Probe module and vertical probe card

Abstract

The utility model discloses a probe module and a vertical probe card, and belongs to the technical field of vertical probes. Comprising a needle plate assembly and a plurality of vertical probes. The needle plate assembly comprises a lower needle plate, a supporting block and an upper needle plate which are sequentially stacked in the first direction, the lower needle plate, the supporting block and the upper needle plate are connected, and the upper needle plate and the lower needle plate are of non-metal structures; the support block is provided with a probe avoiding area, the plurality of vertical probes are arranged at intervals and inserted on the upper probe plate and the lower probe plate, and the probe body of each vertical probe is located in the probe avoiding area. According to the probe module provided by the embodiment of the utility model, not only can the reliable support of the vertical probe be realized, but also the material consumption of the probe plate can be reduced, and the use of a PHOTOVELL material is avoided, so that the production cost is finally reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to vertical probe technical field, concretely relates to a probe module and vertical probe card. BACKGROUND

[0002] The integrated circuit with the integrated degree is generally on the chip, and the chip is the key of modern electronic product, so the advantages and disadvantages of the chip directly determine the advantages and disadvantages of the electronic product. At present, the detection of the chip generally adopts the vertical probe card, and whether the function of the chip is complete can be detected. The probe module is an important component of the probe card, wherein the probe module mainly comprises a needle plate module and a plurality of vertical probes, the needle plate module comprises an upper needle plate and a lower needle plate connected through bolts, and the needle tip and the needle tail of the vertical probe correspond to the upper needle plate and the lower needle plate.

[0003] At present, the upper needle plate and the lower needle plate generally adopt PHOTOVELL material (a kind of processable ceramic), and the vertical probe is inserted into the needle plate module. However, the cost of PHOTOVELL material is high, and the consumption of needle plate is large, which leads to the increase of production cost. UTILITY MODEL CONTENT

[0004] In view of the above defects or improvement requirements of the prior art, the utility model provides a probe module and vertical probe card, which aims at: not only can realize reliable support to the vertical probe, but also can reduce the consumption of needle plate, avoid using PHOTOVELL material, and finally reduce the production cost.

[0005] To achieve the above purpose, in the first aspect, the utility model provides a probe module, which comprises a needle plate assembly and a plurality of vertical probes.

[0006] The needle plate assembly comprises a lower needle plate, a support block and an upper needle plate stacked in sequence along a first direction, the lower needle plate, the support block and the upper needle plate are connected, and the upper needle plate and the lower needle plate are non-metal structures.

[0007] The support block has a probe avoidance area, a plurality of vertical probes are arranged at intervals, are inserted into the upper needle plate and the lower needle plate, and the needle body of each vertical probe is located in the probe avoidance area.

[0008] Optionally, the upper needle plate and / or the lower needle plate are one or several of ceramic substrate, stone sheet, reinforced glass fiber plate, high-density fiber plate, engineering plastic, sapphire glass, polyimide and carbon fiber reinforced plastic.

[0009] Optionally, the lower needle plate, the support block and the upper needle plate are connected by one or several ways of bolt, adhesion, physical sintering, chemical bonding and welding.

[0010] Optionally, the bolt is a countersunk bolt, the upper needle plate is provided with a first countersunk hole, the lower needle plate is provided with a second countersunk hole, the first countersunk hole and the second countersunk hole are correspondingly provided with the countersunk bolt, and each of the countersunk bolts is used for connecting the support block.

[0011] Optionally, a side of the upper needle plate facing the support block is provided with a plurality of regions corresponding to the vertical probes in a hollowed-out manner.

[0012] Optionally, the lower needle plate and the upper needle plate each comprise at least two substrates stacked in a first direction, and each of the substrates has a thickness of 0.12-3 mm.

[0013] In a second aspect, the utility model provides a vertical probe card, the vertical probe card includes a switching module, a PCB back plate and the probe module of one kind in the first aspect,

[0014] The PCB back plate has a first pad area and a second pad area electrically connected, the first pad area has a plurality of first pads electrically connected with the vertical probes on the probe module, and the second pad area has a plurality of second pads connected to a test device;

[0015] The switching module is arranged between the PCB back plate and the probe module, and is used for realizing signal switching between the PCB back plate and the probe module.

[0016] Optionally, the switching module is a multilayer organic circuit board or a multilayer ceramic circuit board.

