Broken silicon wafer removing device
By setting up a crushed silicon wafer rejection device with visual inspection and robotic arm modules on multiple tracks, efficient rejection of silicon wafers on multiple tracks is achieved, solving the problems of low production efficiency and high cost in existing technologies.
Patent Information
- Application Number
- CN202423117155.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-17
AI Technical Summary
Existing silicon wafer fragment rejection devices are only suitable for single tracks, and in multi-track operation, each track needs to be equipped with a rejection device, resulting in low production efficiency and high cost.
A broken silicon wafer rejection device is designed. It uses a vision inspection device to detect broken silicon wafers on multiple tracks, and through a robotic arm module and rejection module of a rejection device, it can move precisely on multiple tracks to achieve multi-track fragment rejection.
It improves the efficiency of debris removal in silicon wafer production, reduces production costs, and only one removal device is needed to cover multiple tracks.
Smart Images
Figure CN223582957U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to photovoltaic production technical field especially relates to a broken silicon wafer rejection device. BACKGROUND
[0002] The silicon wafer is one of important materials in photovoltaic production, as the carrier of solar cell wafer, the quality of silicon wafer determines the conversion efficiency of solar cell wafer. In the process of sorting silicon wafer, there is a certain probability of broken loss of silicon wafer, and the unqualified silicon wafer needs to be rejected, and then normal production is continued.
[0003] The existing silicon wafer fragment rejection device is only suitable for fragment rejection on single track, and the rejection is limited to fixed point, which affects the rejection efficiency of production. In addition, when producing under the working condition of multiple tracks, the rejection device needs to be equipped one by one corresponding to the track, and the production cost is also large. UTILITY MODEL CONTENTS
[0004] The utility model discloses a broken silicon wafer rejection device to solve the technical problem of low fragment rejection efficiency and high production cost in the prior art of silicon wafer production.
[0005] In order to solve the above technical problem, the technical scheme provided by the utility model is as follows:
[0006] The utility model provides a broken silicon wafer rejection device, which comprises:
[0007] A rack;
[0008] A plurality of tracks are arranged on the top surface of the rack in the same direction.
[0009] A visual detection device is arranged on one side of the rack close to the plurality of tracks to detect whether there is a broken silicon wafer on the plurality of tracks.
[0010] A rejection device is arranged on one side of the top surface of the rack close to the plurality of tracks at the first end, and the second end of the rejection device is movably arranged above the plurality of tracks.
[0011] Further, the rejection device comprises:
[0012] A base is arranged on the top surface of the rack outside the plurality of tracks.
[0013] A mechanical arm module is connected to the base at the first end, and the second end of the mechanical arm module is movably arranged above the plurality of tracks in the horizontal plane.
[0014] A removing module is connected to the second end of the mechanical arm module, and the removing module is moved by the mechanical arm module to perform removing work on the predetermined track.
[0015] Further, the mechanical arm module comprises at least one mechanical arm,
[0016] The first end of the at least one mechanical arm is rotatably connected to the base in a horizontal plane, and the second end of the at least one mechanical arm is connected to the removing module.
[0017] Further, the at least one mechanical arm comprises a first mechanical arm, a second mechanical arm and a third mechanical arm,
[0018] The first end of the first mechanical arm is rotatably connected to the base in a horizontal plane by a driving source,
[0019] The first end of the second mechanical arm is rotatably connected to the second end of the first mechanical arm in a horizontal plane by a driving source,
[0020] The first end of the third mechanical arm is rotatably connected to the second end of the second mechanical arm in a horizontal plane by a driving source, and the second end of the third mechanical arm is connected to the removing module.
[0021] Further, the driving source is a first rotary motor.
[0022] Further, a wire slot is formed in the first mechanical arm and the third mechanical arm along the length direction thereof, respectively, and a wire slot cover plate is arranged on the wire slot.
[0023] Further, the removing module comprises:
[0024] A linear module is arranged in an up-down direction, and a fixed end of the linear module is connected to the second end of the mechanical arm module;
[0025] A fixed plate is arranged horizontally, one end of the fixed plate is connected to the sliding end of the linear module, and the linear module drives the fixed plate to ascend and descend;
[0026] A suction cup is connected to the bottom surface of the fixed plate.
[0027] Further, a blowing hole is formed on the side of the fixed plate away from the suction cup, and a blowing connector is arranged in the blowing hole.
