Circuit board and electronic equipment

Abstract

The utility model provides a circuit board and electronic equipment, and the circuit board comprises a first substrate which is provided with a digital ground wire and an analog ground wire, and an interval region is arranged between the digital ground wire and the analog ground wire; and the second substrate is provided with a conductive piece, the conductive piece is opposite to the interval area, and the conductive piece is electrically connected with the digital ground wire and the analog ground wire.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit boards, in particular to a circuit board and an electronic device. BACKGROUND

[0002] The ground layer of the circuit board includes a digital ground wire and an analog ground wire. The digital ground wire is used for the reference potential of digital signals, ensuring stable transmission of digital signals and correct identification of logic levels. The analog ground wire is used for the reference potential of analog signals, ensuring the purity and high precision of analog signals. Among them, the analog ground wire is very sensitive to noise, and the digital ground wire can cause noise interference to the analog ground wire, resulting in signal distortion or measurement error. CONTENT OF THE UTILITY MODEL

[0003] The purpose of the present application is to provide a circuit board and an electronic device.

[0004] To solve the above technical problems, the present application provides the following technical solutions:

[0005] The first aspect of the present application provides a circuit board, comprising:

[0006] A first substrate has a digital ground wire and an analog ground wire, and the digital ground wire and the analog ground wire have a spacing area therebetween;

[0007] A second substrate has a conductive part, the conductive part is opposite to the spacing area, and the conductive part is electrically connected to the digital ground wire and the analog ground wire respectively.

[0008] In some embodiments, the conductive part comprises:

[0009] A conductive channel opposite to the spacing area, the conductive channel is electrically connected to the digital ground wire and the analog ground wire respectively, and the conductive channel is used to accommodate a cooling medium.

[0010] In some embodiments, the second substrate has a groove, and a conductive layer is arranged in the groove; the first substrate is sealingly connected to the second substrate, so that the groove and the first substrate cooperate to form the conductive channel.

[0011] In some embodiments, the second substrate is provided with a first hole and a second hole, and the first hole and the second hole are both in communication with the conductive channel;

[0012] Among them, the first hole can be in communication with the supply end of the cooling system, and the second hole can be in communication with the return end of the cooling system, so that the cooling medium can circulate between the conductive channel and the cooling system.

[0013] In some embodiments, further comprising:

[0014] A connector having a first connecting end and a second connecting end in communication; the first connecting end is configured to communicate with the cooling system;

[0015] In some embodiments, the circuit board is selected from at least one of the following combinations:

[0016] The second connecting end is adapted to the first hole, and the second connecting end is inserted into the first hole.

[0017] The second connecting end is adapted to the second hole, and the second connecting end is inserted into the second hole.

[0018] In some embodiments, the circuit board is selected from at least one of the following combinations:

[0019] The first substrate is configured with a first electronic component on a first side facing away from the second substrate, and part of the conductive channels extend to the first side for dissipating heat from the first electronic component.

[0020] The second substrate is configured with a second electronic component on a second side facing away from the first substrate, and part of the conductive channels extend to the second side for dissipating heat from the second electronic component.

[0021] In some embodiments, the conductive channels include:

[0022] Conductive pipes embedded in the second substrate.

[0023] Part of the conductive pipes protrude from the second substrate to form a communication part, and the communication part is configured with an inlet and an outlet.

[0024] The inlet is capable of communicating with a supply end of the cooling system, and the outlet is capable of communicating with a return end of the cooling system, so that the cooling medium can circulate between the conductive pipes and the cooling system.

[0025] In some embodiments, the circuit board is selected from at least one of the following combinations:

[0026] The cooling medium includes liquid metal.

[0027] The first substrate is a glass substrate.

[0028] The second substrate is a glass substrate.

[0029] The second aspect of the present application provides an electronic device, comprising:

[0030] A cooling system;

[0031] A circuit board, comprising:

[0032] A first substrate having a digital ground and an analog ground, and having a spacing region between the digital ground and the analog ground.

[0033] a second substrate having an electrically conductive member opposite to the spacing region, the electrically conductive member being electrically connected to the digital ground line and the analog ground line respectively, the electrically conductive member being an electrically conductive channel capable of containing a cooling medium;

[0034] wherein the cooling system is in communication with the electrically conductive channel to enable circulation of the cooling medium between the electrically conductive channel and the cooling system.

[0035] In some embodiments, at least one of the first substrate and the second substrate is configured with electronic components, the electronic components including one or more of a central processing unit, a graphics processing unit, a memory chip, a power management chip, a wireless module, a connector, a DC-DC converter, an inductor, an operational amplifier, a temperature sensor, and a power connector, the electrically conductive channel being capable of dissipating heat from at least one of the electronic components. BRIEF DESCRIPTION OF DRAWINGS

[0036] The above and other objects, features and advantages of the example embodiments of the present application will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0037] Figure 1 schematically showing a structural schematic view of a first perspective of a circuit board of the present application;

[0038] Figure 2 schematically showing a structural schematic view of a second perspective of a circuit board of the present application;

[0039] Figure 3 schematically showing a structural schematic view of a third perspective of a circuit board of the present application;

[0040] Figure 4 schematically showing a structural schematic view of an electrically conductive member, a first substrate and a second substrate of a circuit board of the present application

[0041] Figure 5 schematically showing a structural schematic view of an electrically conductive channel, a digital ground line and an analog ground line of one embodiment of a circuit board of the present application;

[0042] Figure 6 for Figure 5 a partial enlarged view at C in FIG. 8;

[0043] Figure 7 schematically showing a structural schematic view of an electrically conductive channel, a digital ground line and an analog ground line of another embodiment of a circuit board of the present application;

[0044] Figure 8 For Figure 7 A local enlarged view at D;

[0045] Figure 9 A structure schematic view of the recess, the first substrate and the second substrate of the circuit board of the present application is shown schematically;

[0046] Figure 10 A structure schematic view of the conductive pipe, the first substrate and the second substrate of the circuit board of the present application is shown schematically.

