Packaging heating structure
By establishing a negative pressure state with a vacuum degree of less than 10⁻³ between the substrate and the encapsulation layer, and using an encapsulation layer formed by materials such as microcrystalline glass to cover the heating film and electrodes, the sealing and integrity problems of high-temperature electric heating film encapsulation are solved, and the stability of encapsulation at high temperatures is achieved.
Patent Information
- Application Number
- CN202423093196.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-16
AI Technical Summary
Existing encapsulation methods for high-temperature electrothermal films cannot maintain sealing and integrity, and the temperature resistance of adhesives is limited.
The design employs a vacuum level of less than 10⁻³ between the substrate and the encapsulation layer, utilizing a negative pressure state for sealing. The encapsulation layer, formed from microcrystalline glass, quartz glass, obsidian, ceramic, or polymer materials, covers the heating film and electrodes, ensuring the integrity and sealing of the encapsulation at high temperatures.
It achieves the maintenance of the integrity and sealing of the packaging at temperatures above 200°C, avoiding the loss of sealing caused by the failure of the adhesive at high temperatures.
Smart Images
Figure CN223584357U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to heating structure technical field especially relates to a package heating structure. BACKGROUND
[0002] Ordinary electric heating film is low temperature electric heating film, generally adopts adhesive film to seal and paste to form the performance of air isolation, electric heating coating protection, waterproof and insulation. But the temperature resistance of adhesive is limited, if it is high temperature electric heating film, the method of using adhesive to paste and cover cannot maintain the sealing and integrity of the package. SUMMARY
[0003] The utility model discloses an embodiment provides a package heating structure to solve one or more technical problems encountered in the prior art.
[0004] In the first aspect, an embodiment of the utility model provides a package heating structure, comprising:
[0005] The substrate is provided with a heating film and an electrode.
[0006] The heating film is a conductive film formed by vacuum plating of metal oxide on the substrate, and is used for electric heating conversion when electrified.
[0007] The electrode is arranged on both sides of the heating film and is in contact with the heating film, and the electrode is electrically connected with the power supply.
[0008] The packaging layer is stacked on the substrate, and the packaging layer completely covers the heating film and the electrode, and the packaging layer is sealed and connected with the edge of the substrate. The vacuum degree between the substrate and the packaging layer is less than 10 -3 .
[0009] In a preferred embodiment, the packaging layer is a panel structure prepared from one of microcrystalline glass, quartz glass, obsidian, ceramic or high polymer material.
[0010] In a preferred embodiment, the thickness of the heating film is 10nm-10000nm.
[0011] In a preferred embodiment, the heating film is a conductive film formed by vacuum plating of one of nickel-chromium alloy, silicon carbide, ZnOxS(1-x), InOxS(1-x), SnxIn(1-x)O, ZnxMg(1-x)O, ZnxAl(1-x)O, NiO, Cu2O and SnO.
[0012] The technical scheme has the advantages or beneficial effects that the vacuum degree between the substrate and the packaging layer is used for sealing and packaging, and the packaging integrity and sealing property can be maintained when the heat generating film is heated to 200 DEG C or above.
[0013] The above summary is merely intended to illustrate the present specification and is not intended to limit in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features will become apparent to those skilled in the art upon consideration of the drawings and the following detailed description. BRIEF DESCRIPTION OF DRAWINGS
[0014] In the drawings, like reference numerals refer to same or similar functionalities throughout the several views, unless otherwise indicated. The drawings are not necessarily to scale. It is to be understood that these drawings only depict certain embodiments in accordance with the disclosure and should not be considered limiting of the scope of the disclosure.
[0015] Figure 1 A cross-sectional view of a heat generating structure according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION
[0016] In the following, only certain example embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and the description are considered to be essentially exemplary rather than limiting.
[0017] An embodiment of the present disclosure provides a heat generating structure, referring to Figure 1 The heat generating structure includes a substrate 100, a heat generating film 200, an electrode 300 and a packaging layer 400.
[0018] The heat generating film 200 is a conductive thin film of metal oxide coated on the substrate 100 by vacuum plating, and the heat generating film 200 is used for electric heating conversion when powered.
[0019] The electrode 300 is arranged on both sides of the heat generating film 200 and connected with the heat generating film 200, and the electrode 300 is electrically connected with a power supply.
[0020] The packaging layer 400 is stacked on the substrate 100, and the packaging layer 400 completely covers the heat generating film 200 and the electrode 300, and the packaging layer 400 and the substrate 100 are sealed and connected at the edges by a connecting piece 500; wherein the vacuum degree between the substrate 100 and the packaging layer 400 is less than 10 -3In this way, the space between the substrate 100 and the encapsulation layer 400 is in a negative pressure state, thereby achieving extrusion encapsulation.
[0021] The present embodiment utilizes the low vacuum degree between the substrate 100 and the encapsulation layer 400 to achieve sealing and encapsulation, and can withstand a temperature of the heating film of 200℃ or above to maintain the integrity and sealing of the encapsulation.
[0022] Further, the encapsulation layer is a panel structure made of one of microcrystalline glass, quartz glass, obsidian, ceramic or polymer material.
[0023] Further, the thickness of the heating film is 10nm-10000nm.
[0024] Further, the heating film is a conductive thin film made of one of nickel-chromium alloy, silicon carbide, ZnOxS(1-x), InOxS(1-x), SnxIn(1-x)O, ZnxMg(1-x)O, ZnxAl(1-x)O, NiO, Cu2O and SnO by vacuum plating.
[0025] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, different embodiments or examples described in the present specification and the features of different embodiments or examples can be combined and combined by those skilled in the art without contradiction.
[0026] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0027] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can easily think of various changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A package for a heat generating structure, characterized by The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. An encapsulation layer is stacked on the substrate, and the encapsulation layer completely covers the heat-generating film and the electrode, and the encapsulation layer is sealedly connected with the substrate edge; wherein the vacuum degree between the substrate and the encapsulation layer is less than 10 -3 .
2. The package of claim 1, wherein the heat-generating structure is a semiconductor die. The application relates to a heating film and a packaging layer.
3. The package of claim 1, wherein the heat-generating structure is a semiconductor die. The application relates to a heating film and a packaging layer.
4. The package of claim 1, wherein the heat-generating structure is a semiconductor die. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer. The application relates to a heating film and a packaging layer.