Power supply device and vehicle

By setting separate housings and liquid cooling structures in the power supply unit, the heat dissipation and installation interference problems of the DC-DC module and the OBC module are solved, achieving efficient heat dissipation and lightweight design.

CN223567979UActive Publication Date: 2025-11-18SHINRY TECH
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Patent Information

Application Number
CN202521951471.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-11
Publication Date
2025-11-18
Estimated Expiration
2035-09-11

AI Technical Summary

Technical Problem

In existing power supply devices, DC-DC modules and OBC modules generate a lot of heat, and when installed together, they are not conducive to heat dissipation, are prone to mutual interference, and affect assembly and heat dissipation efficiency.

Method used

The power supply unit is equipped with a first receiving cavity and a second receiving cavity to respectively house the OBC motherboard and DC motherboard, which generate a large amount of heat. The heat is dissipated through a liquid cooling structure to avoid interference between modules and facilitate installation and heat dissipation.

Benefits of technology

Effective heat dissipation of the DC-DC and OBC modules was achieved, reducing installation interference, improving the assembly efficiency and safety of the power supply unit, while reducing the overall weight and size.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a power supply device and a vehicle, the power supply device comprises a shell, an OBC module and a DCDC module, and the shell is provided with a first accommodating cavity and a second accommodating cavity which are sequentially arranged in a first direction; the OBC module comprises an input filter board, an OBC mainboard, a first adapter and a high-voltage output filter board, both the input filter board and the high-voltage output filter board are accommodated in the first accommodating cavity, the OBC mainboard is accommodated in the second accommodating cavity, and the input filter board is connected with the OBC mainboard through the first adapter; the DCDC module comprises a DC main board and a low-voltage output filter board, and the DC main board and the low-voltage output filter board are accommodated in the first accommodating cavity. According to the power supply device, the OBC main board and the DC main board which are large in heat productivity are contained in the first containing cavity and the second containing cavity respectively, heat dissipation of the OBC main board and the DC main board is facilitated, meanwhile, the DCDC module and the OBC module do not interfere with each other during installation, and assembling of the power supply device is facilitated.
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Description

Technical Field

[0001] This utility model relates to the field of power supply technology, specifically to a power supply device and a vehicle. Background Technology

[0002] In recent years, with the rapid development of new energy electric vehicles, energy conservation, environmental protection, safety, and lightweighting will become the main development directions for future new energy electric vehicles. Among these, the power supply unit in a new energy electric vehicle provides power to the vehicle.

[0003] In existing power supply units, both the DC-DC module and the OBC module generate a significant amount of heat. When these two modules are installed together, heat dissipation is difficult, and they are prone to interfering with each other during installation. Utility Model Content

[0004] The purpose of this invention is to provide a power supply device and vehicle that solves the problems of inconvenient installation and concentrated heat generation of the DC-DC module and OBC module in the power supply device.

[0005] To achieve the objectives of this utility model, the following technical solution is provided:

[0006] In a first aspect, this utility model provides a power supply device, including a housing, an OBC module, and a DC-DC module. The housing has a first receiving cavity and a second receiving cavity arranged sequentially in a first direction. The OBC module includes an input filter board, an OBC main board, a first adapter, and a high-voltage output filter board. The input filter board and the high-voltage output filter board are housed in the first receiving cavity, and the OBC main board is housed in the second receiving cavity. The input filter board and the OBC main board are connected through the first adapter. The DC-DC module includes a DC main board and a low-voltage output filter board, both of which are housed in the first receiving cavity.

[0007] In one embodiment, the power supply device further includes a connection terminal assembly disposed on the housing and corresponding to the first receiving cavity in the first direction.

[0008] In one embodiment, the high-voltage output filter board is integrated into the DC main board, and the DC main board is connected to the OBC main board via a second adapter. The connection terminal assembly includes a low-voltage DC output terminal, a high-voltage DC output terminal, an external signal terminal, and a high-voltage input terminal. The low-voltage DC output terminal is electrically connected to the low-voltage output filter board, the high-voltage DC output terminal and the external signal terminal are both electrically connected to the DC main board, and the high-voltage input terminal is electrically connected to the input filter board. The low-voltage DC output terminal, the high-voltage DC output terminal, the external signal terminal, and the high-voltage input terminal are all located on the same side of the housing.

[0009] In one embodiment, the power supply device further includes a liquid cooling structure connected to the housing, wherein the first receiving cavity and the second receiving cavity are located on opposite sides of the liquid cooling structure in the first direction.

