Frame body structure for semiconductor wafer box carrying and air storage equipment
By introducing slide rails and drive mechanisms into the air storage device, multi-axis movement of the grippers and placement of the plate as an air storage position are achieved, solving the problems of low wafer box handling efficiency and high debugging difficulty in the existing technology, and improving handling efficiency and scheduling flexibility.
Patent Information
- Application Number
- CN202423282871.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing overhead conveyor systems suffer from low efficiency and high debugging difficulty during wafer cassette handling, especially when wafer cassettes cannot be immediately gripped while processing is still in progress, and the inability of the grippers to move laterally results in high requirements for alignment of loading and unloading ports.
A frame structure including a vertical support frame, slide rails and a drive mechanism was designed. The slide rails and drive mechanism enable the grippers to move along the x, y and z axes. Combined with the placement plate as an air storage position, the conversion efficiency and scheduling flexibility of the wafer cell are improved.
This improves the conversion efficiency of wafer cassettes between air storage and processing positions, reduces debugging difficulty, and enables more efficient wafer cassette handling and storage.
Smart Images
Figure CN223560510U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of semiconductor technology, specifically say is used for semiconductor wafer box handling and the frame structure of aerial storage equipment. BACKGROUND
[0002] With the increasing integration of semiconductor chips, the production scale is continuously expanding, and the speed, accuracy and reliability of material transportation are increasingly strict.
[0003] The existing aerial running type transfer car contains the support frame and the jaw group moving along the vertical direction, and the aerial running type transfer car generally has the following problems: during the handling process of the wafer box from the equipment to the aerial storage equipment, if the processing position is still processing, the rail car needs to wait for the processing to be completed after reaching, and the jaw can only clamp the wafer box to the processing position, so the work efficiency is low, and the scheduling flexibility is poor; in addition, the jaw of the aerial running type transfer car cannot move horizontally, and the loading and unloading port on the equipment must be aligned, so the on-site debugging difficulty is large. UTILITY MODEL CONTENTS
[0004] The utility model discloses a frame structure for semiconductor wafer box handling and aerial storage equipment to solve the problems in the prior art, the device improves the wafer box in the aerial storage position and the wafer box is placed to the conversion efficiency between processing position, realizes scheduling flexibility, and reduces the debugging difficulty.
[0005] To solve the above problems, the following technical scheme is provided:
[0006] The utility model discloses a frame structure for semiconductor wafer box handling and aerial storage equipment, including the support frame of vertical arrangement, the inner wall surface on both sides of support frame is fixedly connected with the first sliding rail and second sliding rail of horizontal arrangement, first sliding rail and second sliding rail are parallel and side arrangement and along the length direction arrangement of support frame, first sliding rail and second sliding rail all are provided with sliding plate, sliding plate and first sliding rail and second sliding rail are slidingly matched, two sliding plates are fixedly provided with the third sliding rail and fourth sliding rail of horizontal arrangement, third sliding rail and fourth sliding rail all with first sliding rail and second sliding rail are perpendicular, and third sliding rail and fourth sliding rail along the width direction arrangement of support frame, installation plate is slidably connected between third sliding rail and fourth sliding rail, first sliding rail and second sliding rail all are provided with first drive mechanism and second drive mechanism for driving sliding plate moves along the length direction of support frame, third sliding rail is provided with third drive mechanism for driving installation plate moves along the width direction of support frame, the inner wall surface on the lower end of support frame is provided with a plurality of placement plates for placing wafer box.
[0007] The wafer box clamped by the clamping jaw can be placed on the placement plate, that is, the in-air storage position, thereby solving the problem of no in-air storage position for the wafer box, the first sliding rail and the second sliding rail are arranged to drive the clamping jaw to move along the x-axis direction, the third sliding rail and the fourth sliding rail are arranged to drive the clamping jaw to move along the y-axis direction, when the wafer box is processed on the processing position, the wafer box can be placed on the in-air storage position by driving the clamping jaw, thereby improving the conversion efficiency of the wafer box between the in-air storage position and the processing position, improving the scheduling flexibility, and reducing the debugging difficulty.
