Multi-station parallel PCB electroplating equipment

Abstract

The utility model relates to the technical field of PCB (printed circuit board) electroplating, in particular to multi-station parallel PCB electroplating equipment, which comprises a rack with a plurality of stations, a plurality of electroplating units, flat conveying mechanisms and a plurality of mounting mechanisms for bearing PCBs to be plated with copper, the flat conveying mechanisms are provided with flat conveying structures corresponding to the electroplating units in number, and the flat conveying structures are arranged on the electroplating units; each flat conveying structure comprises a driving piece and a transmission assembly. Each station is provided with at least one electroplating unit, the driving part located on one electroplating unit drives the transmission assembly to drive the hanging mechanism at the electroplating unit to be horizontally conveyed to the next electroplating unit, and the adjacent electroplating units are operated in sequence so that the operation of the next working procedure can be carried out in order. The electroplating units of the same structure are arranged at multiple stations, so that the overall structural form of the equipment is simple and easy to operate, and a plurality of PCBs to be subjected to copper plating are treated and operated on each electroplating unit at different stations by using the same mounting mechanism, so that synchronous and continuous operation of multiple procedures is realized, and the electroplating efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to PCB board electroplating technical field, concretely relates to a kind of PCB electroplating equipment of multi-station parallel. BACKGROUND

[0002] The electroplating of PCB printed circuit board is a key step in the PCB manufacturing process, which is used to form a conductive layer on the surface and inner layer of PCB. The main purpose of electroplating is to establish sufficient conductivity on the metal layer of PCB to connect the components in the circuit. Specifically, copper plating refers to depositing a layer of copper plating on the circuit board and hole wall through electroplating copper to meet customer needs. Deep hole electroplating copper is a key process of printed circuit board. To plate copper on the surface of PCB, the PCB is usually placed in a copper solution, first chemically plated copper on the PCB, and then electroplated to make the copper layer more secure. According to different needs, multiple copper plating can be performed to obtain a thicker copper layer.

[0003] In related technology, the electroplating system for copper plating of PCB uses a motor to drive a conveyor belt to load the PCB to be plated with copper in a flat manner. The ring belt drives the PCB to move and completes electroplating during the movement. Chinese utility model patent CN117512749B discloses a vertical electroplating device, which has two sub-rack bodies for supporting electroplating corresponding to the products to be electroplated. The motor of the conveying assembly drives the driving wheel and the driven wheel located on the two sub-rack bodies to rotate to transport the PCB products from one sub-rack body to another sub-rack body, and the electroplating is completed during the transportation. This structure is complex and can only perform one electroplating process on the PCB. To perform secondary copper plating, the above structure needs to be repeated. This requires more work for the operator and greatly reduces the efficiency of the copper plating process. SUMMARY

[0004] The utility model aims to provide a kind of multi-station parallel's PCB electroplating equipment, it aims at reaching the purpose of simultaneously carrying out copper plating to multiple PCB to be plated with copper in single time to improve copper plating efficiency.

[0005] To achieve the above purpose, the utility model provides a kind of multi-station parallel's PCB electroplating equipment, including the rack with multiple stations, multiple electroplating units, flat conveying mechanism and several for carrying the PCB to be plated with copper hanging mechanism, at least one electroplating unit is arranged in each station, the flat conveying mechanism is equipped with the flat conveying structure corresponding to the number of electroplating units, and the flat conveying structure is arranged on the electroplating unit;Each flat conveying structure includes a driving member and a transmission assembly, the driving member on one electroplating unit drives the transmission assembly to drive the hanging mechanism at the electroplating unit to be horizontally transmitted to the next electroplating unit.

[0006] Optionally, two parallel guide rails are arranged on two sides of each mounting mechanism, and the transmission assembly is provided with two groups of transmission wheels, which are arranged on two sides of the driving member, and one group of transmission wheels is in transmission connection with one side of the guide rail, and the guide rail is arranged parallel to the parallel direction of the plurality of electroplating units.

[0007] Optionally, each group of transmission wheels comprises a driving wheel and a driven wheel arranged at intervals, the driving wheel is connected to the output end of the driving member, and the driven wheel of one electroplating unit is arranged adjacent to and spaced apart from the driving wheel of the next electroplating unit.

[0008] Optionally, the mounting mechanism comprises a mounting plate and guide plates arranged on two sides of the mounting plate, both of the guide plates are arranged in a bent manner with the mounting plate to form a movable space with the electroplating unit, the driving member and the transmission assembly are arranged in the movable space, and the end side of the guide plate away from the mounting plate is bent into the movable space to form the guide rail, the guide rail is provided with a downwardly open guide groove, and the guide rail is movably arranged on the transmission assembly in the movable space through the guide groove.

