Substrate resistance heating device and pulse laser deposition system

Abstract

The utility model discloses a substrate resistance heating device and a pulse laser deposition system, the substrate resistance heating device comprises a base, the base is provided with a mounting position with an opening at the front side, the left side and the right side of the mounting position are respectively provided with a conductive part, and the conductive parts are connected with copper leads; the resistance heating structure comprises a mounting part and a substrate, the mounting part is inserted into the mounting position, the mounting part can move front and back and can be taken out from the front side of the mounting position, the substrate is arranged on the mounting part and is made of a conductive material, and when the mounting part is inserted into the mounting position, a conductive path is formed between the substrate and the conductive parts on the left side and the right side. The heating device is simple in structure, low in cost, small in energy loss, high in heating speed and convenient to install and operate.

Description

TECHNICAL FIELD

[0001] The utility model relates to a coating equipment technical field, especially a kind of substrate resistance heating device and pulsed laser deposition system. BACKGROUND

[0002] Pulsed laser coating system as a new type of coating equipment, with wide application, can be used to prepare metal, semiconductor, oxide, nitride, carbide, boride, silicide, sulfide and fluoride and other various material thin film.Laser emitted by laser enters coating cavity in pulsed laser coating system through laser window, bombards target material, so that target material evaporates even ionizes to form thin film material to substrate.Pulsed laser coating process, substrate table usually needs to heat substrate to very high temperature (such as 700 DEG C), commonly used substrate heating mode, mainly using heater to heat substrate, including radiation heating, contact conduction heating;These heating methods all need to use heater, heating mode is heat transfer, there is heat loss, cost is high, and structure is complex, and the technical requirement of assembly personnel is higher. SUMMARY

[0003] The utility model aims at at least one of the technical problems existing in prior art is solved.For this purpose, the utility model provides a kind of substrate resistance heating device, energy loss is less, heating speed is fast, cost is low and convenient to use and install.

[0004] The utility model further provides a kind of pulsed laser deposition system with the above-mentioned substrate resistance heating device.

[0005] According to the substrate resistance heating device of the first aspect embodiment of the utility model, it includes:

[0006] Base, the base has the mounting site of front side opening, the left and right sides of the mounting site are respectively equipped with conductive part, copper wire is connected to the conductive part;

[0007] Resistance heating structure, the resistance heating structure includes installation part and substrate, the installation part is inserted in the mounting site, the installation part can move back and forth and can be taken out from the front side of the mounting site, the substrate is located in the installation part, the substrate is conductive material, when the installation part is inserted in the mounting site, the substrate and the conductive part between left and right sides form conductive path.

[0008] According to the substrate resistance heating device of the utility model embodiment, at least has following beneficial effects:

[0009] In the embodiment, since the substrate is made of conductive material, the mounting portion is inserted into the mounting position on the base, a conductive path is formed between the substrate and the two conductive portions on the base, and then the power supply is connected through the copper wire, so that the substrate is directly resistance heated by the current to generate high temperature.

[0010] According to some embodiments of the utility model, the base is provided with two electrode female heads, and the two conductive portions on the left and right sides are connected to the two electrode female heads through the copper wire respectively.

[0011] According to some embodiments of the utility model, the conductive portion is provided with an elastic portion, the elastic portion has elasticity, and the elastic portion abuts against the mounting portion downward to limit the forward and backward movement of the mounting portion.

[0012] According to some embodiments of the utility model, the elastic portion includes a first segment and a second segment, the first segment extends downward and backward obliquely, and the second segment is connected to the rear end of the first segment and extends upward and backward obliquely.

[0013] According to some embodiments of the utility model, the mounting portion is provided with a clamping assembly on the left and right sides of the substrate, the clamping assembly includes a lower clamping plate and an upper clamping plate, the lower clamping plate is horizontally arranged, the upper clamping plate is detachably arranged on the upper side of the lower clamping plate, and the upper clamping plate can cooperate with the lower clamping plate to clamp and fix the substrate.

[0014] According to some embodiments of the utility model, the mounting portion is provided with a bottom plate, the left and right sides of the upper surface of the bottom plate are respectively provided with a group of mounting columns, one group of the mounting columns includes at least two mounting columns arranged forward and backward, the upper clamping plate and the lower clamping plate are respectively provided with through holes matched with the mounting columns, and the mounting columns are sleeved with a first insulating sleeve on the lower side of the lower clamping plate and are threadedly connected with a locking nut on the upper side of the upper clamping plate.