[0008] The first driving mechanism comprises a first motor, a first driving wheel, a first driven wheel and a first belt, the first driving wheel and the first driven wheel are respectively located at two ends of the first track, the first belt is sleeved on the outer end faces of the first driving wheel and the first driven wheel, the sliding plate is arranged in a U shape, the lower end of the U-shaped horizontal part of the sliding plate is fixedly connected with a sliding block matched with the first track, the upper end of the U-shaped horizontal part of the sliding plate is provided with a lower pressing block, the upper end of the U-shaped horizontal part of the sliding plate is provided with an upper pressing block matched with the lower pressing block, the lower pressing block and the upper pressing block press the first belt, the lower pressing block, the upper pressing block and the first belt are fixedly matched, and the second driving mechanism is identical in structure with the first driving mechanism.
[0009] The first motor is started, the first driving wheel is driven to rotate by the first motor, the first driven wheel is driven to rotate by the first belt, and the sliding block is driven to move along the x-axis direction in the rotating process of the first belt.
[0010] The third driving mechanism is identical in structure with the first driving mechanism.
[0011] The motor in the third driving mechanism is started, and the mounting plate is driven to move along the x-axis direction.
[0012] A plurality of placement plates are fixedly connected to form a group of placement plates, the placement plates are provided in two groups, the two groups of placement plates are fixedly installed on the support frame, and the two groups of placement plates are located on the two sides of the mounting plate.
[0013] The above scheme effectively solves the problem of placing the wafer box by arranging the placement plates on the two sides of the mounting plate.
[0014] The mounting plate is provided below the clamping jaw, and the mounting plate is provided with a rotating mechanism for driving the clamping jaw to move along the vertical direction.
[0015] The clamping jaw is used for clamping the wafer box, and the rotating mechanism can drive the clamping jaw to move along the z-axis direction.
[0016] The lengths of the first slide rail and the second slide rail are equal to the length of the support frame, and the lengths of the third slide rail and the fourth slide rail are equal to the width of the support frame.
[0017] With the above scheme, the following advantages are achieved:
[0018] The first driving mechanism, the second driving mechanism, the third driving mechanism and the rotating mechanism are arranged on the frame structure for the semiconductor wafer box carrying and aerial storage equipment, and are used for driving the clamping jaw to move along the x-axis, the y-axis and the z-axis directions. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to make the content of the utility model more easily be clearly understood, the following is according to the specific embodiment of the utility model and combines the drawings, and the application is further detailed, wherein:
[0020] Figure 1 It is the structure schematic view of the frame structure for semiconductor wafer box carrying and aerial storage equipment;
[0021] Figure 2 It is the front view of the frame structure for semiconductor wafer box carrying and aerial storage equipment;
[0022] Figure 3 It is the structure schematic view of another view in the frame structure for semiconductor wafer box carrying and aerial storage equipment;
[0023] Figure 4 It is the top view of the frame structure for semiconductor wafer box carrying and aerial storage equipment;
[0024] Figure 5 It is the enlarged schematic view of A part in the frame structure for semiconductor wafer box carrying and aerial storage equipment;
[0025] Figure 6 It is the enlarged schematic view of B part in the frame structure for semiconductor wafer box carrying and aerial storage equipment;
[0026] Figure 7 It is the structure schematic view of the first driving mechanism in the frame structure for semiconductor wafer box carrying and aerial storage equipment;
[0027] Reference numerals are explained as follows: 1, support frame; 2, first sliding rail; 3, second sliding rail; 4, sliding plate; 5, third sliding rail; 6, fourth sliding rail; 7, mounting plate; 8, first driving mechanism; 9, second driving mechanism; 10, third driving mechanism; 11, wafer box; 12, placing plate; 13, first motor; 14, first driving wheel; 15, first driven wheel; 16, first belt; 17, lower pressing block; 18, upper pressing block; 19, clamping jaw; 20, rotating mechanism. DETAILED DESCRIPTION
[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.
[0029] In the specific embodiment 1, as shown in the drawings, Figures 1-3 The frame structure of the utility model for semiconductor wafer box carrying and air storage equipment includes the support frame 1 arranged vertically, the first sliding rail 2 and the second sliding rail 3 horizontally arranged and fixedly connected on the inner wall surface of both sides of the support frame 1, the first sliding rail 2 and the second sliding rail 3 are arranged in parallel and side by side and along the length direction of the support frame 1; the sliding plate 4 is arranged on the first sliding rail 2 and the second sliding rail 3, the sliding plate 4 is slidably matched with the first sliding rail 2 and the second sliding rail 3, the third sliding rail 5 and the fourth sliding rail 6 horizontally arranged are fixedly arranged on the two sliding plates 4, the third sliding rail 5 and the fourth sliding rail 6 are perpendicular to the first sliding rail 2 and the second sliding rail 3, and the third sliding rail 5 and the fourth sliding rail 6 are arranged along the width direction of the support frame 1; the length of the first sliding rail 2 and the second sliding rail 3 is equal to the length of the support frame 1, and the length of the third sliding rail 5 and the fourth sliding rail 6 is equal to the width of the support frame 1.
