High-frequency heating device for separating silicon wafer material seat from resin plate

Abstract

The utility model provides a high-frequency heating device for separating a silicon wafer material seat from a resin plate. The high-frequency heating device comprises a box body, a high-frequency heating mechanism, a transverse moving mechanism, a transmission mechanism, a heating jacking mechanism, a spraying mechanism and a control system, the high-frequency heating mechanism comprises an induction coil; the transverse moving mechanism is connected with the induction coil; the induction coil, the transverse moving mechanism and the spraying mechanism are all arranged in the box body; the transmission mechanism penetrates through the box body and is positioned below the induction coil; an exhaust mechanism and a waste gas treatment mechanism are arranged at the top of the box body. According to the high-frequency heating device designed by the utility model, eddy current is generated in the material seat through an alternating electromagnetic field generated by the induction coil, so that the material seat is heated, the heating process is fast, and the heating is uniform; through automatic control of the control system, continuous operation is achieved, and the heating efficiency is improved; manual operation is reduced, and the production cost is reduced; the method is high in applicability, high in safety and more environment-friendly.

Description

TECHNICAL FIELD

[0001] The utility model belongs to photovoltaic technical field especially, it is a kind of high-frequency heating device that silicon wafer stocker and resin plate separate. BACKGROUND

[0002] After the end of silicon wafer cutting, silicon wafer is separated from material plate first, then material plate and stocker are separated.The method that material plate and stocker are separated is generally water bath heating separation method, its principle is to raise the epoxy resin glue between the adhesive material plate and stocker to certain temperature by water bath heating method, to make it soften and lose adhesive ability, finally realize the separation of material plate and stocker.The main shortcomings of this method are:

[0003] 1) high energy consumption in water bath heating process, often need to heat 60-90min, need to keep water temperature at 90-100 ℃ all the time, with the increase of silicon wafer size, heating time will be longer, energy consumption is larger, water resource is wasted seriously, and heating efficiency is low.

[0004] 2) due to the existence of stocker thickness uneven, inconsistent specification and other reasons, often there is uneven heating problem, setting will cause carbonization in local area of stocker glue layer, and carbonized layer mark is difficult to remove.

[0005] 3) water bath heating process is high-temperature operation, it is difficult to avoid the safety risk to operator. INVENTION CONTENTS

[0006] To solve the above technical problems, the utility model provides a kind of high-frequency heating device that silicon wafer stocker and resin plate separate, heating is uniform, and heating time is short;The whole process is controlled by automation, improves the heating efficiency of stocker and resin plate, and is safe, more environmentally friendly.

[0007] The technical scheme adopted by the utility model is: a kind of high-frequency heating device that silicon wafer stocker and resin plate separate, including high-frequency heating mechanism and transverse moving mechanism;The high-frequency heating mechanism includes induction coil, for generating induction magnetic field to heat the stocker with resin plate, and soften the adhesive;The transverse moving mechanism is connected with the induction coil, for moving the induction coil along the length direction of the stocker with resin plate.

[0008] Further, it further includes box and transmission mechanism, the induction coil and the transverse moving mechanism are all arranged in the box;The transmission mechanism penetrates the box and is located below the induction coil, for transmitting the stocker with resin plate.

[0009] Further, the transmission mechanism is provided with a heating lifting mechanism, the heating lifting mechanism comprises a heating platform and a lifting device, so that the heating platform is lifted by the lifting device to approach the induction coil.

[0010] Further, the lateral movement mechanism is arranged on one side above the heating lifting mechanism, and the induction coil extends above the heating platform.

[0011] Further, a limiting assembly is arranged below the induction coil, so as to avoid the contact between the material holder with the resin plate and the induction coil.

[0012] Further, a temperature sensor is arranged in the box and faces the material holder with the resin plate after being lifted.

[0013] Further, a spraying mechanism is arranged in the box, the spraying mechanism comprises a plurality of spray heads and a water tank, and is communicated with an external water source through a circulating pipeline.

[0014] The spray head is arranged below the lateral movement mechanism and is higher than the height of the material holder with the resin plate when being lifted.