[0010] In one embodiment, the OBC module further includes an OBC device, the OBC motherboard is covered by the liquid cooling structure, and the OBC device is disposed between the OBC motherboard and the liquid cooling structure; and / or, the DC-DC module further includes a DC-DC device, the DC motherboard is covered by the liquid cooling structure, and the DC-DC device is disposed between the DC motherboard and the liquid cooling structure.

[0011] In one embodiment, the liquid cooling structure further includes a first receiving groove and a second receiving groove, wherein the opening of the first receiving groove faces opposite directions to the opening of the second receiving groove, and the opening of the first receiving groove faces the same direction as the opening of the first receiving cavity, wherein at least a portion of the DC-DC device is received in the first receiving groove, and / or, at least a portion of the OBC device is received in the second receiving groove.

[0012] In one embodiment, the OBC device includes a PFC inductor and an OBC transformer, the PFC inductor and the OBC transformer being electrically connected to the OBC motherboard and both being housed in the second receiving slot, the OBC transformer being closer to the connection terminal assembly than the PFC inductor.

[0013] In one embodiment, the OBC device further includes a capacitor, which is plugged into the OBC motherboard and housed in the second housing cavity, and the capacitor is thermally conductively connected to the liquid cooling structure.

[0014] In one embodiment, the DC-DC device further includes a DC transformer electrically connected to the DC motherboard and housed in the first receiving slot.

[0015] Secondly, this utility model also provides a vehicle, including a vehicle body, electrical components, and a power supply device as described in any one of the various embodiments of the first aspect. The power supply device is disposed within the vehicle body and is used to receive alternating current and convert the alternating current into direct current and output it to the electrical components to supply power to the electrical components.

[0016] By sequentially arranging a first receiving cavity and a second receiving cavity in the first direction, the OBC main board and DC main board, which generate a large amount of heat, are respectively housed in the first receiving cavity and the second receiving cavity, which facilitates the dissipation of heat from both. At the same time, the DC-DC module and the OBC module will not interfere with each other during installation, which facilitates the assembly of the power supply device. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A perspective view of a power supply device according to one embodiment;

[0019] Figure 2 An exploded view of a power supply device according to one embodiment;

[0020] Figure 3 This is a cross-sectional schematic diagram of a power supply device according to one embodiment;

[0021] Figure 4 This is a front view schematic diagram of a partial structure of a power supply device according to one embodiment.

[0022] Explanation of reference numerals in the attached figures:

[0023] 100 - Power supply unit;

[0024] 10-Housing, 11-First receiving cavity, 12-Second receiving cavity, 20-OBC module, 21-Input filter board, 22-OBC main board, 23-First adapter, 24-OBC device, 241-PFC inductor, 242-OBC transformer, 243-Capacitor, 25-High voltage output filter board, 26-Second adapter, 30-DC-CDC module, 31-DC main board, 32-Low voltage output filter board, 33-DC-CDC device, 331-DC transformer, 40-Connection terminal assembly, 41-Low voltage DC output terminal, 42-High voltage DC output terminal, 43-External signal terminal, 44-High voltage input terminal, 50-Liquid cooling structure, 51-First heat dissipation unit, 52-Second heat dissipation unit, 53-First receiving slot, 54-Second receiving slot;

[0025] Z - First direction. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or it can be in a middle component. When a component is said to be "connected" to another component, it can be directly connected to the other component or it may be in a middle component.

[0028] Unless otherwise defined, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used in this invention includes any and all combinations of one or more of the associated listed items.

[0029] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0030] Please refer to Figures 1 to 4This application provides a vehicle, including a vehicle body (not shown), electrical components (not shown), and a power supply device 100 as described in this application. The power supply device 100 is disposed in the vehicle body and is used to receive AC power and convert AC power into DC power to output to the electrical components to power them.

[0031] The vehicle may be an electric vehicle or a hybrid electric vehicle, and the vehicle body includes, but is not limited to, the chassis. The electrical components include, but are not limited to, headlights, display instruments, air conditioning, and audio systems, and are mounted on the vehicle body.

[0032] Optionally, the power supply unit 100 can be connected and fixed to the vehicle body by means of welding, bonding, snap-fitting, screwing, riveting, magnetic connection, etc., without limitation. The power supply unit 100 can output DC power to power the electrical devices.

[0033] Optionally, the vehicle may also include a power battery. The power supply unit 100 can receive a first alternating current (AC) signal and output a first direct current (DC) signal, thereby converting the AC input signal into high-voltage direct current required by the power battery to supply power to the power battery. The power supply unit 100 is connected to the vehicle's power battery. The power supply unit 100 can convert the high-voltage direct current input from the power battery into low-voltage direct current, thereby drawing power from the power battery and supplying power to the vehicle's electrical components.

