Blue diaphragm electroplating bath
By designing a blue film electroplating tank and utilizing structures such as a flow stabilizing plate and a flow pipe, the problem of uneven contact between the electroplating solution and the blue film was solved, thereby improving the uniformity and yield of the electroplated layer.
Patent Information
- Application Number
- CN202422911939.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-11-28
AI Technical Summary
Existing electroplating processes have difficulty controlling the uniformity of contact between the electroplating solution and the surface of the blue film to be plated, resulting in inconsistent grid line thickness and electroplating solution spillage onto non-plated surfaces, affecting production yield.
The blue film electroplating tank includes a tank body, a liquid supply pipe, a liquid drain pipe, a flow stabilizing plate, and an anode mesh plate. The flow stabilizing plate forms a stable liquid surface, and the dynamic circulation of the electroplating solution is achieved by the inflow pipe and the overflow tank, ensuring that the material sheet is in uniform contact with the electroplating solution.
It improves the uniformity of the electroplated layer and the production yield, reduces the occurrence of electroplating solution spilling onto non-plated surfaces, and enhances the electroplating quality.
Smart Images
Figure CN223561738U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of battery piece electroplating, and particularly relates to a blue film piece electroplating tank. BACKGROUND
[0002] Metallization is one of important links in solar cell production, which prepares grid lines on the surface of battery pieces through contact or non-contact technology, so that the grid lines and the battery pieces form a close and efficient ohmic contact to guide the photo-generated carriers out of the battery. Metallization affects the cost and conversion efficiency of the battery, and finally relates to the selection of the battery path.
[0003] At present, main metallization schemes include screen printing and electroplating. The screen printing needs silver paste, and the cost is high. After printing, sintering is further needed to form the grid lines, and the process flow is complex. Therefore, the electroplating technology is used to construct low-price metal grid lines, reduce cost and increase efficiency, and becomes the mainstream development trend of the industry.
[0004] When the electroplating technology is used to construct the grid lines in the industry, the blue film piece is usually hung in the electroplating solution by using a hanger, and the blue film piece is contacted with the electroplating solution in a spraying or soaking mode. However, the existing process cannot control the contact uniformity of the electroplating solution and the plated surface of the blue film piece, cannot guarantee the thickness consistency of the grid lines, and the electroplating solution is easy to be turned over to the non-plated surface of the blue film piece, causing quality defects and reducing the production yield. SUMMARY
[0005] The application provides a blue film piece electroplating tank to control the contact uniformity of the piece and the electroplating solution, avoid turning over, and improve the electroplating quality.
[0006] To solve at least one of the above technical problems, the application adopts the technical scheme of a blue film piece electroplating tank, which comprises:
[0007] a tank body;
[0008] a liquid supply pipe connected to the tank body and used for supplying the electroplating solution to the tank body;
[0009] a liquid discharge pipe connected to the tank body and used for discharging the electroplating solution in the tank body;
[0010] a steady flow orifice plate located in the tank body and used for forming a stable liquid surface of the electroplating solution supplied by the liquid supply pipe in the tank body;
[0011] an anode mesh plate located in the tank body and connectable to an external circuit through an anode power supply part.
[0012] Preferably, the tank body is connected with a liquid surge pipe, the output end of the liquid surge pipe penetrates through the steady flow orifice plate, and / or the liquid surge speed is greater than the liquid supply speed of the liquid supply pipe, so as to supply the electroplating solution to the tank body and form a liquid column higher than the stable liquid surface.
[0013] Preferably, the tank body comprises a bottom plate, outer vertical plates and inner vertical plates, the outer vertical plates and the inner vertical plates are located on the vertical plates, the height of the inner vertical plates is less than that of the outer vertical plates, a plurality of the inner vertical plates enclose an electroplating area; a plurality of the outer vertical plates are located outside the inner vertical plates and enclose an overflow tank with the inner vertical plates, the overflow tank is provided with an overflow pipe penetrating the outer vertical plates.
[0014] Preferably, at least one set of connecting blocks is arranged between the outer vertical plates and the inner vertical plates, the liquid supply pipe and the liquid discharge pipe penetrate the connecting blocks and extend into the electroplating area.
[0015] Preferably, the electroplating area is provided with an annular placement platform, the annular placement platform is arranged on the inner vertical plates and comprises at least a first placement step and a second placement step, the first placement step is higher than the second placement step, the steady flow orifice plate is detachably connected to the first placement step, and the anode mesh plate is detachably connected to the second placement step.
[0016] Preferably, one end of the anode power supply part is connected to the anode mesh plate, and the other end penetrates the tank body and extends out of the tank body; the outer wall of the anode power supply part is sealingly connected to the tank body.