[0030] As shown in the drawings, Figure 1 , 7 The first driving mechanism 8 and the second driving mechanism 9 for driving the sliding plate 4 to move along the length direction of the support frame 1 are arranged on the first sliding rail 2 and the second sliding rail 3, the first driving mechanism 8 includes the first motor 13, the first driving wheel 14, the first driven wheel 15 and the first belt 16, the first driving wheel 14 and the first driven wheel 15 are respectively located at both ends of the first track, the first belt 16 is sleeved on the outer end faces of the first driving wheel 14 and the first driven wheel 15, as Figure 5 , 6As shown, the sliding plate 4 is arranged in a U shape, the lower end of the U-shaped horizontal part of the sliding plate 4 is fixedly connected with a sliding block matched with the first track, the upper end of the U-shaped horizontal part of the sliding plate 4 is provided with a lower pressing block 17, the upper part of the first belt 16 above the lower pressing block 17 is provided with an upper pressing block 18 matched with the lower pressing block 17, the lower pressing block 17 and the upper pressing block 18 press the first belt 16, and the lower pressing block 17, the upper pressing block 18 and the first belt 16 are fixedly matched; the second driving mechanism 9 is identical in structure with the first driving mechanism 8, and the second driving mechanism 9 comprises a second motor, a second driving wheel, a second driven wheel and a second belt.
[0031] As shown in Figure 4 , the third sliding rail 5 and the fourth sliding rail 6 are slidably connected with the mounting plate 7, the third sliding rail 5 is provided with a third driving mechanism 10 for driving the mounting plate 7 to move along the width direction of the support frame 1, the third driving mechanism 10 is identical in structure with the first driving mechanism 8, and the third driving mechanism 10 comprises a third motor, a third driving wheel, a third driven wheel and a third belt.
[0032] As shown in Figure 1 , the mounting plate 7 is provided below with a clamping jaw 19 for grabbing the wafer box 11, and the mounting plate 7 is provided above with a rotating mechanism 20 for driving the clamping jaw to move along the height direction of the support frame 1.
[0033] In the embodiment, the length direction of the support frame 1 is the x-axis direction, the width direction of the support frame 1 is the y-axis direction, and the height direction of the support frame 1 is the z-axis direction.
[0034] Through the setting of the rotating mechanism 20, the first motor 13 and the second motor are turned on for driving the clamping jaw 19 to move along the x-axis direction through the setting of the first sliding rail 2 and the second sliding rail 3, and the third motor is turned on for driving the clamping jaw 19 to move along the y-axis direction through the setting of the third sliding rail 5 and the fourth sliding rail 6, so as to ensure that the wafer box 11 can be placed at any position of the processing station.
[0035] In a specific embodiment 2, as shown in Figure 1 , 3The difference between the embodiment and the embodiment 1 is that a plurality of placing plates 12 for placing the wafer boxes 11 are arranged on the inner wall surface of the lower end of the support frame 1 in the embodiment, the plurality of placing plates 12 are fixedly connected to form a group of placing plates 12, the placing plates 12 are provided in two groups, the two groups of placing plates 12 are fixedly installed on the support frame 1, and the two groups of placing plates 12 are located on the two sides of the mounting plate 7. The wafer box 11 grabbed by the clamping jaw 19 can be placed on the placing plate 12, and the placing plate 12 is an air storage position. The problem that the wafer box 11 has no air storage position is effectively solved. When the wafer box 11 is processed on the processing position, the wafer box 11 can be placed on the air storage position by driving the clamping jaw 19. The conversion efficiency of the wafer box 11 between the air storage position and the processing position can be improved, and the scheduling flexibility can be improved.
[0036] In work, the clamping jaw 19 first clamps the wafer box 11, moves along the z-axis direction by the rotating mechanism 20, then the second motor of the first motor 13 is started, drives the first belt 16 and the second belt to move, so that the sliding plate 4 moves along the x-axis direction, thereby driving the clamping jaw 19 to move along the x-axis direction. The third motor is started, so that the mounting plate 7 moves along the y-axis direction, thereby driving the clamping jaw 19 to move along the y-axis direction. If the processing position is empty, the wafer box 11 is placed on the processing position by the clamping jaw 19. If the processing position is not empty, the wafer box 11 is placed on the placing plate 12 by the clamping jaw 19.