[0034] The vehicle in this embodiment of the application uses the power supply device 100 of this embodiment of the application. The power supply device 100 supplies power to the electrical components. While achieving high power density, the power supply device 100 can dissipate the heat generated during operation in a timely manner, ensuring the safety of the power supply device 100 in use.

[0035] The power supply device 100 in the embodiments of this application will be described in detail below.

[0036] First, define the direction. Please refer to [the relevant documentation / reference]. Figure 1 Z represents the first direction. Optionally, the first direction Z can be the height direction of the power supply device 100.

[0037] Please refer to Figures 1 to 4 The present invention provides a power supply device 100, including a housing 10, an OBC module 20 and a DC-DC module 30. The housing 10 has a first receiving cavity 11 and a second receiving cavity 12 arranged sequentially in a first direction Z.

[0038] The shell 10 can be made of a material with high structural strength, specifically metal, high-strength plastic, ceramic, etc. Metal materials include aluminum, aluminum alloys, magnesium alloys, iron, and iron alloys. The shell 10 can be a one-piece structure, meaning it is manufactured using a single molding process, such as stamping or casting, without limitation. Alternatively, the shell 10 can be a modular structure, with its parts connected and fixed by welding, bonding, snap-fitting, screwing, etc.

[0039] In one specific embodiment, in the first direction Z, the first receiving cavity 11 is located above the second receiving cavity 12. It can be understood that when the power supply device 100 is placed horizontally on the ground, the first direction Z is the direction of gravity, and the first receiving cavity 11 is located on the side of the second receiving cavity 12 away from the bottom surface.

[0040] Optionally, in the first direction Z, the orthographic projection of the first receiving cavity 11 and the orthographic projection of the second receiving cavity 12 approximately coincide. With this arrangement, the first receiving cavity 11 and the second receiving cavity 12 are stacked in the first direction Z without increasing the volume of the power supply device 100 in other directions, thereby reducing the volume and weight of the power supply device 100 and facilitating the integration and lightweight design of the vehicle.

[0041] The OBC module 20 includes an input filter board 21, an OBC main board 22, a first adapter 23, and a high-voltage output filter board 25. The input filter board 21 and the high-voltage output filter board 25 are both housed in the first housing cavity 11, and the OBC main board 22 is housed in the second housing cavity 12. The input filter board 21 and the OBC main board 22 are connected through the first adapter 23.

[0042] The OBC (On-Board Charger) motherboard 22, as the core control unit in the OBC module 20 that realizes the charging function, is responsible for converting the AC power input from the external power source (such as a charging pile) into DC power suitable for charging the vehicle battery, and for precisely controlling and managing the charging process.

[0043] Optionally, the substrate of the OBC motherboard 22 may be any circuit board feasible in the art, such as a printed circuit board (PCB), without limitation.

[0044] The input filter board 21 is used to filter out high-frequency noise, spike pulses, and other interference signals in the input power supply, providing a clean and stable power input to the main board, thereby ensuring the normal operation of the vehicle power supply unit 100. Optionally, the substrate of the input filter board 21 can be set with reference to the substrate of the main board, which will not be described in detail here.

[0045] Optionally, the substrate of the input filter board 21 can be set with reference to the substrate of the motherboard, and will not be described in detail here.

[0046] Optionally, in the first direction Z, the OBC mainboard 22 is approximately parallel to the input filter board 21.

[0047] The first adapter 23 is used to establish an electrical connection between the OBC mainboard 22 and the input filter board 21. Specifically, the filtered AC power output from the input filter board 21 can be transmitted to the OBC mainboard 22 through the first adapter 23, and the OBC mainboard 22 converts the input AC power into pulsating DC power. Optionally, the first adapter 23 can be connected to the OBC mainboard 22 and the input filter board 21 by means of soldering, plugging, snap-fitting, or bonding.

[0048] Optionally, the first adapter 23 is an adapter board. In some other embodiments, the first adapter 23 may also be an adapter copper busbar or an adapter cable, or any other feasible adapter, without limitation.

[0049] The DC-DC module 30 includes a DC main board 31 and a low-voltage output filter board 32, both of which are housed in the first receiving cavity 11.

[0050] The DC mainboard 31, as the core conversion unit of the DCDC module 30, primarily functions to transform the input DC power supply voltage, providing a suitable base power for the subsequent low-voltage and high-voltage output sections. Optional, such as... Figure 4 As shown, the high-voltage output filter board 25 is integrated into the DC main board 31. The DC main board 31 includes a DC converter, a low-voltage output section and a high-voltage output section. The high-voltage output filter board 25 is integrated into the DC main board 31 to form the high-voltage output section.