[0015] The water tank is arranged below the heating lifting mechanism.

[0016] Further, an exhaust mechanism and a waste gas treatment mechanism are arranged in communication with the box, so as to exhaust and treat the waste gas in the box.

[0017] Further, a limiting mechanism is arranged on one side of the transmission mechanism close to the box entrance, the limiting mechanism comprises a limiting piece and a limiting lifting mechanism, so that the limiting piece is lifted by the limiting lifting mechanism to block the material holder with the resin plate from entering the inside of the box.

[0018] Further, a control system is arranged and is electrically connected with the high-frequency heating mechanism, the lateral movement mechanism, the transmission mechanism, the temperature sensor, the spraying mechanism and the limiting mechanism.

[0019] The high-frequency heating device has the advantages and positive effects that:

[0020] (1) the high-frequency heating device designed by the utility model generates an alternating electromagnetic field by an induction coil, and the alternating electromagnetic field generates eddy current in the inside of the material holder to heat the material holder, the material holder transmits heat to the adhesive between the material holder and the resin plate and makes the adhesive soften quickly, the adhesive is softened more completely after a certain time of heat preservation, the heating process is fast and uniform.

[0021] (2) The resin plate adhered material seat is transmitted through the transmission mechanism, the whole operation process is automatically controlled through the control system, continuous operation is realized, the heating efficiency of the material seat and the resin plate is improved, manual operation is reduced, and production cost is reduced;

[0022] (3) The material seat adhered with the resin plate does not contact the induction coil, can be suitable for material seats of different specifications and sizes, has strong applicability and high safety;

[0023] (4) Waste gas generated in the heating process and the heat preservation process is discharged through the exhaust mechanism, and is discharged into the air after treatment through the waste gas treatment mechanism, so that environmental protection is further achieved;

[0024] (5) The spraying mechanism is arranged, liquid is sprayed to the material seat adhered with the resin plate when the temperature sensed by the temperature sensor exceeds the preset safety temperature, so that rapid cooling is realized, the safety of the heating process is further improved, and the sprayed liquid is recycled through the circulating pipeline, so that water resource consumption is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a structural schematic view of one specific embodiment of the utility model;

[0026] Figure 2 is another structural schematic view of one specific embodiment of the utility model;

[0027] Figure 3 is a transmission mechanism structural schematic view of one specific embodiment of the utility model;

[0028] Figure 4 is a horizontal moving mechanism schematic view of one specific embodiment of the utility model;

[0029] Figure 5 is a spraying mechanism structural schematic view of one specific embodiment of the utility model.

[0030] In the drawing:

[0031] 10, high-frequency heating mechanism; 11, induction coil; 12, heating host; 20, horizontal moving mechanism; 21, horizontal moving driving device; 22, horizontal moving guide rail; 23, moving support; 30, box body; 40, transmission mechanism; 41, support frame; 42, speed-up chain; 50, limiting component; 60, spraying mechanism; 61, spray head; 62, water tank; 70, exhaust mechanism; 80, heating lifting mechanism; 81, heating platform; 82, lifting device; 90, limiting mechanism; 91, limiting piece; 92, limiting jacking mechanism; 100, material seat adhered with resin plate. DETAILED DESCRIPTION

[0032] The embodiments of the utility model are described below in combination with the drawings.

[0033] As shown in Figure 1 , Figure 2 The utility model provides a kind of high-frequency heating device of silicon wafer stocker and resin plate separation, including high-frequency heating mechanism 10 and transverse moving mechanism 20;High-frequency heating mechanism 10 includes induction coil 11, for generating induction magnetic field to heat the stocker 100 with resin plate bonding, soften viscous adhesive;Transverse moving mechanism 20 is connected with induction coil 11, for making induction coil 11 move along the length direction of the stocker 100 with resin plate bonding, in the moving process, the alternating electromagnetic field generated by induction coil 11 generates eddy current inside the stocker 100 with resin plate bonding, make the stocker 100 with resin plate bonding heat, and then make viscous adhesive between stocker and resin plate soften, facilitate separating stocker and resin plate in subsequent process;Induction coil 11 moves at set speed, and each part of the length direction of the stocker 100 with resin plate bonding is uniformly heated to reach set temperature, and the set temperature is usually 80-100 DEG C, so as to facilitate viscous adhesive between stocker and resin plate to soften.This induction heating process is short, and the transmission speed is fast, and the heating is uniform, and the safety is high.

