Tinning equipment for semiconductor element processing

Abstract

The utility model provides tinning equipment for processing semiconductor elements, which relates to the field of tinning of semiconductor elements and comprises a tinning bath, fixing blocks are fixedly mounted on two sides of the top of the tinning bath, mounting shells are movably mounted on the inner walls of the fixing blocks, and first clamping plates are fixedly mounted at the bottom of each mounting shell at equal intervals. Threaded rods are movably embedded in the mounting shell at equal intervals, the surfaces of the threaded rods are sleeved with second clamping plates in a threaded mode, and a stirring assembly is arranged at the bottom of the tinning bath. According to the tin plating device, every three adjacent first clamping plates, knobs, threaded rods and second clamping plates form a group, the middle of a metal shell is fixed through the first middle clamping plate and the second middle clamping plate, electrified tin plating is carried out, the two sides of the metal shell are fixed through the first clamping plates and the second clamping plates on the two sides, and middle fixing is loosened, so that the metal shell is plated with tin better; and the cover plate is taken down by screwing down the fixing bolts, so that the filter plate in the filter shell can be taken down for replacement and cleaning.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor element tinning technical field especially relates to a kind of tinning equipment for semiconductor element processing. BACKGROUND

[0002] Tinning process is based on electrochemistry principle, deposit a layer of tin metal on the surface of semiconductor element by the action of electric current, in this process, semiconductor element as cathode, tin bar or tin block as anode, tinning solution as electrolyte, under the action of electric current, tin of anode is oxidized into tin ion into tinning solution, while tin ion in tinning solution is reduced into metal tin on the surface of cathode, and deposit on the surface of electronic component to form plating layer, the surface treatment technology of tinning can improve the conductivity, corrosion resistance and solderability of semiconductor element, and the metal shell of semiconductor element installation needs to be tinned.

[0003] In the prior art, when tinning the metal shell, the tinning is not complete at the position where the metal shell is clamped, which affects the subsequent use of the metal shell, and the plating solution needs to be filtered during the tinning process. Long-term filtration can cause the filter layer to be blocked, affecting the filtration. UTILITARY MODEL

[0004] The utility model aims at providing a kind of tinning equipment for semiconductor element processing to solve the problems raised in the above background.

[0005] To achieve the above object, the utility model adopts the following technical scheme: a kind of tinning equipment for semiconductor element processing, comprising: tinning tank, the both sides of the top of the tinning tank are fixedly installed with fixed block, the inner wall of the fixed block is movably installed with installation shell, the bottom of the installation shell is fixedly installed with clamping plate one at equal distance, the inside of the installation shell is movably embedded with threaded rod at equal distance, one end of the threaded rod is fixedly installed with knob, the surface of the threaded rod is threadedly sleeved with clamping plate two, adjacent three clamping plate one, knob, threaded rod and clamping plate two are a group, the bottom of the tinning tank is provided with stirring assembly, one side of the tinning tank is fixedly installed with pipeline one, the other end of the pipeline one is fixedly installed with filter shell, the top of the filter shell is fixedly installed with water pump, the other end of the water pump is fixedly installed with pipeline two, the other end of the pipeline two is fixedly installed on the top of one side of tinning tank, the bottom of the tinning tank is fixedly installed with support leg, the number of support leg is four.

[0006] As a preferred embodiment, the other end of the threaded rod is installed in the inner wall of the installation shell through bearing, and the top of the clamping plate two is attached to the top of the inner wall of the installation shell.

[0007] As a preferred implementation form, one side of the top of the fixed block is movably embedded with a fixed rod, and the surface of the other end of the fixed rod is movably embedded on the other side of the top of the fixed block.

[0008] As a preferred implementation form, the stirring assembly comprises a motor, the output end of the motor is fixedly installed on the bottom of the tinning tank, the output end of the motor is fixedly installed with a rotating rod, and the other end of the rotating rod is fixedly installed with a stirring rod one.

[0009] As a preferred implementation form, the bottom surface of the stirring rod one is attached to the bottom of the inner wall of the tinning tank, and the end of the stirring rod one is fixedly installed with a stirring rod two.

