Laser fuse device

Abstract

The utility model provides a laser fuse device, the laser fuse device comprises a laser assembly and a wire transmission assembly, the laser assembly comprises a plurality of laser chips and an optical element assembly used for focusing laser output by the laser chips to a target focus; and the wire conveying assembly is used for conveying the to-be-fused wire to the target focus. According to the scheme, the multiple laser chips are arranged to emit laser, the laser emitted by the laser chips is processed and focused to the target focus through the optical element assembly, laser focusing is achieved, and meanwhile the wire with the fuse is transmitted to the target focus through the wire transmission assembly. That is to say, fuse processing is performed on the wire located at the target focus through the laser focused at the target focus, the fuse control accuracy is ensured, the scheme of performing laser transmission depending on an optical fiber in the traditional technical scheme is abandoned, and the movement flexibility of the laser fuse device is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser, in particular to a laser fusing device. BACKGROUND

[0002] With the development of laser technology, the application field of laser is gradually extensive, including laser welding, laser lighting, laser printing and the like. In the application of laser printing, generally, the laser fusing device is used to fuse the wire material to be fused, so that the wire material is melted and falls into the molten pool to realize additive printing. In this process, the laser fusing device needs to move according to different printing requirements. In the related art, the fiber is generally used to introduce external laser to fuse the wire material to be fused. However, this scheme depends on the fiber for laser transmission, and the setting of the fiber limits the movement of the laser fusing device, resulting in reduced mobility of the laser fusing device. CONTENT OF THE UTILITY MODEL

[0003] The present application provides a laser fusing device, which aims to solve the technical problem that the setting of the fiber limits the movement of the laser fusing device, resulting in reduced mobility of the laser fusing device in the prior art.

[0004] A laser fusing device comprises:

[0005] A housing comprising a mounting groove and a plurality of mounting cavities arranged around the mounting groove, wherein each of the mounting cavities is provided with a laser outlet, and the groove bottom of the mounting groove is provided with a wire material transmission channel;

[0006] A plurality of laser assemblies arranged in the mounting cavities, wherein each of the laser assemblies comprises a laser chip and an optical element assembly, and the optical element assembly is used to output and focus the laser output by the laser chip from the laser outlet to a target focal point;

[0007] A wire material transmission assembly arranged in the mounting groove and used to transmit the wire material to be fused to the target focal point through the wire material transmission channel.

[0008] Preferably, the wire material transmission assembly comprises a wire material transmission channel, and the target focal point is located on the wire material transmission channel.

[0009] At least two of the laser assemblies are arranged around the periphery of the wire material transmission channel, and the laser assemblies are arranged symmetrically about an axis, wherein the axis of symmetry of the laser assemblies is an axis corresponding to the wire material output direction and the target focal point.

[0010] Preferably, the wire material transmission channel is provided with an extension head, and the extension head is arranged axially in correspondence with the wire material output direction, and is used to transmit the wire material to be fused to different target focal points.

[0011] Preferably, the optical element assembly comprises:

[0012] a first lens group arranged on one side of each of the laser chips for processing and outputting the laser light output by the laser chips;

[0013] a second lens group for adjusting the output angle of the laser light output by the first lens group so as to focus the laser light to the target focal point.

[0014] Preferably, the first lens group comprises:

[0015] a plurality of collimating lenses, each of which corresponds to one of the laser chips, each of the collimating lenses being arranged on the light output side of the corresponding laser chip for collimating and outputting the laser light output by the corresponding laser chip;

[0016] a plurality of first mirrors, each of which corresponds to one of the collimating lenses, each of the first mirrors being arranged on the light output side of the corresponding collimating lens for reflecting the laser light output by the corresponding collimating lens;

[0017] a half-wave plate arranged on the light output side of each of the first mirrors for adjusting the polarization state of the laser light output by the first mirrors and outputting the laser light.

