Feeding device of silicon wafer cleaning machine

Abstract

The utility model relates to a silicon wafer cleaning machine, in particular to a silicon wafer cleaning machine feeding device which comprises a feeding device body, a guide assembly is installed on the feeding device body, two guide plates are oppositely arranged, the sides, close to each other, of the two guide plates are in an arc shape, and in the process of conveying silicon wafers, the feeding assembly is arranged on the feeding device body. When a silicon wafer is in contact with the two guide plates, the silicon wafer is pushed by the feeding device body, so that the silicon wafer is in contact with the arc-shaped sides of the two guide plates, the silicon wafer continuously moves towards the position between the two guide plates through the two guide plates, it is guaranteed that the position of the silicon wafer in the cleaning tank is accurate, and the cleaning effect is improved; and by arranging the threaded rod, the distance between the two guide plates can be adjusted by rotating the threaded rod, and transmission guide of the silicon wafers of different specifications is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of silicon wafer cleaning machines, especially a kind of silicon wafer cleaning machine feeding device. BACKGROUND

[0002] Silicon wafer cleaning machine is one of indispensable equipment in semiconductor production, and its main structure usually includes cleaning tank, spraying system, ultrasonic system, heating system and other parts.Silicon wafer cleaning machine feeding device refers to the mechanism for feeding the silicon wafer to be cleaned into the main part of cleaning machine, which generally includes special fixed clamp, material frame, work station manipulator and up-down lifting mechanism and other component structures.When in use, the silicon wafer to be cleaned is first placed in the special fixed clamp, then the material frame containing the silicon wafer is placed in the inlet, and then the material frame is fed into the main body of the cleaning machine by the conveying belt for subsequent cleaning operation.

[0003] The existing conveying mode is to directly place the silicon wafer on the conveying belt, and the silicon wafer is prone to shift due to vibration during the conveying process, which leads to inaccurate position of the silicon wafer in the cleaning tank, thereby affecting the cleaning effect. SUMMARY

[0004] The utility model aims at providing a kind of silicon wafer cleaning machine feeding device, with accurate position of silicon wafer in cleaning tank, improved cleaning effect.

[0005] To achieve the above-mentioned purpose, the utility model adopts the technical scheme of providing a kind of silicon wafer cleaning machine feeding device, comprising a feeding device main body, a guide assembly is installed on the feeding device main body;

[0006] The guide assembly comprises a fixed frame, a threaded rod, a guide plate and a fixed plate, the bottom end of the fixed frame is fixedly arranged on the upper end of the feeding device main body, the fixed frame is provided with a movable slot, the guide plate is provided with two, the upper end of the two guide plates is fixedly connected with a mounting plate, the two mounting plates are movably arranged in the movable slot, one end of the threaded rod penetrates through the two guide plates, the side of the two guide plates close to each other is arranged in arc shape, the opposite ends of the fixed plate are fixedly connected with the adjacent inner side walls of the fixed frame, one end of the fixed plate penetrates through the two guide plates, the fixed plate is provided with a smoothing assembly for smoothing the silicon wafer.

[0007] Preferably, the smoothing assembly comprises a smoothing block and a limiting group, one end of the smoothing block penetrates through the fixed plate, the smoothing block is provided with a plurality of limiting holes, one end of the limiting group extends into the limiting hole.

[0008] Preferably: the limiting set includes a connecting frame, a clamping column, a limiting disc and a spring, one side of the connecting frame is fixedly connected with one side of the fixed plate, one end of the clamping column penetrates through the connecting frame, the end of the clamping column close to the connecting frame extends into the limiting hole, the end of the clamping column close to the limiting hole is fixedly penetrated through the limiting disc, one end of the spring is fixedly connected with one side of the limiting disc, and the end of the spring away from the limiting disc is fixedly connected with one side of the connecting frame.

[0009] Preferably: the feeding device body includes a conveying belt and a support frame, the conveying belt is installed on the support frame, and the bottom end of the fixed frame is fixedly connected with the upper end of the support frame.

[0010] Preferably: one end of the clamping column is fixedly connected with a pulling block.

[0011] Preferably: one end of the threaded rod is fixedly connected with a rotating disc.

[0012] Beneficial effects:

[0013] 1、The utility model discloses a two guide plates are set up, and the two guide plates are oppositely arranged, and the side of the two guide plates close to each other is arranged as arc, in the process of conveying the silicon wafer, when the silicon wafer contacts the two guide plates, the feeding device body pushes the silicon wafer, makes the silicon wafer contact the arc side of the two guide plates, makes the silicon wafer constantly move to the position between the two guide plates through the two guide plates, guarantees the position of the silicon wafer in the cleaning tank is accurate, improves the cleaning effect.

[0014] 2、The utility model discloses a threaded rod is set up, and the interval of the two guide plates can be adjusted through rotating the threaded rod, realizes conveying and guiding to the silicon wafer of different specifications.