[0010] As a preferred implementation form, the inner wall of the filter shell is movably installed with a filter plate, one side of the filter shell is fixedly installed with a mounting block, and the surface of the mounting block is movably sleeved with a cover plate.

[0011] As a preferred implementation form, one side of the filter shell is fixedly installed with a sealing sheet one, and one side of the cover plate is fixedly installed with a sealing sheet two.

[0012] Compared with the prior art, the device has the advantages and positive effects that:

[0013] 1. The utility model discloses a tinning equipment for semiconductor element processing, which comprises a tinning tank, a plurality of clamping plates, a plurality of knobs, a plurality of threaded rods and a plurality of clamping plates two.

[0014] 2. The utility model discloses a tinning equipment for semiconductor element processing, which comprises a tinning tank, a plurality of clamping plates, a plurality of knobs, a plurality of threaded rods and a plurality of clamping plates two. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a side view of the tinning equipment for semiconductor element processing provided by the utility model;

[0016] Figure 2 It is a cutting drawing of the tinning equipment for semiconductor element processing provided by the utility model;

[0017] Figure 3 It is a cutting drawing of the tinning equipment for semiconductor element processing provided by the utility model;

[0018] Figure 4 The utility model provides a filter shell side view of tinning equipment for semiconductor element processing is provided.

[0019] Figure 5 The utility model provides a cover plate side view of tinning equipment for semiconductor element processing is provided.

[0020] Legend:

[0021] 1, tinning groove;2, fixed block;201, fixed rod;3, installation shell;4, clamping plate one;5, knob;6, threaded rod;7, clamping plate two;8, stirring assembly;801, motor;802, rotating rod;803, stirring rod one;804, stirring rod two;9, pipeline one;10, filter shell;1001, filter plate;1002, mounting block;1003, sealing sheet one;11, water pump;12, pipeline two;13, cover plate;14, sealing sheet two;15, support leg. Specific implementation

[0022] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0023] Please refer to Figures 1-5 The utility model provides a technical scheme: a tinning equipment for semiconductor element processing, include: tinning groove 1, both sides of tinning groove 1 top are fixedly installed with fixed block 2, the inner wall movable installation of fixed block 2 is installed with installation shell 3, the bottom equal interval fixed installation of installation shell 3 is with clamping plate one 4, the inside equal interval movable embedding of installation shell 3 is with threaded rod 6, one end fixed installation of threaded rod 6 is with knob 5, the surface thread cover of threaded rod 6 is with clamping plate two 7, adjacent three clamping plate one 4, knob 5, threaded rod 6 and clamping plate two 7 are a group, the bottom of tinning groove 1 is provided with stirring assembly 8, one side fixed installation of tinning groove 1 is with pipeline one 9, the other end fixed installation of pipeline one 9 is with filter shell 10, the top fixed installation of filter shell 10 is with water pump 11, the other end fixed installation of water pump 11 is with pipeline two 12, the other end fixed installation of pipeline two 12 is in the top of tinning groove 1 one side, the bottom fixed installation of tinning groove 1 is with support leg 15, the number of support leg 15 is four.

[0024] Specifically, when the device is started, tin plating solution is injected into the tin plating tank 1, the mounting shell 3 is placed on the top of the fixed block 2, the metal shell is placed between the middle clamping plate one 4 and the clamping plate two 7, the middle position of the metal shell is fixed, the tin plating tank 1 is connected to the anode, the mounting shell 3 is connected to the cathode, the power supply is turned on, the metal shell is tinned, then the power supply is turned off, the two clamping plates one 4 and two 7 are fixed on both ends of the metal shell, the middle clamping plate one 4 and two 7 are loosened, the power supply is turned on, and the metal shell is tinned, so that the clamped position of the device can also be well tinned, and the metal shell is better tinned, and the device is more perfect.

[0025] In one embodiment, the other end of the threaded rod 6 is mounted on one side of the inner wall of the mounting shell 3 through a bearing, and the top of the clamping plate two 7 is attached to the top of the inner wall of the mounting shell 3.

[0026] Specifically, rotating the knob 5 makes the threaded rod 6 rotate, the clamping plate two 7 moves through the surface of the threaded rod 6, and the metal shell is clamped by the clamping plate one 4 and the clamping plate two 7, so that the device is more perfect.