[0015] According to some embodiments of the utility model, the upper clamping plate and the lower clamping plate are made of conductive material, the conductive portion is provided with an elastic portion, the elastic portion has elasticity, and the elastic portion abuts against the upper surface of the lower clamping plate.

[0016] According to some embodiments of the utility model, the left and right sides of the mounting position are respectively provided with limiting grooves, the limiting grooves extend forward and backward and have an open front end, the rear side of the mounting position is provided with a limiting protrusion, and the left and right ends of the mounting portion are respectively embedded in the limiting grooves on the left and right sides, and the rear end of the mounting portion abuts against the limiting protrusion.

[0017] According to some embodiments of the present application, the front end of the limiting groove is provided with a chamfer.

[0018] According to the pulse laser deposition system of the second aspect of the present application, the substrate resistance heating device is as above.

[0019] Additional aspects and advantages of the present application will be partially given in the following description, some will become apparent from the following description, or will be understood by those skilled in the art through the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0020] The present application will be further described below in combination with the drawings and examples, wherein:

[0021] Figure 1 is the shaft side view of the substrate resistance heating device of the embodiment of the present application;

[0022] Figure 2 is the top view of the substrate resistance heating device of the embodiment of the present application;

[0023] Figure 3 is the front view of the substrate resistance heating device of the embodiment of the present application;

[0024] Figure 4 is the structural exploded view of the substrate resistance heating device of the embodiment of the present application;

[0025] Figure 5 is the structural exploded view of the resistance heating structure of the embodiment of the present application;

[0026] Figure 6 is the connection structure exploded view of the conductive part and the base of the embodiment of the present application.

[0027] LIST OF REFERENCE NUMBERS

[0028] Base 100, mounting position 101, limiting groove 102, limiting convex part 103, electrode female head 110, electrode connecting seat 120, insulating gasket 130, upper pressing plate 140, lower pressing plate 150;

[0029] Conductive part 200, elastic part 201, conductive main body 202, copper wire 210;

[0030] Resistance heating structure 300, mounting part 310, bottom plate 311, mounting column 312, first insulating sleeve 313, locking nut 314, second insulating sleeve 315, handle 316, substrate 320, lower clamping plate 330, upper clamping plate 340. DETAILED DESCRIPTION

[0031] The embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary only, and are used only for explaining the present application, and cannot be understood as a limitation of the present application.

[0032] In the description of the present application, it should be understood that, in relation to the orientation description, for example, the orientation or position relationship indicated by up, down, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0033] In the description of the present application, more than two means more than two. If there is a description of first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0034] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0035] In the pulse laser coating process, the substrate table usually needs to heat the substrate 320 to a very high temperature (such as 700 DEG C), and the commonly used substrate 320 heating method is mainly to heat the substrate 320 by using a heater, which includes radiation heating and contact conduction heating. These heating methods all need to use a heater, the heating method is heat transfer, there is heat loss, the cost is high, and the structure is complex, and the technical requirements for the assembly personnel are high.

[0036] To this end, the present application provides a substrate resistance heating device and a pulse laser deposition system, which can effectively solve the above problems.

[0037] The substrate resistance heating device and the pulse laser deposition system according to the embodiments of the present application are described below with reference to Figures 1 to 6 The substrate resistance heating device and the pulse laser deposition system according to the embodiments of the present application are described below with reference to

[0038] The substrate resistance heating device of one embodiment of the present application comprises: a base 100 and a resistance heating structure 300.

[0039] The base 100 has a mounting position 101 with a front opening, and the left and right sides of the mounting position 101 are respectively provided with a conductive part 200. In this embodiment, one conductive part 200 is arranged on each of the left and right sides, and the two conductive parts 200 are respectively connected with a copper wire 210. Apparently, the conductive part 200 is made of a conductive material, and the conductive part 200 can be connected with a power supply through the copper wire 210. It can be conceived that the material of the conductive part 200 can be tantalum, which not only has excellent conductivity but also can withstand high temperature.

[0040] The resistance heating structure 300 includes a mounting part 310 and a substrate 320. The mounting part 310 is inserted into the mounting position 101, and the mounting part 310 can move forward and backward and can be taken out from the front side of the mounting position 101, that is, the mounting part 310 can be plug-in and plug-out arranged in the mounting position 101, so as to facilitate the disassembly and assembly of the mounting part 310. The substrate 320 is arranged on the mounting part 310, and the substrate 320 is made of a conductive material. When the mounting part 310 is inserted into the mounting position 101, the substrate 320 and the conductive parts 200 on the left and right sides form a conductive path through which current can pass. In this embodiment, a conductive structure is arranged on the mounting part 310, and the conductive structure is in contact with the substrate 320 and the conductive parts 200. Apparently, when the mounting part 310 is inserted into the mounting position 101, the conductive parts 200 are connected with a power supply through the copper wire 210, so as to supply electricity to the substrate 320, so as to use the current to perform resistance heating on the substrate 320 to generate high temperature. The substrate 320 can be made of a metal material.