[0015] 3、The utility model discloses a smoothing assembly, when the silicon wafer is accumulated on the feeding device body, the accumulated silicon wafer is smoothed through the smoothing assembly, ensures that the silicon wafer is stacked in order, thereby improves the wafer taking and sending efficiency, and further improves the overall processing efficiency. ACCURACY

[0016] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the following will introduce the drawings needed to be used in the embodiment or prior art description, obviously, the drawings in the following description are only some embodiments of the utility model, and for the ordinary skilled in the art, other drawings can also be obtained according to these drawings without the creative labor.

[0017] Figure 1 It is the whole structure schematic diagram of the utility model;

[0018] Figure 2The utility model discloses a structure schematic drawing of guiding assembly.

[0019] Figure 3 The utility model discloses a split structure schematic drawing of guiding assembly.

[0020] Figure 4 For Figure 3 The utility model discloses an enlarged structure schematic drawing of A place in the middle.

[0021] In the drawing: 1, conveying belt, 2, fixed frame, 3, mounting plate, 4, guide plate, 5, cleaning machine, 6, support frame, 7, smoothing block, 8, fixed plate, 9, pulling block, 10, connecting frame, 11, rotating disc, 12, threaded rod, 13, spring, 14, limiting disc, 15, clamping column, 16, limiting hole. Specific implementation

[0022] In order to make the technical problem, technical scheme and beneficial effect that the utility model wants to solve more clearly, the following is combined with the drawing and example, and the utility model is further described in detail.It should be understood that the specific example described here is only used to explain the utility model, and is not used to limit the utility model.

[0023] It should be noted that when an element is referred to as "fixed to" or "provided on" another element, it can be directly on another element or indirectly on the other element.When an element is referred to as "connected to" another element, it can be directly connected to another element or indirectly connected to the other element.

[0024] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the utility model and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0025] In addition, the terms "first", "second" are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more features. In the description of the utility model, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0026] Reference Figures 1-4The utility model discloses a silicon wafer cleaning machine feeding device, which is arranged on one side of a cleaning machine 5 and comprises a feeding device main body and a guide assembly installed on the feeding device main body.

[0027] The guide assembly comprises a fixing frame 2, a threaded rod 12, two guide plates 4 and a fixing plate 8. The bottom end of the fixing frame 2 is fixedly arranged on the upper end of the feeding device main body. The fixing frame 2 is provided with a movable slot. The two guide plates 4 are provided with two mounting plates 3 fixedly connected to the upper ends of the two guide plates 4. The two mounting plates 3 are movably arranged in the movable slot. One end of the threaded rod 12 penetrates through the two guide plates 4. The side, where the two guide plates 4 are close to each other, is in the shape of an arc. The opposite ends of the fixing plate 8 are fixedly connected to the adjacent inner side walls of the fixing frame 2. One end of the fixing plate 8 penetrates through the two guide plates 4. The fixing plate 8 is provided with a smoothing assembly for smoothing the silicon wafer. One end of the threaded rod 12 is fixedly connected to a rotating disc 11.

[0028] Specifically, the two guide plates 4 are oppositely arranged and the side, where the two guide plates 4 are close to each other, is in the shape of an arc. During the transmission of the silicon wafer, when the silicon wafer contacts the two guide plates 4, the feeding device main body pushes the silicon wafer so that the silicon wafer contacts the side, where the two guide plates 4 are in the shape of an arc. The two guide plates 4 make the silicon wafer continuously move to the position between the two guide plates 4, which ensures the accurate position of the silicon wafer in the cleaning tank and improves the cleaning effect.

[0029] The distance between the two guide plates 4 can be adjusted by rotating the threaded rod 12, so that different specifications of silicon wafers can be transmitted and guided.

[0030] The smoothing assembly comprises a smoothing block 7 and a limiting group. One end of the smoothing block 7 penetrates through the fixing plate 8. The smoothing block 7 is provided with a plurality of limiting holes 16. One end of the limiting group extends into the limiting hole 16. The limiting group comprises a connecting frame 10, a clamping column 15, a limiting disc 14 and a spring 13. One side of the connecting frame 10 is fixedly connected to one side of the fixing plate 8. One end of the clamping column 15 penetrates through the connecting frame 10. One end of the clamping column 15 close to the connecting frame 10 extends into the limiting hole 16. One end of the clamping column 15 close to the limiting hole 16 is fixedly penetrated through the limiting disc 14. One end of the spring 13 is fixedly connected to one side of the limiting disc 14. The end of the spring 13 away from the limiting disc 14 is fixedly connected to one side of the connecting frame 10. One end of the clamping column 15 is fixedly connected to a pulling block 9.

[0031] Specifically, the utility model is provided with the smoothing block 7. When the silicon wafers are stacked on the feeding device main body, the smoothing assembly can smooth the stacked silicon wafers, so that the silicon wafers are stacked in an orderly and neat manner, thereby improving the efficiency of taking and feeding the silicon wafers and the overall processing efficiency.

