Evaporation device and LED chip

Abstract

The utility model discloses an evaporation device and an LED chip, and the evaporation device comprises a device body which is provided with an evaporation cavity; the plating source is arranged at the bottom of the evaporation cavity; the plating pot is positioned above the plating source and is suitable for revolving around a revolving axis; the plating pot is further configured to be suitable for autorotation; the plating pot comprises a pot body and a connecting piece; the opening of the pot body faces the plating source; the connecting piece is rotationally connected with the middle of one side, deviating from the opening, of the pot body; the angle adjusting piece comprises a fixed part and a movable part; the fixing part is fixedly connected with the connecting piece; one end of the movable part is fixedly connected with the pot body, and the other end is slidably connected with the fixed part to slidably adjust the angle of the pot body relative to the connecting piece. According to the evaporation device, the sliding stroke of the angle adjusting piece is adjusted, the inclination angle of the pot body relative to the connecting piece is adjusted, then the wrapping performance of upper-layer metal on bottom-layer metal of an LED chip electrode is improved, metal migration and electrode falling are prevented, and the reliability of a chip is effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, more specifically, relate to a kind of evaporation device and LED chip. BACKGROUND

[0002] Light emitting diode (LED) has wide use in modern society, and LED electronic display has the advantages of bright color, wide dynamic range, high brightness, long service life, stable and reliable operation, and is widely used in commercial media, cultural performance market, sports venues, information dissemination, news release, securities trading and other fields to meet the needs of different environments. With the continuous expansion of the LED display market, different application environments have higher demands for the reliability of outdoor display LED chips.

[0003] In the use of LED chips, the reliability in high temperature and high humidity environment and salt spray environment is a very important parameter. Especially in outdoor display chip, the chip is in reverse pressure state (reverse voltage) when it is closed, and the Al layer under the P / N metal electrode is often used as the electrode reflection layer. Since the evaporation metal evaporation device inside the evaporation source position is fixed, the angle formed by the evaporation source and the evaporating pot is also fixed, so that the angle between the evaporation source and the hole formed by the photoresist corresponding to the electrode pattern on the chip on the evaporating pot is fixed, so that the maximum stroke of each layer of metal into the hole is fixed, and the angle is fixed. At the same time, the traditional evaporation machine evaporating pot only rotates and revolves, so that the upper bound metal cannot effectively cover the Al layer, which leads to the occurrence of electromigration in high temperature, high humidity, reverse pressure environment and salt spray environment, resulting in electrode shedding and chip failure, which seriously affects the stability and reliability of LED chip.

[0004] Therefore, how to improve the electrode covering property of LED chip becomes a problem to be solved, and the present case is generated. UTILITY MODEL CONTENT

[0005] Therefore, the present application provides an evaporation device and LED chip to improve the electrode covering property of LED chip.

[0006] To achieve the above purpose, the utility model adopts the following technical solutions:

[0007] An evaporation device comprises:

[0008] The device body is provided with an evaporation cavity;

[0009] The evaporation source is arranged at the bottom of the evaporation cavity;

[0010] A plating pot is located above the plating source and is adapted to revolve around a revolution axis; the plating pot is also configured to be adapted to rotate; the plating pot comprises a pot body and a connecting piece; an opening of the pot body faces the plating source, and the connecting piece is rotationally connected with a middle part of the pot body on a side away from the opening;

[0011] An angle adjusting piece comprises a fixed part and a movable part; the fixed part is fixedly connected with the connecting piece; one end of the movable part is fixedly connected with the pot body, and the other end is slidingly connected with the fixed part to slidingly adjust the angle of the pot body relative to the connecting piece.

[0012] Further, the angle adjusting piece is one of a telescopic rod, a telescopic cylinder and a telescopic motor.

[0013] Further, there are at least two plating pots, and each of the plating pots is correspondingly provided with the same number of angle adjusting pieces.

[0014] Further, the angle adjusting pieces corresponding to the pot body are provided with 2N, and N is a positive integer; the 2N angle adjusting pieces are symmetrically arranged in pairs along the circumference.

[0015] Further, the angle adjusting pieces corresponding to the pot body are provided with at least two along the circumference, and the interval between at least two adjacent angle adjusting pieces corresponds to a central angle of less than 180°.