[0017] Optionally, the switching module comprises a switching plate assembly and a plurality of wires, a first end of each of the wires is electrically connected with the plurality of vertical probes through the switching plate assembly, and a second end of each of the wires is welded with a first pad on the PCB back plate in a one-to-one manner.

[0018] Optionally, the switching plate assembly comprises at least two non-metal substrates stacked in a first direction, and each of the non-metal substrates has a thickness of 0.12-3 mm.

[0019] The above improved technical features can be combined with each other as long as they do not conflict with each other.

[0020] Overall, compared with the prior art, the above technical solutions conceived by the utility model have the following beneficial effects:

[0021] (1) The probe module provided by the embodiment of the utility model, since the lower needle plate, the supporting block and the upper needle plate are stacked and connected in sequence, the lower needle plate, the supporting block and the upper needle plate form a supporting whole, wherein the needle body of the vertical probe is inserted and assembled in the probe avoiding area of the supporting block, and the needle tip and the needle tail are correspondingly inserted and assembled in the lower needle plate and the upper needle plate, thereby realizing reliable support of the vertical probe. In addition, the supporting block is located between the lower needle plate and the upper needle plate, which can effectively separate the lower needle plate and the upper needle plate, thereby effectively avoiding the needle plate being too thick, not only reducing the consumption of the needle plate, but also avoiding the use of PHOTOVELL material, thereby finally reducing the production cost.

[0022] (2) The probe module provided by the embodiment of the utility model, the upper needle plate and / or the lower needle plate are one or several of ceramic substrate, stone sheet, reinforced glass fiber plate, high-density fiber plate, engineering plastic, sapphire glass, polyimide and carbon fiber reinforced plastic, which is low in cost.

[0023] (3) The probe module provided by the embodiment of the utility model, the lower needle plate and the upper needle plate each comprise at least two substrates stacked in sequence along the first direction, and the needle plate with a suitable thickness can be assembled through the stacking of the multiple substrates, thereby increasing the use range of the probe module, i.e. adapting to vertical probes of different sizes.

[0024] (4) The probe module provided by the embodiment of the utility model, the side of the upper needle plate facing the supporting block is provided with a hollow area corresponding to the area through which the multiple vertical probes pass, and the hollow area can make the distance between the other limiting boss and the upper needle plate larger, so that the vertical probes have a larger movement allowance between the lower needle plate and the upper needle plate.

[0025] (5) The vertical probe card provided by the embodiment of the utility model, the adapter module is a multilayer organic circuit board or a multilayer ceramic circuit board, thereby realizing the connection and conduction of the vertical probe and the PCB back plate through the circuit board.

[0026] (6) The vertical probe card provided by the embodiment of the utility model, the adapter module comprises an adapter plate assembly and multiple wires, the first end of each wire is electrically connected with the multiple vertical probes through the adapter plate assembly, and the second end of the multiple wires is welded with the multiple first pads on the PCB back plate in one-to-one correspondence, thereby realizing the support and positioning of the wires through the adapter plate assembly, and realizing the connection and conduction of the vertical probe and the PCB back plate through the wires.

[0027] (7)For the utility model embodiment provides a kind of probe module and vertical probe card, the corresponding multiple substrates in upper needle plate, lower needle plate and adapter plate assembly can be ceramic substrate, and the processing mode of needle plate of ceramic substrate material is laser processing, and compared with mechanical processing, in processing stability, precision, efficiency, there is greater promotion;Ceramic substrate and laser processing equipment domestic, import have selectable, no longer rely on exclusive import;Therefore, the self-development of probe card, self-made can no longer be subject to raw material, processing equipment.

[0028] (8)For the utility model embodiment provides a kind of probe module and vertical probe card, the processing mode of needle plate of ceramic substrate material is laser processing, and the shape of needle hole is no longer limited to circular hole, and various shapes can be processed according to design, so the probe used in conjunction with probe card is no longer limited to circular vertical probe, and new type of elastic straight line probe with rectangular cross section can also be used. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is the structure diagram of a kind of probe module provided by the utility model embodiment;

[0030] Figure 2 It is the sectional view of a kind of probe module provided by the utility model embodiment;

[0031] Figure 3 It is the structure diagram of lower needle plate provided by the utility model embodiment;

[0032] Figure 4 It is the structure diagram of a kind of substrate provided by the utility model embodiment;

[0033] Figure 5 It is the structure diagram of vertical probe provided by the utility model embodiment;

[0034] Figure 6 It is the structure diagram of another substrate provided by the utility model embodiment;

[0035] Figure 7 It is the structure diagram of a kind of vertical probe card provided by the utility model embodiment;

[0036] Figure 8 It is the sectional view of a kind of vertical probe card provided by the utility model embodiment;

[0037] Figure 9 It is the structure diagram of a kind of adapter module provided by the utility model embodiment;

[0038] Figure 10 It is the structure diagram of a kind of PCB backboard provided by the utility model embodiment;

[0039] Figure 11 is another cross-sectional view of the vertical probe card provided by the embodiment of the present application;

[0040] Figure 12 is a structural schematic view of another PCB backboard provided by the embodiment of the present application.