[0028] Further, the removing module further comprises:
[0029] An L-shaped connecting plate is vertically connected to the sliding end of the linear module by a long side of the L-shaped connecting plate,
[0030] A second rotary motor is arranged on the inner side of the short side of the L-shaped connecting plate, and the output end of the second rotary motor penetrates through the L-shaped connecting plate downward to connect the fixed plate,
[0031] The fixed plate is driven to rotate by the second rotary motor.
[0032] Further, the device further comprises:
[0033] A controller is arranged to control the removing device based on the detection result of the visual detection device.
[0034] The utility model provides a broken silicon wafer removing device, can according to the result of visual detection, only through a removing device can remove the broken pieces on multiple tracks, and can be targeted and accurately moved to any position on the track, effectively improve the removing efficiency of broken pieces in the production of silicon wafer. In addition, it is not necessary to equip separate removing device for each track, only one is needed, which greatly reduces the production cost.
[0035] The above and other objects, advantages and features of the utility model will become more apparent from the following detailed description of some embodiments thereof, when considered in conjunction with the attached drawings. BRIEF DESCRIPTION OF DRAWINGS
[0036] Some specific embodiments of the utility model will be described in detail hereinafter with reference to the accompanying drawings in an exemplary but not restrictive manner. The same reference signs in the drawings indicate the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale.
[0037] In the drawings:
[0038] Figure 1 It is a structure schematic view of the broken silicon wafer removing device of the utility model embodiment;
[0039] Figure 2 It is Figure 1 It is an enlarged schematic view of A area in the middle;
[0040] Figure 3 It is a structure schematic view of the removing device in the broken silicon wafer removing device of the utility model embodiment;
[0041] Figure 4 It is a structure schematic view of the removing module in the broken silicon wafer removing device of the utility model embodiment.
[0042] Explanation of reference signs:
[0043] Rack-100;
[0044] Track-200;
[0045] Visual detection device-300;
[0046] Elimination device-400; base-410; mechanical arm module-420; first mechanical arm-421; second mechanical arm-422; third mechanical arm-423; first rotary motor-424; wire slot-425; wire slot cover plate-426;
[0047] Elimination module-430; linear module-431; fixed plate-432; air blowing hole-4321; suction cup-433; air blowing connector-434; L-shaped connecting plate-435; second rotary motor-436. DETAILED DESCRIPTION
[0048] In the description of the embodiments, it needs to be understood that the terms "length", "width", "height", "upper", "lower", "left", "right", "vertical", "horizontal", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.
[0049] As a specific embodiment of the utility model, as shown in Figure 1 The broken silicon wafer elimination device of the utility model embodiment can include a rack 100, a plurality of tracks 200, a visual detection device 300 and an elimination device 400. Among them, the plurality of tracks 200 are arranged on the top surface of the rack 100 in the same direction. The plurality of tracks 200 are used to convey silicon wafers, and the broken silicon wafers are left on them. The visual detection device 300 is arranged on one side of the rack 100 close to the plurality of tracks 200 to detect whether there is a broken silicon wafer on the plurality of tracks 200. The first end of the elimination device 400 is arranged close to the plurality of tracks 200, and the second end of the elimination device 400 is movably arranged above the plurality of tracks 200.
[0050] Specifically, the broken silicon wafer elimination device of the utility model embodiment is provided with a plurality of tracks 200 on the top surface of the rack 100, and a visual detection device 300, which can be an industrial camera, for example, is arranged on one side of the plurality of tracks 200 on the rack 100 to directly detect whether there is a broken silicon wafer on the plurality of tracks 200. In addition, the elimination device 400 is also arranged on one side of the plurality of tracks 200 on the rack 100, the first end of the elimination device 400 is installed on the rack 100, and the second end is movably arranged above the plurality of tracks 200, so that according to the detection result of the visual detection device 300, the second end of the elimination device 400 can be moved to above the predetermined track 200 to eliminate the broken silicon wafer on the track 200.
[0051] According to the broken silicon wafer removing device, compared with the prior art, the device is provided with a plurality of tracks 200, the removing device can remove the broken pieces on the plurality of tracks 200 through only one removing device 400 according to the visual detection result, and can be moved to any position on the track 200 in a targeted and accurate manner, thereby effectively improving the removing efficiency of the broken pieces in the production of the silicon wafer. In addition, a separate removing device does not need to be arranged for each track, and only one removing device is needed, thereby greatly reducing the production cost.
[0052] In some embodiments, as shown in Figure 1 and Figure 2 , the removing device 400 can include a base 410, a mechanical arm module 420, and a removing module 430.