[0041] The substrate resistance heating device with the above structure is used. Since the substrate 320 is made of a conductive material, the mounting part 310 is only inserted into the mounting position 101 on the base 100, the substrate 320 and the two conductive parts 200 on the base 100 form a conductive path, and then the power supply is connected through the copper wire 210, so as to directly use the current to perform resistance heating on the substrate 320 to generate high temperature. Compared with the traditional form of heating the substrate 320 by using a heater, the present embodiment has the advantages of simple structure, low cost, less energy loss, and fast heating speed. In addition, the resistance heating structure 300 is plug-in and plug-out arranged on the base 100 through the mounting part 310, and the use and installation operation are convenient.

[0042] Reference Figure 1 , Figure 3 and Figure 6As shown in the utility model, in some embodiments of the utility model, the bottom of the base 100 is provided with an electrode connecting seat 120, two electrode female heads 110 are arranged on the electrode connecting seat 120, the left conductive part 200 is connected with one of the electrode female heads 110 through a copper wire 210, the right conductive part 200 is connected with the other electrode female head 110 through a copper wire 210, so as to form a conductive path between the electrode female head 110 and the conductive part 200; it can be understood that in the pulsed laser deposition system, a substrate table for bearing the substrate 320 is arranged, in the embodiment, the electrode female head 110 is arranged on the base 100, so that the electrode male head matched with the electrode female head 110 can be arranged on the substrate table, the electrode male head is connected with the power supply, so that the substrate resistance heating device of the embodiment can be integrally designed as a pluggable type, so as to facilitate quick installation.

[0043] Referring to Figure 1 , Figure 3 and Figure 6 As shown in the utility model, in some embodiments of the utility model, the conductive part 200 is provided with an elastic part 201, the elastic part 201 has elasticity, the elastic part 201 abuts against the mounting part 310 downward, so as to press the mounting part 310 tightly on the base 100, so as to limit the forward and backward movement of the mounting part 310 by using the friction force, realize the positioning of the mounting part 310, prevent the mounting part 310 from moving randomly and cause the conductive path between the substrate 320 and the conductive part 200 to be disconnected; obviously, the elastic part 201 is elastically abutted against the mounting part 310 to limit the mounting part 310, compared with fixing the mounting part 310 on the base 100 by using the fastener, the mounting part 310 can be conveniently disassembled and assembled.

[0044] Referring to Figure 3 , Figure 4 and Figure 6As shown, in some embodiments of the utility model, the elastic part 201 includes a first section and a second section, the first section extends downwardly and rearwardly, the second section is connected to the rear end of the first section and extends upwardly and rearwardly, that is, a V-shaped structure with an opening upwardly is formed between the first section and the second section, wherein the first section and the second section are both sheet-shaped structures, the bottom end of the V-shaped structure abuts against the mounting part 310 downwardly, obviously, the elastic part 201 is provided as a V-shaped structure, which can not only ensure that the elastic part 201 has a certain elasticity, but also can avoid that the elastic part 201 is deformed randomly due to poor rigidity. In some specific embodiments, the conductive part 200 is also provided with a conductive body 202, the conductive body 202 is detachably arranged on the base 100, one end of the elastic part 201 is connected to the conductive body 202, and the elastic part 201 and the conductive body 202 are provided as an integral structure, and the copper wire 210 is connected to the conductive body 202; wherein the upper and lower sides of the conductive body 202 are respectively provided with insulating gaskets 130, the upper side of the upper insulating gasket 130 is provided with an upper pressing plate 140, the lower side of the lower insulating gasket 130 is provided with a lower pressing plate 150, and the upper pressing plate 140, the insulating gasket 130, the conductive body 202 and the lower pressing plate 150 are locked and fixed on the base 100 through vertically arranged screws, so as to realize detachable installation of the conductive body 202; it can be conceived that the insulating gasket 130 can be made of ceramic material.