[0017] Preferably, the top of the inner vertical plate is provided with a drainage slope, the top of the drainage slope faces the electroplating area, and the bottom of the drainage slope faces the overflow tank.
[0018] Preferably, the outer periphery of the tank body is provided with a plurality of mounting blocks, the mounting blocks are located on the outer vertical plates and / or the bottom plate, and mounting screw holes are arranged on the mounting blocks.
[0019] Preferably, the tank body is at least partially light-transmitting, and the outer side of the light-transmitting part is provided with an LED light source.
[0020] Preferably, the top of the tank body is provided with at least three leveling pads, the leveling pads are detachably connected to the tank body, and the top surfaces of the leveling pads are horizontal and have the same height.
[0021] The application has the following beneficial effects: through the configuration of the anode mesh plate and the anode power supply part, the electroplating tank can be directly used for electroplating after liquid supply and power supply, the structure is simple, and the use is convenient; through the flow stabilizing and buffering effects of the steady flow orifice plate, a stable electroplating liquid surface is provided for the workpiece, and the uniformity of the plating layer is improved; through the surface tension effect of the liquid column of the gushing pipe, when the plating surface of the workpiece is higher than the large surface of the electroplating liquid, the workpiece can be uniformly contacted with the electroplating liquid and liquid overturning can be avoided, and the electroplating yield is improved; through the overflow tank and the overflow pipe, the electroplating liquid is dynamically circulated, and the electroplating quality and the uniformity of the plating layer are improved. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present utility model;
[0023] Figure 2 This is a longitudinal sectional view of the tank body in an embodiment of this utility model;
[0024] Figure 3 This is a cross-sectional view of the tank body in an embodiment of this utility model.
[0025] In the picture:
[0026] 1. Tank body; 11. Bottom plate; 12. Outer vertical plate; 13. Inner partition plate; 131. Drainage slope; 14. Connecting block; 15. Mounting block; 151. Mounting screw hole; 16. Annular platform; 161. First platform; 162. Second platform; 17. Standard level shim;
[0027] 2. Liquid supply pipe;
[0028] 3. Drainage pipe;
[0029] 4. Flow stabilizing orifice plate; 41. Flow stabilizing orifice;
[0030] 5. Anode mesh plate;
[0031] 6. Anode energized section;
[0032] 7. Inflow tube;
[0033] 8. LED light source;
[0034] 9. Overflow pipe. Detailed Implementation
[0035] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments.
[0036] This embodiment proposes a blue film electroplating tank, such as... Figure 1 As shown, it includes: a tank body 1, a liquid supply pipe 2, a liquid discharge pipe 3, a flow stabilizing orifice plate 4, and an anode mesh plate 5. The liquid supply pipe 2 and the liquid discharge pipe 3 are respectively connected to the tank body 1 and are used to supply electroplating solution to the tank body 1 and discharge electroplating solution from the tank body 1, respectively. The flow stabilizing orifice plate 4 and the anode mesh plate 5 are both located inside the tank body 1. The flow stabilizing orifice plate 4 is located above the output end of the liquid supply pipe 2 and is used to make the electroplating solution supplied by the liquid supply pipe 2 form a stable liquid surface in the tank body 1. The anode mesh plate 5 can be connected to an external circuit through the anode energizing part 6 to form a conductive loop with the energized material sheet and the electroplating solution to complete the material sheet electroplating.
[0037] When the liquid supply pipe 2 supplies the electroplating solution to the tank body 1, even if the electroplating solution in the tank body 1 has already submerged the output end of the liquid supply pipe 2, the new electroplating solution output by the liquid supply pipe 2 will still cause the existing electroplating solution in the tank body 1 to surge, and slight surging can cause the strip to contact the high part but not the low part, resulting in uneven distribution of the electroplating solution on the plated surface of the strip and uneven thickness of the plated layer, and strong surging can cause the non-plated surface of the strip to contact the electroplating solution, resulting in defects. In the present embodiment, the flow stabilizing orifice plate 4 is arranged above the output end of the liquid supply pipe 2, and as the name implies, a plurality of flow stabilizing orifices 41 are uniformly distributed on the flow stabilizing orifice plate 4. The electroplating solution can pass through the flow stabilizing orifices 41 to above the flow stabilizing orifice plate 4, and its surging energy is absorbed by the non-orifice part (i.e. the plate body) of the flow stabilizing orifice plate 4, and a smooth liquid surface is formed above the flow stabilizing orifice plate 4. During electroplating, the plated surface of the strip contacts the smooth liquid surface above the flow stabilizing orifice plate 4, and after power is turned on, a metal grid line with uniform thickness can be deposited on the strip, and the situation of the electroplating solution surging to the non-plated surface of the strip is reduced, thereby improving the production yield.