[0034] High-frequency heating mechanism 10 further includes heating host computer 12, and induction coil 11 is electrically connected with heating host computer 12.Specifically, heating host computer 12 generates alternating current, so that induction coil 11 forms alternating electromagnetic field, so that the inside of the stocker 100 with resin plate bonding below induction coil 11 generates alternating current, i.e. eddy current, and the atom in the stocker moves at high speed irregularly, and the atom collides and rubs each other to generate heat energy, so as to heat the stocker.Eddy current makes the viscous adhesive on the upper end face of the stocker reach set temperature and soften, so as to facilitate the separation of the stocker and the resin plate.

[0035] Further, it further includes box 30 and transmission mechanism 40, and induction coil 11 and transverse moving mechanism 20 are arranged on the inner side of the box, and heating host computer 12 is arranged on the outer side of box 30;Transmission mechanism 40 penetrates box 30 and is located below induction coil 11, and is used for transmitting the stocker 100 with resin plate bonding.

[0036] Specifically, the above-mentioned transmission mechanism 40 includes support frame 41, transmission drive device and transmission belt, and transmission drive device and transmission belt are arranged on support frame 41, and a part of the length of transmission belt and support frame 41 penetrates box 30, so as to facilitate the transmission of the stocker 100 with resin plate bonding from the outer side of box 30 to the lower side of induction coil 11 in the inner side of box 30, so as to facilitate heating, and after heating is completed, the stocker 100 with resin plate bonding is transmitted to the outer side of box 30;Subsequently, the next stocker 100 with resin plate bonding is transmitted to realize continuous operation.

[0037] The transmission belt is a commercially available product, which can be selected according to actual needs; preferably, the transmission belt adopts a double-speed chain 42, the material seat 100 with the resin plate bonded thereon is placed on the double-speed chain 42, and the length direction of the material seat 100 with the resin plate bonded thereon is perpendicular to the transmission direction when placed, and the transmission direction is perpendicular to the moving direction of the induction coil 11, so that the induction coil 11 can reciprocate along the length direction of the material seat 100 with the resin plate bonded thereon during heating.

[0038] Further, as shown in Figure 1 、 Figure 3 , the transmission mechanism 40 comprises a heating lifting mechanism 80, which is located inside the box body 30 and comprises a heating platform 81 and a lifting device 82, so that the heating platform 81 is lifted to approach the induction coil 11 through the action of the lifting device 82. Through the above technical solution, the material seat 100 with the resin plate bonded thereon is lifted to a set height close to the induction coil 11, which can make the induction coil 11 more effectively heat the material seat 100 with the resin plate bonded thereon, and avoid affecting the support frame 41 and the transmission belt.

[0039] Specifically, the transmission mechanism 40 adopts a double-speed chain 42, grooves are provided between the double-speed chains 42, the heating lifting mechanism 80 is arranged in the grooves, and the heating platform 81 is connected to the upper part of the lifting rod of the lifting device 82. When the material seat 100 with the resin plate bonded thereon is transmitted to above the heating platform 81, the lifting device 82 operates to lift the heating platform 81 above the double-speed chain 42, and then the material seat 100 with the resin plate bonded thereon is lifted to separate from the double-speed chain 42 and approach the induction coil 11. After heating is completed, the lifting device 82 operates to lower the heating platform 81 to a height lower than the double-speed chain 42, so that the material seat 100 with the resin plate bonded thereon after heating is placed on the double-speed chain 42, the material seat 100 with the resin plate bonded thereon is transferred to the outside of the box body 30, and the transfer of the material seat 100 with the resin plate bonded thereon is completed.

