Direct cooling plate assembly

Abstract

The direct cooling plate assembly comprises a base plate and a liquid separation assembly, the base plate is provided with a plurality of installation areas used for installing heat source modules and a plurality of fluid channels, each installation area is provided with an evaporation cavity, each evaporation cavity communicates with each fluid channel, and the liquid separation assembly comprises a liquid separation head and a plurality of liquid separation pipes. One end of each liquid distribution pipe is connected with the cooling assembly through the liquid distribution head, and the other end of each liquid distribution pipe is communicated with the liquid inlet of the corresponding fluid channel. The flow distribution of refrigerants entering the fluid channels is more uniform through the liquid distribution heads, so that the heat dissipation effect is improved, the evaporation cavities are formed in the installation areas, when the heat source modules are installed in the installation areas, the temperature of the heat source modules can be directly conducted to the evaporation cavities, and the heat dissipation efficiency is improved. The evaporation cavities and the heat source modules are correspondingly distributed in the point shape, so that the situation that condensation is generated in the area, without power devices, of the direct cooling plate assembly is reduced, power consumption is reduced, and the safety of equipment is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic heat dissipation, in particular to a direct cooling plate assembly. BACKGROUND

[0002] With the rapid development of the laser industry, the power of the single laser module of the laser device is getting higher and higher, and the heat dissipation demand is also increasing. Traditional small-power lasers generally use air cooling for heat dissipation, and high-power lasers generally use water cooling for heat dissipation. In recent years, with the pursuit of miniaturization and high power in the laser industry, the problem is that the high-power heat source modules are arranged in a concentrated manner, especially in the case of portable handheld laser welding machines. The traditional air cooling method has low heat dissipation efficiency, and the water cooling method requires a large space to install the supporting water cooling equipment, which cannot meet the requirements of miniaturization, high power and high efficiency. Currently, the phase change cold plate has more obvious advantages in the field of high-power heat source heat dissipation.

[0003] In the process of implementing the present application, the inventors have found that at least the following technical problems exist in the prior art:

[0004] In the prior art, conventional cold plates increase the heat exchange area and the convective heat transfer coefficient by welding and clamping fins, and using toothed shovels, but there is a problem that the flow distribution is not uniform, which leads to poor temperature uniformity, especially in the case of multiple modules. In the case of point-like concentrated distribution of multiple high-power heat source modules, the heat exchange demand is also distributed in a point-like manner on the direct cooling plate, which means that the heat exchange area needs to be increased and the size of the cold plate needs to be increased. However, the point-like distribution of heat sources means that there is a relatively large area without heat sources, which greatly increases the risk of condensation on the surface of the cold plate, affecting the safe operation of the equipment. CONTENT OF THE UTILITY MODEL

[0005] In order to overcome the above-mentioned problems existing in the prior art, the main purpose of the present application is to provide a direct cooling plate assembly that can improve the uniformity of flow distribution to improve the heat dissipation effect.

[0006] In order to achieve the above-mentioned purpose, the following technical solutions are specifically adopted in the present application:

[0007] A direct cooling plate assembly, comprising:

[0008] a substrate provided with a plurality of mounting areas for mounting heat source modules and a plurality of fluid channels, each of the mounting areas being provided with an evaporation cavity, and each of the evaporation cavities being in communication with each of the fluid channels;

[0009] a liquid distribution assembly comprising a liquid distribution head and a plurality of liquid distribution pipes, one end of each of the liquid distribution pipes being connected to the cooling assembly through the liquid distribution head, and the other end of each of the liquid distribution pipes being in communication with the liquid inlet of each of the fluid channels.

[0010] In some embodiments, the lengths of the at least two distribution pipes are different.

[0011] In some embodiments, the substrate is provided with at least two rows of mounting areas along the width direction of the substrate, and the at least two rows of mounting areas are staggered along the length direction of the substrate.

[0012] In some embodiments, the direct cooling plate assembly further comprises a plurality of heat dissipation members, each of which is arranged in each evaporation cavity.