[0016] Further, the pot body and the connecting piece are connected through a universal joint or a universal ball to realize rotational connection.

[0017] Further, a first fixed platform is arranged on a side of the pot body away from the opening;

[0018] A second fixed platform is arranged on the connecting piece opposite to the first fixed platform;

[0019] The angle adjusting piece is located between the first fixed platform and the second fixed platform, the fixed part is fixedly connected with the second fixed platform, and the movable part is fixedly connected with the first fixed platform; the connecting piece is rotationally connected with the middle part of the first fixed platform.

[0020] Further, a plurality of plating discs are arranged in the pot body and face the opening of the pot body; each of the plating discs is rotationally connected with the plating pot, so that the plating disc is adapted to rotate around a central axis thereof.

[0021] Further, the plating disc is rotationally connected with the plating pot through a rotating motor.

[0022] The utility model also provides a LED chip which is made by the evaporation device.

[0023] Compared with the prior art, the technical scheme provided by the utility model has at least the following advantages:

[0024] 1. The evaporation device comprises a device body provided with an evaporation cavity, a plating source arranged at the bottom of the evaporation cavity, a plating pot located above the plating source and adapted to revolve around a revolution axis, the plating pot being further configured to rotate, the plating pot comprising a pot body and a connecting piece, the pot body being open towards the plating source, the connecting piece being rotationally connected to the middle part of the side away from the opening of the pot body, an angle adjusting piece comprising a fixed part and a movable part, the fixed part being fixedly connected to the connecting piece, one end of the movable part being fixedly connected to the pot body, and the other end of the movable part being slidingly connected to the fixed part to slidingly adjust the angle of the pot body relative to the connecting piece.

[0025] 2. The angle adjusting piece corresponding to the pot body is provided with 2N, and the 2N angle adjusting pieces are symmetrically arranged in a circumferential direction two by two, so that the stability of the pot body is better.

[0026] 3. The angle adjusting piece corresponding to the pot body is provided with at least two in a circumferential direction, and the interval of the at least two adjacent angle adjusting pieces corresponds to a central angle less than 180°, so that the angle of the pot body can be adjusted in multiple directions, and the angle adjustment of the pot body relative to the connecting piece is more flexible.

[0027] 4. The plating disc is rotationally connected to the plating pot, so that the plating disc can rotate around the central axis, and when the electrode is evaporated, the windward surface and the leeward surface can be alternately changed by rotating the plating disc, so that the wrapping symmetry of the upper metal layer to the lower metal layer is better. In addition, the rotation of the plating disc in combination with the angle adjustment of the plating pot makes the evaporation device more flexible. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only embodiments of the utility model, and those skilled in the art can obtain other drawings according to the provided drawings without creating creative labor.

[0029] Figure 1 It is a structural schematic view of the evaporation device in the application;

[0030] Figure 2 It is a structural schematic view of one embodiment of the plating pot in the application;

[0031] Figure 3 FIG. 1 is a schematic diagram of a structure of a plating pot according to an embodiment of the present application; Figure 2 FIG. 2 is a schematic diagram of a setting position of a low-angle adjusting member according to an embodiment of the present application;

[0032] Figure 4 FIG. 3 is a schematic diagram of a structure of another embodiment of the plating pot according to the present application;

[0033] Figure 5 FIG. 4 is a schematic diagram of a setting position of the low-angle adjusting member according to an embodiment of the present application; Figure 4

[0034] Figure 6 FIG. 5 is a schematic diagram of another embodiment of the setting position of the low-angle adjusting member according to the present application; Figure 4

[0035] Figure 7 FIG. 6 is a schematic diagram of a position change of the plating pot according to the present application;

[0036] Figure 8 FIG. 7 is a schematic diagram of a position change of a plating disc when the plating pot rotates according to the present application;

[0037] Figure 9 FIG. 8 is a schematic diagram of a structure of an existing electrode;

[0038] Figure 10 FIG. 9 is a schematic diagram of an installation of a plating disc and a plating pot according to the present application;

[0039] Figure 11 FIG. 10 is a schematic diagram of a structure of an LED chip according to the present application;

[0040] Figure 12 FIG. 11 is a schematic diagram of a process of manufacturing a first electrode according to the present application.

