Ball passing detection sensor

Abstract

The utility model discloses a ball passing detection sensor. The ball passing detection sensor comprises a framework and two coil assemblies which are respectively arranged at two opposite ends of the framework, the coil assembly comprises a first PCB which is connected to the skeleton and comprises a first insulating layer which is connected to the skeleton; the first metal layer is arranged on the first insulating layer and comprises a first sub-half coil; the second PCB is connected to the framework and comprises a second insulating layer connected to the framework; the second metal layer is arranged on the second insulating layer and comprises a second sub-half coil; wherein the first PCB and the second PCB are both constructed to be in a semicircular ring shape, the first PCB and the second PCB in the same coil assembly define a ring shape, and all the first sub-half coils and all the second sub-half coils in the same coil assembly are electrically connected to form a detection coil. The ball passing detection sensor is simple in structure, low in manufacturing cost and good in parameter consistency during batch production.

Description

Technical Field

[0001] This utility model relates to a ball detection sensor. Background Technology

[0002] The rational development of nuclear energy is an economical and effective way to alleviate the global energy crisis. The pebble bed high-temperature gas-cooled reactor (PTC) is an advanced "fourth-generation nuclear reactor" with advantages such as high power generation efficiency, inherent safety, and the ability to load and unload fuel without shutting down the reactor. It has received high attention from many countries. The world's existing PBCs include Germany's AVR and THTR reactors, China's HTR-10 high-temperature gas-cooled experimental reactor and 200MW demonstration reactor, and China's 600MW high-temperature gas-cooled reactor in Haiyang, China, is currently under construction.

[0003] Currently, the following types of fuel element detection devices are used in pebble bed reactors (all based on the principle of the influence of graphite conductors on coil inductive reactance):

[0004] One type is the internal type: a detection coil is pre-installed inside the stainless steel ball-passing pipe. When the fuel ball passes through, the inductive reactance of the coil changes. The ball-passing signal is obtained by detecting the change in the inductive reactance of the detection coil. This type of device is used in Germany's AVR reactor, THTR reactor, my country's HTR-10 high temperature gas-cooled experimental reactor, and the PBMR reactor under construction in South Africa.

[0005] The second type is the side-wall perforation installation type: a hole is drilled in the side wall of the stainless steel ball-passing pipe, and a detection coil is installed in the hole. This device is similar to an electromagnetic proximity switch. Germany once used this sensor to design a 200MW module stack loading and unloading system.

[0006] The installation of both types of sensors compromises the integrity of the sphere-passing pipe. The sensor structure and installation method must ensure the high-pressure airtightness of the sphere-passing pipe, resulting in a complex sensor structure and difficult installation. If a sensor malfunctions, repair and replacement require disassembly of the sphere-passing pipe, which is time-consuming, can easily cause radiation contamination, and affects reactor availability. The sensor coil, frame, and other accessories are in direct contact with the radioactive fuel sphere, placing high demands on the radiation resistance of the entire sensor material and impacting its lifespan.

[0007] Tsinghua University proposed an externally mounted ball-passing detection device (patent number: CN200510136309.4). This device includes two sets of six coils, which are semi-circularly attached to the outside of the ball-passing pipe. Ball-passing detection is achieved based on the mutual inductance between the excitation coil, the detection coil, and the fuel ball. Due to the shielding effect of the metal wall of the ball-passing pipe, the effective ball-passing signal is very weak, requiring complex signal analysis and processing to achieve reliable ball-passing counting. This method overcomes the shortcomings of the two aforementioned sensor types, but still has the following limitations:

[0008] (1) The externally attached mutual inductance sensor has a special structure, including two sets of detection coils wound in concave shape and a set of wide excitation coils. The process of winding the concave coils is complicated, and the sensor is difficult to manufacture.

[0009] (2) The signal obtained by the detection circuit is very weak. The subsequent signal processing circuit has a high amplification factor, which can easily introduce interference noise and affect the stability of the system.

[0010] (3) Since the interference waveform is obvious, the complexity of the microcontroller program needs to be increased to improve its waveform recognition capability. The complex program structure is not conducive to the reliability of the software.

