Heat conduction uniform temperature plate

Abstract

The utility model relates to the technical field of temperature uniformizing plates, and discloses a heat conduction temperature uniformizing plate. A heat conduction uniform temperature plate comprises an upper cover plate, a lower cover plate and a copper layer, the periphery of the upper cover plate is provided with an upper sealing edge, a concave-convex structure is etched in an area enclosed by the upper sealing edge, the concave-convex structure comprises a plurality of convex parts and a plurality of concave parts, the convex parts are arranged at intervals, and a concave part is arranged between every two adjacent convex parts; the lower cover plate is provided with a lower sealing edge, and the upper sealing edge and the lower sealing edge are connected in a sealed mode to form a containing cavity. The copper layer is arranged in the containing cavity, supporting columns are arranged on the face, facing the upper cover plate, of the copper layer, and protruding parts are arranged on the face, facing the lower cover plate, of the copper layer. According to the heat conduction uniform temperature plate, the concave-convex structure is etched on the surface of the upper cover plate, the production cost can be reduced, the manufacturing time of the uniform temperature plate can be shortened, the surface area of the upper cover plate can be increased through the concave-convex structure, and the heat diffusion efficiency of the upper cover plate is improved.

Description

Technical Field

[0001] This utility model relates to the field of heat spreader technology, and in particular to a heat conduction heat spreader. Background Technology

[0002] Electronic devices can utilize vapor chambers (VCs) to dissipate heat from electronic components. A vapor chamber typically consists of a sealed upper and lower cover plate forming a chamber. A capillary layer is installed within the chamber, which is filled with a working medium. The working medium absorbs heat from the heat source at the evaporation end and evaporates into vapor. Under pressure difference, the vapor flows to the condensation end, releasing heat and condensing. The condensed liquid returns to the evaporation end through the capillary structure to restart the working cycle. To improve the heat dissipation efficiency of the vapor chamber, one or more layers of copper mesh are typically welded onto the surface of the upper cover plate facing the chamber. This not only increases welding costs but also extends the manufacturing time of the vapor chamber.

[0003] Therefore, there is an urgent need for a heat conduction heat spreader to solve the above-mentioned technical problems. Utility Model Content

[0004] The purpose of this invention is to propose a heat conduction heat spreader that can solve the problem of increasing welding costs and extending the manufacturing time of the heat spreader by welding one or more layers of copper mesh structure on the surface of the upper cover plate facing the cavity.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A heat conduction heat spreader, comprising,

[0007] The upper cover plate has an upper sealing edge around its perimeter. The area enclosed by the upper sealing edge is etched with a concave-convex structure. The concave-convex structure includes multiple protrusions and multiple concaves. The protrusions are strip-shaped. The multiple protrusions are arranged at intervals, and a concave is provided between two adjacent protrusions.

[0008] The lower cover plate has a lower sealing edge, and the upper sealing edge is sealed to the lower sealing edge to form a receiving cavity. A receiving part is provided in the area enclosed by the lower sealing edge. The receiving part is disposed opposite to the concave and convex structure, and there is a gap between the bottom of the receiving part and the concave and convex structure. The bottom of the receiving part forms a recessed groove.

[0009] A copper layer is disposed within the receiving cavity. Support columns are provided on the surface of the copper layer facing the upper cover plate, and protrusions are provided on the surface of the copper layer facing the lower cover plate. The protrusions match the recessed grooves and are engaged within the recessed grooves.

[0010] As an alternative, the copper layer, the support pillar, and the protrusion are formed by sintering copper powder.

[0011] As an optional solution, the copper layer is provided with a first multilayer of copper wires to improve the liquid absorption capacity of the copper layer.

[0012] As an optional solution, a second layer of copper wires is provided in the middle of the copper layer to enhance the capillary capacity of the copper layer.

[0013] As an optional solution, the distance between the two adjacent protrusions is [0.05, 0.10] mm.

[0014] As an alternative, the recess is composed of different etched points with a spacing of 0.005 mm.