[0009] Optionally, each electroplating unit comprises a frame body provided with a cavity, a liquid containing member provided with an electroplating tank, and a lifting driving mechanism, the lifting driving mechanism comprises a cylinder arranged at the top of the frame body and a mounting plate arranged in the cavity, the flat conveying structure is arranged on the side of the mounting plate away from the cylinder, and the cylinder drives the mounting plate and the mounting mechanism arranged on the flat conveying structure to move up and down to extend or take out the PCB to be plated with copper into or out of the electroplating tank.

[0010] Optionally, the electroplating unit further comprises an anode plate and a liquid path assembly, the anode plate is arranged in the electroplating tank and is detachably arranged with the liquid containing member, the liquid containing member is further provided with a wire mounting groove on both sides of the electroplating tank for the anode plate to pass electricity, and the wire mounting groove is not in communication with the electroplating tank.

[0011] Optionally, the liquid containing member is provided with a liquid inlet and a liquid outlet at the bottom, and is provided with an overflow port adjacent to the tank opening of the electroplating tank, and the liquid path assembly comprises a liquid inlet pipe, a liquid outlet pipe and an overflow pipe corresponding to the liquid inlet, the liquid outlet and the overflow port.

[0012] Optionally, each frame body is provided with a first opening and a second opening adjacent to both sides of the adjacent electroplating unit, and the driving member drives the transmission assembly to drive the mounting mechanism to feed from the first opening of each electroplating unit and discharge from the second opening.

[0013] Optionally, the rack is provided with an upper feeding station and a lower feeding station at two ends, the upper feeding station is provided with two upper feeding units, the two upper feeding units are lifted up and down along the rack to feed materials, and the lower feeding station is provided with two lower feeding units, the two lower feeding units are lifted up and down along the rack to receive materials.

[0014] Optionally, a circulating power group is further arranged on the rack, the circulating power group is arranged at the top of the rack, and two ends of the circulating power group are connected with the upper feeding station and the lower feeding station respectively.

[0015] The PCB electroplating device with multiple parallel workstations comprises a rack provided with multiple workstations, multiple electroplating units, a horizontal conveying mechanism and a plurality of hanging mechanisms for carrying copper-plating PCB boards. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a front view structural schematic diagram of the PCB electroplating device with multiple parallel workstations.

[0017] Figure 2 It is a partial three-dimensional structural schematic diagram of the PCB electroplating device with multiple parallel workstations.

[0018] Figure 3 It is a three-dimensional perspective structural schematic diagram of the electroplating unit and internal structure of the PCB electroplating device with multiple parallel workstations.

[0019] Figure 4 It is a side view perspective structural schematic diagram of the electroplating unit and internal structure of the PCB electroplating device with multiple parallel workstations.

[0020] Figure 5 It is a structural schematic diagram of the hanging mechanism of the PCB electroplating device with multiple parallel workstations not entering an electroplating tank.

[0021] Figure 6 It is a structural schematic diagram of the hanging mechanism of the PCB electroplating device with multiple parallel workstations entering an electroplating tank.

[0022] Fig. 100, multi-station parallel PCB plating equipment; 10, rack; 20, plating unit; 21, frame body; 21A, cavity; 21B, first opening; 21C, second opening; 21D, activity space; 22, air cylinder; 23, mounting plate; 30, liquid containing member; 30A, plating tank; 30B, plating area; 30C, overflow port; 31, shell; 33, partition plate; 35, anode plate; 40, flat conveying mechanism; 41, flat conveying structure; 411, driving member; 413, driving wheel; 415, driven wheel; 50, mounting mechanism; 50A, guide rail; 51, mounting plate; 52, guide plate; 53, mounting position; 55, power connection part; 57, position limiter; 60, liquid path assembly; 61, liquid inlet valve; 63, liquid outlet valve; 65, overflow valve; 70, feeding unit; 80, discharging unit; 900, PCB to be plated with copper. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the utility model more clear and explicit, the technical scheme of the utility model will be described clearly and completely below in combination with the drawings.

[0024] The plating of PCB (Printed Circuit Board) is a key step in the PCB manufacturing process, which is used to form a conductive layer on the surface and inner layer of the PCB. The main purpose of plating is to establish sufficient conductivity on the metal layer of the PCB to connect the components in the circuit. Specific copper plating refers to depositing a layer of copper plating on the circuit board and hole wall through copper plating to meet the needs of customers. Deep hole copper plating is a key process in printed circuit boards. To plate copper on the surface of the PCB, the PCB is usually placed in a copper solution, first chemically plated with copper on the PCB, and then electroplated to make the copper layer more secure. According to different needs, multiple copper plating can be performed to obtain a thicker copper layer.

[0025] In related art, the plating system for plating copper on the PCB uses a motor to drive a conveyor belt to load the PCB to be plated with copper flatly. The ring belt drives the PCB to move and completes plating during the movement. Chinese utility model patent CN117512749B discloses a vertical plating device, which has two sub-frame bodies for supporting plating corresponding to the product to be plated. The motor of the conveying assembly drives the driving wheel and the driven wheel located on the two sub-frame bodies to rotate to transport the PCB product from one sub-frame body to another sub-frame body, and the plating is completed during the transportation. This structure is complex, and can only perform one plating process on the PCB. To perform secondary copper plating, the above structure needs to be repeated, which increases the workload of the operator and greatly reduces the efficiency of the copper plating process.