[0051] Specifically, the DC converter section includes an input filter circuit, a switching control circuit, and an output rectifier filter circuit. The input filter circuit, located at the input of the DC converter section, filters out high-frequency noise and interference signals from the input power supply, preventing them from affecting subsequent circuits, and provides a stable input voltage to the DC converter section. The switching control circuit precisely controls the on / off time and frequency of the switching elements based on the feedback signal of the output voltage, thereby achieving stable regulation of the output voltage. The output rectifier filter circuit further smooths pulsating DC signals, outputting a stable DC voltage and providing reliable power to both the low-voltage and high-voltage output sections.

[0052] The low-voltage output section is used to further convert the basic power output from the DC converter into a stable low-voltage DC power supply required by the low-voltage electrical equipment in the vehicle, and the high-voltage output section is used to convert the basic power output from the DC converter into a high-voltage DC power supply required by the high-voltage electrical equipment in the vehicle.

[0053] By integrating a high-voltage output filter board 25 into the DC mainboard 31, the integration level of the power supply unit 100 can be improved, eliminating the need for excessive circuit boards and reducing the weight of the power supply unit 100.

[0054] The low-voltage output filter board 32 is used to filter out high-frequency electrical noise generated by the high-frequency switching of the switching device, making the output voltage smoother and more stable. It can also shape the waveform of the output voltage, reducing fluctuations and distortions. The low-voltage output filter board 32 can adopt any feasible circuit board structure in the art, without limitation.

[0055] Optionally, the low-voltage output filter board 32 is electrically connected to the low-voltage output section via an adapter copper busbar, and the low-voltage output filter board 32 can be set approximately parallel to the motherboard. In the orthographic projection of the motherboard, the orthographic projection of the low-voltage output filter board 32 is located within the orthographic projection of the motherboard.

[0056] In some other embodiments, the low-voltage output filter board 32 and the low-voltage output unit can also be electrically connected by cables, connecting pieces or other feasible connection structures, without limitation.

[0057] With this configuration, the low-voltage output filter board 32 is electrically connected to the low-voltage output section via an adapter copper busbar, and the main circuit board in the power supply unit 100 is integrated into one unit, which can improve the degree of integration and reduce the installation space.

[0058] Optional, such as Figure 4 As shown, the DC mainboard 31 is connected to the OBC mainboard 22 via the second adapter 26. Optionally, the second adapter 26 is an adapter cable. In some other embodiments, the second adapter 26 may also be an adapter board or an adapter busbar, or any other feasible adapter, without limitation.

[0059] Since the OBC motherboard 22 generates a lot of heat during operation, the OBC motherboard 22 and the DC motherboard 31 are spaced apart to facilitate heat dissipation and reduce mutual electromagnetic interference.

[0060] In this embodiment of the utility model, the power supply device 100 has a first receiving cavity 11 and a second receiving cavity 12 arranged sequentially in the first direction Z. The OBC main board 22 and DC main board 31, which generate a lot of heat, are respectively housed in the first receiving cavity 11 and the second receiving cavity 12, which facilitates the dissipation of heat from both. At the same time, the DC-DC module 30 and the OBC module 20 will not interfere with each other during installation, which facilitates the assembly of the power supply device 100.

[0061] In one implementation, such as Figure 1 As shown, the power supply device 100 also includes a connection terminal assembly 40, which is disposed in the housing 10 and corresponds to the first receiving cavity 11 in the first direction Z.

[0062] Optionally, the connection terminal assembly 40 and the housing 10 can be connected and fixed by means of welding, bonding, snap-fitting, screwing, riveting, magnetic connection, etc., without limitation.

[0063] With this configuration, the connection terminal assembly 40 is located on the same side of the housing 10, and the connection terminal assembly 40 is concentrated in the upper part of the housing 10 (i.e., the position corresponding to the housing 10 and the first receiving cavity 11), making the cable connection more centralized and facilitating the installation and maintenance of the power supply device 100. In addition, the same-side layout avoids the connection terminals being scattered in different positions of the housing 10, thereby reducing the overall size of the housing 10 and making the power supply device 100 more compact.

[0064] In some other embodiments, the low-voltage DC output terminal 41, the high-voltage DC output terminal 42, the external signal terminal 43, and the high-voltage input terminal 44 may also be disposed on adjacent or opposite sides of the housing 10, without any specific limitation.

