Handheld laser and handheld laser system

Abstract

The utility model discloses a hand-held laser and a hand-held laser system, in the hand-held laser, one end of a handle assembly is connected with a shell, and the handle assembly is used for providing a grasping space for a user, so that the user can conveniently take the hand-held laser. The semiconductor laser comprises a base and a laser module, and the laser module and the handle assembly are arranged on the two opposite sides of the base respectively. The base is provided with a heat dissipation channel, the handle assembly is provided with a liquid inlet channel and a liquid outlet channel, the liquid inlet channel is communicated with a liquid inlet of the heat dissipation channel, the liquid outlet channel is communicated with a liquid outlet of the heat dissipation channel, cooling liquid can circulate in the heat dissipation channel through the liquid inlet channel and the liquid outlet channel, heat dissipation is conducted on the laser module, and the operation efficiency of the laser module is improved. As the liquid inlet channel and the liquid outlet channel are arranged in the handle assembly, the liquid inlet channel and the liquid outlet channel cannot be bent and folded due to the movement of the handheld laser in the movement process of the handheld laser, and the heat dissipation stability and efficiency of the laser module are improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor laser technology, and in particular to a handheld laser and a handheld laser system. Background Technology

[0002] Semiconductor lasers generate a significant amount of waste heat during operation, requiring efficient heat dissipation devices to remove this heat and ensure stable operation. Therefore, in handheld laser welding machines, to prevent heat from the laser from being transferred to the machine's casing and potentially burning the user, two existing methods exist: First, the laser is not mounted on the handle; instead, it is output via fiber optic cable to the handle for adjustment. Second, the laser is directly mounted on the handle. Currently, this method places the laser on the rear end of the base with a coolant line for heat dissipation, but this arrangement affects the user's grip and makes operation less convenient. Utility Model Content

[0003] To address the aforementioned technical problems, this application provides a handheld laser, comprising:

[0004] The housing has a receiving cavity;

[0005] A semiconductor laser, located in the accommodating cavity, is used to emit laser light;

[0006] The handle assembly is connected to the housing at one end;

[0007] The semiconductor laser includes a base and a laser module, with the laser module and the handle assembly respectively disposed on opposite sides of the base;

[0008] The base is provided with a heat dissipation channel, and the handle assembly is provided with a liquid inlet channel and a liquid outlet channel. The liquid inlet channel is connected to the liquid inlet of the heat dissipation channel, and the liquid outlet channel is connected to the liquid outlet of the heat dissipation channel.

[0009] The laser module is disposed on the first surface of the base, and the liquid outlet and liquid inlet of the heat dissipation channel are located on the second surface of the base. The first surface and the second surface of the base are arranged opposite to each other. The liquid inlet is disposed at one end of the second surface, and the liquid outlet is disposed at the other end of the second surface. The liquid inlet and the liquid outlet are arranged correspondingly.

[0010] The heat dissipation channel is a closed loop, the liquid inlet is located on one side of the closed loop, and the liquid outlet is located on the opposite side of the closed loop.

[0011] The handheld laser also includes a focusing lens, which is disposed in the accommodating cavity and located on the optical axis of the semiconductor laser, for focusing the laser emitted by the semiconductor laser.

[0012] The handheld laser also includes a protective mirror, which is located in the accommodating cavity, on the side of the focusing mirror away from the semiconductor laser, and on the optical axis of the semiconductor laser.

[0013] The handle assembly has its inlet channel connected to the inlet pipe of the coolant supply assembly, and its outlet channel connected to the outlet channel of the coolant supply assembly. The inlet channel injects coolant from the coolant supply assembly into the heat dissipation channel through the inlet port, and the outlet channel discharges coolant from the heat dissipation channel through the outlet port.

[0014] To address the aforementioned technical problems, this application also provides a handheld laser system, comprising the aforementioned handheld laser and a coolant supply assembly. The inlet pipe of the coolant supply assembly is connected to the inlet channel of the handheld laser, and the outlet pipe of the coolant supply assembly is connected to the outlet channel of the handheld laser, thereby supplying flowing coolant to the heat dissipation channel of the handheld laser.