[0018] Preferably, the second lens group comprises:

[0019] a second mirror arranged on the output surface of the first lens group;

[0020] a galvanometer arranged on the side of the reflection surface of the second mirror;

[0021] the second mirror is used to output the laser light output by the first lens group from the reflection surface, and the galvanometer is used to adjust the output angle of the laser light output from the reflection surface of the second mirror so as to focus the laser light to the target focal point.

[0022] Preferably, the second mirror further comprises a transmission layer for transmitting part of the laser light output by the first lens group from the transmission layer;

[0023] The laser assembly further comprises a detection element arranged on one side of the transmission layer for detecting the laser parameter of the laser light output by the transmission layer.

[0024] Preferably, the shell is provided with a conical output head, a space is arranged in the conical output head, a heat insulation coating is arranged on the inner wall of the space in the conical output head, so as to avoid the exposure of laser to air for melting the fuse, thereby improving the efficiency of melting the fuse and the utilization rate of heat.

[0025] The application has the following beneficial effects: the laser assembly and the wire transmission assembly are arranged, the laser assembly includes a plurality of laser chips and an optical element assembly for focusing the laser emitted by the laser chips to a target focal point, and the wire transmission assembly is arranged to transmit the wire to be fused to the target focal point. The scheme emits laser through the plurality of laser chips, processes and focuses the laser emitted by the laser chips to the target focal point through the optical element assembly, realizes laser focusing, and transmits the wire to be fused to the target focal point through the wire transmission assembly, that is, the wire located at the target focal point is fused by the laser focused on the target focal point, so as to ensure the accuracy of the fusion control, abandon the scheme of relying on an optical fiber to transmit laser in the traditional technical scheme, and improve the flexibility of the movement of the laser fusion equipment. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0027] Figure 1 is one of the structural schematic diagrams of the laser fusion equipment provided in the embodiments of the application;

[0028] Figure 2 is one of the structural schematic diagrams of the laser fusion equipment provided in the embodiments of the application;

[0029] Figure 3 is one of the structural schematic diagrams of the laser assembly in the laser fusion equipment provided in the embodiments of the application;

[0030] Figure 4 is one of the structural schematic diagrams of the arrangement of the laser assembly in the laser fusion equipment provided in the embodiments of the application;

[0031] Figure 5 is the structural schematic diagram of the shell in the laser fusion equipment provided in the embodiments of the application.

[0032] In the drawings:

[0033] 1. Laser assembly, 10, laser chip, 110, fast axis collimation lens, 111, slow axis collimation lens, 112, first mirror, 113, half wave plate, 114, second mirror, 115, galvanometer, 2, wire transmission assembly, 20, wire transmission channel, 200, telescopic head, 3, wire, 4, target focal point, 5, housing, 50, mounting cavity, 500, step, 501, laser outlet, 51, mounting groove, 52, conical output head, 6, laser beam, 7, detection element. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0035] In the description of the present application, it should be understood that the terms "center", "thickness", "upper", "lower", "front", "rear", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0036] In the embodiments of the present application, the association relationship between the associated objects described by "and / or" indicates that there can be three relationships, for example, A and / or B can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / ", unless otherwise specified, generally represents a "or" relationship between the associated objects before and after it.

[0037] In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration." Any implementation described as "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations. The following description is presented to enable any person skilled in the art to make and use the application. Details are set forth in the following description for purpose of explanation. It should be appreciated that one of ordinary skill in the art will readily recognize that the application can be practiced without the use of these specific details. In other instances, well-known structures and processes have not been described in detail in order to avoid obscuring the description of the application. Thus, the present application is not intended to be limited by the embodiments shown, but is to be accorded with the widest scope consistent with the principles and features disclosed.