[0065] In one implementation, such as Figure 1 and Figure 4 As shown, the connection terminal assembly 40 includes a low-voltage DC output terminal 41, a high-voltage DC output terminal 42, an external signal terminal 43, and a high-voltage input terminal 44. The low-voltage DC output terminal 41 is electrically connected to the low-voltage output filter board 32. The high-voltage DC output terminal 42 and the external signal terminal 43 are both electrically connected to the DC main board 31. The high-voltage input terminal 44 is electrically connected to the input filter board 21. The low-voltage DC output terminal 41, the high-voltage DC output terminal 42, the external signal terminal 43, and the high-voltage input terminal 44 are all located on the same side of the housing 10.

[0066] The low-voltage DC output terminal 41 is used to output the low-voltage DC power converted by the power supply device 100 to the electrical components of the vehicle, and the high-voltage output terminal is used to output the high-voltage DC power converted by the power supply device 100 to the electrical components of the vehicle. Optionally, the low-voltage DC output terminal 41 and the high-voltage DC output terminal 42 are spaced apart and arranged on the same side of the housing 10. The low-voltage DC output terminal 41 and the high-voltage DC output terminal 42 can be connected and fixed to the housing 10 by welding, bonding, snap-fitting, screwing, riveting, or other connection methods.

[0067] Optionally, the low-voltage DC output terminal 41 is soldered to the corresponding solder point of the low-voltage output filter board 32, and the high-voltage DC output terminal 42 is soldered to the corresponding solder point of the high-voltage output filter board 25 integrated on the DC main board 31, which can ensure a firm and reliable connection with low contact resistance.

[0068] The external signal terminal 43 is used to realize communication and control signal transmission between the power supply device 100 and external devices (such as charging guns, vehicle controllers, etc.). Optionally, the external signal terminal 43 can adopt a pin-type or socket-type structure, or any feasible external signal terminal 43 in the art, without limitation. Optionally, the external signal terminal 43 can be electrically connected to the DC mainboard 31 by means of soldering, crimping, snap-fitting, etc.

[0069] The high-voltage input terminal 44 is used to receive external high-voltage power (in vehicles, high-voltage power typically comes from a battery pack or generator) and stably transmit the high-voltage power to the input filter board 21, providing a basis for subsequent power conversion and processing. Optionally, the high-voltage input terminal 44 can be electrically connected to the input filter board 21 by means of soldering, plugging, snap-fitting, etc.

[0070] Optionally, the first adapter 23 may be connected to the end of the input filter board 21 away from the high-voltage input terminal 44. In some other embodiments, the high-voltage input terminal 44 and the first adapter 23 may also be electrically connected to the same side of the input filter board 21, without limitation.

[0071] With this configuration, the external signal terminal 43 and the high-voltage input terminal 44 work together to ensure the normal operation of the power supply unit 100. The external signal terminal 43 transmits the vehicle's operating status information to the main board, which adjusts the power supply's output parameters, such as voltage and current, based on this information. Simultaneously, the high-voltage input terminal 44 stably transmits external high-voltage power to the input filter board 21. The filtered power is then supplied to the main board and other circuit modules. Throughout this process, the two terminal components cooperate to ensure that the power supply unit 100 can provide appropriate electrical energy according to the vehicle's actual needs, and to guarantee the safety and stability of the power system.

[0072] Optionally, in the first direction Z, the external signal terminal 43 is located above the low-voltage DC output terminal 41, and the high-voltage DC output terminal 42 and the high-voltage input terminal 44 are approximately at the same height.

[0073] With this configuration, the low-voltage DC output terminal 41, the high-voltage DC output terminal 42, the external signal terminal 43, and the high-voltage input terminal 44 are located on the same side of the housing 10, making the cable connections more concentrated and facilitating the installation and maintenance of the power supply device 100.

[0074] In some other embodiments, the low-voltage DC output terminal 41, the high-voltage DC output terminal 42, the external signal terminal 43, and the high-voltage input terminal 44 may also be disposed on adjacent or opposite sides of the housing 10, without any specific limitation.

[0075] In one implementation, such as Figure 2 and Figure 3As shown, the power supply device 100 also includes a liquid cooling structure 50, which is connected to the housing 10. In the first direction Z, the first receiving cavity 11 and the second receiving cavity 12 are located on both sides of the liquid cooling structure 50, respectively.

[0076] The liquid cooling structure 50 and the shell 10 can be an integral structure, meaning that the liquid cooling structure 50 and the shell 10 are manufactured using a single molding process. This molding process can be stamping, casting, etc., and is not limited to any particular process. Alternatively, the liquid cooling structure 50 and the shell 10 can be separate structures, connected and fixed together by welding, bonding, snap-fitting, screwing, or other methods.