[0041] In all the drawings, the same reference signs refer to the same technical features, specifically:

[0042] 1, needle plate assembly; 11, lower needle plate; 12, support block; 121, probe avoidance area; 13, upper needle plate; 131, hollow; 14, second countersunk hole; 15, countersunk bolt; 16, base plate; 17, through hole; 181, fifth bolt; 182, second connecting bolt; 2, vertical probe; 21, needle tip; 22, needle body; 23, needle tail; 24, limiting boss; 3, adapter module; 31, adapter plate assembly; 32, wire; 33, third solder pad; 34, fourth solder pad; 4, first connecting piece; 41, outer flange; 42, hollow part; 5, PCB backboard; 51, hollow area; 52, first reinforcing plate; 53, second reinforcing plate; 6, dowel. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application. In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as there is no conflict.

[0044] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0045] In addition, the terms "first", "second", "third", "fourth", "fifth", "sixth", "seventh" and "eighth" are only used for descriptive purpose and cannot be understood as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features defined as "first", "second", "third", "fourth", "fifth", "sixth", "seventh" and "eighth" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0046] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0047] In the present application, unless otherwise specifically defined and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0048] Embodiment:

[0049] Figure 1 is a structural schematic diagram of a probe module provided by an embodiment of the present application, Figure 2 is a sectional view of a probe module provided by an embodiment of the present application, as Figure 1 and Figure 2 As shown in the figures, it comprises a needle plate assembly 1 and a plurality of vertical probes 2.

[0050] The needle plate assembly 1 comprises a lower needle plate 11, a support block 12 and an upper needle plate 13 stacked in sequence along a first direction (Z direction), the lower needle plate 11, the support block 12 and the upper needle plate 13 are connected, and the upper needle plate 13 and the lower needle plate 11 are non-metal structures.

[0051] The support block 12 has a probe avoidance area 121, a plurality of vertical probes 2 are arranged at intervals, and are inserted into the upper needle plate 13 and the lower needle plate 11, and the needle body 22 of each vertical probe 2 is located in the probe avoidance area 121.

[0052] The utility model discloses a kind of probe modules, since lower needle plate 11, support block 12 and upper needle plate 13 are sequentially stacked and connect, so that lower needle plate 11, support block 12 and upper needle plate 13 form a supported whole, wherein the needle body 22 of vertical probe 2 is inserted in the probe avoidance area 121 of support block 12, needle tip 21 and needle tail 23 are correspondingly inserted in lower needle plate 11 and upper needle plate 13, to reliably support vertical probe 2.

[0053] In addition, support block 12 is located between lower needle plate 11 and upper needle plate 13, which can effectively separate lower needle plate 11 and upper needle plate 13, thereby effectively avoiding thick needle plate, not only reducing the consumption of needle plate, but also avoiding the use (or reducing the use) of PHOTOVELL material, thereby ultimately reducing production cost.

[0054] That is, the utility model discloses a kind of probe modules, not only can reliably support vertical probe 2, but also reduce the consumption of needle plate, avoid the use of PHOTOVELL material, thereby ultimately reducing production cost.

[0055] In the embodiment, upper needle plate 13 and / or lower needle plate 11 is one or several of ceramic substrate, stone sheet, reinforced glass fiber plate, high-density fiberboard, engineering plastic, sapphire glass, polyimide and carbon fiber reinforced plastic, with low cost.

[0056] Specifically, the ceramic substrate is one or several of silicon nitride ceramic substrate, aluminum nitride ceramic substrate and silicon carbide ceramic substrate.

[0057] Exemplarily, the material of support block 12 is stainless steel, zirconia ceramic or alumina ceramic.

[0058] In the embodiment, lower needle plate 11, support block 12 and upper needle plate 13 can be connected by one or several ways of bolt, adhesion, physical sintering, chemical bonding and welding, and the utility model does not limit this.