[0038] In addition to making the strip directly contact the smooth liquid surface of the electroplating solution, a liquid surge pipe 7 can also be connected to the tank body 1 to supply the electroplating solution to the tank body 1, and by controlling the height of the output end of the liquid surge pipe 7 or the surge speed, a liquid column higher than the smooth liquid surface can be formed in the tank body 1 by the electroplating solution supplied by the liquid surge pipe 7. During electroplating, the smooth liquid surface formed by the flow stabilizing orifice plate 4 has a small gap with the plated surface of the strip, which can be a millimeter or smaller, and the height of the liquid surge pipe 7 or the surge speed is pre-adjusted before production (i.e. the liquid surge pipe 7 can be lower than the flow stabilizing orifice plate 4 or higher than the flow stabilizing orifice plate 4, and when it is lower than the flow stabilizing orifice plate 4, the surge speed of the liquid surge pipe 7 can be appropriately increased), so that the top surface of the liquid column ejected by the output end of the liquid surge pipe 7 contacts the plated surface of the strip. Since the liquid column and the smooth liquid surface formed by the flow stabilizing orifice plate 4 are continuous liquids, under the combined influence of the surface tension of the liquid column and the strip and the gravity of the electroplating solution itself, the smooth liquid surface formed by the flow stabilizing orifice plate 4 can only be dragged to the plated surface of the strip for electroplating reaction, but cannot surge to the non-plated surface of the strip, thereby improving the yield of the strip electroplating.
[0039] In the technical solution of the liquid surge pipe 7, the stable liquid surface formed by the steady flow orifice plate 4 is not directly in contact with the material sheet, but is used to make the liquid level in the tank body 1 uniform, and the distance between the liquid column top surface formed by the liquid surge pipe 7 is the same, so as to achieve effective traction and avoid the liquid level in the tank body 1 being high and low, and the low part being unable to be pulled by the surface tension of the liquid column and the material sheet. In addition, the liquid surge pipe 7 should correspond to the middle part of the material sheet as much as possible, rather than the edge part, because the points far from the liquid column formed by the liquid surge pipe 7 on the stable liquid surface are less affected by the surface tension traction, if the liquid surge pipe 7 corresponds to the middle part of the material sheet, the liquid surge speed can be slightly increased to ensure that the edges of the material sheet can contact the electroplating liquid, and to avoid the liquid being turned over to the non-plating surface of the material sheet, but if the liquid surge pipe 7 corresponds to the edge part of the material sheet, in order to make the material sheet be uniformly electroplated, the liquid surge speed must be increased to the edge of the material sheet far from the liquid surge pipe 7 to be able to contact the electroplating liquid, so the edge of the material sheet close to the liquid surge pipe 7 is likely to cause the liquid to be turned over.
[0040] Reference is made to the accompanying drawings Figures 1-3 The tank body 1 comprises a bottom plate 11, outer vertical plates 12 and inner partition plates 13, a plurality of outer vertical plates 12 are sequentially connected to form a first cylinder part, a plurality of inner partition plates 13 are sequentially connected to form a second cylinder part, the axial dimension of the second cylinder part is smaller than that of the first cylinder part, the first cylinder part is sleeved outside the second cylinder part, and the bottom surfaces of the two are flush, the bottom plate 11 is fixedly arranged at the bottom of the first cylinder part and the second cylinder part to block the bottom end opening of the first cylinder part, and the anode mesh plate 5 is arranged inside the second cylinder part; the second cylinder part is used as an electroplating area, the gap between the first cylinder part and the second cylinder part is used as an overflow tank, the output end of the liquid supply pipe 2, the input end of the liquid discharge pipe 3 and the inner side of the second cylinder part are communicated, and the overflow pipe 9 penetrating through the outer vertical plate 12 is arranged in the overflow tank. During electroplating, the liquid supply pipe 2, the liquid surge pipe 7 and the overflow pipe 9 are opened, the height of the material sheet is controlled to be higher than the top of the second cylinder part and lower than the top of the first cylinder part, the liquid supply pipe 2 is used to supply liquid to the electroplating area to make the liquid level rise to contact the material sheet for electroplating, but since the liquid level capable of contacting the material sheet is higher than the top of the second cylinder part, the electroplating liquid close to the liquid level will fall into the overflow tank after reacting with the material sheet and be discharged through the overflow pipe 9; in this way, through the synchronous action of the liquid supply pipe 2, the liquid surge pipe 7 and the overflow pipe 9, the electroplating liquid near the plating surface of the material sheet is always in circulating flow, the concentration of the electroplating liquid near the material sheet is maintained, the deposition thickness of the plating layer is ensured, and the yield is improved.