[0026] As Figures 1 to 2To achieve the above object, the utility model provides a multi -station parallel's PCB plating equipment 100. Referring to Figures 1 to 3 As shown, the multi -station parallel's PCB plating equipment 100 includes the rack 10 being equipped with multiple stations, multiple plating units 20, flat conveying mechanism 40 and several for carrying the copper -plated PCB board 900 hanging mechanism 50, each station sets at least one plating unit 20, flat conveying mechanism 40 is equipped with the flat conveying structure 41 corresponding the number of plating units 20, and one flat conveying structure 41 is correspondingly arranged on one plating unit 20, each flat conveying structure 41 includes driving part 411 and transmission assembly, and the driving part 411 on one plating unit 20 drives transmission assembly and drives the hanging mechanism 50 at the plating unit 20 horizontal transmission to next plating unit 20.

[0027] In the embodiment, at least one plating unit 20 is arranged in each station of the rack 10 of the multi -station parallel's PCB plating equipment 100, and multiple groups of operation can be simultaneously performed in one station. The driving part 411 on one plating unit 20 drives transmission assembly and drives the hanging mechanism 50 at the plating unit 20 horizontal transmission to next plating unit 20, and the driving part 411 of next plating unit 20 cooperates with transmission assembly to receive the hanging mechanism 50 translated from the previous plating unit 20 to perform the operation of the next process, and the adjacent plating units 20 are sequentially operated to orderly perform the operation of the next process. The plating units 20 of the same structure are arranged in multiple stations, so that the overall structure of the equipment is simple and easy to operate, and multiple copper -plated PCB boards 900 are processed by each plating unit 20 on the same hanging mechanism 50 in different stations, realizing the synchronization and continuous operation of multiple processes, and the full intelligent operation and processing, reducing the operation workload, greatly improving the plating efficiency and the orderliness and compactness of the operation of multiple processes.

[0028] Illustratively, the copper plating of the PCB generally includes the following process steps: 1. Prepare the solution: prepare a certain proportion of copper solution, which is generally composed of copper sulfate, sulfuric acid and hydrochloric acid. Mix copper sulfate and sulfuric acid according to a certain proportion, add enough water, and stir uniformly. Then gradually add hydrochloric acid to the mixed solution and continue to stir, and finally obtain the copper solution. 2. Pickling pre-invasion (station): the prepared PCB is cleaned with acetone or other cleaning agents to remove dirt and oxide layer on the surface. Then rinse with clean water and dry; 3. Glue: evenly coat the photosensitive glue on the copper plated surface of the PCB, and use the light shield plate to shield. Then place the PCB in the dryer to dry the photosensitive glue completely; 4. Exposure and development: align the dried PCB with the paper layer, and use the exposure machine to expose. Then place the exposed PCB in the developing solution, and wait for the developing solution to dissolve the unexposed photosensitive glue part to reveal the copper disc pattern; 5. Copper plating: according to the revealed copper disc pattern, put the PCB into the copper solution for copper plating. First, chemical copper plating is carried out on the PCB, and then electroplating is carried out to make the copper layer more firm. According to different needs, multiple copper plating can be carried out to obtain a thicker copper layer; 6. Pickling and impurity removal: clean the copper plated PCB with dilute sulfuric acid to remove the surface oxide layer. Then trim to remove excess copper layer to make the circuit on the PCB clearer; 7. Anticorrosion treatment: anticorrosion treatment is carried out on the trimmed PCB to protect the copper layer from oxidation and corrosion.

[0029] Illustratively, the multi-station parallel PCB plating equipment 100 is provided with multiple stations, except for the feeding station and the discharging station, at least one plating unit 20 is arranged in each station for copper plating. The multiple plating units 20 are of the same structure, so that the overall equipment has a simple and compact structure. The flat conveying mechanism 40 can drive each mounting mechanism 50 to each plating unit 20 one by one to complete the pickling, cleaning, copper plating (which can be repeated multiple times), cleaning, and anticorrosion plating of the copper plating process. The equipment structure is perfect, the operation is convenient, the manual operation steps are reduced, and it is suitable for popularization and use.

[0030] Further, the multi-station parallel PCB plating equipment 100 has the following beneficial effects:

[0031] 1. The multi-station parallel production mode that can be controlled individually can carry out multiple production processes through multiple treatment tanks at the same time, reducing production time and improving production efficiency;

[0032] 2. The multi-station parallel PCB plating equipment 100 can change the arrangement of the treatment tanks according to different production processes, thereby adapting to different process flows and having strong expansibility;

[0033] 3. The multi-station parallel PCB electroplating equipment 100 and the production using this equipment can realize continuous automated processing of PCB boards. Apart from placing the workpiece to be processed and removing the workpiece, there is no external operation, which reduces the workload of operators.