[0059] Specifically, when needle plate, support block 12 and upper needle plate 13 are connected by bolt, the bolt is countersunk bolt 15 at this time, the first countersunk hole (not shown in the figure) is arranged on upper needle plate 13, the second countersunk hole 14 is arranged on lower needle plate 11, the countersunk bolt 15 is correspondingly inserted in the first countersunk hole and the second countersunk hole 14, and each countersunk bolt 15 is used to connect support block 12.

[0060] In the above embodiment, by arranging countersunk hole and countersunk bolt 15, reliable connection of the three can be realized, and bolt leakage can be avoided.

[0061] In one implementation mode of the utility model,Figure 3 is a structural schematic view of the lower needle plate provided by the embodiment of the utility model, Figure 4 is a structural schematic view of a substrate provided by the embodiment of the utility model, in combination with Figure 3 and Figure 4 As shown in the figures, the lower needle plate 11 and the upper needle plate 13 each comprise at least two substrates 16 stacked in sequence along a first direction.

[0062] It is easy to understand that the needle plate of appropriate thickness can be assembled by stacking the plurality of substrates 16, thereby increasing the use range of the probe module, i.e. adapting to vertical probes 2 of different sizes.

[0063] Exemplarily, the substrate 16 can be one or several of a ceramic substrate, a stone sheet, a reinforced glass fiber plate, a high-density fiber plate, an engineering plastic, a sapphire glass, a polyimide, and a carbon fiber reinforced plastic.

[0064] In addition, each substrate 16 has a thickness of 0.12-3 mm.

[0065] Exemplarily, the lower needle plate 11 and the upper needle plate 13 each comprise two substrates 16, and the two substrates 16 oppositely have through holes 17 of different diameters and concentricity, thereby forming counterbores, and the connection between the needle plate and the support block 12 can be finally realized by inserting a counterbores bolt 15 in each counterbore. In addition, the two needle plates can be bonded together.

[0066] In the embodiment, each substrate 16 is provided with a direction identification mark, thereby avoiding misalignment of the two substrates 16 during assembly.

[0067] Figure 5 is a structural schematic view of the vertical probe provided by the embodiment of the utility model, as shown in the figure, Figure 5 The vertical probe 2 is provided with two limit bosses 24 arranged at intervals, one limit boss 24 abuts against the lower needle plate 11, and the other limit boss 24 is spaced apart from the upper needle plate 13, thereby not only avoiding the vertical probe 2 from being separated from the lower needle plate 11 (during crimping, the lower needle plate 11 moves downward for crimping), but also allowing the vertical probe 2 to have a certain amount of upward and downward movement between the lower needle plate 11 and the upper needle plate 13, thereby facilitating deformation during subsequent crimping.

[0068] In the embodiment, the side of the upper needle plate 13 facing the support block 12 is provided with a plurality of hollowed-out regions 131 (see Figure 6 corresponding to the regions through which the vertical probes 2 pass.

[0069] It is easy to understand that the spacing between the other limit boss 24 and the upper needle plate 13 can be larger by providing the hollowed-out regions 131, and the vertical probe 2 has a larger amount of movement between the lower needle plate 11 and the upper needle plate 13.

[0070] Exemplarily, the hollowing 131 is located on a base plate 16 of the upper needle plate 13.

[0071] Figure 7 is a structure diagram of a vertical probe card provided by an embodiment of the present application, Figure 8 is a sectional view of a vertical probe card provided by an embodiment of the present application, in combination with Figure 7 and Figure 8 as shown, comprising a switching module 3, a PCB back plate 5 and the above probe module.

[0072] The PCB back plate 5 has a first pad area and a second pad area electrically connected, the first pad area has a plurality of first pads electrically connected with the vertical probes on the probe module, and the second pad area has a plurality of second pads connected to the testing equipment.

[0073] The switching module 3 is arranged between the PCB back plate 5 and the probe module, and is used for realizing signal switching between the PCB back plate and the probe module.

[0074] In the above embodiment, the switching module 3 plays a role of conducting the vertical probes 2 and the PCB back plate 5, and the connection and conduction of the vertical probes and the testing equipment can be finally realized through the second pads on the PCB back plate 5.

[0075] In an implementation manner of the present application, the switching module is a multi-layer organic circuit board or a multi-layer ceramic circuit board.