[0011] To address the aforementioned issues, Tsinghua University also proposed an externally mounted sphere detection method and device for pebble bed type high-temperature gas-cooled reactors (Patent No.: 200910250491.4). The resonant bridge circuit of this device includes two self-inductance coils, which use two opposing semi-annular columns surrounding the outside of the pipe as a frame, with two semi-annular coils wound top and bottom on each side of the frame. However, the following shortcomings still exist:

[0012] (1) The process of winding a self-inductance coil on a semi-toroidal cylinder is slightly complicated and the manufacturing difficulty is slightly higher;

[0013] (2) When mass production is carried out, it is difficult to guarantee the consistency of parameters of the self-inductance coil. Utility Model Content

[0014] The technical problem to be solved by this application is how to simplify the structure of the ball detection sensor and reduce the manufacturing difficulty of the ball detection sensor.

[0015] This utility model provides a ball detection sensor, which includes: a frame and two coil assemblies respectively disposed at opposite ends of the frame;

[0016] The coil assembly includes:

[0017] The first PCB board, connected to the frame, includes:

[0018] A first insulating layer is connected to the skeleton;

[0019] A first metal layer is disposed on the first insulating layer, including a first sub-half coil;

[0020] The second PCB board, connected to the frame, includes:

[0021] A second insulating layer is attached to the skeleton;

[0022] A second metal layer is disposed on the second insulating layer, including a second sub-half coil;

[0023] The first PCB board and the second PCB board are both constructed as semi-circular rings, and the first PCB board and the second PCB board in the same coil assembly form a ring. All the first sub-half coils and all the second sub-half coils in the same coil assembly are electrically connected to form a detection coil.

[0024] In one illustrative embodiment, the first PCB board is provided with a plurality of first insulating layers and a plurality of first metal layers, the first insulating layers and the first metal layers are arranged alternately in the thickness direction of the first PCB board, and the first sub-half coils of the plurality of first metal layers are connected in series to form a first half coil.

[0025] The second PCB board is provided with multiple second insulating layers and multiple second metal layers. The second insulating layers and the second metal layers are arranged alternately in the thickness direction of the second PCB board, and the second sub-half coils of the multiple second metal layers are connected in series to form a second half coil.

[0026] In one illustrative embodiment, a plurality of first PCB boards and a plurality of second PCB boards are disposed in a single coil assembly, the plurality of first PCB boards being stacked and the plurality of second PCB boards being stacked.

[0027] Multiple first half-coils of first PCB boards are connected in series, and multiple second half-coils of second PCB boards are connected in series. The multiple first half-coils connected in series are connected in series with the multiple second half-coils connected in series.

[0028] In one illustrative embodiment, a plurality of first PCB boards and a plurality of second PCB boards are disposed in a single coil assembly, the plurality of first PCB boards being stacked and the plurality of second PCB boards being stacked.

[0029] Multiple first half-coils of first PCB boards are connected in parallel, multiple second half-coils of second PCB boards are connected in parallel, and the multiple first half-coils connected in parallel are connected in series with the multiple second half-coils connected in parallel.

[0030] In one illustrative embodiment, an insulating layer is provided between two adjacent first PCB boards, and an insulating layer is provided between two adjacent second PCB boards.

[0031] In one illustrative embodiment, the center distance between the two coil assemblies is equal to the radius of the fuel ball to be detected; or,

[0032] The center distance between the two coil assemblies is equal to 1 to 1.5 times the diameter of the fuel ball to be tested.

[0033] In one illustrative embodiment, a channel between the first PCB board and the second PCB board is provided for a ball-passing conduit to transport the fuel ball to be tested;

[0034] The distance from the outermost loop of the inner half-loop coil of the first and second sub-half coils to the ball-passing tube is less than 10mm.

[0035] In one illustrative embodiment, the skeleton includes a first support and a second support;

[0036] The first support includes a first base and a first fixing post and a second fixing post extending from opposite ends of the first base;

[0037] The second support includes a second base and a third and a fourth fixing post extending from opposite ends of the second base;

[0038] The first PCB board is provided with a first mounting hole, and the second PCB board is provided with a second mounting hole;

[0039] The first fixing post and the second fixing post pass through the first mounting holes of the first PCB board of the two coil assemblies, and the third fixing post and the fourth fixing post pass through the second mounting holes of the second PCB board of the two coil assemblies.