[0077] The liquid cooling structure 50 uses a flowing cooling medium to dissipate heat from the heat-generating components within the power supply unit 100. The cooling medium can be water, ethylene glycol solution, mineral oil, fluorinated liquid, deionized water, etc., and there are no restrictions. Optional options are available; please refer to [reference needed]. Figure 3 In the first direction Z, the liquid cooling structure 50 includes a first heat dissipation unit 51 and a second heat dissipation unit 52, and in the first direction Z, the first heat dissipation unit 51 is stacked on the second heat dissipation unit 52.

[0078] Optionally, the housing 10 includes a side peripheral wall and a mounting plate. The mounting plate is connected to the side peripheral wall and encloses it to form a first receiving cavity 11 and a second receiving cavity 12 spaced apart. The mounting plate includes a first surface and a second surface opposite to each other in a first direction Z. A first heat dissipation unit 51 is disposed on the mounting plate and protrudes from one side of the first surface, and a second heat dissipation unit 52 protrudes from one side of the second surface. Optionally, the first heat dissipation unit 51 corresponds to the first receiving cavity 11, and the second heat dissipation unit 52 corresponds to the second receiving cavity 12.

[0079] Optionally, in the orthographic projection of the first heat dissipation unit 51 in the first direction Z, at least partially overlap with the orthographic projection of the second heat dissipation unit 52. In other embodiments, in the orthographic projection of the first heat dissipation unit 51 and the second heat dissipation unit 52 in the first direction Z, they may also be spaced apart.

[0080] With this configuration, the liquid cooling structure 50 can simultaneously dissipate heat from the heat-generating devices in the first receiving cavity 11 and the second receiving cavity 12, thereby dissipating the heat generated by the power supply device 100 during operation and improving heat exchange efficiency.

[0081] In one implementation, such as Figure 2 and Figure 3As shown, the OBC module 20 also includes an OBC device 24, the OBC motherboard 22 is covered by the liquid cooling structure 50, and the OBC device 24 is disposed between the OBC motherboard 22 and the liquid cooling structure 50; and / or, the DC-DC module 30 also includes a DC-DC device 33, the DC motherboard 31 is covered by the liquid cooling structure 50, and the DC-DC device 33 is disposed between the DC motherboard 31 and the liquid cooling structure 50.

[0082] Optionally, the OBC device 24 can be thermally connected to the second heat dissipation unit 52; and / or, the DC-DC device 33 can be thermally connected to the first heat dissipation unit 51.

[0083] Optionally, the DC-DC device 33 includes a first power device, which is attached to the side of the first heat dissipation unit 51, or the first power device is tightly attached to the side of the first heat dissipation unit 51 via a spring-loaded tab. In other embodiments, the first power device can also be thermally conductively connected to the side or top surface of the first heat dissipation unit 51 via any other feasible connection method.

[0084] Optionally, the OBC device 24 includes a second power device, which is attached to the top surface of the second heat dissipation unit 52 (i.e., the surface of the second heat dissipation unit 52 facing away from the first heat dissipation unit 51). Alternatively, the second power device is in close contact with the top surface of the second heat dissipation unit 52 via a thermally conductive component. In other embodiments, the second power device may also be thermally conductively connected to the side or top surface of the second heat dissipation unit 52 via any other feasible connection method.

[0085] With this configuration, the OBC device 24 and the DC-DC device 33 are sandwiched between the OBC motherboard 22 and the DC motherboard 31, which facilitates the overall layout of the internal components of the power supply device 100. Furthermore, the liquid cooling structure 50 is positioned between the OBC device 24 and the DC-DC device 33 in the first direction Z, which can dissipate heat in a timely manner and prevent local heat accumulation.

[0086] In one implementation, such as Figure 3 As shown, the liquid cooling structure 50 also has a first receiving groove 53 and a second receiving groove 54. The opening of the first receiving groove 53 faces opposite directions to the opening of the second receiving groove 54. The opening of the first receiving groove 53 faces the same direction as the opening of the first receiving cavity 11. At least a portion of the DC-DC device 33 is received in the first receiving groove 53, and / or at least a portion of the OBC device 24 is received in the second receiving groove 54.

[0087] Optionally, the first heat dissipation unit 51 has a first receiving groove 53 at the end facing away from the second heat dissipation unit 52, and the second heat dissipation unit 52 has a second receiving groove 54 at the end facing away from the first heat dissipation unit 51. The DC-DC module 30 also includes a first magnetic element, and the OBC module 20 also includes a second magnetic element. The first magnetic element is received in the first receiving groove 53, and the second magnetic element is received in the second receiving groove 54.

[0088] The first magnetic element is electrically connected to the DC mainboard 31, and the second magnetic element is electrically connected to the OBC mainboard 22.