[0076] Specifically, the first surface of the switching module 3 has a plurality of third pads 33, and the second surface of the switching module has a plurality of fourth pads 34 (see Figure 9 ), the plurality of third pads and the plurality of fourth pads are one-to-one corresponding and communicated, each vertical probe 2 is electrically connected with the corresponding third pad, and each fourth pad is one-to-one corresponding and welded with the plurality of first pads on the PCB back plate 5 (see Figure 10 ), so as to realize the connection and conduction of the vertical probes and the PCB back plate through the switching module 3.

[0077] Exemplarily, the probe card further comprises a first reinforcing plate 52 fixedly arranged on the front surface of the PCB back plate 5 and a second reinforcing plate 53 fixedly arranged on the back surface of the PCB back plate (see Figure 11 ).

[0078] The outer contour of the projection of the probe module on the PCB back plate is located within the outer contour of the projection of the first reinforcing plate on the PCB back plate, and the outer contour of the projection of the probe module on the PCB back plate is located within the outer contour of the projection of the second reinforcing plate on the PCB back plate.

[0079] The middle part of the first reinforcing plate 52 has a hollow area, the adapter module 3 is arranged in the hollow area of the middle part of the first reinforcing plate 52, and the thickness of the adapter module 3 is consistent with that of the first reinforcing plate 52.

[0080] The probe module is fixedly connected with the first reinforcing plate 52 through a bolt.

[0081] The first reinforcing plate 52 plays a role of positioning the adapter module 3, and the second reinforcing plate 53 plays a role of leveling and supporting the PCB back plate.

[0082] Exemplarily, a bolt is arranged on the first reinforcing plate 52, the bolt is connected with the second reinforcing plate 53 after penetrating through the PCB back plate 5, so that the PCB back plate 5 can be clamped between the first reinforcing plate 52 and the second reinforcing plate 53.

[0083] In another implementation manner of the utility model, the adapter module comprises an adapter plate assembly and a plurality of wires, the first end of each wire is electrically connected with the plurality of vertical probes through the adapter plate assembly, and the second end of each wire is welded with a plurality of first pads on the PCB back plate in one-to-one correspondence.

[0084] Specifically, the middle part of the PCB back plate 5 has a hollow area 51 (see Figure 12 The first connecting piece 4 is fixedly arranged in the hollow area 51 of the PCB back plate 5, and the first connecting piece 4 has a hollow part 42 corresponding to the probe arrangement area of the probe module.

[0085] The adapter module 3 comprises an adapter plate assembly 31 and a plurality of wires 32 (see Figure 8 The first end of each wire 32 is electrically connected with the plurality of vertical probes 2 through the adapter plate assembly 31, and the second end of each wire 32 is welded with a plurality of first pads on the PCB back plate 5 in one-to-one correspondence.

[0086] The probe module and the adapter plate assembly 31 are positioned through a pin 6 arranged on the first connecting piece 4, and the probe module and the adapter plate assembly 31 are fixedly connected with the first connecting piece 4 through a fifth bolt 181.

[0087] In addition, the adapter module 3 is connected with the upper needle plate 13 and the first connecting piece 4 through one or more of the following modes: a bolt, adhesion, physical sintering, chemical bonding and welding.

[0088] The bottom of the first connecting piece 4 has an outer flange 41, a plurality of second connecting bolts 182 are inserted on the PCB back plate 5 to connect the outer flange 41, so as to realize reliable connection between the first connecting piece 4 and the PCB back plate 5.

[0089] Exemplarily, the first connecting piece 4, the first reinforcing plate 52 and the second reinforcing plate 53 can all be made of stainless steel or ceramic material. For example, the first connecting piece 4, the first reinforcing plate 52 and the second reinforcing plate 53 are generally made of non-magnetic metal pieces (commonly stainless steel), and ceramic material (alumina ceramic, zirconia ceramic, etc.) is selected under special temperature.

[0090] Specifically, the adapter plate assembly includes at least two non-metal substrates stacked in sequence along a first direction, each non-metal substrate having a thickness of 0.12-3 mm.

[0091] Exemplarily, at least a first through hole and a second through hole are respectively provided on the corresponding two non-metal substrates, the first through hole has a larger diameter than the second through hole, the first through hole and the second through hole form countersunk holes, and a countersunk bolt is inserted into the countersunk holes, the countersunk bolt being used to connect the first connecting piece.

[0092] Exemplarily, the non-metal substrates in the adapter plate assembly can also be one or more of ceramic substrates, stone sheets, reinforced glass fiber plates, high-density fiber plates, engineering plastics, sapphire glass, polyimide and carbon fiber reinforced plastic.