[0040] In this application, the heating platform 81 is preferably square, the width of which is less than the distance between the two double-speed chains 42, and the heating platform 81 is arranged between the two double-speed chains 42, which can lift the middle part of the material seat 100 with the resin plate bonded thereon, so that the material seat 100 with the resin plate bonded thereon can be stably supported.

[0041] The lifting device 82 can be a pneumatic cylinder or a pneumatic guide rail, or a gear and rack transmission, or other lifting devices 82, which can be selected according to actual needs, and no specific requirements are made here. Preferably, the lifting device 82 is a pneumatic cylinder, and the heating platform 81 is arranged on the upper part of the lifting rod of the pneumatic cylinder, so that the heating platform 81 can be lifted relative to the double-speed chain 42.

[0042] Further, as shown in Figure 1 、 Figure 4As shown, the transverse moving mechanism 20 is arranged on one side above the heating lifting mechanism 80, so that the induction coil 11 extends to above the heating platform 81 on one side; the shape and size of the induction coil 11 can be set as required, preferably, the induction coil 11 is a planar spiral, and the radius is set to be able to cover the full width of the material seat 100 with the resin plate bonded; during operation, the induction coil 11 is parallel to the material seat 100 with the resin plate bonded; specifically, the high-frequency heating device of the present application is used for heating silicon wafer material seats and resin plates of different specifications, so the radius of the induction coil 11 is greater than the width of the material seat of the largest specification in its applicable range.

[0043] Specifically, the transverse moving mechanism 20 can adopt a pneumatic cylinder or pneumatic guide rail, or a gear and rack transmission, or other transverse moving mechanisms 20, preferably, the transverse moving mechanism 20 includes a transverse moving driving device 21 and a transverse moving guide rail 22, the transverse moving driving device 21 adopts a pneumatic cylinder, and a moving bracket 23 is slidably arranged on the transverse moving guide rail 22, and the induction coil 11 is arranged on the moving bracket 23, so that the induction coil 11 can reciprocate along the transverse moving guide rail 22, and the moving range can cover the full length of the material seat 100 with the resin plate bonded, that is, the length of the transverse moving guide rail 22 is not less than the length of the material seat of the largest specification in its applicable range.

[0044] Specifically, the moving bracket 23 extends towards the heating platform 81, so that the induction coil 11 is above the heating platform 81, and the height of the induction coil 11 is higher than the material seat 100 with the resin plate bonded on the heating platform 81 after jacking up.

[0045] Preferably, the transverse moving mechanism 20 is arranged on a mounting bracket inside the box body 30, and the mounting bracket is connected to the conveying mechanism 40, so that the transverse moving mechanism 20 is above one side of the material seat 100 with the resin plate bonded on the heating platform 81 after jacking up in the length direction, and the length direction of the transverse moving guide rail 22 of the transverse moving mechanism 20 is arranged along the length direction of the material seat 100 with the resin plate bonded.

[0046] Further, as shown, Figure 5 The inside of the box body 30 is also provided with a limiting assembly 50 below the induction coil 11, which is used to limit the contact between the material seat 100 with the resin plate bonded and the induction coil 11 after being jacked up by the heating platform 81.

[0047] Specifically, the limiting assembly 50 is arranged on the mounting bracket or the conveying mechanism, and the limiting assembly 50 includes a horizontal plate, the height of which is slightly higher than the height of the material seat 100 with the resin plate bonded after being jacked up by the heating platform 81, so as to prevent the induction coil 11 from directly contacting the material seat 100 with the resin plate bonded and causing safety accidents,

[0048] Further, the box 30 is also provided with a temperature sensor, which is directed to the upper end surface of the material seat 100 to which the resin plate is bonded. The position of the temperature sensor can be set on the inner wall of the box 30, the mounting bracket or the conveying mechanism 40, and can be set as required. The temperature sensor monitors the temperature of the upper end surface of the material seat 100 to which the resin plate is bonded, and the upper end surface of the material seat 100 to which the resin plate is bonded is provided with a plurality of monitoring points to ensure that each part of the material seat 100 to which the resin plate is bonded reaches the set temperature after heating. Then, the temperature is kept for a set time to effectively soften the adhesive, so as to facilitate the separation of the material seat and the resin plate in the subsequent process. When the temperature monitored by the temperature sensor exceeds the set safety temperature, an alarm signal is sent to interrupt the heating in time.