[0089] Optionally, the first heat dissipation unit 51 has a first water channel, and the second heat dissipation unit 52 has a second water channel, both of which are three-dimensional water channels. The first water channel surrounds the side wall of the first receiving groove 53, and the second water channel surrounds the side wall of the second receiving groove 54. Optionally, the opening direction of the first receiving groove 53 is opposite to the opening direction of the second receiving groove 54.

[0090] The first and second magnetic components include, but are not limited to, core magnetic components such as transformers and inductors. They achieve the conversion, transmission and regulation of electrical energy through the principle of electromagnetic induction, so as to realize the efficient and stable operation of the power supply device 100.

[0091] With this configuration, at least a portion of the DC-DC device 33 and at least a portion of the OBC device 24 are respectively disposed in the first receiving tank 53 and the second receiving tank 54 of the liquid cooling structure 50. This configuration can make full use of the internal space of the voltage device, and the cooling medium can flow in three dimensions within the three-dimensional channels of the first heat dissipation unit 51 and the second heat dissipation unit 52 to dissipate heat from the DC-DC device 33 and the OBC device 24. The contact area is large, which can improve the heat dissipation effect.

[0092] In one embodiment, the OBC device 24 includes a PFC inductor 241 and an OBC transformer 242, which are electrically connected to the OBC motherboard 22 and are both housed in a second receiving slot 54. The OBC transformer 242 is closer to the connection terminal assembly 40 than the PFC inductor 241.

[0093] The OBC transformer 242 is responsible for converting AC mains voltage to DC voltage to charge the vehicle's battery. The OBC transformer 242 plays a role in voltage transformation and electrical isolation within the OBC charger, ensuring the safety and efficiency of the charging process.

[0094] A PFC (Power Factor Correction) inductor improves the power factor of the power supply unit 100 by adjusting the input current waveform, reducing reactive power loss and improving energy efficiency. The PFC inductor 241 ensures that the equipment meets the power factor requirements of the power grid, improving the system stability of the power supply unit 100.

[0095] Optionally, the PFC inductor 241 and OBC transformer 242 can be connected to the OBC motherboard 22 by means of soldering, plugging, screwing, etc., without restriction.

[0096] In one specific embodiment, such as Figure 2 As shown, the first adapter 23 is located on the side of the input filter board 21 away from the connection terminal assembly 40, meaning the PFC inductor 241 is closer to the first adapter 23 than the OBC transformer 242. In use, the filtered AC power output from the input filter board 21 is transmitted to the OBC main board 22 via the first adapter 23, and the input current is preferentially adjusted through the PFC inductor 241, ensuring that the current phase of the subsequent input circuits is consistent with the voltage.

[0097] This design allows the heat generated by the PFC inductor 241 and OBC transformer 242 during operation to be dissipated promptly through the sidewall of the second receiving slot 54, ensuring the safety of the power supply device 100. Simultaneously, the reasonable layout of the PFC inductor 241 and OBC transformer 242 in the second receiving slot 54 facilitates the overall wiring of the OBC module 20.

[0098] In one implementation, such as Figure 2 As shown, the OBC device 24 also includes a capacitor 243, which is plugged into the OBC motherboard 22 and housed in the second housing cavity 12. The capacitor 243 is thermally conductively connected to the liquid cooling structure 50.

[0099] Capacitor 243 has the characteristics of storing and releasing charge. It can be used to absorb surge voltage when power devices are turned off, filter differential / common mode noise, provide low impedance circuits, etc., and can ensure the stable, efficient and safe operation of battery devices.

[0100] Optionally, capacitor 243 and OBC motherboard 22 can be connected by soldering, plugging, screwing, or other methods, without restriction. Optionally, capacitor 243 is disposed between the side wall of the second receiving groove 54 and the housing 10, and is thermally conductively connected to the second receiving groove 54.

[0101] With this configuration, the liquid cooling structure 50 can also dissipate heat from the capacitor 243 in a timely manner, eliminating the need for an additional heat dissipation structure and facilitating the miniaturization design of the power supply unit 100.

[0102] In one embodiment, the DC-DC device 33 further includes a DC transformer 331, which is electrically connected to the DC main board 31 and housed in the first receiving slot 53.

[0103] The DC transformer 331, as a functional component of the DC-DC converter, is responsible for converting between different DC voltage levels. Optionally, the DC transformer 331 is used to convert high-voltage DC voltage to low-voltage DC voltage. In some other embodiments, the DC transformer 331 can also be used to convert low-voltage DC voltage to high-voltage DC voltage.

[0104] Optionally, the DC transformer 331 and the DC motherboard 31 can be connected by soldering, plugging, screwing, or other methods, without restriction.