[0038] Specifically, referring to Figures 1-3 As shown, the laser fusing device comprises a housing 5, and a laser assembly 1 and a wire transmission assembly 2 arranged in the housing 5, wherein the laser assembly 1 comprises a plurality of laser assemblies 1, each of which outputs a laser beam, the laser beams output by the laser assemblies 1 are focused on a target focal point 4, and the wire transmission assembly 2 comprises a cylindrical wire transmission channel 20, and the target focal point 4 is located on the wire transmission channel 20, that is, the wire to be fused 3 is arranged on the wire transmission channel 20 of the wire transmission assembly 2, and the driving mechanism of the wire transmission assembly 2 controls the axial transmission of the wire 3 in the wire transmission channel 20 to transmit the wire 3 to the target focal point 4, while the light beams output by the laser assemblies 1 are focused on the target focal point 4, and the wire 3 transmitted to the target focal point 4 is fused, and the housing 5 is provided with a discharge port corresponding to the target focal point 4, which is used to output the wire 3 after being fused at the target focal point 4 from the discharge port.

[0039] Specifically, the laser assembly 1 comprises a laser chip 10 and an optical element assembly for focusing the laser emitted by the laser chip 10 to the target focal point 4. In this scheme, the laser chip 10 emits laser, and the optical element assembly adjusts the laser emitted by the laser chip 10 to focus the laser to the target focal point 4.

[0040] In the embodiments of the present application, one laser assembly 1 emits one laser beam, but in some other embodiments of the present application, one laser assembly 1 can also emit multiple laser beams or different wavelengths of laser beams, which are not limited in the present application.

[0041] Preferably, a plurality of laser chips 10 can be arranged in one laser assembly 1 to meet different laser energy requirements and increase the flexibility of laser energy adjustment of the laser assembly 1.

[0042] It can be understood that the purpose of the wire transmission channel 20 is to transmit the wire to be melted 3 to the target focal point 4, that is, the wire transmission channel 20 meets the coaxial arrangement of the wire output direction and the target focal point 4, that is, the wire to be melted 3 can be transmitted to the target focal point 4. Exemplarily, the wire transmission channel 20 can also be prismatic or curved channel shape, which can be designed according to the structure of the wire to be melted 3.

[0043] Preferably, the wire transmission assembly 2 comprises a wire transmission channel 20 and a driving mechanism for driving the wire 3 to transmit in the wire transmission channel 20. Exemplarily, the driving mechanism can be a driving motor, a wire conveying guide rail, etc.

[0044] Preferably, the wire transmission channel 20 is a wire conveying guide rail.

[0045] Preferably, the optical element assembly comprises a plurality of mirrors for adjusting the output angle of the laser. Each mirror can set different inclination angles and adjust the transmission direction of the laser according to different focusing requirements (i.e. the position of the target focal point 4), so as to output the laser to the target focal point 4.

[0046] Preferably, the optical element assembly can also be provided with a galvanometer 115 for flexibly adjusting the output angle of the laser output to the target focal point 4 to meet different focusing requirements and improve the use flexibility of the laser wire melting device.

[0047] Specifically, referring to Figure 1 and Figure 2 , the laser assembly 1 is provided with six, which are arranged around the wire transmission channel 20, and the laser assembly 1 is arranged in axial symmetry. That is, it can be understood that the light beams output by the laser assembly 1 are arranged around the outer surface of the wire to be melted 3, which can ensure that the wire to be melted 3 is uniformly heated and avoid clumping due to uneven heating of the melted wire 3.

[0048] It can be understood that the number of the laser assembly 1 is multiple, and the laser beams 6 emitted by each laser assembly 1 have the same spacing, which aims to ensure that the laser emitted by the laser assembly 1 can continuously and uniformly act on the wire 3 around, and avoid uneven heating caused by the gap of the laser spot around the wire 3. The specific number is not limited in the application.

[0049] Specifically, the target focal point 4 is a fixed position, and the laser assembly 1 adjusts the angle of different wavelengths through the optical element group to focus different wavelengths to the target focal point 4.