[0027] In one embodiment, a fixed rod 201 is movably embedded on one side of the top of the fixed block 2, and the surface of the other end of the fixed rod 201 is movably embedded on the other side of the top of the fixed block 2.

[0028] Specifically, after placing the mounting shell 3 on the top of the fixed block 2, the other end of the fixed rod 201 is embedded on the other side of the top of the fixed block 2 by pushing the fixed rod 201, the mounting shell 3 is limited, the device remains stable when in use, and the device is more perfect.

[0029] In one embodiment, the stirring assembly 8 includes a motor 801, the output end of the motor 801 is fixedly installed on the bottom of the tin plating tank 1, the output end of the motor 801 is fixedly installed with a rotating rod 802, the other end of the rotating rod 802 is fixedly installed with a stirring rod one 803, the bottom surface of the stirring rod one 803 is attached to the bottom of the inner wall of the tin plating tank 1, and the end of the stirring rod one 803 is fixedly installed with a stirring rod two 804.

[0030] Specifically: after the tinning liquid is poured into the tinning tank 1, the motor 801 is started by the external power source to drive the rotating rod 802 to make the stirring rod one 803 run to stir the tinning liquid, so that the composition of the tinning liquid is uniform. The bottom of the stirring rod one 803 is attached to the bottom of the inner wall of the tinning tank 1, and the end of the stirring rod one 803 is fixedly installed with the stirring rod two 804, so that the stirring effect of the device is better, the concentration difference of the tinning liquid is reduced, and the metal shell can be better tinned.

[0031] In one embodiment, the inner wall of the filter shell 10 is movably installed with the filter plate 1001, one side of the filter shell 10 is fixedly installed with the mounting block 1002, the surface of the mounting block 1002 is movably sleeved with the cover plate 13, one side of the filter shell 10 is fixedly installed with the sealing piece one 1003, and one side of the cover plate 13 is fixedly installed with the sealing piece two 14.

[0032] Specifically: during the tinning process, the tinning liquid in the tinning tank 1 is poured into the filter shell 10 through the pipeline one 9 for filtering, and then is conveyed into the device again through the pipeline two 12, so that the impurity particles in the tinning liquid are filtered, the influence on the metal shell tinning is reduced, and when the filter plate 1001 installed in the filter shell 10 needs to be replaced for long-term use, the cover plate 13 is movably sleeved on the surface of the mounting block 1002, the cover plate 13 is removed, the filter plate 1001 in the filter shell 10 is removed for cleaning and replacement, and then when the cover plate 13 is installed on the filter shell 10, the sealing piece two 14 fixedly installed on one side of the cover plate 13 and the sealing piece one 1003 fixedly installed on one side of the filter shell 10 can keep the cover plate 13 sealed, so that the device is more perfect.

[0033] Working principle: when the device starts to work, tin plating liquid is injected into the inside of the tin plating tank 1, the installation shell 3 is placed on the top of the fixed block 2, the other end of the fixed rod 201 is embedded on the other side of the top of the fixed block 2 by pushing the fixed rod 201, the installation shell 3 is limited, the metal shell is placed between the middle clamping plate one 4 and the clamping plate two 7 by a group of the adjacent three clamping plates, the knob 5, the threaded rod 6 and the clamping plate two 7, the clamping plate two 7 is moved by rotating the knob 5, the middle position of the metal shell is fixed, the tin plating tank 1 is connected with the anode, the installation shell 3 is connected with the cathode, the power supply is connected, the metal shell is tin plated, then the power supply is cut off, the clamping plate one 4 and the clamping plate two 7 on both sides are fixed on both ends of the metal shell, the middle clamping plate one 4 and the clamping plate two 7 are loosened, the power supply is connected, the metal shell is tin plated, so that the clamped position of the device can also be well tin plated, the metal shell is better tin plated, and the device is more perfect; during the tin plating process, the motor 801 is started by the external power supply to drive the rotating rod 802 to make the stirring rod one 803 work to stir the tin plating liquid, the composition of the tin plating liquid is uniform, the bottom of the stirring rod one 803 is attached to the bottom of the inner wall of the tin plating tank 1, the end of the stirring rod one 803 is fixedly installed with the stirring rod two 804, the stirring effect of the device is better, the concentration difference of the tin plating liquid is reduced, the metal shell can be better tin plated, the tin plating liquid in the tin plating tank 1 is filtered by the filter shell 10 through the pipeline one 9, then is transported to the inside of the device again through the pipeline two 12, the impurity particles in the tin plating liquid are filtered, the influence on the metal shell is reduced, when the filter plate 1001 installed in the filter shell 10 needs to be replaced during long-term use, the cover plate 13 is movably sleeved on the surface of the mounting block 1002, the cover plate 13 is taken down, the filter plate 1001 in the filter shell 10 can be taken down for cleaning and replacement, then when the cover plate 13 is installed on the filter shell 10, the cover plate 13 can be kept sealed by the sealing piece two 14 fixedly installed on one side of the cover plate 13 and the sealing piece one 1003 fixedly installed on one side of the filter shell 10, the device is more perfect.