[0093] It should be noted that the upper needle plate, the lower needle plate and the corresponding plurality of substrates (or non-metal substrates) in the adapter plate assembly can all be ceramic substrates. The processing method of the needle plate made of ceramic substrate material is laser processing. Compared with mechanical processing, laser processing has greater improvement in processing stability, precision and efficiency. Ceramic substrates and laser processing equipment are available for domestic and imported selection, and are no longer dependent on exclusive import. Therefore, the self-research and self-manufacture of the probe card can no longer be restricted by raw materials and processing equipment.

[0094] The processing method of the needle plate made of ceramic substrate material is laser processing. The shape of the needle hole is no longer limited to a circular hole, and various shapes can be processed according to the design. Therefore, the probes used in combination with the probe card are no longer limited to circular vertical probes, and can also be combined with new type of elastic straight line probes with rectangular cross section.

[0095] It should be noted that the number of substrates in the lower needle plate 11, the upper needle plate 13 and the adapter plate assembly 31 is not limited to two. The thickness and number of single substrates 16 are selected and designed for combination use according to the size specifications of the vertical probes 2 used, the thickness of the raw materials used and the use requirements. In addition, the shape of each substrate 16 is not limited to a circle, but can also be designed as a rectangle, a polygon, etc. The shape diameter of a single substrate 16 is not limited to being the same, and the shape of a single substrate 16 in the lower needle plate 11, the upper needle plate 13 and the adapter plate assembly 31 can be designed to be inconsistent in size. These can be selected and designed according to actual conditions.

[0096] Those skilled in the art can understand that the above description is only preferred embodiments of the present application, and is not intended to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A probe module, characterized by, Includes a needle plate assembly and multiple vertical probes; The needle plate assembly includes a lower needle plate, a support block, and an upper needle plate stacked sequentially along a first direction. The lower needle plate, the support block, and the upper needle plate are connected. The upper needle plate and the lower needle plate are non-metallic structures. The support block has a probe avoidance area, and multiple vertical probes are arranged at intervals and inserted into the upper needle plate and the lower needle plate, with the needle body of each vertical probe located in the probe avoidance area.

2. A probe module according to claim 1, wherein, The upper needle plate and / or the lower needle plate are one or more of the following: ceramic substrate, stone sheet, reinforced glass fiber board, high-density fiberboard, engineering plastic, sapphire glass, polyimide, and carbon fiber reinforced plastic.

3. The probe module of claim 1, wherein, The lower needle plate, the support block, and the upper needle plate are connected by one or more methods such as bolts, adhesives, physical sintering, chemical bonding, and welding.

4. A probe module according to claim 3, wherein, The bolts are countersunk bolts. The upper pin plate is provided with a first countersunk hole, and the lower pin plate is provided with a second countersunk hole. The countersunk bolts are inserted into the first countersunk hole and the second countersunk hole respectively. Each countersunk bolt is used to connect the support block.

5. The probe module of claim 1, wherein, The area through which the multiple vertical probes pass on the side of the upper needle plate facing the support block is set to be hollow.

6. The probe module of claim 1, wherein, Both the lower needle plate and the upper needle plate include at least two substrates stacked sequentially along a first direction, and the thickness of each substrate is 0.12 to 3 mm.

7. A vertical probe card, characterized by, The vertical probe card includes an adapter module, a PCB backplane, and a probe module as described in any one of claims 1-6; The PCB backplane has a first pad area and a second pad area that are electrically connected. The first pad area has a plurality of first pads that are electrically connected to vertical probes on the probe module, and the second pad area has a plurality of second pads that are connected to the test equipment. The adapter module is disposed between the PCB backplane and the probe module, and is used to realize signal transfer between the PCB backplane and the probe module.

8. The vertical probe card of claim 7, wherein The adapter module is a multilayer organic circuit board or a multilayer ceramic circuit board.

9. The vertical probe card of claim 7, wherein, The adapter module includes an adapter board assembly and multiple wires. The first end of each wire passes through the adapter board assembly and is electrically connected to the multiple vertical probes. The second end of each wire is soldered to a corresponding first pad on the PCB backplane.

10. A vertical probe card according to claim 9, characterized in that, The adapter plate assembly includes at least two non-metallic substrates stacked sequentially along a first direction, each non-metallic substrate having a thickness of 0.12 to 3 mm.

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