[0041] Reference signs:

[0042] Device body 1; evaporation cavity 11; fixed disc 12; transmission shaft 13; plating pot fixing arm 14; guide rail fixing frame 15; lifting part 151; guide rail 16; plating source 2; plating pot 3; pot body 31; connecting member 32; rotating disc 33; first fixed platform 34; second fixed platform 35; mounting bracket 36; angle adjusting member 4; plating disc 5; rotating motor 6; substrate 7; first-type semiconductor layer 8; active layer 9; second-type semiconductor layer 10; transparent conductive layer 20; first electrode 30; second electrode 40; photoresist 50; insulating protective layer 60; first direction D. DETAILED DESCRIPTION

[0043] ​​To make the content of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0044] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in other ways that are not described in detail in the present application, and those skilled in the art can make similar extensions without departing from the connotation of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0045] Secondly, the present application is described in detail in combination with the schematic diagram, and in the detailed description of the embodiments of the present application, the cross-sectional view of the device structure is locally enlarged without the general proportion for the convenience of description, and the schematic diagram is only an example, which should not limit the scope of protection of the present application. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in the actual manufacture.

[0046] As shown in Figure 1 , 2 , the present application provides an evaporation device, which comprises a device body 1, an evaporation source 2, an evaporation pot 3 and an angle adjusting piece 4. The device body 1 is provided with an evaporation cavity 11. The evaporation source 2 is arranged at the bottom of the evaporation cavity 11. The evaporation pot 3 is located in the evaporation cavity 11, and the evaporation pot 3 is located above the evaporation source 2 and is adapted to revolve around a revolution axis; the evaporation pot 3 is also configured to be adapted to rotate. The evaporation pot 3 comprises a pot body 31 and a connecting piece 32; the opening of the pot body 31 faces the evaporation source 2, and the connecting piece 32 is rotationally connected with the middle part of the side away from the opening of the pot body 31. The angle adjusting piece 4 comprises a fixed part and a movable part; the fixed part is fixedly connected with the connecting piece 32; one end of the movable part is fixedly connected with the pot body 31, and the other end is slidingly connected with the fixed part to slidingly adjust the angle of the pot body 31 relative to the connecting piece 32.

[0047] The evaporation device of the present application increases the angle adjusting piece 4, adjusts the sliding stroke of the angle adjusting piece 4, adjusts the inclination angle of the pot body 31 relative to the connecting piece 32, and further improves the wrapping property of the upper layer metal of the electrode in the LED chip to the bottom layer metal, prevents metal migration and electrode falling, and effectively improves the reliability of the chip. The upper layer metal is, for example, Ti, Pt and Au, and the bottom layer metal is, for example, Al and other reflective metals.

[0048] Further, as shown in Figure 1As shown, the device body 1 further comprises a fixed disc 12, a transmission shaft 13 and a pot fixing arm 14. The fixed disc 12 is located in the evaporation cavity 11 and is fixedly connected with the transmission shaft 13, and the transmission shaft 13 is rotationally connected with the upper cavity wall of the evaporation cavity 11. Under the driving of a driving motor (not shown in the figure), the fixed disc 12 is driven to rotate around the axis of the transmission shaft 13. The axis of the transmission shaft 13 is the axis of revolution of the pot 3. The pot fixing arm 14 is the same in number as the pot 3, one end of which is fixedly connected with the fixed disc 12 and extends downwardly and obliquely, and the other end is used for mounting the pot 3. The pot 3 is mounted on the pot fixing arm 14, and when the fixed disc 12 rotates, the pot 3 is driven to revolve around the axis of revolution.

[0049] As shown in the figure, Figure 1 The device body 1 further comprises a guide rail fixing frame 15 and a guide rail 16. The guide rail fixing frame 15 is provided with a plurality of guide rail fixing frames 15 and is arranged in a circumferential direction around the fixed disc 12. One end of the guide rail fixing frame 15 is fixedly connected with the upper cavity wall of the evaporation cavity 11 and extends towards the lower cavity wall of the evaporation cavity 11; the other end of the guide rail fixing frame 15 is formed with a lifting portion 151 extending towards the middle of the evaporation cavity 11. The guide rail 16 is annular and is mounted on the lifting portion 151 of each guide rail fixing frame 15.

[0050] Further, the evaporation source 2 is arranged on the lower cavity wall of the evaporation cavity 11.