[0049] Further, as shown in Figure 1 、 Figure 5 , the box 30 is also provided with a spraying mechanism 60, which is communicated with an external water source through a circulating pipeline and includes a plurality of spray heads 61 and a water tank 62. The spray heads 61 are arranged along the length direction of the material seat 100 to which the resin plate is bonded and are arranged below the horizontal moving mechanism 20 and are directed to the position of the material seat 100 to which the resin plate is bonded when it is lifted up. The water tank 62 is arranged below the heating lifting mechanism 80. Preferably, the bottom of the box 30 is funnel-shaped as the water tank 62, the bottom of the funnel is connected with the circulating pipeline to prevent liquid from being sprayed outside and to reduce the space occupation. When the temperature monitored by the temperature sensor exceeds the set safety temperature, the spraying mechanism 60 is started, the liquid sprayed by the spray heads 61 is uniformly sprayed on the upper end surface of the material seat 100 to which the resin plate is bonded, so that the material seat 100 to which the resin plate is bonded is rapidly cooled down to avoid the upper end surface of the material seat 100 to which the resin plate is bonded from being excessively heated to cause carbonization and reduce the risk of fire. At the same time, the spray heads 61 are arranged below the horizontal moving mechanism 20, so that the sprayed liquid is not easy to fall on the horizontal moving mechanism 20 and the induction coil 11 to avoid affecting the use of the two. Then, the liquid falls into the water tank 62 below the heating lifting mechanism 80 and is recycled through the circulating pipeline. The water tank 62 is a tank structure with an open top, and its size is not less than that of the material seat, so that the liquid on the upper end surface of the material seat 100 to which the resin plate is bonded can fall into the water tank 62.

[0050] Further, as shown in Figure 1 、 Figure 2As shown, the high-frequency heating device provided in the present application further comprises an exhaust mechanism 70 and a waste gas treatment mechanism (not shown) in communication with the box 30. One end of the exhaust mechanism 70 is in communication with the box 30, and the other end is in communication with the waste gas treatment mechanism. The exhaust port of the waste gas treatment mechanism is in communication with the air. During the heating process of the material seat 100 with the resin plate bonded thereto, the adhesive softens to produce irritating gas. Directly discharging the gas into the air will pollute the environment. By providing the exhaust mechanism 70, the irritating gas can be discharged from the box 30. Further, the waste gas treatment mechanism is used for treatment. Finally, the treated gas is discharged into the air. The exhaust mechanism 70 and the waste gas treatment mechanism are commercially available products, which can be selected according to the needs. The specific structure is not described here. Preferably, the exhaust mechanism 70 is in communication with the box 30 through a pipeline connected to the top of the box 30.

[0051] Further, as shown in Figure 1 、 Figure 3 The limiting mechanism 90 is provided on the side of the transmission mechanism 40 close to the inlet of the box 30. The limiting mechanism 90 comprises a limiting piece 91 and a limiting jacking mechanism 92. The limiting jacking mechanism 92 can be raised to block the material seat 100 with the resin plate bonded thereto from entering the inside of the box 30. The limiting piece 91 is arranged above the double-speed chain 42 to prevent the blocked material seat 100 with the resin plate bonded thereto from being turned over. When the box 30 has a material seat 100 with a resin plate bonded thereto inside for heating, the limiting piece 91 is in a raised state. After the material seat 100 with the resin plate bonded thereto after heating is continuously transmitted by the transmission mechanism 40, the limiting piece 91 is lowered to enable the next material seat 100 with the resin plate bonded thereto to be heated by entering the inside of the box 30 through the transmission mechanism 40, so as to realize continuous operation.

[0052] The transmission mechanism 40 and the heating lifting mechanism 80 are arranged in the groove of the transmission mechanism 40 in the same way. The height of the limiting piece 91 after being lowered is lower than that of the double-speed chain.