[0040] In one illustrative embodiment, both the first base and the second base are constructed as semi-circular rings, and the first base and the second base are assembled into a ring;

[0041] The first mounting hole, the second mounting hole, the first fixing post, the second fixing post, the third fixing post, and the fourth fixing post are all provided in multiple quantities;

[0042] The plurality of first fixing posts pass through the plurality of first mounting holes of the first PCB board of one coil assembly, the plurality of second fixing posts pass through the plurality of first mounting holes of the first PCB board of another coil assembly, the plurality of third fixing posts pass through the plurality of second mounting holes of the second PCB board of one coil assembly, and the plurality of fourth fixing posts pass through the plurality of second mounting holes of the second PCB board of another coil assembly.

[0043] In one illustrative embodiment, a shielding housing is also included, which houses the skeleton and the two coil assemblies.

[0044] Since each coil assembly contains a detection coil formed by connecting a first half-coil and a second half-coil, when a fuel ball passes through the detection coil of any coil assembly, the eddy currents in the fuel ball cause a change in the impedance of the detection coil. A single fuel ball sequentially passes through the detection coils of two coil assemblies along the ball-passing pipe, and the impedances of the detection coils of these two coil assemblies change sequentially, thus achieving fuel ball passage detection. Simultaneously, the first and second PCB boards can be manufactured using PCB board fabrication processes, eliminating the need for wire winding, simplifying the production process, and reducing production costs. This type of ball-passing detection sensor is suitable for mass production and exhibits good consistency in sensor parameters. Furthermore, this ball-passing detection sensor is positioned outside the ball-passing pipe, without damaging the pipe's structure.

[0045] The novel pebble detection system proposed in this patent is used to accurately detect and count graphite-based fuel spheres in the charging pipeline, unloading pipeline, and spent fuel pipeline, and to provide accurate pebble information to the control system. This enables effective control of fuel element loading and unloading without shutting down the reactor, thus ensuring the continuous operation of the pebble bed high-temperature gas-cooled reactor.

[0046] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained by means of the structures particularly pointed out in the description and the drawings. Attached Figure Description

[0047] The accompanying drawings are provided to further illustrate the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solution of this utility model and do not constitute a limitation on the technical solution of this utility model.

[0048] Figure 1 This is a top view schematic diagram of a ball detection sensor according to an embodiment of this utility model;

[0049] Figure 2 This is a simplified schematic diagram of a ball detection sensor according to an embodiment of the present invention;

[0050] Figure 3 This is a front view schematic diagram of a coil assembly according to an embodiment of the present utility model;

[0051] Figure 4 This is a three-dimensional schematic diagram of a portion of the ball-passing detection sensor and the ball-passing pipe in an embodiment of this utility model;

[0052] Figure 5 This is a disassembly diagram of the skeleton in an embodiment of the present utility model;

[0053] Figure 6This is a disassembly diagram of the shielding shell in an embodiment of the present invention. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

[0055] like Figure 1 , 2 As shown, Figure 1 , 2 This application illustrates a ball-passing detection sensor 100. The ball-passing detection sensor 100 includes a frame 1 and two coil assemblies 2. The two coil assemblies 2 are respectively disposed at opposite ends of the frame 1, and are spaced apart from each other.

[0056] The coil assembly 2 includes a first PCB board 21 and a second PCB board 22. Both the first PCB board 21 and the second PCB board 22 are printed circuit boards and are constructed as semi-circular flat plates. The first PCB board 21 includes a first insulating layer 211 and a first metal layer 212. The first insulating layer 211 is made of insulating material. The first insulating layer 211 is the supporting structure of the first PCB board 21. The first insulating layer 211 has a generally semi-circular plate-like structure. The first insulating layer 211 can be a phenolic paper laminate, an epoxy paper laminate, a polyester glass mat laminate, or an epoxy glass cloth laminate. The first metal layer 212 is a metal sheet or film. The first metal layer 212 can be made of copper or a copper alloy. The first metal layer 212 is stacked on the first insulating layer 211. The first metal layer 212 includes a first sub-half coil 2121. The first sub-half coil 2121 is a metal wire extending in a spiral shape. The first sub-half coil 2121 can extend along the edge of the first insulating layer 211.