[0053] The base 410 is arranged on the top surface of the rack 100 outside the plurality of tracks 200. The first end of the mechanical arm module 420 is connected to the base 410, and the second end of the mechanical arm module 420 is movably arranged above the plurality of tracks 200 in the horizontal plane. The removing module 430 is connected to the second end of the mechanical arm module 420, and the removing module 430 is moved by the mechanical arm module 420 to perform removing work on the predetermined track 200.
[0054] That is, the base 410 of the removing device 400 is installed on the top surface of the rack 100 outside the plurality of tracks 200, one end of the base 410 is connected to the mechanical arm module 420, the other end of the mechanical arm module 420 is movably arranged above the plurality of tracks 200 relative to the one end, and the other end of the mechanical arm module 420 is connected to the removing module 430. Then, the other end of the mechanical arm module 420 is driven to move to a predetermined position above the plurality of tracks 200, so that the removing module 430 removes the broken pieces at the predetermined position on the predetermined track 200, which is simple and reliable in driving and greatly improves the efficiency of removing the broken pieces.
[0055] In some embodiments, as shown in Figure 2 , the mechanical arm module 420 includes at least one mechanical arm. The first end of the at least one mechanical arm is rotatably connected to the base 410 in the horizontal plane, and the second end of the at least one mechanical arm is connected to the removing module 430.
[0056] That is, the mechanical arm module 420 includes one or more mechanical arms, one end of the one or more mechanical arms is rotatably connected to the base 410 in the horizontal plane, so that the other end can be rotatably moved in the horizontal plane.
[0057] In some embodiments, as shown in Figure 3As shown, the at least one mechanical arm can include a first mechanical arm 421, a second mechanical arm 422, and a third mechanical arm 423. The first end of the first mechanical arm 421 is rotatably connected to the base 410 in the horizontal plane by a driving source. The first end of the second mechanical arm 422 is rotatably connected to the second end of the first mechanical arm 421 in the horizontal plane by a driving source. The first end of the third mechanical arm 423 is rotatably connected to the second end of the second mechanical arm 422 in the horizontal plane by a driving source, and the second end of the third mechanical arm 423 is connected to the rejection module 430.
[0058] Thus, the rotation connection between the plurality of mechanical arms enables the mechanical arm module 420 to efficiently move in a large range among the plurality of tracks 200, and further enables the rejection module 430 to perform debris rejection on the predetermined position.
[0059] Preferably, as shown, the driving source is a first rotary motor 424. Figure 3
[0060] That is, the end of the mechanical arm is driven to relatively rotate by the first rotary motor 424, which is stable and reliable and has low maintenance cost.
[0061] In some embodiments, as shown, a wire slot 425 is formed along the length direction of the first mechanical arm 421 and the third mechanical arm 423 respectively, and a wire slot cover plate 426 is arranged on the wire slot 425. Figure 3
[0062] That is, the wire slot 425 is formed on the first and last mechanical arms to facilitate laying of the wire, and the wire slot cover plate 426 is arranged on the wire slot 425 to shield the wire slot 425, thereby protecting the wire.
[0063] In some embodiments, as shown, the rejection module 430 can include a linear module 431, a fixed plate 432, and a suction cup 433. The linear module 431 is arranged in the up-down direction, and the fixed end thereof is connected to the second end of the mechanical arm module 420. The fixed plate 432 is arranged horizontally, and one end thereof is connected to the sliding end of the linear module 431, and the linear module 431 drives the fixed plate 432 to ascend and descend. The suction cup 433 is connected to the bottom surface of the fixed plate 432. Figure 4
[0064] That is, the fixed plate 432 is driven to ascend and descend by the linear module 431 in the rejection module 430, so that the suction cup 433 on the fixed plate 432 reaches a suitable height to perform debris suction.
[0065] In some embodiments, as shown, the side of the fixed plate 432 away from the suction cup 433 is further formed with a blowing hole 4321, and a blowing connector 434 is arranged in the blowing hole 4321. Figure 4
[0066] That is, the air blowing joint 434 can also be arranged by opening an air blowing hole 4321 on the fixing plate 432, that is, the debris on the track 200 can be blown away by the air blowing joint 434 on the fixing plate 432. This setting is suitable for the case where the suction cup 433 is not suitable for work, for example, the residual debris is very small, and the work of removing the debris can be more efficient by using the air blowing joint 434.
[0067] In some embodiments, as shown in Figure 4 The removing module 430 can further include an L-shaped connecting plate 435 and a second rotary motor 436. The long side of the L-shaped connecting plate 435 is vertically connected to the sliding end of the linear module 431. The second rotary motor 436 is arranged on the inner side of the short side of the L-shaped connecting plate 435, and the output end of the second rotary motor 436 penetrates downward through the L-shaped connecting plate 435 to connect the fixing plate 432. The fixing plate 432 is driven to rotate by the second rotary motor 436.