[0015] The beneficial effects of this application are as follows: Unlike existing technologies, the handheld laser of this application includes a housing, a semiconductor laser, and a handle assembly. The housing has a cavity in which the semiconductor laser is located and used to emit laser light; one end of the handle assembly is connected to the housing to provide a gripping space for the user, facilitating the user's handling of the laser. The semiconductor laser includes a base and a laser module, with the laser module and the handle assembly respectively positioned on opposite sides of the base. The base has a heat dissipation channel, and the handle assembly has a liquid inlet channel and a liquid outlet channel. The liquid inlet channel communicates with the liquid inlet of the heat dissipation channel, and the liquid outlet channel communicates with the liquid outlet of the heat dissipation channel. Therefore, coolant can circulate through the liquid inlet and liquid outlet channels of the handle assembly in the heat dissipation channel, cooling the laser module and improving its operating efficiency. Since the inlet and outlet channels are located in the handle assembly, they will not affect the user's handling of the handheld laser. Furthermore, during the movement of the handheld laser, the inlet and outlet channels will not bend or fold due to the movement or placement of the handheld laser, thus not affecting the flow of coolant. This improves the stability and efficiency of heat dissipation for the laser module and enhances the user's experience with the handheld laser. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] in:

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of the handheld laser of this application;

[0019] Figure 2 This is a schematic diagram of the structure of the first embodiment of the heat dissipation channel of this application;

[0020] Figure 3 This is a schematic diagram of the structure of the second embodiment of the heat dissipation channel of this application;

[0021] Figure 4 This is a structural schematic diagram of the third embodiment of the heat dissipation channel of this application.

[0022] Reference numerals: Handheld laser 1; Housing 11; Semiconductor laser 12; Base 121; Heat dissipation channel 122; First sub-pipe 1221; Second sub-pipe 1222; Third sub-pipe 1223; Fourth sub-pipe 1224; Fifth sub-pipe 1225; Liquid inlet 123; Liquid outlet 124; Handle assembly 13; Liquid passage 131; Focusing lens 14; Protective lens 15. Detailed Implementation

[0023] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0024] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0025] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0026] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A alone, A and B simultaneously, and B alone. Additionally, the character " / " generally indicates that the preceding and following related objects are in an "or" relationship. Furthermore, "many" in this application means two or more. Moreover, the term "at least one" in this application means any combination of at least two of any one or more of a plurality of objects. For example, including at least one of A, B, and C can mean including any one or more elements selected from the set consisting of A, B, and C. Furthermore, the terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0027] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of an embodiment of the handheld laser of this application. The handheld laser 1 provided in this application embodiment includes a housing 11, a semiconductor laser 12, and a handle assembly 13.

[0028] The housing 11 has a receiving cavity in which the semiconductor laser 12 is located. The housing 11 isolates the semiconductor laser 12 from the external environment, preventing dust, moisture, and other contaminants from contacting the semiconductor laser 12 and affecting its operation. The semiconductor laser 12 is used to emit laser light. The laser emitted by the semiconductor laser 12 can be used for welding metal materials, etc.

[0029] One end of the handle assembly 13 is connected to the housing 11 to provide a gripping space for the user. The user can grip the handheld laser 1 through the handle assembly 13, which reduces the difficulty for the user to grip the handheld laser and improves the convenience of the user to use the handheld laser.

[0030] Specifically, the semiconductor laser 12 includes a base 121 and a laser module (not shown). The laser module and the handle assembly 13 are respectively disposed on opposite sides of the base 121. The base 121 is provided with a heat dissipation channel 122, and the handle assembly 13 is provided with a liquid passage 131, which can be a parallel liquid inlet channel and a liquid outlet channel. The liquid inlet channel is connected to the liquid inlet of the heat dissipation channel 122, and the liquid outlet channel is connected to the liquid outlet of the heat dissipation channel.

[0031] The laser module is used to emit laser light. During the laser emission process, the laser module generates a lot of heat. If the heat is not dissipated, the laser module will operate in a high-temperature environment, which will seriously damage its performance.

[0032] Therefore, a heat dissipation channel 122 is provided in the base 121 for the flow of coolant, such as, but not limited to, water. When the laser module generates heat during operation, the heat is conducted to the base 121 and then carried away by the coolant flowing in the heat dissipation channel 122. This prevents heat buildup and an increase in the ambient temperature of the laser module, ensuring that the laser module operates in a suitable environment and improving its operating efficiency.