[0057] The second PCB board 22 includes a second insulating layer 221 and a second metal layer 222. The second insulating layer 221 is made of insulating material. The second insulating layer 221 serves as the supporting structure for the second PCB board 22. The second insulating layer 221 has a generally semi-circular plate-like structure. The second insulating layer 221 can be a phenolic paper laminate, an epoxy paper laminate, a polyester glass mat laminate, or an epoxy glass cloth laminate. The second metal layer 222 is a metal sheet or film. The first metal layer 212 can be made of copper or a copper alloy. The second metal layer 222 is stacked on the second insulating layer 221. The second metal layer 222 includes a second sub-half coil 2221. The second sub-half coil 2221 is a spirally extending metal wire. The second sub-half coil 2221 can extend along the edge of the second insulating layer 221.

[0058] The number of turns of the first half-coil 2121 and the second half-coil 2221 is greater than 2. The number of turns of the first half-coil 2121 and the second half-coil 2221 can both be 6 turns.

[0059] Both the first PCB board 21 and the second PCB board 22 are detachably connected to the frame 1. The first PCB board 21 and the second PCB board 22 of the same coil assembly 2 form a ring. The channel enclosed by the first PCB board 21 and the second PCB board 22 allows the ball-passing pipe 200 to pass through. The ball-passing pipe 200 is used to transport the fuel ball 300 to be detected, which can be a graphite-based nuclear fuel ball 300, and the fuel ball 300 moves along the ball-passing pipe 200. All the first sub-coils 2121 and all the second sub-coils 2221 of the same coil assembly 2 are electrically connected by wires to form a detection coil 20. All the first sub-coils 2121 and all the first sub-coils 2121 of the same coil assembly 2 have the same winding direction, for example, they are all wound clockwise.

[0060] Thus, since each coil assembly 2 contains a detection coil 20 formed by connecting a first sub-half coil 2121 and a second sub-half coil 2221, when the fuel ball 300 passes through the detection coil 20 of any coil assembly 2, the eddy currents in the fuel ball 300 cause a change in the coil impedance of the detection coil 20. A single fuel ball 300 sequentially passes through the detection coils 20 of two coil assemblies 2 along the ball-passing pipe 200, and the coil impedances of the detection coils 20 of these two coil assemblies 2 change sequentially, thereby achieving ball-passing detection of the fuel ball 300. Simultaneously, the first PCB board 21 and the second PCB board 22 can be manufactured using PCB board fabrication technology, eliminating the need for wire winding, simplifying the production process, and reducing production costs. This ball-passing detection sensor 100 is suitable for mass production, exhibiting good consistency in sensor parameters. This ball-passing detection sensor 100 is positioned outside the ball-passing pipe 200, without damaging the structure of the ball-passing pipe 200.

[0061] In one illustrative embodiment, such as Figure 1 As shown, the coil assembly 2 also includes a first terminal 23 and a second terminal 24. The first terminal 23 and the second terminal 24 are electrically connected to the first PCB board 21 and the second PCB board 22, respectively. The first terminal 23 and the second terminal 24 are respectively connected to the two ends of the detection coil 20 of the coil assembly 2. The first terminal 23 and the second terminal 24 are used to output the electrical signal generated in the detection coil 20 to the outside.

[0062] In one illustrative embodiment, such as Figure 3As shown, the first PCB board 21 is provided with multiple first insulating layers 211 and multiple first metal layers 212. Both the first metal layer 211 and the first insulating layer 212 can have eight layers. The first insulating layers 211 and the first metal layers 212 are arranged alternately in the thickness direction of the first PCB board 21. Each first insulating layer 211 has a first metallized hole, and two adjacent first sub-half coils 2121 are electrically connected through the first metallized hole. The first sub-half coils 2121 of multiple first metal layers 212 in the same first PCB board 21 are connected in series to form a first half coil. The first metal layer 212 can be made as thick as possible, and the first insulating layer 211 can be made as thin as possible to increase current carrying capacity.

[0063] The second PCB board 22 has multiple second insulating layers 221 and multiple second metal layers 222. Both the second metal layers 222 and the second insulating layers 221 can have eight layers. The second insulating layers 221 and the second metal layers 222 are arranged alternately along the thickness direction of the second PCB board 22. Each second insulating layer 221 has a second metallized via, and adjacent second sub-half coils 2221 are electrically connected through these vias. The second sub-half coils 2221 of multiple second metal layers 222 on the same second PCB board 22 are connected in series to form a second half coil. The second metal layers 222 can be made as thick as possible, and the second insulating layers 221 can be made as thin as possible to increase current carrying capacity.