[0013] Each of the heat dissipation members comprises a cover plate and a toothed member, the cover plate is arranged on the evaporation cavity, and the side of the cover plate away from the evaporation cavity forms the mounting area, the toothed member comprises a plurality of teeth, each of which is connected to the side of the cover plate facing the evaporation cavity and is distributed along the width direction of the cover plate, so that a refrigerant flow channel is formed between adjacent two teeth.

[0014] In some embodiments, the toothed member is provided with a plurality of toothed members, each of which is distributed along the length direction of the cover plate, so that a mixing channel is formed between adjacent two toothed members, and the mixing channel is communicated with the refrigerant flow channel.

[0015] In some embodiments, the plurality of teeth are uniformly distributed along the width direction of the cover plate.

[0016] In some embodiments, the length of each tooth extends to the bottom wall of the evaporation cavity.

[0017] In some embodiments, the cover plate and the toothed member are integrally formed.

[0018] In some embodiments, the direct cooling plate assembly further comprises a header, the header is connected with the cooling assembly, and the header is connected with a plurality of axially distributed joints, each of which is communicated with the liquid outlet of each fluid channel.

[0019] In some embodiments, each of the fluid channels is linear.

[0020] Compared with the prior art, the direct cooling plate assembly provided by the present application has at least the following beneficial effects:

[0021] The liquid distribution assembly of the present application comprises a liquid distribution head and a plurality of liquid distribution pipes, one end of each liquid distribution pipe is connected with the cooling assembly through the liquid distribution head, and the other end of each liquid distribution pipe is in communication with the liquid inlet of each fluid channel. The liquid distribution head makes the flow distribution of the refrigerant entering each fluid channel more uniform, thereby improving the heat dissipation effect. In addition, each mounting area of the present application is provided with an evaporation cavity. When the heat source module is mounted in the mounting area, the temperature of the heat source module can be directly conducted to the evaporation cavity. By making the evaporation cavity correspondingly distributed in a dot shape with the heat source module, the condensation in the area without power devices of the direct cooling plate assembly is reduced, the power consumption is reduced, and the safety of the equipment is improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 A structure schematic diagram of the direct cooling plate assembly provided by the embodiment of the present application is shown in the figure.

[0023] Figure 2 A structure schematic diagram of the direct cooling plate assembly provided by the embodiment of the present application is shown in the figure.

[0024] Figure 3 A perspective view of the direct cooling plate assembly provided by the embodiment of the present application is shown in the figure.

[0025] Figure 4 A partial sectional view of the direct cooling plate assembly provided by the embodiment of the present application is shown in the figure.

[0026] Figure 5 A structure schematic diagram of the heat dissipation piece of the direct cooling plate assembly provided by the embodiment of the present application is shown in the figure.

[0027] Figure 6 A structure schematic diagram of the heat dissipation piece of the direct cooling plate assembly provided by the embodiment of the present application is shown in the figure.

[0028] Figure 7 A structure schematic diagram of the heat dissipation piece of the direct cooling plate assembly provided by the embodiment of the present application is shown in the figure.

[0029] REFERENCE NUMERALS:

[0030] 1, base plate; 11, mounting area; 12, fluid channel; 120, liquid inlet; 121, liquid outlet; 13, evaporation cavity;

[0031] 2, liquid distribution assembly; 21, liquid distribution head; 22, liquid distribution pipe; 23, pipe;

[0032] 3, header; 31, joint; 32, outflow port;

[0033] 4, heat source module;

[0034] 5, expansion valve;

[0035] 6, heat sink; 61, cover plate; 62, spading member; 620, spade; 63, refrigerant flow channel; 64, mixing passage. DETAILED DESCRIPTION

[0036] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0037] In the description of the present application, unless explicitly defined and limited, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" means two or more, and the term "multiple" means two or more; the terms "connection", "fixation" and the like should be understood in a broad sense, for example, "connection" can be fixed connection, or detachable connection, or integral connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0038] In the description of the present application, it should be understood that the "upper", "lower" and other orientation words described in the embodiments of the present application are described from the angle shown in the drawings, and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when referring to one element connected to another element "on" or "below", it can be directly connected to another element "on" or "below", or indirectly connected to another element "on" or "below" through an intermediate element.