[0033] The inlet of the heat dissipation channel 122 is connected to the inlet channel, and the outlet of the heat dissipation channel 122 is connected to the outlet channel. Furthermore, the inlet pipe of the external coolant supply component can be connected to the other end of the inlet channel, and the outlet pipe of the coolant supply component can be connected to the other end of the outlet channel. The coolant supply component can inject coolant into the heat dissipation channel 122 through the inlet and outlet channels. Simultaneously, the coolant in the heat dissipation channel 122 can be discharged through the outlet and outlet channel into the outlet pipe. This achieves coolant flow in the heat dissipation channel 122, improving the heat carrying efficiency of the coolant and thus enhancing heat dissipation efficiency.

[0034] In existing technologies, handheld lasers typically have inlet and outlet coolant lines connected to the rear end of the base. When a user holds the handheld laser to work, the movement of the laser may bend or fold the inlet and / or outlet coolant lines, affecting the flow of coolant in the heat dissipation channels and thus impacting heat dissipation efficiency. To avoid this, the user needs to constantly monitor the status of the inlet and outlet coolant lines while moving the handheld laser, which affects work efficiency and causes considerable inconvenience when using the handheld laser.

[0035] The handheld laser 1 provided in this application embodiment has a handle assembly 13 connected to the housing 11, providing a gripping space for the user to hold the handheld laser 1, improving its portability and user experience. Furthermore, the handle assembly 13 has a fluid passage 131 that connects to the heat dissipation channel 122 in the base 121 and to an external coolant supply assembly, enabling coolant flow within the heat dissipation channel 122. Because of the handle assembly 13, the fluid passage 131 does not bend or fold with the movement or change of position of the handheld laser 1, eliminating the need for user attention during use, thus improving the user experience, heat dissipation efficiency of the laser module, and overall operating efficiency.

[0036] Optionally, the laser module is disposed on the first surface of the base 121, and the liquid outlet and liquid inlet of the heat dissipation channel 122 are located on the second surface of the base 121, wherein the first surface and the second surface of the base 121 are arranged opposite to each other. This rational structural arrangement, with the laser module disposed on the first surface of the base 121 and the liquid outlet and liquid inlet on the second surface, ensures that the placement of the liquid inlet and outlet channels does not affect the placement of the laser module, improving the orderly arrangement of internal components in the handheld laser 1. Furthermore, placing the laser module on different surfaces from the liquid inlet and outlet prevents coolant from damaging the laser module in case of leakage at the inlet or outlet, thus improving the safety of the handheld laser 1.

[0037] Furthermore, the inlet is located at one end of the second surface, and the outlet is located at the opposite end of the second surface, with the inlet and outlet corresponding to each other. As shown above, the liquid passage 131 includes an inlet channel and an outlet channel arranged in parallel. The inlet channel is connected to the inlet, and the outlet channel is connected to the outlet. By correspondingly setting the inlet and outlet, it is possible to achieve simultaneous connection between the parallel inlet channel and the outlet channel. If the inlet and outlet are not corresponding, separate inlet and outlet channels need to be set up to connect to the inlet and outlet respectively, increasing the installation difficulty for users.

[0038] This embodiment provides a corresponding setting for the liquid inlet and liquid outlet, which can reduce the difficulty for users to install the liquid inlet channel and liquid outlet, and simplify the internal structure of the handheld laser 1.

[0039] In one embodiment, the handheld laser 1 may further include a sealing ring (not shown), which is disposed between the liquid inlet channel and the liquid outlet and between the liquid outlet channel and the liquid outlet to seal the connection between the liquid inlet channel and the liquid outlet and the connection between the liquid outlet channel and the liquid outlet, thereby preventing leakage and improving the safety of the handheld laser 1.

[0040] Optionally, please refer to Figure 2 , Figure 2 This is a schematic diagram of the structure of the first embodiment of the heat dissipation channel of this application. The heat dissipation channel 122 is a closed loop, with the liquid inlet 123 located on one side of the closed loop and the liquid outlet 124 located on the opposite side of the closed loop. The coolant can then enter the closed loop through the liquid inlet channel and the liquid inlet 123, flow within the closed loop, carry the heat from the base 121, and be discharged through the liquid outlet 124 and the liquid outlet channel, thereby improving the heat dissipation efficiency of the laser module.