[0015] As an alternative, the outer periphery of the concave-convex structure is provided with a welding area, and the upper cover plate and the lower cover plate are brazed or diffusion welded together.

[0016] As an alternative, the uneven structure is formed by galvanometer laser etching.

[0017] As an optional solution, the laser source is a blue light source, and the wavelength of the laser is 1080 nanometers.

[0018] As an optional solution, the laser power is 1000W.

[0019] This invention has at least the following beneficial effects: the concave-convex structure etched on the surface of the top cover plate can reduce production costs and shorten the production time of the heat spreader. Furthermore, the concave-convex structure can increase the surface area of ​​the top cover plate and improve its heat diffusion efficiency. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments of this utility model will be briefly introduced below.

[0021] Figure 1 A schematic diagram of a heat conduction heat spreader structure provided in an embodiment of this utility model;

[0022] Figure 2 An exploded view of a heat conduction heat spreader provided in an embodiment of this utility model;

[0023] Figure 3 Another angle view of the top cover plate provided in this embodiment of the utility model;

[0024] Figure 4 for Figure 3 Enlarged view of a portion of point A in the middle;

[0025] Figure 5 Another angle view of the lower cover plate provided in an embodiment of this utility model.

[0026] Figure label:

[0027] 1. Top cover plate; 11. Concave-convex structure; 12. Recess; 13. Convex; 2. Copper layer; 21. Support column; 22. Protrusion; 3. Bottom cover plate; 31. Receiving part; 32. Recessed groove. Detailed Implementation

[0028] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0029] In the existing technology, in order to improve the heat dissipation power of the heat exchanger, one or more layers of copper mesh structure are usually welded on the surface of the top cover plate facing the chamber. This results in higher production costs and extends the heat exchanger manufacturing time.

[0030] Therefore, such as Figures 1 to 5 As shown, an embodiment of this utility model provides a heat conduction heat spreader to solve the above-mentioned technical problems.

[0031] Specifically, a heat-conducting heat spreader includes an upper cover plate 1, a lower cover plate 3, and a copper layer 2. The upper cover plate 1 has an upper sealing edge around its perimeter. A raised / lower structure 11 is etched within the area enclosed by the upper sealing edge. The raised / lower structure 11 includes multiple protrusions 13 and multiple recesses 12. The protrusions 13 are strip-shaped, and the multiple protrusions 13 are arranged alternately. A recess 12 is provided between two adjacent protrusions 13. The raised / lower structure 11 is etched on the surface of the upper cover plate 1, which can reduce production costs, shorten the manufacturing time of the upper cover plate 1, and increase the surface area of ​​the upper cover plate 1, thereby improving the heat diffusion efficiency of the upper cover plate 1. The lower cover plate 3 has a lower sealing edge, and the upper sealing edge and the lower sealing edge are sealed together to form a containment layer. The cavity is enclosed by a lower sealing edge and a receiving part 31 is provided. The receiving part 31 is arranged opposite to the concave-convex structure 11, and there is a gap between the bottom of the receiving part 31 and the concave-convex structure 11. The bottom of the receiving part 31 forms a recessed groove 32. A copper layer 2 is provided in the receiving cavity. Multiple support columns 21 are provided on the surface of the copper layer 2 facing the upper cover plate 1. The support columns 21 are used to support the cover plate 1. The multiple support columns 21 are spaced apart, which is conducive to the return of condensed liquid to the lower cover plate 3. A protrusion 22 is provided on the surface of the copper layer 2 facing the lower cover plate 3. The protrusion 22 matches the recessed groove 32. The protrusion 22 is engaged in the recessed groove 32, and the recessed groove 32 can fix the protrusion 22.

[0032] In some embodiments, in order to reduce production costs and facilitate the assembly of the upper cover plate 1, lower cover plate 3 and copper layer 2 in the receiving part 31, the copper layer 2, support column 21 and protrusion 22 are integrally formed by sintering copper powder, so that the assembly can be completed simply by placing the copper layer 2 in the receiving part 31.