[0034] The arrangement direction of multiple PCBs to be plated with copper is defined as the X-axis direction, and the lifting direction of the PCBs is defined as the Z-axis direction. Then, the direction perpendicular to the X-axis and Z-axis is defined as the Y-axis direction. The intersection of the three axes, X-axis, Y-axis and Z-axis is the origin O point. The three axes and the origin O point together form a spatial rectangular coordinate system O-XYZ. The following description of various embodiments uses this coordinate system as the orientation standard.

[0035] Combined with reference Figure 4 and Figure 5 As shown, optionally, each electroplating unit 20 includes a frame 21 with a cavity 21A, a liquid container 30 with an electroplating tank 30A, and a lifting drive mechanism. The lifting drive mechanism includes a cylinder 22 located on the top of the frame 21 and a mounting plate 23 located in the cavity 21A. A horizontal conveying structure 41 is located on the side of the mounting plate 23 facing away from the cylinder 22. The cylinder 22 drives the mounting plate 23 and the hanging mechanism 50 hanging on the horizontal conveying structure 41 to move up and down to insert or remove the PCB to be plated into or out of the electroplating tank 30A.

[0036] In this embodiment, the cylinder 22 of the lifting drive mechanism is fixedly installed on the top of the frame 21, and its movable end is connected to the mounting plate 23 located in the cavity 21A. The liquid container 30 is located in the cavity 21A and is spaced directly below the mounting plate 23. The hanging mechanism 50 is detachably connected to the mounting plate 23. The side of the hanging mechanism 50 facing away from the mounting plate 23 has multiple parallel hanging positions 53 for suspending the PCB boards 900 to be plated with copper. The electroplating tank 30A has multiple spaced electroplating areas 30B corresponding to the PCB boards 900 to be plated with copper. The cylinder 22 drives the mounting plate 23 to drive the hanging mechanism 50 to rise and fall in the cavity 21A, so that multiple PCB boards 900 to be plated with copper enter or leave multiple electroplating areas 30B. Multiple PCB boards 900 to be plated with copper can be processed simultaneously by lifting and lowering. This process can be one of pickling, cleaning or electroplating treatment, which improves the orderliness, smoothness and efficiency of the copper plating operation of the PCB board.

[0037] Combined with reference Figure 6As shown, further, the liquid containing member 30 includes a housing 31 provided with an electroplating tank 30A and a plurality of partition plates 33, which are spaced apart along the X-axis direction in the electroplating tank 30A and detachably connected with the housing 31, each of the partition plates 33 is in the O-YZ plane to divide the electroplating tank 30A into a plurality of electroplating zones 30B, and the two side edges of each of the partition plates 33 along the Y-axis direction are spaced apart from the two side plates of the housing 31 along the Y-axis, so that the electrolytes of the plurality of electroplating zones 30B in the same electroplating tank 30A are communicated with each other, the distribution uniformity of the electrolyte in each of the electroplating zones 30B in the same electroplating tank 30A is improved, and the uniformity of the copper plating quality is improved.

[0038] Optionally, each of the frame bodies 21 is provided with a first opening 21B and a second opening 21C adjacent to the two sides of the adjacent electroplating units 20, and the driving member 411 drives the transmission assembly to drive the mounting mechanism 50 to feed from the first opening 21B of each of the electroplating units 20 and discharge from the second opening 21C.

[0039] Optionally, the rack 10 is provided with a feeding station and a discharging station at both ends, the feeding station is provided with two feeding units 70, and the two feeding units 70 are lifted up and down along the rack 10 to feed materials, and the discharging station is provided with two discharging units 80, and the two discharging units 80 are lifted up and down along the rack 10 to receive materials.

[0040] In this embodiment, the frame bodies 21 of the plurality of electroplating units 20 are arranged side by side along the Y-axis direction, the connecting line of the first opening 21B and the second opening 21C of the frame body 21 is the X-axis direction and is perpendicular to the arrangement direction of the plurality of copper-plated PCBs 900, and the feeding station and the discharging station are located at both ends of the plurality of frame bodies 21. The mounting mechanism 50 can be pre-assembled with the plurality of copper-plated PCBs 900, the mounting mechanism 50 enters the electroplating unit 20 from the first opening 21B of the first frame body 21 along the Y-axis direction from the feeding station, then the mounting mechanism 50 feeds from each of the first openings 21B along the Y-axis and discharges from the corresponding second openings 21C, until the copper plating operation is completed. The mounting mechanism 50 after the copper plating operation is transported to the discharging station by the horizontal conveying mechanism 40 for discharging, at this time, the next mounting mechanism 50 can continuously feed through the first opening 21B, improving the operation continuity, orderliness and operation efficiency of the copper plating operation.