[0041] In one embodiment, please continue to refer to Figure 2The heat dissipation channel 122 may include a first sub-pipe 1221, a second sub-pipe 1222, a third sub-pipe 1223, and a fourth sub-pipe 1224. The first end of the first sub-pipe 1221 is connected to the first end of the second sub-pipe 1222, the second end of the first sub-pipe 1221 is connected to the first end of the fourth sub-pipe 1224, the first end of the third sub-pipe 1223 is connected to the second end of the second sub-pipe 1222, and the second end of the third sub-pipe 1223 is connected to the second end of the fourth sub-pipe 1224. The liquid inlet 123 is disposed on the first sub-pipe 1221, and the liquid outlet 124 is disposed on the third sub-pipe 1223. The liquid inlet 123 and the liquid outlet 124 are aligned in the width direction of the base 121.

[0042] Furthermore, after the coolant enters the heat dissipation channel 122 through the inlet channel and inlet port 123, as... Figure 2 As shown by the middle arrow, the direction of the arrow indicates the flow direction of the coolant in the pipeline. After the coolant enters the first sub-pipe 1221 through the inlet 123, it is divided into two parts. The first part of the coolant flows through the pipeline path of "inlet 123 - first end of first sub-pipe 1221 - first end of second sub-pipe 1222 - second end of second sub-pipe 1222 - first end of third sub-pipe 1223 - outlet 124"; the second part of the coolant flows through the pipeline path of "inlet 123 - second end of first sub-pipe 1221 - first end of fourth sub-pipe 1224 - second end of fourth sub-pipe 1224 - second end of third sub-pipe 1223 - outlet 124". This ensures that the coolant flows through all the pipelines in the heat dissipation channel 122, carrying the heat from the corresponding area on the base 121, and is discharged through the outlet 124 to dissipate heat for the laser module.

[0043] By setting up the heat dissipation channel 122, heat dissipation is achieved for the laser module in the handheld laser 1, thereby improving the operating efficiency of the laser module and the handheld laser 1.

[0044] Optionally, the distances between the first sub-pipe 1221 and the first surface of the base 121, the distances between the second sub-pipe 1222 and the first surface, the distances between the third sub-pipe 1223 and the first surface, and the distances between the fourth sub-pipe 1224 and the first surface are all equal.

[0045] That is, the first sub-pipe 1221, the second sub-pipe 1222, the third sub-pipe 1223, and the fourth sub-pipe 1224 are located on the same horizontal plane. Since the laser module is set on the first surface of the base 121, and the distances between the first sub-pipe 1221, the second sub-pipe 1222, the third sub-pipe 1223, and the fourth sub-pipe 1224 and the first surface are equal, it can be ensured that the distance between the coolant flowing through the first sub-pipe 1221, the second sub-pipe 1222, the third sub-pipe 1223, and the fourth sub-pipe 1224 and the laser module is equal. This ensures that the heat dissipation efficiency of the coolant on the laser module is equal in any sub-pipe, improves the uniformity of heat dissipation of the laser module by the coolant in the heat dissipation channel 122, and improves the operating efficiency of the laser module.

[0046] In another embodiment, such as Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of the second embodiment of the heat dissipation channel of this application. Based on the first embodiment, the heat dissipation channel 122 provided in this embodiment further includes an additional fourth sub-pipe 1224 and an additional second sub-pipe 1222. One end of the second sub-pipe 1222 and the fourth sub-pipe 1224 is connected to the first sub-pipe 1221, and the other end is connected to the third sub-pipe 1223. Furthermore, as... Figure 3 As shown by the middle arrow, the coolant in the first sub-pipe 1221 can enter the third sub-pipe 1223 through any one or more of the second sub-pipes 1222 of the multiple fourth sub-pipes 1224. Compared with the first embodiment, this embodiment additionally sets up a sub-pipe for coolant to circulate in the middle area, so as to dissipate heat in the middle area of ​​the laser module and improve the heat dissipation efficiency of the laser module.