[0039] The conventional direct cooling plate mostly adopts a serpentine flow channel to ensure the uniformity of the cooling plate, which is consistent with the uniform cooling plate in the liquid cooling plate. However, when the heat flux of a certain area is too high, the refrigerant in the cooling plate flow channel cannot meet the heat exchange of the local high-power heat source module, and more time or lower temperature of the whole cooling plate needs to be spent to dissipate heat of the heat source module, resulting in poor heat dissipation effect of the uniform cooling plate.

[0040] Referring to Figures 1-3 As shown in the drawings, Figure 1 The structure schematic diagram of the direct cooling plate assembly provided by the embodiments of the present application, Figure 2 The structure schematic diagram of the direct cooling plate assembly provided by the embodiments of the present application, Figure 3A perspective view of a direct cooling plate assembly is provided in the embodiments of the present application. The embodiments disclose a direct cooling plate assembly, which comprises a base plate 1, a distribution assembly 2 and a collecting pipe 3. The base plate 1 is provided with a plurality of mounting areas 11 for mounting heat source modules 4 (the heat source modules 4 can be components such as batteries) and a plurality of fluid channels 12 distributed along the length direction of the base plate 1. Each mounting area 11 is provided with an evaporation cavity 13, and each evaporation cavity 13 is in communication with each fluid channel 12, thereby meeting the heat exchange of the heat source modules 4 with local high power, without spending more time or lowering the temperature of the whole direct cooling plate assembly to dissipate heat of the heat source modules 4, and improving the heat dissipation effect of the direct cooling plate assembly. The distribution assembly 2 comprises a distribution head 21 and a plurality of distribution pipes 22. One end of each distribution pipe 22 is connected to the distribution head 21, and the distribution head 21 is connected to a cooling assembly through a pipe 23. The other end of each distribution pipe 22 is in communication with the liquid inlet 120 of each fluid channel 12. The liquid outlet 32 of the collecting pipe 3 is connected to the cooling assembly, and the collecting pipe 3 is connected to a plurality of axially distributed joints 31. Each joint 31 is in communication with the liquid outlet 121 of each fluid channel 12. The length direction of the base plate 1 is the X direction in Figure 3 , and the width direction of the base plate 1 is the Y direction in Figure 3 .

[0041] Specifically, the cooling assembly comprises a refrigerant pump, a heat exchanger and an expansion valve 5. The refrigerant pump is connected to the input end of the heat exchanger through a pipeline, the output end of the heat exchanger is connected to the input end of the expansion valve 5 through a pipeline, the output end of the expansion valve 5 is connected to each distribution pipe 22 through the pipe 23, and the liquid outlet 32 of the collecting pipe 3 is connected to the refrigerant pump. In operation, the refrigerant pump compresses the refrigerant into a high-temperature and high-pressure gas state, drives the gaseous refrigerant into the heat exchanger for heat exchange to obtain a liquid refrigerant with medium temperature and high pressure, then drives the liquid refrigerant with medium temperature and high pressure to flow into the expansion valve 5, and the liquid refrigerant becomes a low-temperature and low-pressure gas-liquid mixture after being decompressed by the expansion valve 5. The low-temperature and low-pressure gas-liquid mixture refrigerant is uniformly distributed into each distribution pipe 22 from the nozzle of the distribution head 21 through the pipe 23, then reaches each evaporation cavity 13 through each fluid channel 12, and exchanges heat with the heat source modules 4 of each mounting area 11 to reduce the temperature of each heat source module 4. The refrigerant directly evaporates to dissipate heat, with high heat dissipation density and fast heat dissipation efficiency. After heat exchange, the refrigerant changes from liquid state to gaseous state, flows out of the liquid outlet 121 of each fluid channel 12, and is collected in the collecting pipe 3, then returns to the refrigerant pump through the liquid outlet 32 for compression, and the cycle is repeated.

[0042] In the embodiments, the lengths of at least two distribution pipes 22 are different, so that in the case that the heat of the heat source modules 4 on the plurality of mounting areas 11 is different, the temperature difference between the plurality of evaporation cavities 13 can be reduced by connecting the distribution pipes 22 with different lengths, thereby improving the accuracy of temperature control, and further improving the heat dissipation effect of the direct cooling plate assembly.