[0041] Optionally, the rack 10 is further provided with a circulating power group, the circulating power group is arranged at the top of the rack 10, and the two ends of the circulating power group are connected with the feeding station and the discharging station, respectively.

[0042] In this embodiment, the circulating power group can be a linear transport structure combined with a motor and a pulley. The unloading unit 80 receives the mounting mechanism 50 and the PCB on the unloading station after the copper plating operation is completed. After the PCB on the mounting mechanism 50 is taken off, the unloading unit is raised along the Z axis to be received by the circulating power group. The circulating power group receives the mounting mechanism 50 and transports it along the top of the rack 10 and along the Y axis to the feeding station. Then, the mounting mechanism is assembled with the PCB to be plated with copper at the feeding station. Then, the assembled structure is sent to the electroplating unit adjacent to the feeding station and the copper plating operation is started. The overall structure is smooth, the feeding end and the unloading end are clearly divided, and the carrier is recycled, greatly improving the copper plating automation process and copper plating efficiency.

[0043] Optionally, each mounting mechanism 50 is provided with parallel guide rails 50A on both sides, and the transmission assembly is provided with two sets of transmission wheels. The two sets of transmission wheels are arranged on both sides of the driving member 411. One set of transmission wheels is in transmission connection with one side guide rail 50A, and the guide rail 50A is parallel to the parallel direction of the plurality of electroplating units 20.

[0044] In this embodiment, the parallel direction of the plurality of electroplating units 20 is the Y axis direction, and the guide rails 50A of the mounting mechanism 50 are located on both sides of the mounting mechanism 50 along the X axis and the guide rails 50A on both sides are parallel to the Y axis direction. The driving member 411 of the flat transport mechanism 40 can be a servo motor unit. The servo motor drives the transmission assembly to move the mounting mechanism 50 in a direction parallel to the Y axis. The transmission assembly is provided with two sets of transmission wheels, and the two sets of transmission wheels are arranged on both sides of the driving member 411 to correspond to the guide rails 50A on both sides of the mounting mechanism 50. The driving assembly drives the two sets of transmission wheels of the transmission assembly to rotate around the X axis to transport the mounting mechanism 50 along the Y axis. This facilitates each mounting mechanism 50 to process a plurality of PCBs arranged along the X axis in the same electroplating unit 20 at one time. Then, the mounting mechanism 50 is horizontally transported into the cavity 21A of the rack 21 of the next electroplating unit 20 through the cooperation of the flat transport structure 41 of the electroplating unit 20 and the flat transport structure 41 of the next electroplating unit 20. The operation is smooth and orderly, and manual intervention is not required, reducing the manual operation steps.

[0045] Optionally, each set of transmission wheels includes a driving wheel 413 and a driven wheel 415 arranged at intervals. The driving wheel 413 is connected to the output end of the driving member 411. The driven wheel 415 of one electroplating unit 20 is adjacent to and arranged at intervals with the driving wheel 413 of the next electroplating unit 20.

[0046] In the embodiment, the cooperation of the horizontal conveying structure 41 of the previous electroplating unit 20 and the horizontal conveying structure 41 of the next electroplating unit 20 horizontally transports the hanging mechanism 50 into the cavity 21A of the rack body 21 of the next electroplating unit 20. Specifically, the transmission wheel of each horizontal conveying structure 41 includes a driving wheel 413 connected to the output end of the driving motor, and a driven wheel 415 which can be driven by the driving wheel 413 through a belt linkage or directly contact the hanging mechanism 50 to roll and transmit the power transmitted by the driving wheel 413 to the hanging mechanism 50. The driven wheel 415 of one electroplating unit 20 is adjacent to and spaced apart from the driving wheel 413 of the next electroplating unit 20, so that during the feeding process of the horizontal conveying structure 41 of the previous electroplating unit 20, the driving wheel 413 of the transmission wheel of the next electroplating unit 20 receives the hanging mechanism 50 when the hanging mechanism 50 is not separated from the driven wheel 415 of the previous transmission wheel. In this way, the whole copper plating operation is smooth and orderly, and manual intervention is not required to complete the operation, reducing the manual operation steps.

[0047] Further, the rack body 21 is also provided with a stop portion, and the hanging mechanism 50 is provided with a limit stop 57 for abutting and limiting the stop portion, so that the PCB board to be plated with copper 900 is located directly above the electroplating tank 30A. When the mounting plate 23 and the hanging mechanism 50 are completely assembled, the stop portion on the rack body 21 abuts and limits the limit stop 57 of the hanging mechanism 50, improving the alignment accuracy of the PCB board to be plated with copper 900 and the electroplating tank 30A. At the same time, it also ensures the alignment accuracy of each PCB board to be plated with copper 900 and the electroplating area 30B directly below it, ensures the electroplating partition accuracy, avoids the electroplating interference between adjacent PCB boards to be plated with copper 900, and improves the copper plating efficiency and copper plating quality.