[0051] Further, the pot 3 further comprises a rotating disc 33 fixedly connected with the connecting piece 32. The connecting piece 32 is rotationally connected with the pot fixing arm 14, and the periphery of the rotating disc 33 is in contact with the guide rail 16. When the fixed disc 12 rotates to drive the pot 3 to revolve, the rotating disc 33 rotates to drive the pot 3 to rotate.

[0052] Further, the pot 3 is provided with at least two, and each of the pots 3 is correspondingly provided with the same number of angle adjusting pieces 4. In this application, the pot 3 is taken as an example for illustration.

[0053] Further, the angle adjusting piece 4 is one of a telescopic rod, a telescopic cylinder and a telescopic motor. The telescopic rod can be an electric telescopic rod, which is convenient to control. In the drawings of this application, the telescopic rod is taken as an example for illustration.

[0054] Further, the angle adjusting piece 4 corresponding to the pot body 31 is provided with 2N, N being a positive integer; the 2N angle adjusting pieces 4 are arranged in a circumferential direction in pairs of symmetry, so that the stability of the pot body 31 is better. For example, N is 1, 2, 3, etc. As shown in the figure, Figure 3 , 6 respectively show the cases where N is 1 and 2.

[0055] Further, the angle adjusting member 4 corresponding to the pot body 31 is provided with at least two in the circumferential direction, and the interval of the at least two adjacent angle adjusting members 4 corresponds to an angle less than 180°, so that the angle of the pot body 31 can be adjusted in multiple directions, and the angle adjustment of the pot body 31 relative to the connecting member 32 is more flexible. For example, as shown in Figure 5 As described above, two angle adjusting members 4 are provided, and the interval of the two adjacent angle adjusting members 4 corresponds to an angle of 90°, so that the pot body 31 can be rotated and tilted around different axes by adjusting the two adjusting members respectively, and the angle adjustment of the pot body 31 relative to the connecting member 32 is more flexible. Figure 5 Based on the provision of two angle adjusting members 4, in order to make the structure of the plating pot 3 more stable, as shown in Figure 6 Two symmetrically arranged angle adjusting members 4 can be provided.

[0056] Preferably, as shown in Figure 4 , the pot body 31 and the connecting member 32 are connected by a universal joint or a universal ball to realize rotary connection, so that the pot body 31 and the connecting member 32 can rotate in multiple directions, so that when the interval of the two adjacent angle adjusting members 4 corresponds to an angle less than 180°, the pot body 31 can be rotated and tilted around different axes.

[0057] It should be understood that when the angle adjusting member 4 is provided with two and symmetrically arranged (i.e. the case shown in Figure 3 , only the rotation of the plating pot 3 around one axis can be adjusted, and at this time the pot body 31 and the connecting member 32 can also be connected by hinging. Figure 2 A schematic view of the connection by hinging is shown.

[0058] Further, as shown in Figure 4 , the side of the pot body 31 away from the opening is provided with a first fixed platform 34; the connecting member 32 is provided with a second fixed platform 35 opposite to the first fixed platform 34; the angle adjusting member 4 is located between the first fixed platform 34 and the second fixed platform 35, and the fixed part is fixedly connected with the second fixed platform 35, and the movable part is fixedly connected with the first fixed platform 34. The connecting member 32 is rotatably connected with the middle part of the first fixed platform 34.

[0059] Further, as shown in Figure 4 , 7 , 10, further comprising a plurality of plating trays 5 arranged in the pot body 31 and facing the opening of the pot body 31, each plating tray 5 is rotatably connected with the plating pot 3, so that the plating tray 5 is adapted to rotate around its central axis.

[0060] Further, as shown in Figure 10 , the plating tray 5 is rotatably connected with the plating pot 3 by a rotating motor 6.

[0061] Specifically, the plating pot 3 further comprises mounting brackets 36 fixed on the back of the pot body 31 away from the opening, the number of the mounting brackets 36 is the same as and one-to-one corresponding to the number of the plating discs 5. The rotating motors 6 are mounted on the mounting brackets 36 and connected with the plating discs 5 for driving the plating discs 5 to rotate, the number of the rotating motors 6 is the same as and one-to-one corresponding to the number of the plating discs 5. For example, as shown in Figure 10 The pot body 31 can be provided with a hollow at the position where the plating disc 5 is mounted, facilitating the connection of the rotating motor 6 with the plating disc 5.