[0043] In the embodiment, each fluid channel 12 is linear, that is, the length of each fluid channel 12 extends along the width direction of the base plate 1, and the liquid inlet 120 and the liquid outlet 121 of each fluid channel 12 are located at the two ends of the base plate 1. Compared with the existing serpentine flow channel, the linear flow channel can reduce the flow resistance of the fluid, thereby reducing the energy consumption of the pump and improving the overall efficiency of the system.

[0044] The liquid distribution assembly 2 of the embodiment includes a liquid distribution head 21 and a plurality of liquid distribution pipes 22. One end of each liquid distribution pipe 22 is connected to the cooling assembly through the liquid distribution head 21, and the other end of each liquid distribution pipe 22 communicates with the liquid inlet 120 of each fluid channel 12. The liquid distribution head 21 makes the flow distribution of the refrigerant entering each fluid channel 12 more uniform, thereby improving the heat dissipation effect. In addition, each mounting area 11 of the embodiment is provided with an evaporation cavity 13. When the heat source module 4 is mounted in the mounting area 11, the temperature of the heat source module 4 can be directly conducted to the evaporation cavity 13. By making the evaporation cavity 13 correspondingly distributed in a dot shape with the heat source module 4, the condensation of the area without power devices of the direct cooling plate assembly is reduced, the power consumption is reduced, and the safety of the equipment is improved.

[0045] Referring to Figure 3 As shown in the drawings, along the width direction of the base plate 1, the base plate 1 is provided with two rows of mounting areas 11, and each row of mounting areas 11 includes three mounting areas 11 arranged at intervals along the length direction of the base plate 1. The two rows of mounting areas 11 are arranged at intervals along the length direction of the base plate 1, thereby improving the mounting density of the heat source module 4 while reducing the mutual influence of the heat source modules 4, reducing the volume of the direct cooling plate assembly, thereby reducing the occupied space of the direct cooling plate assembly, facilitating the arrangement of the direct cooling plate assembly. In specific applications, the number of mounting areas 11 can be set as needed.

[0046] Referring to Figure 4 and Figure 5 As shown in the drawings, Figure 4 is a partial sectional view of the direct cooling plate assembly provided by the embodiment of the present application, Figure 5 is a structure schematic view of the heat dissipation piece of the direct cooling plate assembly provided by the embodiment of the present application. The direct cooling plate assembly further includes a plurality of heat dissipation pieces 6, and each heat dissipation piece 6 is arranged in each evaporation cavity 13. Each heat dissipation piece 6 includes a cover plate 61 and a toothed shovel piece 62. The cover plate 61 is arranged on the evaporation cavity 13, and the side of the cover plate 61 away from the evaporation cavity 13 forms the mounting area 11. The toothed shovel piece 62 includes a plurality of toothed shovels 620, which are connected to the side of the cover plate 61 facing the evaporation cavity 13 and are arranged at intervals along the width direction of the cover plate 61, so that the refrigerant flow channel 63 is formed between the adjacent two toothed shovels 620. When the heat source module 4 is mounted in the mounting area 11, the heat of the heat source module 4 can be conducted to the surface of the toothed shovel piece 62. The toothed shovel piece 62 exchanges heat with the liquid flowing through the evaporation cavity 13, thereby increasing the heat exchange area and improving the heat dissipation effect of the direct cooling plate assembly.

[0047] In this embodiment, the lengths of the shovel teeth 620 extend to the bottom wall of the evaporation chamber 13 respectively, so as to ensure that the shovel teeth 620 can contact the liquid flowing through the evaporation chamber 13, thereby ensuring that the shovel teeth 620 and the liquid flowing through the evaporation chamber 13 exchange heat sufficiently, and further improving the heat dissipation effect of the direct cooling plate assembly.

[0048] In this embodiment, the multiple shovel teeth 620 are uniformly distributed at intervals along the width direction of the cover plate 61, ensuring the uniformity of heat dissipation of the shovel tooth member 62.

[0049] In this embodiment, the cover plate 61 and the shovel tooth member 62 are integrally formed, which simplifies the process and is convenient for manufacturing. It can be understood that in other embodiments, the cover plate 61 and the shovel tooth member 62 can also be separately provided.