[0047] In other embodiments, please refer to Figure 4 , Figure 4 This is a schematic diagram of the structure of the third embodiment of the heat dissipation channel of this application. Based on the first embodiment, the heat dissipation channel 122 provided in this embodiment also includes a fifth sub-pipe 1225.

[0048] The first and second ends of the fifth sub-pipe 1225 are respectively connected to the closed loop. Specifically, the first end of the fifth sub-pipe 1225 is connected to the first sub-pipe 1221, and the second end of the fifth sub-pipe 1225 is connected to the third sub-pipe 1223. The first end of the fifth sub-pipe 1225 is located on the first side of the inlet 123, and the second end of the fifth sub-pipe 1225 is located on the second side of the outlet 124. The first side of the inlet 123 corresponds to the first side of the outlet 124, and the second side of the inlet 123 corresponds to the second side of the outlet 124.

[0049] like Figure 4As shown, the first side of the inlet 123 is the side of the inlet 123 near the fourth sub-pipe 1224, the second side of the inlet 123 is the side of the inlet 123 near the second sub-pipe 1222, the first side of the outlet 124 is the side of the outlet 124 near the fourth sub-pipe 1224, and the second side of the outlet 124 is the side of the outlet 124 near the second sub-pipe 1222.

[0050] Specifically, on the first sub-pipe 1221, the first end of the fifth sub-pipe 1225 is not connected to the inlet 123; on the third sub-pipe 1223, the second end of the fifth sub-pipe 1225 is not connected to the outlet 124. Therefore, the coolant entering through the inlet 123 can only flow along the path: “Inlet 123 - First end of first sub-pipe 1221 - First end of second sub-pipe 1222 - Second end of second sub-pipe 1222 - First end of third sub-pipe 1223 - Second end of fifth sub-pipe 1225 - First end of fifth sub-pipe 1225 - Second end of first sub-pipe 1221 - First end of fourth sub-pipe 1224 - Second end of fourth sub-pipe 1224 - Second end of third sub-pipe 1223 - Outlet 124”.

[0051] Compared to the structure of the heat dissipation channel 122 provided in the first or second embodiment, the flow of coolant in the heat dissipation channel 122 provided in this embodiment is smoother. In the first or second embodiment, since the coolant is divided into at least two parts that later merge in the pipe or at the outlet, the merging of coolant will cause a counterforce, which will damage the pipe wall of the heat dissipation channel 122 and affect the flow of coolant at the counterforce point, reducing the smoothness of coolant flow. Therefore, compared to the heat dissipation channel 122 provided in the first and second embodiments, the heat dissipation channel 122 provided in this embodiment has higher practicality, improves the smoothness of coolant flow in the heat dissipation channel 122, effectively improves the heat dissipation efficiency of the laser module, and improves the operating efficiency of the handheld laser 1.

[0052] Alternatively, please continue reading Figure 1 The handheld laser 1 provided in this embodiment also includes a focusing lens 14, which is disposed in the accommodating cavity and located on the optical axis of the semiconductor laser 12, and is used to focus the laser emitted by the semiconductor laser 12 for output.

[0053] Specifically, the laser module may include multiple laser matrices, each laser matrix emitting a laser beam. Multiple laser beams are focused by the focusing lens 14, thereby improving the quality of the laser emitted by the laser module and enhancing the practicality of the handheld laser 1.

[0054] Optionally, the handheld laser 1 also includes a protective mirror 15, which is located in the accommodating cavity, disposed on the side of the focusing mirror 14 away from the semiconductor laser 12, and located on the optical axis of the semiconductor laser 12.

[0055] After the laser is focused by the focusing lens 14, it will be emitted into the environment through the protective lens 15. At the same time, the reflected laser or ambient light is blocked, preventing stray light from entering the cavity through the protective lens 15 and damaging other optical components in the cavity, thus improving the safety of the handheld laser 1.

[0056] Optionally, the inlet channel of the handle assembly 13 is connected to the inlet pipe of the coolant supply assembly, and the outlet channel of the handle assembly 13 is connected to the outlet channel of the coolant supply assembly. The inlet channel injects coolant from the coolant supply assembly into the heat dissipation channel 122 through the inlet port 123, and the outlet channel discharges coolant from the heat dissipation channel 122 through the outlet port 124. This achieves coolant circulation in the heat dissipation channel 122, improving the heat dissipation efficiency of the laser module.