[0033] In some embodiments, the copper layer 2 is provided with a first multilayer copper wire, which is sintered in copper powder to improve the liquid absorption capacity of the copper layer 2.

[0034] In some embodiments, in order to enhance the capillary capacity of the copper layer 2, a second multilayer copper wire is provided at the middle position within the copper layer 2.

[0035] In some embodiments, the distance between two adjacent protrusions 13 is [0.05, 0.10] mm, which makes it convenient to make a recess 12 between the two adjacent protrusions 13 and has a better heat dissipation effect.

[0036] In some embodiments, the recess 12 is composed of different etched points with a spacing of 0.005 mm. More etched points can further increase the surface area of ​​the upper cover plate 1, thereby improving the heat dissipation efficiency of the cover plate 1.

[0037] In some embodiments, in order to connect the upper cover plate 1 and the lower cover plate 3 as a whole, a welding area is provided on the outer periphery of the concave-convex structure 11, and the upper cover plate 1 and the lower cover plate 3 are brazed or diffusion welded together.

[0038] In some embodiments, since the galvanometer laser has high intensity and good stability, the concave-convex structure 11 is preferably formed by galvanometer laser scanning.

[0039] In some embodiments, for ease of maintenance of the laser, the laser light source is preferably a blue light source, and the laser wavelength is preferably 1080 nanometers.

[0040] In some embodiments, the cover plate 1 is made of copper, and to obtain a better concave-convex structure 11, the laser power is preferably 1000W.

[0041] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A heat-conducting heat spreader, characterized in that, include, The upper cover plate (1) has an upper sealing edge around its perimeter. The area enclosed by the upper sealing edge is etched with a concave-convex structure (11). The concave-convex structure (11) includes multiple protrusions (13) and multiple recesses (12). The protrusions (13) are strip-shaped. The multiple protrusions (13) are arranged at intervals. A recess (12) is provided between two adjacent protrusions (13). The lower cover plate (3) is provided with a lower sealing edge. The upper sealing edge and the lower sealing edge are sealed together to form a receiving cavity. A receiving part (31) is provided in the area enclosed by the lower sealing edge. The receiving part (31) is arranged opposite to the concave-convex structure (11), and there is a gap between the bottom of the receiving part (31) and the concave-convex structure (11). A recessed groove (32) is formed at the bottom of the receiving part (31). A copper layer (2) is disposed in the cavity. A support column (21) is provided on the surface of the copper layer (2) facing the upper cover plate (1). A protrusion (22) is provided on the surface of the copper layer (2) facing the lower cover plate (3). The protrusion (22) matches the recessed groove (32) and is engaged in the recessed groove (32).

2. The heat conduction heat spreader according to claim 1, characterized in that, The copper layer (2), the support column (21), and the protrusion (22) are formed by sintering copper powder into one piece.

3. The heat conduction heat spreader according to claim 1, characterized in that, The copper layer (2) is provided with a first multilayer copper wire to improve the liquid absorption capacity of the copper layer (2).

4. The heat conduction temperature distribution plate according to claim 3, characterized in that, The copper layer (2) has a second layer of copper wires in the middle position to enhance the capillary capacity of the copper layer (2).

5. The heat conduction temperature distribution plate according to claim 1, characterized in that, The distance between the two adjacent protrusions (13) is [0.05, 0.10] mm.

6. The heat conduction temperature distribution plate according to claim 1, characterized in that, The recess (12) is composed of different etch points with a spacing of 0.005 mm.

7. The heat conduction heat spreader according to any one of claims 1-6, characterized in that, The outer periphery of the concave-convex structure (11) is provided with a welding area, and the upper cover plate (1) and the lower cover plate (3) are brazed or diffused welded together.

8. The heat conduction heat spreader according to any one of claims 1-6, characterized in that, The concave-convex structure (11) is formed by galvanometer laser etching.

9. The heat conduction temperature distribution plate according to claim 8, characterized in that, The laser source is a blue light source, and the wavelength of the laser is 1080 nanometers.

10. The heat conduction temperature distribution plate according to claim 8, characterized in that, The power of the laser is 1000W.

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