[0041] Since the inner partition plate 13 has a certain height, in order to avoid the electroplating liquid falling from the top of the inner partition plate 13 into the overflow tank, the liquid falls rapidly and hits the bottom plate 11 or the original liquid in the overflow tank, causing splashing, the embodiment is provided with a drainage slope surface 131 at the top of the inner partition plate 13, the top of the drainage slope surface 131 is towards the electroplating area, and the bottom is towards the overflow tank.
[0042] In addition, the connecting block 14 is arranged between the outer vertical plate 12 and the inner partition plate 13, and is integrally formed with the outer vertical plate 12 and the inner partition plate 13 or is fixedly connected with the outer vertical plate 12 and the inner partition plate 13 by other means (gluing, welding, etc.), the liquid supply pipe 2 and the liquid discharge pipe 3 are respectively penetrated through the connecting block 14 and extend into the electroplating area, so that the electroplating liquid of different concentrations in the electroplating area and the overflow tank are prevented from mixing, and the updating effect of the electroplating liquid near the material sheet is reduced.
[0043] The tank body 1 can be configured to be fully light-transmissive or partially light-transmissive, and the LED light source 8 is arranged in the light-transmissive part, so as to improve the ion activity of the electroplating liquid in the electric field and improve the electroplating efficiency and quality. Figure 1 In this application, as an example, the electroplating tank is configured to be light-transmissive at least at the bottom surface, and the LED light source 8 is arranged at the bottom of the electroplating tank.
[0044] In addition, a plurality of mounting blocks 15 are arranged on the outer periphery of the tank body 1, the mounting blocks 15 are arranged on the outer vertical plate 12 or the bottom plate 11, mounting screw holes 151 are arranged on the mounting blocks 15, and the electroplating tank is fixed to the original rack or other parts in the factory building.
[0045] Referring to the accompanying drawings, Figure 2 The annular material placing table 16 is arranged in the electroplating area, is arranged on the inner partition plate 13 and can be integrally formed with the inner partition plate 13 or fixedly connected with the inner partition plate 13 by other means (gluing, welding, etc.), the annular material placing table 16 comprises a first material placing step 161 and a second material placing step 162, the first material placing step 161 is higher than the second material placing step 162, the steady flow orifice plate 4 is detachably connected with the first material placing step 161, and the anode mesh plate 5 is detachably connected with the second material placing step 162, so as to facilitate installation, disassembly and maintenance.
[0046] When the copper grid lines are plated on the blue film sheet, a nickel seed layer can be plated on the blue film sheet to improve the bonding force with copper; according to the process requirement, tin can be plated on the surface of the copper grid lines, and when nickel, copper and tin are plated, the anode mesh plate 5 can be made of the same material as the plated metal and is configured as a mesh-shaped hollow plate, so that the electroplating liquid passes through the anode mesh plate 5 and contacts the material sheet; the size of the anode mesh plate 5 is configured according to the actual use requirement, and the area of the top view projection of the anode mesh plate 5 should be not less than the area of the surface to be plated of the material sheet, so as to ensure that uniform electric field force is generated on each part of the material sheet and the electroplating uniformity is improved.
[0047] The anode power supply part 6 for charging the anode mesh plate 5 can be configured in any shape such as a block, a rod, a plate, etc. One end of the anode power supply part 6 is connected with the anode mesh plate 5, and the other end sequentially penetrates the annular placing table 16, the inner partition plate 13 and the outer standing plate 12 to connect an anode power terminal (not shown in the figure). The anode power supply part 6 can be integrally formed with the anode mesh plate 5, or can be connected through a conductive connecting piece such as a bolt, etc. for convenient installation and disassembly. The part of the anode power supply part 6 penetrating the outer standing plate 12 of the electroplating tank should be well sealed to prevent liquid leakage. The shape structure of the anode power supply part 6 located outside the electroplating tank can be configured according to the shape and structure of the anode power terminal, and a threaded groove or a clamping groove for mounting the anode power terminal can be adaptively arranged, which is not specifically limited here.