[0050] Preferably, the setting position of the optical element assembly in the laser assembly 1 is fixed, that is, it can be understood that when the laser chip 10 outputs different wavelengths, the target focal point 4 will also fall on different positions on the axis, at this time, by setting the telescopic head 200 with telescopic function, the telescopic movement of the telescopic head 200 on the axis corresponding to the target focal point 4 is controlled, so as to ensure that the wire material 3 can be transmitted to different focal point positions and the accurate positioning of the wire material 3 is ensured, so as to avoid the shaking of the wire material 3 from the wire material transmission channel 20 to the target focal point 4 without positioning, which deviates from the target focal point 4, thereby affecting the quality of laser wire melting.

[0051] It can be understood that the wire material 3 used for laser wire melting is generally small in diameter, and if the distance between the output port of the wire material transmission channel 20 and the target focal point 4 is too large, it may cause the wire material 3 to shake.

[0052] It can be further understood that the wire material 3 is output from the output port of the telescopic head 200, that is, the output port of the wire material transmission channel 20.

[0053] Preferably, the wire material transmission channel 20 can also be set to move axially as a whole to adjust the distance between the output port and the target focal point 4, so as to realize the position adjustment of the output port.

[0054] It can be understood that the position adjustment of the output port can be realized by setting a moving drive.

[0055] Preferably, a preset distance can be set between the output port of the telescopic head 200 and the target focal point 4, and the telescopic movement of the telescopic head 200 is controlled according to the preset distance.

[0056] Preferably, the preset distance can be set according to the hardness of the wire material 3, and the preset distance is proportional to the hardness of the wire material 3.

[0057] Preferably, the laser wire melting device further comprises a laser printer, and specifically, the laser printer can be arranged in the shell 5 or arranged outside the shell 5, and the laser printer and each laser chip 10 are signal connected, so as to realize the control of the laser output of the laser chip 10.

[0058] Preferably, referring to Figure 3 , the laser wire melting device further comprises a laser parameter detection element 7, and the laser printer controls the output of each laser assembly 1 by acquiring the laser parameters detected by the laser parameter detection element 7, such as controlling the output wavelength, output power, output energy, etc.

[0059] Specifically, the laser parameter detection element 7 is not specifically limited in the present application, and examples include, but are not limited to, a photodetector, a power detector, etc. By installing the photodetector or power detector on the output side of each laser assembly 1, the laser parameters of the laser assembly 1 can be detected, i.e., the laser parameters include, but are not limited to, laser power, laser wavelength, laser energy, etc.

[0060] Specifically, referring to Figure 2 , the laser printer further comprises a retractable retractable head 200, and a drive for controlling the drive mechanism in the laser fuse device. The laser printer can be a control chip, a microprocessor, etc.

[0061] Preferably, the present application also provides an embodiment of an optical element assembly, specifically, the optical element assembly comprises: a first lens group, the first lens group is arranged on one side of each of the laser chips 10, for processing and outputting the laser output by the laser chips 10; a second lens group, the second lens group is used for adjusting the output angle of the laser output by the first lens group, so as to focus the laser to the target focal point 4.

[0062] Specifically, referring to Figure 4 , the first lens group comprises a plurality of collimating lenses, wherein the collimating lenses comprise slow-axis collimating lenses 111 and fast-axis collimating lenses 110; specifically, the number of collimating lenses corresponds to the number of laser chips 10, so that each collimating lens corresponds to each laser chip 10 one by one, and each collimating lens is arranged on the light output side of the corresponding laser chip 10, to ensure that the light output by one laser chip 10 is processed by slow-axis collimation and fast-axis collimation, and the collimated laser is output.

[0063] Specifically, referring to Figure 4 , the first lens group further comprises a plurality of first mirrors 112; wherein the first mirrors 112 are total reflection mirrors, and are arranged on the light output side of each collimating lens; the first mirrors 112 correspond to each collimating lens one by one, and are used for adjusting the optical path of the laser output by the collimating lens.

[0064] Specifically, in the embodiment of the present application, the optical path adjustment of each first mirror 112 makes the laser output by each laser chip 10 located in the same optical path, avoiding the generation of multiple light beams.