[0048] Further, the connection between the driving motor of the horizontal conveying structure 41 and the driving wheel 413 can be gear transmission, or can be connected by a belt, chain or the like. The driving wheel 413 and the driven wheel 415 located on both sides of the hanging mechanism 50 cooperate to horizontally transport the hanging mechanism 50 and the PCB board in the corresponding electroplating unit 20. The number of driving wheels 413 and driven wheels 415 can be changed according to the processing size of the PCB board. The limit stop 57 is used to control the horizontal displacement distance of the moving platform.

[0049] Optionally, the hanging mechanism 50 includes a hanging plate 51 and guide plates 52 arranged on both sides of the hanging plate 51. Both guide plates 52 are arranged with the hanging plate 51 to form an active space 21D with the electroplating unit 20. The driving member 411 and the transmission assembly are arranged in the active space 21D. The end side of the guide plate 52 away from the hanging plate 51 is bent to form a guide rail 50A in the active space 21D. The guide rail 50A is provided with a guide groove with an opening facing downward. The guide rail 50A is movably arranged on the transmission assembly in the active space 21D through the guide groove.

[0050] In the embodiment, the mounting mechanism 50 is arranged by bending the guide plates 52 and the mounting plate 51, so that each flat conveying structure 41 of the flat conveying mechanism 40 can be fixedly installed on the side of the mounting plate 23 away from the lifting cylinder 22. When the mounting mechanism 50 enters the cavity 21A of the frame 21 of the electroplating unit 20, the mounting plate 51, the two guide plates 52 and the mounting plate 23 temporarily form a movable space 21D. The movable space 21D is arranged to enable the flat conveying structure 41 to avoid the mounting mechanism 50, so that the layout is flexible and does not occupy extra space. Meanwhile, the mounting mechanism 50 and the flat conveying structure 41 can be naturally connected. After the connection, the stopper 57 on the mounting mechanism 50 abuts against the stopper to limit the position of the mounting mechanism 50 above the liquid containing member 30, so that the positioning accuracy of the mounting mechanism 50 and the electroplating tank 30A is improved, the smoothness of the lifting operation is ensured, and the copper plating operation efficiency of each electroplating unit 20 is improved.

[0051] Optionally, the electroplating unit 20 further comprises an anode plate 35 and a liquid path assembly 60. The anode plate 35 is arranged in the electroplating tank 30A and is detachably arranged with the liquid containing member 30. The liquid containing member 30 is further provided with a wire mounting groove on both sides of the electroplating tank 30A for the anode plate 35 to pass electricity. The wire mounting groove is not communicated with the electroplating tank 30A.

[0052] In the embodiment, the multi-station parallel PCB electroplating equipment 100 further comprises a plurality of anode plates 35 connected to the positive pole of the power supply. The number of anode plates 35 arranged in each electroplating unit 20 is consistent with the number of PCBs to be plated with copper arranged on the mounting mechanism 50. Each anode plate 35 is arranged in the electroplating tank 30A on the side corresponding to the electroplating area 30B. The PCB to be plated with copper 900 is located on the other side of the electroplating area 30B and is electrically connected to the negative pole of the power supply, so that the positive and negative poles of the power supply are connected to the anode plate 35 and the PCB to be plated with copper 900 respectively to form an electroplating electric circuit.

[0053] Specifically, for the electroplating copper station, the electrolyte is contained in the electroplating tank 30A. After each PCB to be plated with copper 900 enters the electroplating area 30B of the electroplating tank 30A, it is soaked in the electrolyte and is in communication with the negative pole of the power supply. The PCB and the anode plate 35 in communication with the positive pole of the power supply react through the electrolyte in the tank to realize copper plating of the PCB.

[0054] Further, the plurality of anode plates 35 are arranged on the same side of the plurality of electroplating areas 30B and are attached to the partition plate 33, so that the arrangement position of the anode plate 35 is regular and the arrangement position of the positive pole of the power supply is fixed, avoiding the risk of electric connection between adjacent electroplating areas 30B. Meanwhile, it is convenient to fix the arrangement position of the mounting position 53 on the mounting mechanism 50 and the PCB to be plated with copper 900, facilitating standardized operation.

[0055] Further, the mounting plate 51 is provided in an integrated structure with the guide plate 52 and in a U-shaped plate, and the end of the U-shaped side wall of the U-shaped plate is formed with an assembly part, the assembly part is detachably connected with the mounting plate 23, and the plurality of mounting positions 53 are arranged at the bottom of the U-shaped plate away from the mounting plate 23. The mounting plate 51 is provided with at least two mounting positions 53 corresponding to each copper-plated PCB 900, and the connecting lines of the mounting positions 53 of the same copper-plated PCB 900 are arranged along the Y-axis.