[0032] When the clamping column 15 is completely separated from the limiting hole 16, the position of the flattening block 7 can be adjusted, and after the position of the flattening block 7 is adjusted, the clamping column 15 can be released, the clamping column 15 is driven to re-enter the clamping hole corresponding to the position of the clamping column 15 by the pushing force of the spring 13, the position of the clamping column 15 is adjusted and limited, and the universality of the whole device is improved.

[0033] The upper feeding device body comprises a transmission belt 1 and a support frame 6, the transmission belt 1 is installed on the support frame 6, and the bottom end of the fixing frame 2 is fixedly connected with the upper end of the support frame 6.

[0034] Working principle: the two guide plates 4 are oppositely arranged, and the side of each guide plate 4 close to the other guide plate 4 is arc-shaped, in the process of conveying the silicon wafer, when the silicon wafer contacts the two guide plates 4, the upper feeding device body pushes the silicon wafer, and the silicon wafer contacts the arc-shaped side of the two guide plates 4, the silicon wafer continuously moves to the position between the two guide plates 4 through the two guide plates 4, the position of the silicon wafer in the cleaning tank is accurate, and the cleaning effect is improved.

[0035] The interval of the two guide plates 4 can be adjusted by rotating the threaded rod 12, and different specifications of the silicon wafer can be conveyed and guided.

[0036] The flattening block 7 is arranged, when the silicon wafers are stacked on the upper feeding device body, the stacked silicon wafers are flattened by the flattening assembly, the silicon wafers are stacked in order, the wafer taking and feeding efficiency is improved, and the overall processing efficiency is improved.

[0037] The clamping column 15 is moved away from the limiting hole 16, when the clamping column 15 is completely separated from the limiting hole 16, the position of the flattening block 7 can be adjusted, and after the position of the flattening block 7 is adjusted, the clamping column 15 can be released, the clamping column 15 is driven to re-enter the clamping hole corresponding to the position of the clamping column 15 by the pushing force of the spring 13, the position of the clamping column 15 is adjusted and limited.

[0038] The above only describes preferred embodiments of the utility model, and does not limit the utility model, any modification, equivalent replacement and improvement within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A silicon wafer cleaning machine feeding device, comprising a feeding device main body, characterized in that: The guiding assembly is installed on the feeding device body; The guiding assembly comprises a fixed frame (2), a threaded rod (12), guiding plates (4) and a fixed plate (8), the bottom end of the fixed frame (2) is fixedly arranged on the upper end of the feeding device body, the fixed frame (2) is provided with a movable groove, the guiding plates (4) are provided with two, the upper ends of the two guiding plates (4) are fixedly connected with mounting plates (3), the two mounting plates (3) are movably arranged in the movable groove, one end of the threaded rod (12) penetrates through the two guiding plates (4), the side of the two guiding plates (4) close to each other is arranged in an arc shape, the opposite ends of the fixed plate (8) are fixedly connected with the adjacent inner side walls of the fixed frame (2), one end of the fixed plate (8) penetrates through the two guiding plates (4), and the fixed plate (8) is provided with a smoothing assembly for smoothing the silicon wafer.

2. The on-board loading apparatus for a silicon wafer cleaning machine of claim 1, wherein: The smoothing assembly comprises a smoothing block (7) and a limiting group, one end of the smoothing block (7) penetrates through the fixed plate (8), the smoothing block (7) is provided with a plurality of limiting holes (16), and one end of the limiting group extends into the limiting hole (16).

3. The on-board loading apparatus for a silicon wafer cleaning machine of claim 2 wherein: The limiting group comprises a connecting frame (10), a clamping column (15), a limiting disc (14) and a spring (13), one side of the connecting frame (10) is fixedly connected with one side of the fixed plate (8), one end of the clamping column (15) penetrates through the connecting frame (10), one end of the clamping column (15) close to the connecting frame (10) extends into the limiting hole (16), one end of the clamping column (15) close to the limiting hole (16) is fixedly penetrated through the limiting disc (14), one end of the spring (13) is fixedly connected with one side of the limiting disc (14), and the other end of the spring (13) away from the limiting disc (14) is fixedly connected with one side of the connecting frame (10).

4. The on-board loading apparatus for a silicon wafer cleaning machine of claim 3, wherein: The feeding device body comprises a conveying belt (1) and a support frame (6), the conveying belt (1) is installed on the support frame (6), and the bottom end of the fixed frame (2) is fixedly connected with the upper end of the support frame (6).

5. The on-board loading apparatus for a silicon wafer cleaning machine of claim 4 wherein: One end of the clamping column (15) is fixedly connected with a pulling block (9).

6. The on-board loading apparatus for a silicon wafer cleaning machine of claim 5 wherein: One end of the threaded rod (12) is fixedly connected with a rotating disc (11).

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