Heat dissipation device and power device with same

Abstract

The utility model provides a heat dissipation device and a power device with the same, and the heat dissipation device comprises a bottom plate which is provided with a containing cavity, and a cooling medium is stored in the containing cavity; the heat dissipation assembly comprises a heat dissipation box, a first communicating pipe and a second communicating pipe, the heat dissipation box is provided with a heat dissipation cavity, the first end of the first communicating pipe communicates with the top of the containing cavity, the second end of the first communicating pipe communicates with the heat dissipation cavity, the first end of the second communicating pipe communicates with the heat dissipation cavity, and the second end of the second communicating pipe communicates with the side portion of the containing cavity. Through the technical scheme provided by the invention, the problem that the heat transfer resistance is increased and the heat dissipation efficiency of the power device is influenced due to the fact that a thermal interface material is arranged between the bottom plate and the radiator in the related technology can be solved.

Description

Technical Field

[0001] This utility model relates to the field of power technology, and more specifically, to a heat dissipation device and a power device having the same. Background Technology

[0002] The demand for power devices is constantly increasing due to their ability to improve the efficiency of power conversion and transmission. Power devices are also widely used in new energy vehicles, industrial control, and locomotive traction, playing a vital and indispensable role.

[0003] In related technologies, power devices need to be cooled during operation. A layer of thermal interface material, such as thermal grease, is applied to the base plate of the power device. Then, the heat sink is connected to the base plate of the power device. The thermal interface material is placed between the heat sink and the base plate, thereby filling the solid contact interface gap between the base plate and the heat sink and improving the heat dissipation capacity of the device.

[0004] However, placing a thermal interface material between the base plate and the heat sink in related technologies increases the thermal resistance, which in turn affects the heat dissipation efficiency of power devices. Utility Model Content

[0005] This invention provides a heat dissipation device and a power device having the same, to solve the problem in related technologies that setting a thermal interface material between the base plate and the heat sink increases the thermal resistance and thus affects the heat dissipation efficiency of the power device.

[0006] According to one aspect of the present invention, a heat dissipation device is provided, comprising: a base plate having a receiving cavity containing a cooling medium; and a heat dissipation assembly including a heat dissipation box, a first connecting pipe, and a second connecting pipe, wherein the heat dissipation box has a heat dissipation cavity, a first end of the first connecting pipe is connected to the top of the receiving cavity, a second end of the first connecting pipe is connected to the heat dissipation cavity, a first end of the second connecting pipe is connected to the heat dissipation cavity, and a second end of the second connecting pipe is connected to the side of the receiving cavity.

[0007] Furthermore, a first heat dissipation structure is provided on the outer wall of the first connecting pipe; and / or, a second heat dissipation structure is provided on the outer wall of the heat dissipation box.

[0008] Furthermore, the first heat dissipation structure includes a plurality of first heat dissipation fins disposed on the first connecting pipe; the second heat dissipation structure includes a plurality of second heat dissipation fins disposed on the outer wall of the heat dissipation box.

[0009] Furthermore, the first connecting pipe has a first vertical pipe section, a first horizontal pipe section, and a second vertical pipe section. The first end of the first vertical pipe section is located at the top of the base plate and communicates with the receiving cavity. The second end of the first vertical pipe section is connected to the first end of the first horizontal pipe section. The second end of the first horizontal pipe section is connected to the first end of the second vertical pipe section. The second end of the second vertical pipe section is connected to the heat dissipation cavity. A first heat dissipation structure is provided on the side wall of the first horizontal pipe section and the side wall of the second vertical pipe section.

[0010] Furthermore, the bottom wall of the heat dissipation cavity is higher than the bottom wall of the receiving cavity, the second connecting pipe is inclined, and the first end of the second connecting pipe is higher than the second end of the second connecting pipe.

[0011] Furthermore, the heat dissipation assembly includes at least two heat dissipation boxes, at least two first connecting pipes, and at least two second connecting pipes. The first ends of the multiple first connecting pipes are connected together and connected to the top of the receiving cavity through a manifold. The second end of each first connecting pipe is correspondingly provided with a heat dissipation box and connected to the heat dissipation cavity. A second connecting pipe is correspondingly provided between each heat dissipation box and the base plate.