[0045] Referring to Figure 1 , Figure 3 and Figure 5As shown, in some embodiments of the present application, the mounting portion 310 is provided with clamping assemblies on the left and right sides of the substrate 320, the clamping assemblies comprising a lower clamping plate 330 and an upper clamping plate 340, the lower clamping plate 330 being horizontally arranged, and the upper clamping plate 340 being detachably arranged on the upper side of the lower clamping plate 330 and capable of cooperating with the lower clamping plate 330 to clamp and fix the substrate 320, so as to realize detachable mounting of the substrate 320 and facilitate replacement of the substrate 320, when the substrate 320 needs to be replaced, the upper clamping plate 340 can be simply detached. In some specific embodiments, the mounting portion 310 is provided with a bottom plate 311, the bottom plate 311 being inserted into the mounting position 101, the left and right sides of the upper surface of the bottom plate 311 are respectively provided with a group of mounting columns 312, the group of mounting columns 312 comprising at least two mounting columns 312 arranged in front and back, the upper clamping plate 340 and the lower clamping plate 330 are both provided with through holes matched with the mounting columns 312, the upper clamping plate 340 is sleeved on the mounting columns 312 in the same group through the through holes thereon, and the lower clamping plate 330 is also sleeved on the mounting columns 312 in the same group through the through holes thereon, a first insulating sleeve 313 is sleeved on the mounting column 312, the first insulating sleeve 313 is located on the lower side of the lower clamping plate 330 to support the lower clamping plate 330 and form insulation between the lower clamping plate 330 and the bottom plate 311; a locking nut 314 is threadedly connected to the upper side of the upper clamping plate 340, the upper clamping plate 340 is locked by the locking nut 314 to enable the upper clamping plate 340 to clamp the substrate 320 in cooperation with the lower clamping plate 330, so as to realize detachable mounting of the substrate 320, which is simple in structure and convenient to disassemble and assemble; obviously, in order to avoid contact between the lower clamping plate 330, the upper clamping plate 340 and the mounting column 312, the first insulating sleeve 313 can be arranged in a stepped shape and partially inserted into the through holes of the lower clamping plate 330 and the upper clamping plate 340; further, a second insulating sleeve 315 is also sleeved on the mounting column 312, the second insulating sleeve 315 is located between the locking nut 314 and the upper clamping plate 340; it can be conceived that the first insulating sleeve 313 and the second insulating sleeve 315 can be made of ceramic material; in addition, the bottom plate 311 and the mounting column 312 are an integral structure and can be made of titanium alloy, which can withstand high temperature.

[0046] Referring to Figure 1 , Figure 3 and Figure 5As shown in the utility model, in some embodiments of the utility model, the upper clamping plate 340 and the lower clamping plate 330 are both conductive materials, which can be tantalum, which not only has excellent conductivity, but also can withstand high temperature; the conductive part 200 is provided with an elastic part 201, the elastic part 201 has elasticity, and the elastic part 201 abuts against the upper surface of the lower clamping plate 330, so that the elastic part 201 abuts against the lower clamping plate 330 to form a conductive path for current between the conductive part 200 and the substrate 320, and in the embodiment, the lower clamping plate 330 is the conductive structure described above. In addition, along the left-right direction, the elastic part 201 is arranged staggered with the upper clamping plate 340 to avoid interference between the upper clamping plate 340 and the elastic part 201 when the upper clamping plate 340 is disassembled. It can be understood that the lower clamping plate 330 is horizontally arranged, that is, the upper surface of the lower clamping plate 330 is horizontal, and the elastic part 201 abuts against the upper surface of the lower clamping plate 330, so that when the resistance heating structure 300 is assembled on the base 100 or removed from the base 100, the elastic part 201 and the lower clamping plate 330 form relative displacement on the upper surface of the lower clamping plate 330, and the disassembly resistance is small. In some embodiments, the elastic part 201 includes a first section and a second section, and a V-shaped structure with an upward opening is formed between the first section and the second section, the bottom end of the V-shaped structure abuts against the upper surface of the lower clamping plate 330, and the design of the V-shaped structure makes the process of inserting the mounting part 310 into the mounting position 101 more smooth, and during the movement of the mounting part 310, the lower clamping plate 330 can automatically push the elastic part 201 upward, which is convenient and fast to operate.