[0053] Specifically, the limiting jacking mechanism 92 can adopt a pneumatic cylinder or a pneumatic guide rail, or a gear and rack transmission, or other transmission modes. Preferably, a pneumatic cylinder is adopted.

[0054] Further, the high-frequency heating device provided by the application further comprises a control system electrically connected with the high-frequency heating mechanism 10, the horizontal moving mechanism 20, the conveying mechanism 40, the temperature sensor, the spraying mechanism 60 and the limiting mechanism 90 respectively to control the actions of the high-frequency heating mechanism 10, the horizontal moving mechanism 20, the conveying mechanism 40, the temperature sensor, the spraying mechanism 60 and the limiting mechanism 90. The control device is a programmable controller, which is internally provided with an edited program, so that the high-frequency heating mechanism 10, the horizontal moving mechanism 20, the conveying mechanism 40, the temperature sensor, the spraying mechanism 60 and the limiting mechanism 90 act according to the edited program to automatically complete the heating of the material seat 100 with the resin plate, soften the adhesive, realize the control integration, improve the heating efficiency, reduce the personnel participation, realize the continuous operation and reduce the production cost.

[0055] A high-frequency heating method for a silicon wafer material seat and a resin plate, which adopts the high-frequency heating device and specifically comprises the following steps.

[0056] The material seat 100 with the resin plate is placed on the double-speed chain 42, the double-speed chain 42 is operated, and the material seat 100 with the resin plate is conveyed into the box body 30; the controller controls the limiting mechanism 90 to operate to block the next material seat 100 with the resin plate from entering the box body 30.

[0057] When the material seat 100 with the resin plate moves above the heating jacking mechanism, the control system controls the heating jacking mechanism to operate, the heating platform 81 lifts the material seat 100 with the resin plate to a set height, the heating host 12 is operated, the copper belt of the induction coil 11 forms an alternating electromagnetic field, the horizontal moving mechanism 20 is operated to drive the heating host 12 to move along the length direction of the material seat 100 with the resin plate at a set speed, so that each part of the material seat 100 with the resin plate is uniformly heated; in the heating process, the temperature sensor in the box body 30 measures the temperature of each monitoring point on the upper end surface of the material seat 100 with the resin plate, when the temperature of each monitoring point reaches 80-100℃, the temperature sensor sends a signal to the control system, and the control system controls the heating host 12 to stop operating; the material seat 100 with the resin plate after heating is kept stationary, and the temperature is kept for 1-2 minutes to ensure that the adhesive between the resin plate and the material seat is uniformly softened.

[0058] In the heating and temperature keeping process, the exhaust mechanism 70 and the waste gas treatment mechanism continuously work to exhaust and treat the waste gas in the box body 30 and finally discharge the waste gas into the air;

[0059] After the temperature keeping time ends, the controller controls the heating jacking mechanism to operate, the heating platform 81 drives the material seat 100 with the resin plate to descend to fall on the double-speed chain 42, and the material seat 100 with the resin plate is conveyed to the outside of the box body 30 along with the operation of the double-speed chain 42.

[0060] At this time, the controller controls the limiting mechanism 90 to operate, so that the next material holder 100 with the resin plate is transmitted into the box 30 by the multiple-speed chain 42, heated and kept warm, and automatic continuous operation is realized.

[0061] The temperature sensor is preset with a safety temperature, and when the temperature monitored by the temperature sensor exceeds the safety temperature, an alarm signal is sent to the control system, and the control system controls the spraying system to operate in response to the signal to spray liquid to the material holder 100 with the resin plate to rapidly cool it.