[0064] Thus, both the first PCB board 21 and the second PCB board 22 are multilayer PCB boards. The first PCB board 21 has multiple first sub-half coils 2121, which are connected in series to form a first half coil. The second PCB board 22 has multiple second sub-half coils 2221, which are connected in series to form a second half coil. The first and second half coils can be connected in series to form a detection coil 20. This detection coil 20 has a large number of turns, which increases the inductance and improves the detection sensitivity.

[0065] In one illustrative embodiment, a single coil assembly 2 comprises multiple first PCB boards 21 and multiple second PCB boards 22, with the same number of first PCB boards 21 and second PCB boards 22, for example, 2 to 5 each. The multiple first PCB boards 21 are stacked and aligned with each other. The multiple second PCB boards 22 are stacked and aligned with each other. The first PCB boards 21 and the second PCB boards 22 are arranged in a one-to-one correspondence, and the first PCB board 21 and its corresponding second PCB board 22 form a ring-shaped plate structure.

[0066] The first half-coils of two adjacent first PCB boards 21 are electrically connected by wires, and multiple first half-coils of the first PCB boards 21 are connected in series. The second half-coils of two adjacent second PCB boards 22 are electrically connected by wires, and multiple second half-coils of the second PCB boards 22 are connected in series. The multiple first half-coils connected in series are connected in series with the multiple second half-coils connected in series.

[0067] In this way, multiple first PCB boards 21 are stacked and multiple second PCB boards 22 are stacked, making the ball detection sensor 100 relatively compact. At the same time, multiple first half-coils and multiple second half-coils are connected in series to form a detection coil 20, which can further increase the inductance of the detection coil 20 to ensure that the inductance of the detection coil 20 can be impedance matched with the detection instrument.

[0068] In one illustrative embodiment, such as Figure 4 As shown, a single coil assembly 2 includes multiple first PCB boards 21 and multiple second PCB boards 22 (not shown in the figure for clarity). The number of first PCB boards 21 and second PCB boards 22 is the same, for example, 2 to 5 each. The multiple first PCB boards 21 are stacked and aligned with each other. The multiple second PCB boards 22 are stacked and aligned with each other. The first PCB boards 21 and the second PCB boards 22 are arranged in a one-to-one correspondence, and the first PCB board 21 and its corresponding second PCB board 22 form a ring-shaped plate structure.

[0069] In the same coil assembly 2, the starting ends of the first half-coils of all the first PCB boards 21 are electrically connected by wires, the ending ends of the first half-coils of all the first PCB boards 21 are electrically connected by wires, and the first half-coils of all the first PCB boards 21 are connected in parallel. In the same coil assembly 2, the starting ends of the second half-coils of all the second PCB boards 22 are electrically connected by wires, the ending ends of the second half-coils of all the second PCB boards 22 are electrically connected by wires, and the second half-coils of all the second PCB boards 22 are connected in parallel. The ending ends of the first half-coils of the first PCB board 21 are electrically connected to the starting ends of the second half-coils of the second PCB board 22 by wires, thereby realizing the series connection of multiple parallel first half-coils and multiple parallel second half-coils.

[0070] In this way, multiple first PCB boards 21 are stacked and multiple second PCB boards 22 are stacked, making the ball detection sensor 100 relatively compact. At the same time, multiple first half-coils are connected in parallel and multiple second half-coils are connected in parallel, which can increase the current carrying capacity of the detection coil 20 composed of the first half-coils and the second half-coils, ensuring that the required detection current is met.

[0071] In one illustrative embodiment, an insulating layer is provided between two adjacent first PCB boards 21. This insulating layer may be a polyimide insulating layer, which separates the two adjacent first PCB boards 21.

[0072] An insulating layer is provided between two adjacent second PCB boards 22. This insulating layer can be a polyimide insulating layer, which separates the two adjacent second PCB boards 22.

[0073] In this way, the two adjacent first PCB boards 21 and the two adjacent second PCB boards 22 are separated by an insulating layer, which can improve the safety of the multiple stacked first PCB boards 21 and multiple second PCB boards 22, and also extend the service life of the multiple first PCB boards 21 and multiple second PCB boards 22.