[0065] Preferably, in the embodiment of the present application, a focusing lens can also be provided to focus the laser output by each laser chip 10, which is not specifically limited in the present application.

[0066] Specifically, referring to Figure 4The first lens group further comprises a half-wave plate 113 arranged on the light output side of each first mirror 112 for adjusting the polarization state of the laser output by the first mirror 112 and outputting.

[0067] It can be understood that the first mirror 112 has adjusted the lasers to the same optical path, and at this time, the laser output by the first mirror 112 is adjusted in polarization state and then output by arranging a half-wave plate 113 on the light output side of the first mirror 112, that is, the output of the half-wave plate 113 is the output of the first lens group.

[0068] For example, referring to Figure 4 One laser chip 10 corresponds to one slow-axis collimation lens 111 and one fast-axis collimation lens 110, and the laser chip 10, the slow-axis collimation lens 111 and the fast-axis collimation lens 110 are arranged in sequence. The laser output by the laser chip 10 is subjected to slow-axis collimation processing by the slow-axis collimation lens 111, and then subjected to fast-axis collimation processing by the fast-axis collimation lens 110, and then enters the first mirror 112 for optical path adjustment so that the optical paths of the lasers of the laser chips 10 are the same, and further, the laser enters the half-wave plate 113 for polarization state adjustment and output.

[0069] It can be understood that the arrangement sequence of the slow-axis collimation lens 111 and the fast-axis collimation lens 110 in the optical path is not specifically limited in the present application.

[0070] Preferably, the second lens group comprises a galvanometer 115 arranged on the light output side of the first lens output laser for adjusting the output angle of the laser output by the first lens group so that the laser is focused to the target focal point 4.

[0071] Preferably, the second lens group comprises a second mirror 114, and by arranging the second mirror 114 to have a fixed angle, the output of the laser to the target focal point 4 is ensured.

[0072] For example, referring to Figure 4 The second lens group further comprises a second mirror 114 arranged on the output side of the first lens group, that is, the output side of the half-wave plate 113 in the present embodiment. Specifically, the laser output by the first lens group passes through the second mirror 114, most of which is output from the reflecting surface of the second mirror 114, and a small part is output from the transmitting surface of the second mirror 114, and a detection element 7 arranged on one side of the transmitting surface detects the laser parameter of the laser and sends the laser parameter to the laser printer.

[0073] Specifically, the second mirror 114 is provided with a transmission layer, so that the second mirror 114 has a transmission function, and the amount of transmitted laser light of the projection surface can be controlled by setting the thickness of the material layer.

[0074] Specifically, the laser printer determines the laser parameter output by the laser assembly 1 according to the transmittance and the detected laser parameter, and further controls the output power of the laser chip 10 according to the laser parameter.

[0075] Preferably, in some embodiments, the galvanometer 115 can be replaced by a mirror, and the mirror is set to a fixed angle to ensure that the laser is output to the target focal point 4.

[0076] Specifically, referring to Figure 5 The shell 5 also includes a plurality of mounting cavities 50, and each of the mounting cavities 50 is mounted with one laser assembly 1, wherein the mounting cavities 50 corresponding to the laser emission direction of the laser assembly 1 are provided with a laser outlet 501.

[0077] Preferably, the mounting cavities 50 are respectively provided with a detachable cover plate, and when the cover plate is closed on the shell 5, the mounting cavities 50 are formed, so as to facilitate the installation and adjustment of the laser assembly 1.

[0078] Preferably, the part of the shell 5 corresponding to the mounting cavities 50 can be a detachable part.

[0079] Specifically, referring to Figure 5 In the embodiment of the present application, the shell 5 further includes a mounting groove 51, and the wire transmission assembly 2 is partially embedded in the mounting groove 51, wherein the mounting groove 51 includes a groove bottom and a groove wall, and the groove bottom of the mounting groove 51 is provided with a wire 3 transmission port for outputting the wire 3 from the groove bottom of the mounting groove 51, and the mounting cavities 50 for installing the laser assembly 1 are arranged around the groove wall of the mounting groove 51, so that the wire 3 is located at the center of the laser focal point.