[0012] Furthermore, the bottom wall of the receiving cavity is provided with a concave-convex structure, which includes multiple bosses provided on the bottom wall of the receiving cavity. Each boss extends along the width direction of the bottom plate, and the multiple bosses are spaced apart along the length direction of the bottom plate.

[0013] Furthermore, the volume of the heat dissipation cavity is larger than the volume of the receiving cavity.

[0014] Furthermore, the thickness of the base plate is set between 2.5mm and 20mm.

[0015] According to another aspect of the present invention, a power device is provided, which includes the heat dissipation device provided above.

[0016] The present invention provides a heat dissipation device comprising a base plate and a heat dissipation assembly. The base plate has a receiving cavity that can store a cooling medium. By utilizing the storage of the cooling medium in the receiving cavity, there is no need to install other heat sinks for heat dissipation of the power device. The cooling medium on the base plate of the power device absorbs heat, thus achieving the function of heat dissipation and cooling. There is no need to install other heat sinks on the base plate for heat dissipation. As long as the heat dissipation assembly is integrated with the base plate, the cooling medium in the receiving cavity of the base plate absorbs heat and then cools down under the action of the heat dissipation assembly. Thus, heat dissipation is achieved simply by circulating the cooling medium. The heat dissipation component includes a heat sink with a heat dissipation cavity. A first end of a first connecting pipe is connected to the top of the cavity, and a second end of the first connecting pipe is connected to the heat dissipation cavity. This allows the cooling medium in the cavity to absorb heat and become gaseous, flowing into the heat dissipation cavity of the heat sink through the first connecting pipe. This ensures that the gaseous cooling medium releases heat within the cavity, transforming it into a liquid state. Since the first end of a second connecting pipe is connected to the cavity, and the second end is connected to the side of the cavity, the liquid cooling medium can flow back into the cavity through the second connecting pipe. This circulation of the cooling medium allows it to absorb heat from the power devices within the cavity, releasing heat and becoming liquid again before flowing back into the cavity through the second connecting pipe. This continuous circulation of the cooling medium ensures efficient heat dissipation for the power devices, improving the practicality and structural reliability of the heat dissipation device. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0018] Figure 1 A schematic diagram of the heat dissipation device provided in Embodiment 1 of this utility model is shown;

[0019] Figure 2 A schematic diagram of the heat dissipation device provided in Embodiment 2 of this utility model is shown;

[0020] Figure 3 A cross-sectional view of the base plate of the heat dissipation device provided in Embodiment 2 of this utility model is shown.

[0021] The above figures include the following reference numerals:

[0022] 10. Base plate; 11. Receiving cavity;

[0023] 20. Heat dissipation assembly; 21. Heat dissipation box; 22. First connecting pipe; 221. First vertical pipe segment; 222. First horizontal pipe segment; 223. Second vertical pipe segment; 23. Second connecting pipe;

[0024] 30. First heat dissipation structure; 31. First heat sink;

[0025] 40. Second heat dissipation structure; 41. Second heat sink;

[0026] 50. Concave-convex structure; 51. Boss. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0028] like Figure 1 As shown, Embodiment 1 of this utility model provides a heat dissipation device, which includes a base plate 10 and a heat dissipation assembly 20. The base plate 10 has a receiving cavity 11, which stores a cooling medium. The heat dissipation assembly 20 includes a heat dissipation box 21, a first connecting pipe 22, and a second connecting pipe 23. The heat dissipation box 21 has a heat dissipation cavity. The first end of the first connecting pipe 22 is connected to the top of the receiving cavity 11, and the second end of the first connecting pipe 22 is connected to the heat dissipation cavity. The first end of the second connecting pipe 23 is connected to the heat dissipation cavity, and the second end of the second connecting pipe 23 is connected to the side of the receiving cavity 11.