[0074] In one illustrative embodiment, such as Figure 2 As shown, both coil assemblies 2 are constructed as rings. The center distance D between the two coil assemblies 2 is equal to the radius of the fuel ball 300 to be detected.

[0075] By setting the center distance D between the two coil assemblies 2 to be equal to the radius of the fuel ball 300 to be detected, the fuel ball detection sensor 100 can count the fuel balls 300 more accurately and is more suitable for counting the fuel balls 300.

[0076] In one illustrative embodiment, such as Figure 2 As shown, both coil assemblies 2 are constructed as rings. The center distance D between the two coil assemblies 2 is equal to 1 to 1.5 times the diameter of the fuel ball 300 to be detected.

[0077] With the center distance D between the two coil assemblies 2 equal to 1 to 1.5 times the diameter of the fuel ball 300 to be detected, the ball detection sensor 100 is more suitable for measuring the speed of the fuel ball 300 and detecting broken balls.

[0078] In one illustrative embodiment, a channel between the first PCB board 21 and the second PCB board 22 is provided for the passage of the ball-passing conduit 200, which is used to transport the fuel ball 300 to be tested. The distance from the outermost loop of the inner half-loop coil of the first sub-half coil 2121 and the second sub-half coil 2221 to the ball-passing conduit 200 is less than 10 mm.

[0079] The inner half-loop coils of the first half-coil 2121 and the second half-coil 2221 refer to the portions of the first half-coil 2121 and the second half-coil 2221 closest to the ball-passing pipe 200. The distance from the outermost loop of the inner half-loop coil of the first half-coil 2121 and the second half-coil 2221 to the ball-passing pipe 200 is less than 10mm, ensuring that the ball-passing detection sensor 100 has high detection efficiency.

[0080] In one illustrative embodiment, such as Figure 5 As shown, the frame 1 includes a first support 11 and a second support 12. The first support 11 includes a first base 111, a first fixing post 112, and a second fixing post 113. Both the first fixing post 112 and the second fixing post 113 are constructed as straight strips. The cross-section of the first fixing post 112 and the second fixing post 113 can be a fan-shaped annulus. The first base 111 can be constructed as a semi-circular annulus. The first fixing post 112 and the second fixing post 113 extend from opposite ends of the first base 111, respectively.

[0081] The second support 12 includes a second base 121, a third fixing post 122, and a fourth fixing post 123. Both the third fixing post 122 and the fourth fixing post 123 are constructed as straight strips. The cross-section of the third fixing post 122 and the fourth fixing post 123 can be a fan-shaped annulus. The second base 121 can be constructed as a semi-circular annulus. The second base 121 and the first base 111 form a ring, through which the ball-passing pipe 200 passes. The third fixing post 122 and the fourth fixing post 123 extend from opposite ends of the second base 121.

[0082] The first PCB board 21 has a first mounting hole 2111. The cross-section of the first mounting hole 2111 can be an annular shape. The second PCB board 22 has a second mounting hole. The cross-section of the second mounting hole can also be an annular shape. Both the first mounting hole 2111 and the second mounting hole are through holes. The first fixing post 112 passes through the first mounting hole 2111 of the first PCB board 21 of one coil assembly 2, and the second fixing post 113 passes through the first mounting hole 2111 of the first PCB board 21 of the other coil assembly 2. The first PCB boards 21 of the two coil assemblies 2 are respectively mounted on the first fixing post 112 and the second fixing post 113, and the first PCB boards 21 of the two coil assemblies 2 are separated by the first base 111. The first PCB board 21 and the first base 111 can be connected by screws.

[0083] The third fixing post 122 passes through the second mounting hole 2211 of the second PCB board 22 of one coil assembly 2, and the fourth fixing post 123 passes through the second mounting hole 2211 of the second PCB board 22 of another coil assembly 2. The second PCB boards 22 of the two coil assemblies 2 are respectively mounted on the third fixing post 122 and the fourth fixing post 123, and the second PCB boards 22 of the two coil assemblies 2 are separated by the second base 121. The second PCB board 22 and the second base 121 can be connected by screws.

[0084] In this way, the first PCB board 21 and the second PCB board 22 can be securely mounted on the frame 1.

[0085] In one illustrative embodiment, both the first base 111 and the second base 121 are constructed as semi-circular rings. The first base 111 and the second base 121 are mounted in a ring on the ball-passing pipe 200.