[0105] With this configuration, the DC transformer 331 is housed in the first receiving slot 53, which allows the heat generated by the DC transformer 331 during operation to be dissipated in a timely manner through the side wall of the first receiving slot 53, ensuring the safety of the power supply device 100.

[0106] In the description of the embodiments of this utility model, it should be noted that the orientation or positional relationship of the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and other indicators are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0107] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the present utility model.

Claims

1. A power supply device (100), characterized by, The power supply device (100) comprises a shell (10) having a first receiving cavity (11) and a second receiving cavity (12) arranged in sequence in a first direction; an OBC module (20) comprising an input filter board (21), an OBC main board (22), a first adapter (23) and a high-voltage output filter board (25), the input filter board (21) and the high-voltage output filter board (25) are accommodated in the first receiving cavity (11), the OBC main board (22) is accommodated in the second receiving cavity (12), and the input filter board (21) is connected with the OBC main board (22) through the first adapter (23); a DCDC module (30) comprising a DC main board (31) and a low-voltage output filter board (32), the DC main board (31) and the low-voltage output filter board (32) are accommodated in the first receiving cavity (11). The power supply device (100) further comprises a connection terminal assembly (40), which is arranged in the shell (10) corresponding to the first receiving cavity (11) in the first direction. The high-voltage output filter board (25) is integrated in the DC main board (31), and the DC main board (31) is connected with the OBC main board (22) through a second adapter (26); the connection terminal assembly (40) comprises a low-voltage DC output terminal (41), a high-voltage DC output terminal (42), an external signal terminal (43) and a high-voltage input terminal (44), the low-voltage DC output terminal (41) is electrically connected with the low-voltage output filter board (32), the high-voltage DC output terminal (42) and the external signal terminal (43) are both electrically connected with the DC main board (31), the high-voltage input terminal (44) is electrically connected with the input filter board (21), and the low-voltage DC output terminal (41), the high-voltage DC output terminal (42), the external signal terminal (43) and the high-voltage input terminal (44) are arranged on the same side of the shell (10). The power supply device (100) further comprises a liquid cooling structure (50) connected with the shell (10), and the first receiving cavity (11) and the second receiving cavity (12) are located on both sides of the liquid cooling structure (50) in the first direction.

2. The power supply device (100) according to claim 1, characterized in that The OBC module (20) further comprises an OBC device (24), the OBC main board (22) is covered on the liquid cooling structure (50), and the OBC device (24) is arranged between the OBC main board (22) and the liquid cooling structure (50); and / or, the DCDC module (30) further comprises a DCDC device (33), the DC main board (31) is covered on the liquid cooling structure (50), and the DCDC device (33) is arranged between the DC main board (31) and the liquid cooling structure (50).

3. The power supply device (100) according to claim 2, characterized in that ​ 4. The power supply device (100) according to claim 2, characterized in that ​ 5. The power supply device (100) according to claim 4, characterized in that ​ 6. The power supply device (100) according to claim 5, characterized in that The liquid cooling structure (50) further has a first accommodating groove (53) and a second accommodating groove (54), an opening of the first accommodating groove (53) is opposite to an opening of the second accommodating groove (54) in terms of direction, the opening of the first accommodating groove (53) is the same as the opening of the first accommodating cavity (11) in terms of direction, at least part of the DCDC device (33) is accommodated in the first accommodating groove (53), and / or at least part of the OBC device (24) is accommodated in the second accommodating groove (54).

7. The power supply device (100) according to claim 6, characterized in that The OBC device (24) comprises a PFC inductor (241) and an OBC transformer (242), the PFC inductor (241) and the OBC transformer (242) are electrically connected with the OBC main board, and are both accommodated in the second accommodating groove (54), the OBC transformer (242) is closer to the connection terminal assembly (40) than the PFC inductor (241).

8. The power supply device (100) according to claim 5, characterized in that The OBC device (24) further comprises a capacitor (243), the capacitor (243) is plugged into the OBC main board (22) and is accommodated in the second accommodating cavity (12), the capacitor (243) is in heat-conductible connection with the liquid cooling structure (50).

9. The power supply device (100) according to claim 6, characterized in that The DCDC device (33) further comprises a DC transformer (331), the DC transformer (331) is electrically connected with the DC main board (31) and is accommodated in the first accommodating groove (53).

10. A vehicle characterized by comprising: A vehicle body, an electric device, and a power supply device (100) according to any one of claims 1 to 9 are included, the power supply device (100) is arranged in the vehicle body, and the power supply device (100) is used to receive alternating current and convert the alternating current into direct current to output to the electric device to supply power to the electric device.