[0029] The heat dissipation device provided in this embodiment includes a base plate 10 and a heat dissipation component 20. The base plate 10 has a receiving cavity 11, which can store a cooling medium. Therefore, the cooling medium stored in the receiving cavity 11 can be used to dissipate heat from the power device without the need for other heat sinks. The cooling medium on the base plate 10 of the power device absorbs heat, which can achieve the function of heat dissipation and cooling. There is no need to set up other heat sinks on the base plate 10 for heat dissipation. As long as the heat dissipation component 20 is integrated with the base plate 10, the cooling medium in the receiving cavity 11 of the base plate 10 absorbs heat and is then cooled by the action of the heat dissipation component 20. Thus, heat dissipation can be achieved simply by circulating the cooling medium. The heat dissipation assembly 20 includes a heat dissipation box 21, which has a heat dissipation cavity. The first end of a first connecting pipe 22 is connected to the top of the receiving cavity 11, and the second end of the first connecting pipe 22 is connected to the heat dissipation cavity. This allows the cooling medium in the receiving cavity 11 to absorb heat and become gaseous, which then flows into the heat dissipation cavity of the heat dissipation box 21 under the action of the first connecting pipe 22. This ensures that the gaseous cooling medium can release heat within the heat dissipation cavity, causing it to become liquid under the action of the heat dissipation box 21. Since the first end of the second connecting pipe 23 is connected to the heat dissipation cavity, the second end of the second connecting pipe 23... The end is connected to the side of the receiving cavity 11, so that the liquid cooling medium can be returned to the receiving cavity 11 through the second connecting pipe 23. This enables the cooling medium to circulate, so that the cooling medium in the receiving cavity 11 absorbs heat from the power device, and the gaseous cooling medium flows into the heat dissipation cavity of the heat sink 21 through the first connecting pipe 22 to release heat and become liquid cooling medium, and then flows back to the receiving cavity 11 through the second connecting pipe 23. This achieves the circulation of the cooling medium and can continuously dissipate heat from the power device, ensuring the heat dissipation efficiency of the power device and improving the practicality and structural reliability of the heat dissipation device.

[0030] like Figure 1 As shown, a first heat dissipation structure 30 is provided on the outer wall of the first connecting pipe 22. Using the above structure, by providing the first heat dissipation structure 30 on the outer wall of the first connecting pipe 22, the first heat dissipation structure 30 can dissipate heat from the gaseous cooling medium flowing into the first connecting pipe 22, thereby converting a portion of the gaseous cooling medium into a liquid state, which can then flow through the first connecting pipe 22 into the heat dissipation cavity of the heat sink 21, and return to the receiving cavity 11 through the second connecting pipe 23.

[0031] like Figure 1As shown, a second heat dissipation structure 40 is provided on the outer wall of the heat dissipation box 21. By adopting the above structure and providing the second heat dissipation structure 40 on the outer wall of the heat dissipation box 21, the heat dissipation efficiency of the heat dissipation box 21 can be improved, and the gaseous cooling medium in the heat dissipation cavity can be converted into a liquid cooling medium by releasing heat under the action of the second heat dissipation structure 40.

[0032] like Figure 1 As shown, the first heat dissipation structure 30 includes a plurality of first heat sinks 31 disposed on the first connecting pipe 22. By employing the above-described first heat dissipation structure 30 and providing a plurality of first heat sinks 31, the heat dissipation efficiency of the first connecting pipe 22 can be improved.

[0033] like Figure 1 As shown, the second heat dissipation structure 40 includes a plurality of second heat dissipation fins 41 disposed on the outer wall of the heat dissipation box 21. By employing the above-described second heat dissipation structure 40 and providing a plurality of second heat dissipation fins 41, the heat dissipation efficiency of the heat dissipation box 21 can be improved.

[0034] It should be noted that both the first heat sink 31 and the second heat sink 41 can enhance heat transfer by increasing the contact area with the surrounding environment. The first heat sink 31 and the second heat sink 41 conduct heat, with some heat being conducted forward and the other part being transferred through convection with the fluid via the surrounding surfaces of the sheet-like structure. As heat is transferred forward along the sheet-like structure, the temperature gradually decreases, resulting in a gradual reduction in both the heat conducted forward and the heat transferred to the surrounding fluid.