[0057] In summary, in the handheld laser 1 provided in this application embodiment, the handle assembly 13 is connected to the housing 11, providing a gripping space for the user to hold the handheld laser 1, improving the portability of the handheld laser 1 and enhancing the user's experience. Furthermore, the handle assembly 13 is provided with a liquid-flowing pipe 131, which can communicate with the heat dissipation channel 122 in the base 121 and is also connected to an external coolant supply component, enabling the flow of coolant in the heat dissipation channel 122. Simultaneously, due to the presence of the handle assembly 13, the liquid-flowing pipe 131 will not bend or fold with the movement or change of position of the handheld laser 1, eliminating the need for the user to pay attention to it during use, thus improving the user experience, enhancing the heat dissipation efficiency of the laser module inside the handheld laser 1, and improving the operating efficiency of the handheld laser 1.

[0058] This application also provides a handheld laser system (not shown), including a handheld laser 1 and a coolant supply assembly. The inlet pipe of the coolant supply assembly is connected to the inlet channel of the handheld laser 1, and the outlet pipe of the coolant supply assembly is connected to the outlet channel of the handheld laser 1, so as to supply flowing coolant to the heat dissipation channel 122 of the handheld laser 1.

[0059] Specifically, the coolant in the coolant supply assembly can enter the inlet channel through the inlet pipe, and then enter the heat dissipation channel 122 through the inlet channel and inlet 123. It flows in the sub-pipes in the heat dissipation channel 122, carrying the heat from the base 121, and then flows to the outlet 124. It is discharged through the outlet 124 into the outlet channel, and then enters the outlet pipe from the outlet channel, and then enters the coolant supply assembly, realizing the circulation of coolant in the heat dissipation channel 122, thereby improving the heat dissipation efficiency of the laser module.

[0060] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A handheld laser, characterized in that, include: The housing has a receiving cavity; A semiconductor laser, located in the accommodating cavity, is used to emit laser light; The handle assembly is connected to the housing at one end; The semiconductor laser includes a base and a laser module, with the laser module and the handle assembly respectively disposed on opposite sides of the base; The base is provided with a heat dissipation channel, and the handle assembly is provided with a liquid inlet channel and a liquid outlet channel. The liquid inlet channel is connected to the liquid inlet of the heat dissipation channel, and the liquid outlet channel is connected to the liquid outlet of the heat dissipation channel.

2. The handheld laser according to claim 1, characterized in that, The laser module is disposed on the first surface of the base, and the liquid outlet and liquid inlet of the heat dissipation channel are located on the second surface of the base. The first surface and the second surface of the base are arranged opposite to each other. The liquid inlet is disposed at one end of the second surface, and the liquid outlet is disposed at the other end of the second surface. The liquid inlet and the liquid outlet are arranged correspondingly.

3. The handheld laser according to claim 1, characterized in that, The heat dissipation channel is a closed loop, with the liquid inlet located on one side of the closed loop and the liquid outlet located on the opposite side of the closed loop.

4. The handheld laser according to claim 1, characterized in that, The handheld laser also includes a focusing lens, which is disposed in the accommodating cavity and located on the optical axis of the semiconductor laser, for focusing the laser emitted by the semiconductor laser.

5. The handheld laser according to claim 4, characterized in that, The handheld laser also includes a protective mirror, which is located in the accommodating cavity, disposed on the side of the focusing mirror away from the semiconductor laser, and located on the optical axis of the semiconductor laser.

6. The handheld laser according to claim 1, characterized in that, The inlet channel of the handle assembly is connected to the inlet pipe of the coolant supply assembly, and the outlet channel of the handle assembly is connected to the outlet channel of the coolant supply assembly. The inlet channel injects coolant from the coolant supply assembly into the heat dissipation channel through the inlet port, and the outlet channel discharges coolant from the heat dissipation channel through the outlet port.

7. A handheld laser system, characterized in that, Includes a handheld laser and a coolant supply assembly as described in any one of claims 1-6, wherein the inlet pipe of the coolant supply assembly is connected to the inlet channel of the handheld laser, and the outlet pipe of the coolant supply assembly is connected to the outlet channel of the handheld laser, so as to supply flowing coolant to the heat dissipation channel of the handheld laser.

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