[0037] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, unless otherwise specified and limited, it should be noted that the terms "mounting", "connection" and "connection" should be understood in a broad sense, for example, they can be mechanical connection or electrical connection, or the communication between two elements, or direct connection, or indirect connection through an intermediate medium. For ordinary skilled persons in the art, the specific meaning of the above terms can be understood according to the specific circumstances.
[0038] Obviously, the above embodiments are only examples for the purpose of clear illustration, and are not a limitation on the embodiments. For ordinary skilled persons in the art, other different forms of changes or variations can be made on the basis of the above description, and it is not necessary or possible to enumerate all the embodiments here. However, the obvious changes or variations still fall within the protection scope of the present application.
Claims
1. A rack structure for semiconductor wafer cassette handling and air storage equipment, characterized by, The utility model provides a kind of wafer box conveying device, including the support frame (1) of vertical arrangement, the inner wall surface of both sides of the support frame (1) is fixedly connected with the first slide rail (2) and the second slide rail (3) of horizontal arrangement, the first slide rail (2) and the second slide rail (3) are arranged in parallel and are arranged along the length direction of support frame (1);The first slide rail (2) and the second slide rail (3) are all provided with sliding plate (4), the sliding plate (4) is slidably matched with the first slide rail (2) and the second slide rail (3), two the sliding plate (4) is fixedly provided with the third slide rail (5) and the fourth slide rail (6) of horizontal arrangement, the third slide rail (5) and the fourth slide rail (6) are all perpendicular to the first slide rail (2) and the second slide rail (3), and the third slide rail (5) and the fourth slide rail (6) are arranged along the width direction of support frame (1);The third slide rail (5) and the fourth slide rail (6) are slidably connected with mounting plate (7); The first slide rail (2) and the second slide rail (3) are all provided with first drive mechanism (8) and second drive mechanism (9) for driving sliding plate (4) to move along the length direction of support frame (1), the third slide rail (5) is provided with third drive mechanism (10) for driving mounting plate (7) to move along the width direction of support frame (1); The inner wall surface of the lower end of the support frame (1) is provided with a plurality of placing plates (12) for placing wafer boxes (11).
2. The rack structure for semiconductor wafer box handling and air storage equipment according to claim 1, wherein, The first drive mechanism (8) contains first motor (13), first driving wheel (14), first driven wheel (15) and first belt (16), the first driving wheel (14) and the first driven wheel (15) are respectively located at both ends of the first track, the first belt (16) is connected on the outer end surface of the first driving wheel (14) and the first driven wheel (15), the sliding plate (4) is arranged in U shape, the lower end of the U-shaped horizontal part of the sliding plate (4) is fixedly connected with a sliding block matched with the first track, the upper end of the U-shaped horizontal part of the sliding plate (4) is provided with a lower pressing block (17), the upper end of the first belt (16) above the lower pressing block (17) is provided with an upper pressing block (18) matched with the lower pressing block (17), the lower pressing block (17) and the upper pressing block (18) compress the first belt (16), the lower pressing block (17), the upper pressing block (18) and the first belt (16) are fixedly matched.
3. The rack structure for semiconductor wafer box handling and air storage equipment according to claim 1, wherein, The second drive mechanism (9) is consistent with the first drive mechanism (8), and the third drive mechanism (10) is consistent with the first drive mechanism (8).
4. The rack structure for semiconductor wafer box handling and air storage equipment according to claim 1, wherein, A plurality of placing plates (12) are fixedly connected to form a group of placing plates (12), the placing plates (12) are provided with two groups, and the two groups of placing plates (12) are fixedly installed on the support frame (1), and the two groups of placing plates (12) are located on both sides of the mounting plate (7).
5. The rack structure for semiconductor wafer box handling and air storage equipment according to claim 1, wherein, The mounting plate (7) is provided with a clamping jaw (19) below, and a rotating mechanism (20) is arranged on the mounting plate (7) for driving the clamping jaw to move in the vertical direction.
6. The rack structure for semiconductor wafer box handling and air storage equipment according to claim 1, wherein, The length of the first slide rail (2) and the second slide rail (3) is equal to the length of the support frame (1), and the length of the third slide rail (5) and the fourth slide rail (6) is equal to the width of the support frame (1).