[0062] Figure 9 The existing electrode structure is shown, Figure 10 The positions of the windward side and the leeward side are shown. Figure 9 The left side of the middle is the side wall where the electrode is located at the leeward side, and the right side is the side wall where the electrode is located at the windward side. It can be seen from the figure that the two sides are asymmetric, the angle of the side wall formed by the upper metal layer at the windward side is small, and the wrapping of the lower metal layer is better. The plating disc 5 is connected with the plating pot 3 to rotate, so that the plating disc 5 can rotate around the central axis. During the evaporation and plating of the electrode, the windward side and the leeward side can be alternately changed by rotating the plating disc 5, so that the wrapping of the upper metal layer to the lower metal layer is more symmetrical. The rotation of the plating disc 5 is matched with the angle adjustment of the plating pot 3, so that the flexibility of the evaporation and plating device is higher.

[0063] As shown in Figure 11 The present application also provides an LED chip made by the evaporation and plating device described in any one of the above, so that the top metal layer of the first electrode 30 and the second electrode 40 of the LED chip forms a good symmetrical wrapping to the side surface of the bottom metal layer, preventing metal migration and electrode falling, effectively improving the reliability of the chip.

[0064] The LED chip comprises a substrate 7, a first type semiconductor layer 8, an active layer 9, a second type semiconductor layer 10, a first electrode 30 electrically connected with the first type semiconductor layer 8, and a second electrode 40 electrically connected with the second type semiconductor layer 10, which are sequentially stacked in a first direction D. Preferably, it further comprises a transparent conductive layer 20 located on the second type semiconductor layer 10. The substrate 7 can be one of Al2O3, Si and SiC. One of the first type semiconductor layer 8 and the second type semiconductor layer 10 is an N-type semiconductor layer, and the other is a P-type semiconductor layer. The present application takes the first type semiconductor layer 8 as N-GaN and the second type semiconductor layer 10 as P-GaN as an example for illustration.

[0065] The LED chip of the present application is made by the evaporation and plating device described in any one of the above, so it has the beneficial effects of the evaporation and plating device described in any one of the above, which will not be repeated here.

[0066] For example, the first electrode is evaporated and plated, Figure 7 , 8As shown, a hole is formed on the photoresist 50, and the first electrode 30 is evaporated in the hole. As the angle of the evaporation boat 3 changes, the angle between the evaporation source 2 and the surface of the first-type semiconductor layer 8 changes, which changes the angle of the sidewall of the evaporated film. In actual operation, the evaporation boat 3 can be adjusted to different angles by the angle adjusting member 4, and then evaporated. The angle of the sidewall of the evaporated film corresponding to different angles of the evaporation boat 3 can be obtained by analyzing the product by FIB (Focused Ion Beam) and SEM (Scanning Electron Microscopy). The evaporation boat 3 can be adjusted to a suitable angle before evaporation, so that the desired angle can be obtained. In addition, the evaporation device itself has a crystal oscillator for monitoring the film thickness, and the angle of the evaporation boat 3 can be adjusted in real time according to the thickness change during evaporation. During evaporation, the rotating motor 6 can be controlled to drive the evaporation plate 5 to rotate, so that the windward surface and the leeward surface are alternated, the wrapping angle of the electrode in each direction is consistent, the metal morphology is better, and the wrapping is better. It should be understood that the actual LED chip is set on the evaporation plate 5 to evaporate the electrode, Figure 8 Only a schematic description is given, and only the part of the first-type semiconductor layer 8 on the LED chip that needs to be evaporated with the electrode is shown, and other structures are omitted.

[0067] As shown in Figure 11 , 12 In the manufacture of the LED chip, the following steps are included:

[0068] S01: providing an epitaxial layer including a substrate 7, a first-type semiconductor layer 8, an active layer 9 and a second-type semiconductor layer 10 grown in sequence along a first direction D.

[0069] S02: etching the epitaxial layer to form a groove exposing the first-type semiconductor layer 8. The etching method can use dry etching or wet etching.

[0070] S03: forming a transparent conductive layer 20 on the surface of the second-type semiconductor layer 10, and etching the transparent conductive layer 20 to expose part of the surface of the second-type semiconductor layer 10. The transparent conductive layer 20 is a material with high transparency, high conductivity and low contact resistance, such as indium tin oxide, indium tin oxide, zirconium oxide, cadmium oxide, etc.