[0034] The above is only a preferred embodiment of the present application, and does not limit the present application in other forms. Any skilled person in the art can modify or change the above disclosed technical content to equivalent embodiments applied to other fields, but any simple modification, equivalent change and modification made on the basis of the technical essence of the present application to the above embodiments still belongs to the protection scope of the technical scheme of the present application.

Claims

1. A tin plating apparatus for semiconductor device processing, characterized in that, include: A tin plating tank (1) is provided. Fixing blocks (2) are fixedly installed on both sides of the top of the tin plating tank (1). An installation shell (3) is movably installed on the inner wall of the fixing blocks (2). Clamping plates (4) are fixedly installed at equal intervals at the bottom of the installation shell (3). Threaded rods (6) are movably embedded at equal intervals inside the installation shell (3). A knob (5) is fixedly installed at one end of the threaded rod (6). A clamping plate (7) is threaded onto the surface of the threaded rod (6). Three adjacent clamping plates (4), knobs (5), threaded rods (6), and clamping plates (7) form a unit. The tin plating tank (1) is equipped with a stirring assembly (8) at the bottom. A pipe (9) is fixedly installed on one side of the tin plating tank (1). A filter shell (10) is fixedly installed at the other end of the pipe (9). A water pump (11) is fixedly installed on the top of the filter shell (10). A pipe (12) is fixedly installed at the other end of the water pump (11). The other end of the pipe (12) is fixedly installed on the top of one side of the tin plating tank (1). A support leg (15) is fixedly installed at the bottom of the tin plating tank (1). The number of support legs (15) is four.

2. The tin plating equipment for semiconductor component processing according to claim 1, characterized in that: The other end of the threaded rod (6) is mounted on one side of the inner wall of the mounting housing (3) via a bearing, and the top of the clamping plate (7) is attached to the top of the inner wall of the mounting housing (3).

3. The tin plating equipment for semiconductor component processing according to claim 1, characterized in that: A fixing rod (201) is movably embedded on one side of the top of the fixing block (2), and the surface of the other end of the fixing rod (201) is movably embedded on the other side of the top of the fixing block (2).

4. The tin plating equipment for semiconductor component processing according to claim 1, characterized in that: The stirring assembly (8) includes a motor (801), the output end of which is fixedly installed at the bottom of the tin plating tank (1), a rotating rod (802) is fixedly installed at the output end of the motor (801), and a stirring rod (803) is fixedly installed at the other end of the rotating rod (802).

5. The tin plating equipment for semiconductor element processing according to claim 4, characterized in that: The bottom surface of the stirring rod one (803) is attached to the bottom of the inner wall of the tin plating tank (1), and the end of the stirring rod one (803) is fixedly installed with the stirring rod two (804).

6. The tin plating equipment for semiconductor component processing according to claim 1, characterized in that: A filter plate (1001) is movably installed on the inner wall of the filter housing (10), and an installation block (1002) is fixedly installed on one side of the filter housing (10). A cover plate (13) is movably fitted on the surface of the installation block (1002).

7. The tin plating equipment for semiconductor component processing according to claim 6, characterized in that: A sealing sheet (1003) is fixedly installed on one side of the filter shell (10), and a sealing sheet (14) is fixedly installed on one side of the cover plate (13).

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