[0035] like Figure 1As shown, the first connecting pipe 22 has a first vertical pipe section 221, a first horizontal pipe section 222, and a second vertical pipe section 223. The first end of the first vertical pipe section 221 is located on the top of the base plate 10 and communicates with the receiving cavity 11. The second end of the first vertical pipe section 221 is connected to the first end of the first horizontal pipe section 222. The second end of the first horizontal pipe section 222 is connected to the first end of the second vertical pipe section 223. The second end of the second vertical pipe section 223 is connected to the heat dissipation cavity. A first heat dissipation structure 30 is provided on the side wall of the first horizontal pipe section 222 and the side wall of the second vertical pipe section 223. The first connecting pipe 22 with the above structure connects the first end of the first vertical pipe section 221 to the receiving cavity 11, the second end of the first vertical pipe section 221 to the first horizontal pipe section 222, the first horizontal pipe section 222 to the first end of the second vertical pipe section 223, and the second end of the second vertical pipe section 223 to the heat dissipation cavity. In this way, the gaseous cooling medium can be discharged into the heat dissipation cavity through the first vertical pipe section 221, the first horizontal pipe section 222, and the second vertical pipe section 223. Furthermore, the first heat dissipation structure 30 is provided on the first horizontal pipe section 222 and the second vertical pipe section 223, which can improve the heat dissipation efficiency and thus ensure the heat dissipation treatment of the gaseous cooling medium.

[0036] like Figure 1 As shown, the bottom wall of the heat dissipation cavity is higher than the bottom wall of the receiving cavity 11. The second connecting pipe 23 is inclined, and the first end of the second connecting pipe 23 is higher than the second end of the second connecting pipe 23. With the above structure, the bottom wall of the heat dissipation cavity is higher than the bottom wall of the receiving cavity 11, and the second connecting pipe 23 is inclined. This allows the liquid cooling medium to flow back into the receiving cavity 11 through the second connecting pipe 23. This eliminates the need for other power structures to discharge the cooling medium from the heat dissipation cavity into the receiving cavity 11, thereby eliminating the need for a compressor and a circulating pump. The entire system is more compact because the inclined second connecting pipe 23 facilitates the flow of the liquid cooling medium from a higher position to a lower position by gravity, i.e., from the heat dissipation cavity back into the receiving cavity 11. This allows the heat dissipation device of this embodiment to circulate based on heat drive and the gravity of the liquid.

[0037] like Figure 2 and Figure 3As shown, this second embodiment provides a heat dissipation assembly 20. The difference between this second embodiment and the first embodiment is that the heat dissipation assembly 20 includes at least two heat dissipation boxes 21, at least two first connecting pipes 22, and at least two second connecting pipes 23. The first ends of the multiple first connecting pipes 22 are connected together and communicate with the top of the receiving cavity 11 through a manifold. The second end of each first connecting pipe 22 is correspondingly provided with a heat dissipation box 21 and communicates with the heat dissipation cavity. A second connecting pipe 23 is correspondingly provided between each heat dissipation box 21 and the base plate 10. Using the above structure, by providing at least two heat dissipation boxes 21, at least two first connecting pipes 22, and at least two second connecting pipes 23, it is possible to facilitate the flow of cooling medium from the receiving cavity 11 into the multiple first connecting pipes 22 through the manifold, and then into the at least two heat dissipation boxes 21, thereby improving the heat dissipation efficiency of the cooling medium.

[0038] It should be noted that the second connecting pipe 23 in Embodiment 2 has the same structure as the second connecting pipe 23 in Embodiment 1.

[0039] like Figure 3 As shown, a concave-convex structure 50 is provided on the bottom wall of the receiving cavity 11. The concave-convex structure 50 includes a plurality of protrusions 51 provided on the bottom wall of the receiving cavity 11. Each protrusion 51 extends along the width direction of the base plate 10, and the plurality of protrusions 51 are spaced apart along the length direction of the base plate 10. By adopting the above structure, by providing the concave-convex structure 50 on the bottom wall of the receiving cavity 11, and by making the plurality of protrusions 51 of the concave-convex structure 50 spaced apart along the length direction of the base plate 10, the contact area between the receiving cavity 11 of the base plate and the cooling medium is increased, thereby improving the heat transfer efficiency and ensuring that the cooling medium in the receiving cavity 11 plays a role in heat dissipation for the power devices.

[0040] In this embodiment, the volume of the heat dissipation cavity is larger than the volume of the receiving cavity 11. By employing the above structure, it is possible to ensure that the cooling medium, which is converted from a gaseous state in the receiving cavity 11 and introduced into the heat dissipation cavity, can dissipate heat and become liquid again.