[0071] S04: evaporating the first electrode 30 and the second electrode 40 by using the above-mentioned evaporation device.

[0072] Specifically, as shown in Figure 12As shown, taking the evaporation of the first electrode 30 as an example, a photoresist 50 pattern is made on the surface of the chip semi-finished product. The first electrode 30 is evaporated by using the above-mentioned evaporation device. According to actual needs, the sliding stroke of the angle adjusting piece 4 is adjusted, the pot body 31 of the evaporation pot 3 is adjusted and fixed to a suitable angle. In addition, during the evaporation of the electrode, the rotating motor 6 drives the evaporation plate 5 to rotate, so that the windward surface and the leeward surface are alternately changed. Finally, the first electrode 30 is stacked; the electrode made by the evaporation device of the present application has a good symmetrical wrapping of the top layer metal to the side surface of the bottom layer metal, which prevents metal migration and electrode falling off, and effectively improves the reliability of the chip.

[0073] S05: Growing an insulating protective layer 60 on the surface of the chip semi-finished product, and etching to expose the first electrode 30 and the second electrode 40. For example: silicon oxide, silicon nitride, aluminum oxide and magnesium fluoride, etc. The etching method can be dry etching or wet etching.

[0074] Those skilled in the art should understand that in the disclosure of the present application, the orientations or positional relationships indicated by the terms "transverse", "longitudinal", "upper", "lower" and the like are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the above-mentioned terms cannot be understood as a limitation on the present application.

[0075] It should be noted that each embodiment in the present specification adopts a progressive manner for description, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between each embodiment can be referred to each other.

[0076] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A vapor deposition apparatus, characterized in that, include: The main body of the device is equipped with a vapor deposition chamber; The plating source is located at the bottom of the vapor deposition chamber; A plating pot, located above the plating source, is adapted to revolve about a revolution axis; the plating pot is also configured to rotate on its own axis; the plating pot includes a pot body and a connector; the opening of the pot body faces the plating source, and the connector is rotatably connected to the middle of the pot body on the side opposite to the opening. An angle adjustment component includes a fixed part and a movable part; the fixed part is fixedly connected to the connecting member; one end of the movable part is fixedly connected to the pot body, and the other end is slidably connected to the fixed part to adjust the angle of the pot body relative to the connecting member.

2. The vapor deposition apparatus as described in claim 1, characterized in that, The angle adjustment component is one of the following: a telescopic rod, a telescopic cylinder, and a telescopic motor.

3. The vapor deposition apparatus as described in claim 1, characterized in that, The plating pot is provided in at least two, and each plating pot is provided with the same number of angle adjustment components.

4. The vapor deposition apparatus as described in claim 1, characterized in that, There are 2N angle adjustment components corresponding to the pot body, where N is a positive integer; the 2N angle adjustment components are arranged symmetrically in pairs along the circumference.

5. The vapor deposition apparatus as described in claim 1, characterized in that, At least two angle adjustment members corresponding to the pot body are provided circumferentially, and the central angle corresponding to the interval between at least two adjacent angle adjustment members is less than 180°.

6. The vapor deposition apparatus as described in claim 5, characterized in that, The pot body and the connector are connected by a universal joint or a universal ball joint to achieve a rotatable connection.

7. The vapor deposition apparatus as described in claim 1, characterized in that, The pot body is provided with a first fixed platform on the side opposite to the opening; The connector is provided with a second fixing platform opposite to the first fixing platform; The angle adjustment component is located between the first fixed platform and the second fixed platform, and the fixed part is fixedly connected to the second fixed platform, while the movable part is fixedly connected to the first fixed platform; the connecting component is rotatably connected to the middle part of the first fixed platform.

8. The vapor deposition apparatus as described in claim 1, characterized in that, It also includes a plurality of plating plates placed on the pot body and facing the opening of the pot body, each of the plating plates being rotatably connected to the plating pot so that the plating plate is adapted to rotate about its central axis.

9. The vapor deposition apparatus as described in claim 8, characterized in that, The plating pan is rotatably connected to the plating pot via a rotating motor.

10. An LED chip, characterized in that, It is manufactured using the vapor deposition apparatus described in any one of claims 1 to 9.

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