[0047] Referring to Figure 1 , Figure 4 and Figure 6 As shown in the utility model, in some embodiments of the utility model, the base 100 is provided with a recess, and the mounting position 101 is formed through the recess, the left and right sides of the mounting position 101 are respectively provided with limiting grooves 102, the limiting grooves 102 extend forward and rearward and have front openings, the rear side of the mounting position 101 is provided with a limiting convex part 103, the left and right ends of the mounting part 310 are respectively embedded in the limiting grooves 102 on the left and right sides, and the rear end of the mounting part 310 abuts against the limiting convex part 103, so that the mounting and positioning of the mounting part 310 are realized, and the structure is simple and practical. Specifically, in the embodiment, the left and right ends of the bottom plate 311 of the mounting part 310 are respectively embedded in the limiting grooves 102 on the left and right sides, the front end of the bottom plate 311 is provided with a handle 316 for an operator to hold, and the handle 316 extends to the outside of the mounting position 101. Further, the front end of the limiting groove 102 is provided with a chamfer to facilitate the insertion of the bottom plate 311 into the limiting groove 102 during assembly, thereby saving operation time.

[0048] The utility model discloses still provide a kind of pulsed laser deposition system, including the substrate resistance heating device above, in addition, pulsed laser deposition system is also equipped with substrate stage, electrode male head is equipped on substrate stage, electrode male head is adapted with the electrode female head 110 of substrate resistance heating device, electrode male head is connected power supply.The pulsed laser deposition system of this embodiment since including the substrate resistance heating device above, therefore at least have the overall beneficial effect of substrate resistance heating device, not do here superfluously.

[0049] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present specification.

[0050] The embodiments of the utility model are described in detail above in combination with the drawings, but the utility model is not limited to the above embodiments, and various changes can be made within the knowledge range possessed by those skilled in the art without departing from the purpose of the utility model.

Claims

1. A substrate resistance heating device, characterized by comprising: The base has a front opening mounting position, and the left and right sides of the mounting position are respectively provided with conductive parts connected with copper wires. The resistance heating structure includes a mounting part and a substrate, the mounting part is inserted into the mounting position, the mounting part can move forward and backward and can be taken out from the front side of the mounting position, the substrate is provided on the mounting part, the substrate is made of conductive material, and when the mounting part is inserted into the mounting position, the substrate forms a conductive path with the conductive parts on the left and right sides. The base is provided with two electrode female heads, and the conductive parts on the left and right sides are respectively connected to the two electrode female heads through the copper wires.

2. The substrate resistance heater of claim 1, wherein: The conductive part is provided with an elastic part, the elastic part has elasticity, and the elastic part abuts against the mounting part downward to limit the forward and backward movement of the mounting part.

3. The substrate resistance heater of claim 1, wherein: The elastic part includes a first section and a second section, the first section extends downward and backward, and the second section is connected to the rear end of the first section and extends upward and backward.

4. The substrate resistance heater of claim 3, wherein: The mounting part is provided with a clamping assembly on the left and right sides of the substrate, the clamping assembly includes a lower clamping plate and an upper clamping plate, the lower clamping plate is horizontally arranged, the upper clamping plate is detachably arranged on the upper side of the lower clamping plate and can cooperate with the lower clamping plate to clamp and fix the substrate.

5. The substrate resistance heater of claim 1, wherein: The mounting part is provided with a bottom plate, the left and right sides of the upper surface of the bottom plate are respectively provided with a group of mounting columns, one group of the mounting columns includes at least two mounting columns arranged forward and backward, the upper clamping plate and the lower clamping plate are respectively provided with through holes matched with the mounting columns, and the upper clamping plate and the lower clamping plate are sleeved on the mounting columns in the same group through the through holes, the mounting column is sleeved with a first insulating sleeve on the lower side of the lower clamping plate, and a locking nut is threadedly connected on the upper side of the upper clamping plate.

6. The substrate resistance heater of claim 5, wherein: The upper clamping plate and the lower clamping plate are made of conductive material, the conductive part is provided with an elastic part, the elastic part has elasticity, and the elastic part abuts against the upper surface of the lower clamping plate.

7. The substrate resistance heater of claim 5, wherein: The left and right sides of the mounting position are respectively provided with limiting grooves, the limiting grooves extend forward and backward and have open front ends, the rear side of the mounting position is provided with a limiting protrusion, and the left and right ends of the mounting part are respectively embedded in the limiting grooves on the left and right sides, and the rear end of the mounting part abuts against the limiting protrusion.

8. The substrate resistance heater of claim 1, wherein: The front end of the limiting groove is provided with a chamfer.

9. The substrate resistance heater of claim 8, wherein: The substrate resistance heating device includes the substrate resistance heating device of any one of claims 1 to 9.

10. A pulsed laser deposition system, characterized by, ​

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