[0041] In this embodiment, the thickness of the base plate 10 is set between 2.5 mm and 20 mm. This structure facilitates effective reduction of the junction temperature of power devices.

[0042] It should be noted that the thickness of the base plate 10 can be set to 2.5mm, 4mm, 8mm, 12mm, 16mm, 20mm, or any other value between 2.5mm and 20mm.

[0043] This utility model provides a power device including the aforementioned heat dissipation device. Using this structure, the base plate and heat sink can be integrated, eliminating the need to apply other thermal interface materials to the base plate. Instead, the cooling medium between the base plate and the heat sink circulates, allowing the aforementioned heat dissipation device to effectively dissipate heat from the power device.

[0044] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0045] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0046] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0047] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0048] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0049] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A heat dissipation device, characterized in that, The heat dissipation device includes: The base plate (10) has a receiving cavity (11) containing a cooling medium; The heat dissipation assembly (20) includes a heat dissipation box (21), a first connecting pipe (22) and a second connecting pipe (23). The heat dissipation box (21) has a heat dissipation cavity. The first end of the first connecting pipe (22) is connected to the top of the receiving cavity (11), the second end of the first connecting pipe (22) is connected to the heat dissipation cavity, the first end of the second connecting pipe (23) is connected to the heat dissipation cavity, and the second end of the second connecting pipe (23) is connected to the side of the receiving cavity (11).

2. The heat dissipation device according to claim 1, characterized in that, A first heat dissipation structure (30) is provided on the outer wall of the first connecting pipe (22); and / or, A second heat dissipation structure (40) is provided on the outer wall of the heat dissipation box (21).

3. The heat dissipation device according to claim 2, characterized in that, The first heat dissipation structure (30) includes a plurality of first heat dissipation fins (31) disposed on the first connecting pipe (22); The second heat dissipation structure (40) includes a plurality of second heat dissipation fins (41) disposed on the outer wall of the heat dissipation box (21).

4. The heat dissipation device according to claim 1, characterized in that, The first connecting pipe (22) has a first vertical pipe section (221), a first horizontal pipe section (222) and a second vertical pipe section (223). The first end of the first vertical pipe section (221) is located at the top of the base plate (10) and communicates with the receiving cavity (11). The second end of the first vertical pipe section (221) is connected to the first end of the first horizontal pipe section (222). The second end of the first horizontal pipe section (222) is connected to the first end of the second vertical pipe section (223). The second end of the second vertical pipe section (223) is connected to the heat dissipation cavity. A first heat dissipation structure (30) is provided on the side wall of the first horizontal pipe section (222) and the side wall of the second vertical pipe section (223).

5. The heat dissipation device according to claim 1, characterized in that, The bottom wall of the heat dissipation cavity is higher than the bottom wall of the receiving cavity (11), the second connecting pipe (23) is inclined, and the first end of the second connecting pipe (23) is higher than the second end of the second connecting pipe (23).

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that, The heat dissipation assembly (20) includes at least two heat dissipation boxes (21), at least two first connecting pipes (22), and at least two second connecting pipes (23). The first ends of the plurality of first connecting pipes (22) are connected together and connected to the top of the receiving cavity (11) through a manifold. The second end of each first connecting pipe (22) is correspondingly provided with a heat dissipation box (21) and connected to the heat dissipation cavity. Each heat dissipation box (21) and the base plate (10) are correspondingly provided with a second connecting pipe (23).

7. The heat dissipation device according to any one of claims 1 to 5, characterized in that, The bottom wall of the receiving cavity (11) is provided with a concave-convex structure (50), the concave-convex structure (50) includes a plurality of protrusions (51) provided on the bottom wall of the receiving cavity (11), each of the protrusions (51) extends along the width direction of the bottom plate (10), and the plurality of protrusions (51) are spaced apart along the length direction of the bottom plate (10).

8. The heat dissipation device according to claim 1, characterized in that, The volume of the heat dissipation cavity is greater than the volume of the receiving cavity (11).

9. The heat dissipation device according to claim 1, characterized in that, The thickness of the base plate (10) is set between 2.5 mm and 20 mm.

10. A power device, characterized in that, The power device includes the heat dissipation device according to any one of claims 1 to 9.

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