[0050] In this embodiment, the cover plate 61 and the substrate 1 are connected by welding to reduce the leakage of the liquid in the evaporation chamber 13 from the connection between the cover plate 61 and the substrate 1, ensuring the sealing performance of the evaporation chamber 13, and thus ensuring the normal operation of the direct cooling plate assembly. It can be understood that in other embodiments, the cover plate 61 and the substrate 1 can also be connected by other means, such as bolt connection or snap connection, as long as the connection between the cover plate 61 and the substrate 1 is sealed by a sealing member.

[0051] Refer to Figures 5-7 as shown in Figure 6 which is a front view structural schematic diagram of the heat dissipation member of the direct cooling plate assembly provided by the embodiment of the present application, Figure 7 and which is a side view structural schematic diagram of the heat dissipation member of the direct cooling plate assembly provided by the embodiment of the present application. The shovel tooth member 62 is provided with multiple ones, and the multiple shovel tooth members 62 are distributed at intervals along the length direction of the cover plate 61 respectively, so as to form a mixing channel 64 between two adjacent shovel tooth members 62. The mixing channel 64 is communicated with the refrigerant flow channel 63, so that the refrigerant passing through each refrigerant flow channel 63 can be mixed in the mixing channel 64, reducing the situation that the gaps between the shovel teeth 620 are inconsistent during the processing of the shovel teeth 620, resulting in inconsistent flow rates of the refrigerant in each refrigerant flow channel 63, improving the consistency of the flow rates in each refrigerant flow channel 63, and making the gas-liquid two-phase uniformity of the refrigerant in the refrigerant flow channel 63 in the evaporation chamber 13 better, the evaporation more uniform, reducing the local temperature difference, and improving the heat dissipation effect.

[0052] In this embodiment, the shovel tooth member 62 is provided with three ones, and the three shovel tooth members 62 are distributed at intervals along the length direction of the cover plate 61 respectively, forming two mixing channels 64 to further improve the heat dissipation effect of the direct cooling plate assembly. In practical applications, the number of the shovel tooth members 62 can be set according to needs.

[0053] The above description is only the preferred embodiment of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A cold plate assembly, comprising: The application relates to a direct cooling plate assembly. The direct cooling plate assembly comprises a substrate provided with a plurality of mounting areas for mounting heat source modules and a plurality of fluid channels, each of the mounting areas is provided with an evaporation cavity, and each of the evaporation cavities is communicated with each of the fluid channels. The direct cooling plate assembly further comprises a plurality of heat dissipation pieces, each of the heat dissipation pieces is arranged in each of the evaporation cavities.

2. The cold plate assembly of claim 1, wherein, Each of the heat dissipation pieces comprises a cover plate and a toothed piece, the cover plate covers the evaporation cavity, and the side of the cover plate away from the evaporation cavity forms the mounting area.

3. The cold plate assembly of claim 1, wherein, The toothed piece comprises a plurality of teeth, the plurality of teeth are connected to the side of the cover plate facing the evaporation cavity and are distributed along the width direction of the cover plate, and the refrigerant flow channel is formed between two adjacent teeth.

4. The cold plate assembly of claim 1, wherein, The toothed piece is provided with a plurality of toothed pieces, the plurality of toothed pieces are distributed along the length direction of the cover plate, and the mixing channel is formed between two adjacent toothed pieces. The plurality of teeth are uniformly distributed along the width direction of the cover plate.

5. The cold plate assembly of claim 4, wherein, The length of each of the teeth extends to the bottom wall of the evaporation cavity.

6. The cold plate assembly of claim 4, wherein, The cover plate and the toothed piece are integrally formed.

7. The cold plate assembly of claim 4, wherein, The direct cooling plate assembly further comprises a collecting pipe connected with the cooling assembly, and the collecting pipe is connected with a plurality of joints distributed along the axial direction, each of the joints is communicated with the liquid outlet of each of the fluid channels.

8. The cold plate assembly of claim 4, wherein, Each of the fluid channels is linear.

9. The cold plate assembly of claim 1, wherein, ​ 10. The cold plate assembly of any one of claims 1-9, wherein, ​

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