[0056] The opposite side of the anode plate 35 in the electroplating area 30B is provided with a negative electrode, and the mounting mechanism 50 includes an electrical connection part 55 arranged at the end of the mounting position 53, and the copper-plated PCB 900 is electrically connected with the negative electrode through the electrical connection part 55. Specifically, each mounting position 53 is provided with a mounting groove, and the copper-plated PCB 900 is provided with a mounting hole, and the groove wall of the mounting groove passes through the mounting hole to suspend the copper-plated PCB 900.

[0057] The mounting groove is a stepped groove with different upper and lower groove widths, the upper groove width is greater than the lower groove width, which facilitates the early mounting and assembly of the mounting hole of the copper-plated PCB 900 and the groove wall of the mounting groove, and the lower groove width is slightly greater than or equal to the thickness of the copper-plated PCB 900, so that the copper-plated PCB 900 is relatively limited by the groove wall of the lower groove after the mounting and assembly, and the shaking of the copper-plated PCB 900 is avoided.

[0058] Further, the electrical connection part 55 is arranged on the groove wall of the mounting groove, and the electrical connection part 55 is electrically connected with the copper-plated PCB 900 after the mounting and assembly. When the mounting plate 23 driven by the cylinder 22 drives the mounting mechanism 50 to descend completely into the electroplating tank 30A, the other end of the electrical connection part 55 is electrically connected with the negative electrode, so that the copper-plated PCB 900 is successfully connected into the electric circuit, and the electrolytic copper plating operation is performed. The stepped groove of the mounting groove also improves the reliability of the electrical connection between the electrical connection part 55 and the copper-plated PCB 900.

[0059] Optionally, the liquid container 30 is provided with a liquid inlet and a liquid outlet at the bottom, and a overflow port 30C is arranged adjacent to the tank opening of the electroplating tank 30A, and the liquid path assembly 60 includes a liquid inlet pipe, a liquid outlet pipe and an overflow pipe corresponding to the liquid inlet, the liquid outlet and the overflow port 30C.

[0060] In the embodiment, the liquid inlet pipe, the liquid outlet pipe and the overflow pipe are arranged at the bottom of the liquid containing member 30 and are spaced apart, and the overflow port 30C at the slot of the electroplating tank 30A corresponds to the overflow groove at the bottom of the liquid containing member 30 for temporarily storing overflow liquid. The liquid inlet pipe, the liquid outlet pipe and the overflow pipe are respectively installed to the openings of the liquid inlet port, the liquid outlet port and the overflow groove, and the liquid path assembly 60 further comprises a liquid inlet valve 61, a liquid outlet valve 63 and an overflow valve 65 connected to the liquid inlet pipe, the liquid outlet pipe and the overflow pipe, which are exposed to the bottom of the liquid containing member 30, facilitating manual operation, maintenance and repair. The multiple electroplating zones 30B in the same electroplating tank 30A are uniformly supplied with liquid through the liquid inlet valve 61, so that the electrolyte can be uniformly distributed in the multiple electroplating zones 30B. After the electrolyte in the electroplating tank 30A is filled, it flows into the overflow groove through the overflow port 30C, and finally flows out through the overflow valve 65 intermittently or at one time. The liquid outlet valve 63 is closed during the liquid inlet process and the electrolysis process, and is used to empty the electrolyte in the electroplating tank 30A when the electrolyte needs to be replaced.

[0061] Further, the liquid inlet pipe, the liquid outlet pipe and the overflow pipe are respectively arranged in correspondence with the number of the liquid inlet valve 61, the liquid outlet valve 63 and the overflow valve 65. In a specific embodiment, the liquid path assembly 60 can be provided with one liquid inlet pipe, two liquid outlet pipes and four overflow pipes, and the bottom of the corresponding liquid containing member 30 is provided with one liquid inlet valve 61, two liquid outlet valves 63 and four overflow valves 65. The number of the valves is set as required, and is not limited herein.

[0062] The PCB electroplating equipment 100 with multiple parallel workstations has the following beneficial effects:

[0063] 1. The PCB electroplating equipment 100 with multiple parallel workstations can automatically transport the copper-plated PCB boards into each electroplating tank, and can realize the automatic copper-plating process of the PCB boards, thereby reducing the labor cost input.

[0064] 2. Each electroplating unit in the PCB electroplating equipment 100 with multiple parallel workstations can be controlled to lift up and down individually, and the electroplating time can be freely regulated, so that the process can be adjusted according to the actual situation during the production process.

[0065] 3. The PCB electroplating equipment 100 with multiple parallel workstations can simultaneously produce multiple PCB boards and can simultaneously perform respective processing operations in multiple workstations, and the running time interval of each mounting mechanism 50 is relatively short, so that a next group of PCB boards can be immediately mounted after a group of PCB boards is sent in, thereby realizing the continuous production of the PCB boards and improving the production efficiency.