[0048] The strip is extended into the tank body 1 from the top end of the tank body 1, and a clamp or a lifting tool is needed to fix the strip at the non-plating surface of the strip. However, the clamp and the lifting tool should be movable to facilitate the strip to enter and exit the tank body 1. In view of the need to use a suspension structure with mobility, and considering the levelness and stability of the non-plating surface of the strip during electroplating in the tank body 1, at least three leveling pads 17 are arranged at the top of the tank body 1 in the embodiment. The leveling pads 17 are detachably connected with the tank body 1, the top surfaces of the leveling pads 17 are horizontal and have the same height, and the leveling pads 17 are used to support the clamp or the lifting tool of the strip, so that the bottom surface or the related contact surface of the clamp or the lifting tool is horizontal, thereby ensuring the levelness and stability of the strip.
[0049] The beneficial effects of the present application are as follows: through the configuration of the anode mesh plate 5 and the anode power supply part 6, the electroplating tank can be directly used for electroplating after supplying liquid and supplying power, and the structure is simple and convenient to use; through the flow stabilizing and buffering effect of the flow stabilizing orifice plate 4, a stable electroplating liquid surface is provided for the strip, and the uniformity of the plating layer is improved; through the surface tension effect of the liquid column of the liquid surge pipe 7, when the plating surface of the strip is higher than the large surface of the electroplating liquid, the strip can be uniformly contacted with the electroplating liquid and the liquid overturning can be avoided, and the electroplating yield is improved; through the overflow tank and the overflow pipe 9, the electroplating liquid is dynamically circulated, and the electroplating quality and the uniformity of the plating layer are improved.
[0050] The above describes the embodiments of the present application in detail, and the above description is only a preferred embodiment of the present application and cannot be considered as limiting the scope of the present application. Any equivalent changes and improvements made within the scope of the present application should still belong to the scope of the patent coverage of the present application.
Claims
1. A blue membrane sheet plating tank characterized by comprising: The application relates to a tank body, a liquid supply pipe connected to the tank body for supplying electroplating liquid to the tank body, a liquid discharge pipe connected to the tank body for discharging the electroplating liquid in the tank body, a steady flow orifice plate in the tank body for forming a steady liquid surface of the electroplating liquid supplied by the liquid supply pipe in the tank body, and an anode mesh plate in the tank body and connected to an external circuit through an anode power supply part. The tank body is provided with a liquid surge pipe having an output end penetrating the steady flow orifice plate and / or a liquid surge speed greater than the liquid supply speed of the liquid supply pipe, for supplying electroplating liquid to the tank body and forming a liquid column higher than the steady liquid surface. The tank body comprises a bottom plate, outer vertical plates and inner partition plates, the outer vertical plates and the inner partition plates are located on the vertical plates, the height of the inner partition plates is less than that of the outer vertical plates, and the inner partition plates are surrounded to form electroplating zones; the outer vertical plates outside the inner partition plates are surrounded with the inner partition plates to form overflow tanks, and overflow pipes penetrating the outer vertical plates are arranged in the overflow tanks. At least one set of connecting blocks is arranged between the outer vertical plates and the inner partition plates, and the liquid supply pipe and the liquid discharge pipe penetrate the connecting blocks and extend into the electroplating zones. An annular placement platform is arranged in the electroplating zones, the annular placement platform is arranged on the inner partition plates and comprises at least a first placement step and a second placement step, the first placement step is higher than the second placement step, the steady flow orifice plate is detachably connected to the first placement step, and the anode mesh plate is detachably connected to the second placement step. One end of the anode power supply part is connected to the anode mesh plate, and the other end penetrates the tank body and extends out of the tank body; and the outer wall of the anode power supply part is sealingly connected to the tank body.
2. The blue membrane sheet plating tank according to claim 1, wherein The top of the inner partition plate is provided with a drainage slope, the top of the drainage slope faces the electroplating zones, and the bottom of the drainage slope faces the overflow tanks.
3. The blue membrane sheet plating cell according to claim 1 or 2, characterized by The outer periphery of the tank body is provided with a plurality of mounting blocks, the mounting blocks are located on the outer vertical plates and / or the bottom plate, and mounting screw holes are arranged on the mounting blocks.
4. The blue membrane sheet plating tank according to claim 3, wherein The tank body is at least partially light-transmitting, and the outer side of the light-transmitting part is provided with an LED light source.
5. The blue membrane sheet plating cell according to claim 3, wherein The top of the tank body is provided with at least three leveling pads, the leveling pads are detachably connected to the tank body, and the top surfaces of the leveling pads are horizontal and have the same height.
6. The blue membrane sheet plating cell according to claim 5, wherein 7. The blue membrane sheet electroplating cell according to claim 3, wherein 8. The blue membrane sheet electroplating cell according to claim 3, wherein 9. The blue membrane sheet electroplating cell according to any one of claims 1-2, 4-8, wherein, 10. The blue membrane sheet electroplating cell according to any one of claims 1-2, 4-8, wherein,