[0086] The first support 11 is provided with a plurality of first fixing posts 112 and a plurality of second fixing posts 113. The number of first fixing posts 112 and second fixing posts 113 can be three. The plurality of first fixing posts 112 are arranged circumferentially along the first base 111, and the plurality of second fixing posts are arranged circumferentially along the first base 111.

[0087] The second support 12 is provided with a plurality of third fixing posts 122 and a plurality of fourth fixing posts 123. The number of third fixing posts 122 and fourth fixing posts 123 can be three. The plurality of third fixing posts 122 are arranged circumferentially along the second base 121, and the plurality of fourth fixing posts are arranged circumferentially along the fourth base.

[0088] The first PCB board 21 has multiple first mounting holes 2111. The second PCB board 22 has multiple second mounting holes 2211. The number of first mounting holes 2111, second mounting holes 2211, first fixing posts 112, second fixing posts 113, third fixing posts 122, and fourth fixing posts 123 are the same.

[0089] Multiple first fixing posts 112 on the first bracket 11 pass through multiple first mounting holes 2111 on the first PCB board 21 of one coil assembly 2, respectively. Multiple second fixing posts 113 on the first bracket 11 pass through multiple first mounting holes 2111 on the first PCB board 21 of another coil assembly 2, respectively. Multiple third fixing posts 122 on the second bracket 12 pass through multiple second mounting holes 2211 on the second PCB board 22 of one coil assembly 2, respectively. Multiple fourth fixing posts 123 on the second bracket 12 pass through multiple second mounting holes 2211 on the second PCB board 22 of another coil assembly 2, respectively.

[0090] In this way, both the first PCB board 21 and the second PCB board 22 are penetrated by multiple fixing posts, which can fix the first PCB board 21 and the second PCB board 22 more firmly and improve the vibration resistance of the ball detection sensor 100.

[0091] In one illustrative embodiment, the ball detection sensor 100 further includes a shielding housing 3. The shielding housing 3 has wiring mounting holes 33 located on its sidewall. A mounting cavity 30 is also provided inside the shielding housing 3. The frame 1 and two coil assemblies 2 are housed in the mounting cavity 30. A first terminal 23 and a second terminal 24 extend from the wiring mounting holes 33 and can be fixed to the shielding housing 3 with screws. The shielding housing 3 is a metal housing.

[0092] In this way, both coil assemblies 2 are set inside the shielding shell 3, which can shield external electromagnetic interference, making the detection results of the ball detection sensor 100 more accurate.

[0093] In one illustrative embodiment, such as Figure 5 As shown, the shielding shell 3 includes a first shell 31 and a second shell 32. Both the first shell 31 and the second shell 32 are precision cast. The first shell 31 can be connected to the second shell 32 via a hinge. The first shell 31 and the second shell 32 enclose an installation cavity 30. A first positioning step 311 is provided on both the top and bottom walls of the first shell 31. A second positioning step 321 is provided on both the top and bottom walls of the second shell 32. The first positioning step 311 of the first shell 31 and the second positioning step 321 of the second shell 32 abut against the frame 1, thus restricting the translation of the frame 1. A first set screw hole 312 is provided on the top and bottom walls of the first shell 31, and a first set screw is provided within the first set screw hole 312. The first set screw abuts against the frame 1, thus restricting the rotation of the frame 1. A second set screw hole 322 is provided on the top and bottom walls of the second shell 32, and a second set screw is provided within the second set screw hole 322. The second set screw abuts against the frame 1, thus restricting the rotation of the frame 1.

[0094] In the description of this utility model, it should be noted that the terms "upper", "lower", "one side", "the other side", "one end", "the other end", "side", "opposite", "four corners", "periphery", "'mouth' structure", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the structure referred to has a specific orientation, or is constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0095] In the description of the embodiments of this utility model, unless otherwise expressly specified and limited, the terms "connection," "direct connection," "indirect connection," "fixed connection," "installation," and "assembly" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. The terms "installation," "connection," and "fixed connection" can refer to a direct connection or an indirect connection through an intermediate medium, or they can refer to the internal communication between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0096] Although the embodiments disclosed in this utility model are as described above, the content described is only for the purpose of facilitating understanding of this utility model and is not intended to limit this utility model. Any person skilled in the art to which this utility model pertains may make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed in this utility model, but the patent protection scope of this utility model shall still be defined by the appended claims.