[0066] In the utility model, if the terms "inner", "outer", "upper", "lower" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, only for the convenience of describing the present application and simplifying the description, and not for indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, therefore, it cannot be understood as a limitation on the present application.

[0067] In the utility model, unless otherwise expressly specified and limited, if the terms "set", "mount", "fix", "connect" are understood in a broad sense, for example, "connect" can be fixed connection, can also be detachable connection, or integrally connected, can be mechanical connection, can also be electrical connection, can be directly connected, can also be indirectly connected through intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0068] The above is only the preferred embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structural transformation made by using the contents of the utility model specification and drawings, or direct / indirect application in other related technical fields under the concept of the utility model is included in the patent protection range of the utility model.

Claims

1. A multi-station parallel PCB plating apparatus, characterized by, The rack includes a plurality of workstations, a plurality of electroplating units, a flat conveying mechanism, and a plurality of hanging mechanisms for carrying PCBs to be plated with copper. Each of the workstations is provided with at least one electroplating unit. The flat conveying mechanism is provided with a number of flat conveying structures corresponding to the number of electroplating units, and the flat conveying structures are arranged on the electroplating units. Each of the flat conveying structures includes a driving member and a transmission assembly. The driving member on one of the electroplating units drives the transmission assembly to drive the hanging mechanism at the electroplating unit to be horizontally conveyed to the next electroplating unit.

2. The multi-station, parallel PCB plating apparatus of claim 1, wherein, Each of the hanging mechanisms is provided with parallel guide rails on both sides. The transmission assembly is provided with two sets of transmission wheels. The two sets of transmission wheels are arranged on both sides of the driving member. One set of the transmission wheels is in transmission connection with one of the guide rails. The guide rails are arranged in parallel with the parallel direction of the plurality of electroplating units.

3. The multi-station, parallel PCB plating apparatus of claim 2, wherein, Each of the sets of transmission wheels includes a driving wheel and a driven wheel arranged at intervals. The driving wheel is connected to the output end of the driving member. The driven wheel of one of the electroplating units is arranged adjacent to and at intervals from the driving wheel of the next electroplating unit.

4. The multi-station, parallel PCB plating apparatus of claim 2, wherein, The hanging mechanism includes a hanging plate and guide plates arranged on both sides of the hanging plate. Both of the guide plates are arranged at an angle with the hanging plate to form a movable space with the electroplating units. The driving member and the transmission assembly are arranged in the movable space. The end side of the guide plate away from the hanging plate is arranged at an angle into the movable space to form the guide rail. The guide rail is provided with a guide groove with an opening downward. The guide rail is arranged on the transmission assembly in the movable space through the guide groove.

5. The multi-station, parallel PCB plating apparatus of claim 1, wherein, Each of the electroplating units includes a frame body provided with a cavity, a liquid containing member provided with an electroplating tank, and a lifting driving mechanism. The lifting driving mechanism includes a pneumatic cylinder arranged on the top of the frame body and a mounting plate arranged in the cavity. The flat conveying structure is arranged on the side of the mounting plate away from the pneumatic cylinder. The pneumatic cylinder drives the mounting plate and the hanging mechanism arranged on the flat conveying structure to move up and down to extend or take out the PCB to be plated with copper into or out of the electroplating tank.

6. The multi-station, parallel PCB plating apparatus of claim 5, wherein, The electroplating unit further includes an anode plate and a liquid path assembly. The anode plate is arranged in the electroplating tank and is detachably arranged with the liquid containing member. The liquid containing member is further provided with a wire mounting groove on both sides of the electroplating tank for the anode plate to pass electricity. The wire mounting groove is not in communication with the electroplating tank.

7. The multi-station, parallel PCB plating apparatus of claim 6, wherein, The bottom of the liquid containing member is provided with a liquid inlet and a liquid outlet. The tank opening adjacent to the electroplating tank is provided with an overflow opening. The liquid path assembly corresponding to the liquid inlet, the liquid outlet, and the overflow opening includes a liquid inlet pipe, a liquid outlet pipe, and an overflow pipe.

8. The multi-station, parallel PCB plating apparatus of claim 5, wherein, Each of the frame bodies is provided with a first through hole and a second through hole adjacent to both sides of the adjacent electroplating unit. The driving member drives the transmission assembly to drive the hanging mechanism to feed from the first through hole of each of the electroplating units and discharge from the second through hole.

9. The multi-station, parallel PCB plating apparatus of any one of claims 1 to 8, wherein, The rack is provided with a feeding workstation and a discharging workstation at both ends. The feeding workstation is provided with two feeding units. The two feeding units move up and down along the rack to feed materials. The discharging workstation is provided with two discharging units. The two discharging units move up and down along the rack to receive or discharge materials.

10. The multi-station, parallel PCB plating apparatus of claim 9, wherein, The rack is also provided with a circulating power assembly, which is arranged at the top of the rack and has two ends connected with the feeding station and the discharging station respectively.

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