[0062] The high-frequency heating device designed by the utility model, through the eddy current generated by the alternating electromagnetic field generated by the induction coil in the internal of the material holder to heat the material holder, the material holder transmits heat to the adhesive between the material holder and the resin plate and makes the adhesive quickly soften, the adhesive softening is more thorough after a certain time of heat preservation, the conduction speed is fast, and the heating is uniform; the material holder with the resin plate is transmitted through the transmission mechanism, the whole operation process is automatically controlled through the control system, continuous operation is realized, the heating efficiency of the material holder and the resin plate is improved; manual operation is reduced, and the production cost is reduced; the material holder with the resin plate is not in contact with the induction coil, can be suitable for heating of material holders of different specifications and sizes, has strong applicability and high safety; the waste gas generated in the heating process and the heat preservation process is discharged through the exhaust mechanism, and is discharged into the air after being treated by the waste gas treatment mechanism, is more environmentally friendly; through the setting of the spraying mechanism, when the temperature sensed by the temperature sensor exceeds the preset safety temperature, liquid is sprayed to the material holder with the resin plate to realize rapid cooling, further improve the safety of the heating process, and the sprayed liquid is recycled through the circulating pipeline, reducing water consumption.

[0063] The embodiments of the utility model are described in detail above, but the content described can only be the preferred embodiment of the utility model, and cannot be considered as limiting the scope of the utility model. Any equivalent changes and improvements within the scope of the utility model application should still belong to the patent coverage of the utility model.

Claims

1. A high-frequency heating device for separating silicon wafer holders from resin plates, characterized in that: The high-frequency heating mechanism comprises an induction coil for generating an induction magnetic field to heat the material holder with resin plates to soften the adhesive; the lateral movement mechanism is connected with the induction coil and used to move the induction coil along the length direction of the material holder with resin plates.

2. The high frequency heating device for separating the silicon wafer stocker from the resin plate according to claim 1, characterized in that: The box and a transmission mechanism are further included, the induction coil and the lateral movement mechanism are arranged in the box; the transmission mechanism penetrates through the box and is located below the induction coil, and is used to transmit the material holder with resin plates.

3. The high frequency heating device for separating the silicon wafer stocker from the resin plate according to claim 2, characterized in that: The heating lifting mechanism is arranged on the transmission mechanism, and comprises a heating platform and a lifting device, so that the heating platform lifts the material holder with resin plates to be close to the induction coil through the action of the lifting device.

4. The high frequency heating device for separating the silicon wafer stocker from the resin plate according to claim 3, characterized in that: The lateral movement mechanism is arranged on one side above the heating lifting mechanism, and the induction coil extends above the heating platform.

5. The high frequency heating device for separating the silicon wafer stocker from the resin plate according to claim 3 or 4, characterized in that: A limiting assembly is further arranged below the induction coil to avoid the material holder with resin plates lifted by the heating platform from contacting the induction coil.

6. The high frequency heating device for separating the silicon wafer stocker from the resin plate according to claim 5, characterized in that: A temperature sensor is further arranged in the box and faces the material holder with resin plates after being lifted.

7. The high frequency heating device for separating the silicon wafer stocker from the resin plate according to claim 6, characterized in that: A spraying mechanism is further arranged in the box, and comprises a plurality of nozzles and a water tank, and is connected with an external water source through a circulating pipeline; wherein, The nozzles are arranged below the lateral movement mechanism and are higher than the height of the material holder with resin plates when being lifted; The water tank is arranged below the heating lifting mechanism.

8. The high frequency heating device for separating the silicon wafer stocker from the resin plate according to claim 7, characterized in that: An exhaust mechanism and a waste gas treatment mechanism are further arranged in communication with the box to exhaust and treat the waste gas in the box.

9. The high frequency heating device for separating the silicon wafer stocker from the resin plate according to claim 8, characterized in that: A limiting mechanism is arranged on one side of the transmission mechanism close to the entrance of the box, and comprises a limiting piece and a limiting jacking mechanism, so that the limiting piece is lifted to block the material holder with resin plates from entering the inside of the box through the action of the limiting jacking mechanism.

10. The high frequency heating device for separating the silicon wafer stocker from the resin plate according to claim 9, characterized in that: A control system is further included and is electrically connected with the high-frequency heating mechanism, the lateral movement mechanism, the transmission mechanism, the temperature sensor, the spraying mechanism and the limiting mechanism.

Images