[0068] Therefore, the fixing plate 432 can be driven to rotate in the horizontal plane, and the position of the fixing plate 432 relative to the linear module 431 can be adjusted in the plane, thereby improving the flexibility of the components on the fixing plate 432 in removing debris.
[0069] In some embodiments, the broken silicon wafer removing device can further include a controller. The controller is used to control the operation of the removing device 400 based on the detection result of the visual detection device 300.
[0070] Specifically, for example, when the industrial camera detects a broken silicon wafer on the track 200, the controller (for example, an industrial computer) calculates the coordinates, calculates the required rotation angle of each first rotary motor 424 and second rotary motor 436 through inverse algorithm, and drives the suction cup 433 to move to the top of the debris after the rotation angle calculated by the industrial computer is executed by each rotary motor. The servo motor controls the linear module 431 to descend to the track height, the suction cup 433 sucks the debris, or the air blowing joint 434 blows away the debris.
[0071] At this point, those skilled in the art should recognize that although the present application has been shown and described in detail in the above embodiments, many other variations or modifications can be determined or deduced directly according to the disclosure of the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should be understood and recognized as covering all these other variations or modifications.
Claims
1. A device for rejecting broken silicon wafers, characterized in that, include: frame; Multiple tracks are arranged in the same direction on the top surface of the frame; A visual inspection device is provided on one side of the frame near the plurality of tracks to detect whether there are broken silicon wafers on the plurality of tracks; The rejection device has a first end located near one side of the top surface of the frame, close to the plurality of tracks, and a second end movably located above the plurality of tracks.
2. The silicon wafer crushing and rejection device according to claim 1, characterized in that, The rejection device includes: A base, which is disposed on the top surface of the frame outside the plurality of tracks; A robotic arm module, wherein a first end of the robotic arm module is connected to the base, and a second end of the robotic arm module is movably disposed above the multiple tracks on a horizontal plane; A rejection module is connected to the second end of the robotic arm module. The rejection module is moved by the robotic arm module to perform rejection work on the predetermined track.
3. The silicon wafer crushing and rejection device according to claim 2, characterized in that, The robotic arm module includes at least one robotic arm. At least one of the robotic arms has its first end rotatably connected to the base on a horizontal plane, and at least one of the robotic arms has its second end connected to the rejection module.
4. The silicon wafer crushing and rejection device according to claim 3, characterized in that, At least one of the robotic arms includes a first robotic arm, a second robotic arm, and a third robotic arm. The first end of the first robotic arm is rotatably connected to the base on a horizontal plane via a drive source. The first end of the second robotic arm is rotatably connected to the second end of the first robotic arm on a horizontal plane via a drive source. The first end of the third robotic arm is rotatably connected to the second end of the second robotic arm on a horizontal plane via a drive source, and the second end of the third robotic arm is connected to the rejection module.
5. The silicon wafer crushing and rejection device according to claim 4, characterized in that, The driving source is a first rotary motor.
6. The silicon wafer crushing and rejection device according to claim 4, characterized in that, The first robotic arm and the third robotic arm are respectively provided with grooves along their length, and the grooves are provided with groove cover plates.
7. The silicon wafer crushing and rejection device according to claim 2, characterized in that, The rejection module includes: A linear module, wherein the linear module is arranged in the vertical direction and its fixed end is connected to the second end of the robotic arm module; A fixed plate is horizontally arranged, with one end connected to the sliding end of the linear module, and the linear module drives the fixed plate to rise and fall. A suction cup, which is attached to the bottom surface of the fixed plate.
8. The silicon wafer crushing and rejection device according to claim 7, characterized in that, An air blowing hole is formed on the side of the fixing plate away from the suction cup, and an air blowing connector is provided in the air blowing hole.
9. The silicon wafer crushing and rejection device according to claim 7, characterized in that, The rejection module also includes: An L-shaped connecting plate, the long side of which is vertically connected to the sliding end of the linear module. A second rotary motor is disposed on the inner side of the short side of the L-shaped connecting plate, and the output end of the second rotary motor passes downward through the L-shaped connecting plate and connects to the fixing plate. The fixed plate is rotated by the second rotary motor.
10. The silicon wafer crushing and rejection device according to claim 1, characterized in that, Also includes: A controller is used to control the rejection device to operate based on the detection results of the visual inspection device.