Claims

1. A ball-passing detection sensor, characterized in that, include: A frame and two coil assemblies respectively disposed at opposite ends of the frame; The coil assembly includes: The first PCB board, connected to the frame, includes: A first insulating layer is connected to the skeleton; A first metal layer is disposed on the first insulating layer, including a first sub-half coil; The second PCB board, connected to the frame, includes: A second insulating layer is connected to the skeleton; A second metal layer is disposed on the second insulating layer, including a second sub-half coil; The first PCB board and the second PCB board are both constructed as semi-circular rings, and the first PCB board and the second PCB board in the same coil assembly form a ring. All the first sub-half coils and all the second sub-half coils in the same coil assembly are electrically connected to form a detection coil.

2. The ball detection sensor according to claim 1, characterized in that, The first PCB board is provided with multiple first insulating layers and multiple first metal layers. The first insulating layers and the first metal layers are arranged alternately in the thickness direction of the first PCB board. The first sub-half coils of the multiple first metal layers are connected in series to form a first half coil. The second PCB board is provided with multiple second insulating layers and multiple second metal layers. The second insulating layers and the second metal layers are arranged alternately in the thickness direction of the second PCB board, and the second sub-half coils of the multiple second metal layers are connected in series to form a second half coil.

3. The ball detection sensor according to claim 2, characterized in that, A single coil assembly is provided with multiple first PCB boards and multiple second PCB boards, with the multiple first PCB boards stacked on top of each other; Multiple first half-coils of first PCB boards are connected in series, and multiple second half-coils of second PCB boards are connected in series. The multiple first half-coils connected in series are connected in series with the multiple second half-coils connected in series.

4. The ball detection sensor according to claim 2, characterized in that, A single coil assembly is provided with multiple first PCB boards and multiple second PCB boards, with the multiple first PCB boards stacked on top of each other; Multiple first half-coils of first PCB boards are connected in parallel, multiple second half-coils of second PCB boards are connected in parallel, and the multiple first half-coils connected in parallel are connected in series with the multiple second half-coils connected in parallel.

5. The ball detection sensor according to claim 3 or 4, characterized in that, An insulating layer is provided between two adjacent first PCB boards, and an insulating layer is provided between two adjacent second PCB boards.

6. The ball detection sensor according to claim 2, characterized in that, The center distance between the two coil assemblies is equal to the radius of the fuel ball to be detected; or, The center distance between the two coil assemblies is equal to 1 to 1.5 times the diameter of the fuel ball to be tested.

7. The ball detection sensor according to claim 1, characterized in that, The channel between the first PCB board and the second PCB board is through which the ball-passing pipe is used to transport the fuel ball to be tested; The distance from the outermost loop of the inner half-loop coil of the first and second sub-half coils to the ball-passing tube is less than 10mm.

8. The ball detection sensor according to claim 1, characterized in that, The skeleton includes a first support and a second support; The first support includes a first base and a first fixing post and a second fixing post extending from opposite ends of the first base; The second support includes a second base and a third and a fourth fixing post extending from opposite ends of the second base; The first PCB board is provided with a first mounting hole, and the second PCB board is provided with a second mounting hole; The first fixing post and the second fixing post pass through the first mounting holes of the first PCB board of the two coil assemblies, respectively, and the third fixing post and the fourth fixing post pass through the second mounting holes of the second PCB board of the two coil assemblies, respectively.

9. The ball detection sensor according to claim 8, characterized in that, Both the first base and the second base are constructed as semi-circular rings, and the first base and the second base are assembled together to form a ring; The first mounting hole, the second mounting hole, the first fixing post, the second fixing post, the third fixing post, and the fourth fixing post are all provided in multiple quantities; The plurality of first fixing posts pass through the plurality of first mounting holes of the first PCB board of one coil assembly, the plurality of second fixing posts pass through the plurality of first mounting holes of the first PCB board of another coil assembly, the plurality of third fixing posts pass through the plurality of second mounting holes of the second PCB board of one coil assembly, and the plurality of fourth fixing posts pass through the plurality of second mounting holes of the second PCB board of another coil assembly.

10. The ball detection sensor according to claim 9, characterized in that, It also includes a shielding housing that houses the skeleton and the two coil assemblies.

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