove; 111. Slot; 2. Ceramic sheet; 3. Diode module; 31. Anode electrode; 32. Chip; 33. Cathode electrode; 34. Disc spring; 35. Pressure plate; 4. Isolation adhesive; 5. High fiber insulating coating. Detailed Implementation

[0018] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0019] Reference Appendix Figure 1-3This utility model proposes a diode module base plate, including a mounting base plate 1. An annular groove 11 is formed on the upper surface of the mounting base plate 1. A circular mounting portion is formed in the center of the annular groove 11. A circular ceramic plate 2 is mounted on the upper surface of the mounting portion. The ceramic plate 2 is coaxially arranged with the mounting portion, and its diameter is larger than that of the mounting portion, so that the edge of the ceramic plate 2 extends out of the mounting portion and is located above the annular groove 11. A diode module 3 is mounted on the upper surface of the ceramic plate 2. An insulating adhesive 4 is filled in the annular groove 11. The edge of the ceramic plate 2 contacts the upper surface of the insulating adhesive 4, so that the creepage distance of the diode module 3 is the sum of the creepage distance on the ceramic plate 2 and the creepage distance on the insulating adhesive 4, thereby increasing the creepage distance.

[0020] The annular groove 11 has a vertical surface near the mounting part and an arc-shaped surface away from the mounting part. A slot 111 is formed on the surface of the annular groove 11 near the mounting part. When the release adhesive 4 is filled into the annular groove 11, the slot 111 is also filled with release adhesive 4, thereby enhancing the strength of the release adhesive 4 and making it more stable within the annular groove 11 and less likely to fall off.

[0021] A high-fiber insulating coating 5 is sprayed between the ceramic sheet 2 and the mounting part; the surface of the annular groove 11 near the mounting part and the inner surface of the slot 111 are also sprayed with a high-fiber insulating coating 5. The high-fiber insulating coating 5 can further improve the insulation between the ceramic and the insulating adhesive 4, that is, to prevent the current from creeping short distance due to poor contact between the ceramic sheet 2 and the insulating adhesive 4.

[0022] The diode module 3 includes an anode electrode 31, which is mounted on the upper surface of the ceramic plate 2. A chip 32 is mounted on the upper surface of the anode electrode 31, and a cathode electrode 33 is mounted on the upper surface of the chip 32. The cross-section of the cathode electrode 33 is set to an inverted T-shape.

[0023] A disc spring 34 is coaxially sleeved on the cathode electrode 33 post, and a pressure plate 35 is pressed onto the disc spring 34. The pressure plate 35 is also sleeved on the cathode electrode 33 post, and four bolts are threaded through the pressure plate 35. The bolts are threaded to the mounting base plate 1 to achieve the pressing of the pressure plate 35. The pressure plate 35 can press the cathode electrode 33, chip 32, anode electrode 31 and ceramic sheet 2 through the disc spring 34.

[0024] The anode electrode 31 is configured as a right angle, with one panel parallel to the mounting base plate 1 and the other panel perpendicular to the mounting base plate 1 and positioned above the mounting base plate 1 to facilitate connection with other electrical components.

[0025] In summary, by providing an insulating adhesive 4 within the annular groove 11, this invention allows the edge of the ceramic sheet 2 to contact the insulating adhesive 4, thereby increasing the creepage distance between the diode module 3 and the base plate and improving the insulation capability between the diode module 3 and the base plate. The high-fiber insulating plating layer 5 placed between the ceramic sheet 2 and the annular groove 11 prevents short-distance creepage due to inadequate contact between the ceramic sheet 2 and the insulating adhesive 4, further ensuring the insulation capability of the diode module 3.

[0026] Although the present invention has been described with reference to preferred embodiments, various modifications can be made to it and components can be replaced with equivalents without departing from the scope of the present invention. In particular, the technical features mentioned in the various embodiments can be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0027] In the description of this utility model, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, articles, or apparatus / devices.

[0030] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A diode module base plate, comprising a mounting base plate (1), characterized in that: The mounting base plate (1) has an annular groove (11) on its upper surface. The annular groove (11) is configured with a mounting part in the middle. A ceramic plate (2) is coaxially mounted on the mounting part. The diameter of the ceramic plate (2) is larger than the diameter of the mounting part. A diode module (3) is mounted on the upper surface of the ceramic plate (2). The annular groove (11) is filled with insulating adhesive (4). The edge of the ceramic plate (2) is in contact with the insulating adhesive (4).

2. The diode module base plate according to claim 1, characterized in that: The annular groove (11) is further recessed on the side surface near the installation to enhance the strength of the adhesive (4).

3. The diode module base plate according to claim 2, characterized in that: A high-fiber insulating coating (5) is provided between the mounting part and the ceramic sheet (2). The high-fiber insulating coating (5) is provided on the side surface of the annular groove (11) near the mounting part and inside the slot (111).

4. The diode module base plate according to claim 1 or 3, characterized in that: The diode module (3) includes an anode electrode (31), which is disposed on the upper surface of the ceramic sheet (2). A chip (32) is disposed on the upper surface of the anode electrode (31), and a cathode electrode (33) with a T-shaped cross-section is disposed on the upper surface of the chip (32). A disc spring (34) is sleeved on the cathode electrode (33), and a pressure plate (35) is pressed onto the disc spring (34). The pressure plate (35) is connected to the mounting base plate (1) by bolts.

5. The diode module base plate according to claim 4, characterized in that: The anode electrode (31) is set in a right angle, with one panel parallel to the mounting base plate (1) and the other panel perpendicular to the mounting base plate (1).

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