[0080] Preferably, the telescopic head 200 of the wire transmission assembly 2 can be telescopic in the wire 3 transmission port.

[0081] Preferably, referring to Figure 1 and Figure 2 The shell 5 further includes a conical output head 52, and the conical output head 52 is provided with a space for avoiding the laser beam 6 output by each of the laser assemblies 1 and the wire 3 transmitted by the wire transmission assembly 2.

[0082] Preferably, the output head can be detachably connected.

[0083] Preferably, the inner wall of the avoidance space of the conical output head 52 is provided with a heat insulation coating.

[0084] The present application sets the conical output head 52 to avoid the exposure of laser to air for melting the fuse, so as to improve the efficiency of melting the fuse and the utilization rate of heat.

[0085] Specifically, referring to Figures 3-5 The laser assembly 1 is arranged in the shell 5, and the shell 5 is provided with a first accommodating cavity corresponding to each laser assembly 1, wherein the first accommodating cavity is internally provided with a plurality of steps 500, and each step 500 is correspondingly provided with a chip and a lens group. One lens group includes a fast-axis collimating lens 110, a slow-axis collimating lens 111 and a first reflector 112. By arranging the steps 500, the laser interference is avoided.

[0086] The above describes in detail the laser fuse device provided by the embodiment of the present application. The specific examples are applied to describe the principle and implementation mode of the present application. The above embodiment is only used to help understand the method and core idea of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range can be changed. In conclusion, the content of the specification should not be understood as the limitation of the present application.

Claims

1. A laser fuse apparatus, characterized by, The laser wire melting device comprises a shell, a plurality of installation cavities arranged around the installation groove, and a plurality of laser assemblies arranged in the installation cavities. The laser wire melting device further comprises a wire transmission assembly arranged in the installation groove and configured to transmit the wire to be melted to the target focus point through the wire transmission channel. The target focus point is located on the wire transmission channel.

3. The laser wire melting device according to claim 1, wherein the wire transmission channel is provided with an extension head arranged axially corresponding to the wire output direction, and the extension head is configured to transmit the wire to be melted to different target focus points.

2. The laser fuse apparatus of claim 1, wherein, The optical element assembly comprises a first lens group arranged on one side of each laser chip and configured to process and output the laser output by the laser chip, and a second lens group configured to adjust the output angle of the laser output by the first lens group so as to focus the laser to the target focus point. The first lens group comprises a plurality of collimating lenses each corresponding to one of the laser chips and arranged on the light output side of the corresponding laser chip, a plurality of first mirrors each corresponding to one of the collimating lenses and arranged on the light output side of the corresponding collimating lens, and a half-wave plate arranged on the light output side of each first mirror and configured to adjust the polarization state of the laser output by the first mirror. The second lens group comprises a second mirror arranged on the output surface of the first lens group, and a galvanometer mirror arranged on one side of the reflection surface of the second mirror.

4. The laser fuse apparatus of claim 1, wherein, The second mirror is configured to output the laser output by the first lens group from the reflection surface, and the galvanometer mirror is configured to adjust the output angle of the laser output by the second mirror from the reflection surface so as to focus the laser to the target focus point. The second mirror further comprises a transmission layer configured to transmit part of the laser output by the first lens group from the transmission layer. The laser assembly further comprises a detection element arranged on one side of the transmission layer and configured to detect the laser parameter of the laser output by the transmission layer.

5. The laser fuse apparatus of claim 4, wherein, The shell is provided with a conical output head, the conical output head is provided with a space for avoiding the wire, and the inner wall of the space for avoiding the wire is provided with a heat insulation coating. ​ ​ ​ 6. The laser fuse apparatus of claim 4, wherein, ​ ​ ​ ​ 7. The laser fuse apparatus of claim 6, wherein, ​ ​ 8. The laser fuse apparatus of claim 1, wherein, ​

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