[0047] BRIEF DESCRIPTION OF DRAWINGS

[0048] 1, the first substrate; 11, the digital ground wire; 12, the analog ground wire; 13, the spacing area; 14, the second conductive via; 2, the second substrate; 21, the first conductive via; 3, the conductive member; 31, the conductive channel; 311, the recess; 312, the first hole; 313, the second hole; 314, the conductive pipe; 315, the communication part; 3151, the inlet; 3152, the outlet; 4, the connecting member; 41, the first connecting end; 42, the second connecting end; 5, the first electronic component; 6, the second electronic component; 7, the cooling medium. DETAILED DESCRIPTION

[0049] The embodiments of the present disclosure will be described in further detail below with reference to the drawings and examples. The detailed description and drawings of the following examples are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure, and the present disclosure can be implemented in many different forms, and is not limited to the specific examples disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0050] The present disclosure provides these examples in order to make the present disclosure thorough and complete, and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specified, the relative arrangement of components and steps, the composition of materials, numerical expressions and values set forth in these examples should be interpreted as merely exemplary, and not as a limitation.

[0051] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like is only for the purpose of facilitating the description of the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0052] In addition, "first", "second", and similar words used in the disclosure do not represent any order, quantity or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

[0053] It should also be noted that in the description of the present disclosure, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances. When it is described that a specific device is located between the first device and the second device, there can be or can not be an intermediate device between the specific device and the first device or the second device.

[0054] All terms used in the present disclosure have the same meaning as understood by those skilled in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or excessively formalized sense, unless specifically defined here.

[0055] Techniques, methods and devices known to those skilled in the relevant art can not be discussed in detail, but where appropriate, the techniques, methods and devices should be considered as part of the specification.

[0056] The digital ground line will generate noise due to current fluctuation, high frequency components of digital signals, etc., and the analog ground line is very sensitive to noise, and any slight disturbance can cause signal distortion or measurement error.

[0057] In the current ground design, in order to reduce the noise interference of the digital ground line to the analog ground line, a spacing area is provided between the digital ground line and the analog ground line to effectively isolate the interference of the two different types of ground lines and improve the stability and performance of the system.

[0058] However, the inventors found that such spacing of the digital ground line and the analog ground line would cause the impedance of the ground layer to be discontinuous, reducing signal reflection and distortion.

[0059] Based on the above consideration, the present application provides a circuit board, comprising: a first substrate having a digital ground line and an analog ground line, wherein the digital ground line and the analog ground line are spaced apart; and a second substrate having a conductive member, wherein the conductive member is electrically connected to the digital ground line and the analog ground line respectively.

[0060] The circuit board of the embodiment of the present application can be applied to computers, mobile phones, industrial control devices, vehicle information systems, etc.

[0061] As shown in Figures 1 to 8 The present application provides a circuit board, comprising:

[0062] The first substrate 1 has a digital ground line 11 and an analog ground line 12, and the digital ground line 11 and the analog ground line 12 are spaced apart.

[0063] The second substrate 2 has a conductive member 3, wherein the conductive member 3 is opposite to the spaced apart region 13, and the conductive member 3 is electrically connected to the digital ground line 11 and the analog ground line 12 respectively.

[0064] The first substrate 1 is used for carrying the digital ground line 11 and the analog ground line 12. The digital ground line 11 and the analog ground line 12 can be located on the first surface of the first substrate 1 or the second surface of the first substrate 1, wherein the first surface of the first substrate 1 and the first surface of the second substrate 2 are opposite to each other. The first surface of the first substrate 1 is opposite to the second surface of the first substrate 1, and the first surface of the second substrate 2 is opposite to the second surface of the second substrate 2.

[0065] The digital ground line 11 and the analog ground line 12 can be installed on the first substrate 1 in the form of printed wiring, or can be formed by etching process. The digital ground line 11 and the analog ground line 12 can be spaced apart by a preset distance to form the spacing area 13, and the preset distance can be adjusted according to the sensitivity of the analog circuit and the noise level of the digital circuit. For example, when the sensitivity of the analog circuit is relatively high and the noise level of the digital circuit is relatively large, the preset distance can be greater than or equal to 15 mm, so as to reduce the interference of the digital ground line 11 on the analog ground line 12 and improve the purity and high precision of the analog signal. When the sensitivity of the analog circuit is relatively low and the noise level of the digital circuit is relatively small, the preset distance can be between 5 mm and 15 mm, so as to save space while meeting the isolation requirement. The first substrate 1 can be made of epoxy resin and / or glass fiber composite material, or can be made of ceramic material, so as to provide good electrical performance and mechanical support. It should be noted that the type of the first substrate 1 is not specifically limited in the present application, that is, a person skilled in the art can set and adjust the type according to the actual situation. The above is only an exemplary description of the forms in which the first substrate 1 in the present application can be applied, but is not limited to the cases described in the above embodiments. The first substrate 1 can carry the digital ground line 11 and the analog ground line 12, and can have the spacing area 13 between them, so as to reduce the interference therebetween.

[0066] The second substrate 2 is used to carry the conductive piece 3. The conductive piece 3 can be in the form of a plane, a strip, a grid, etc. The conductive piece 3 can be made of a material having electrical conductivity, such as copper, aluminum, silver, etc. The conductive piece 3 can be bonded or welded to the first surface of the second substrate 2. When the digital ground line 11 and the analog ground line 12 are arranged on the first surface of the first substrate 1, the conductive piece 3 can be electrically connected to the digital ground line 11 and the analog ground line 12 by welding or pressure bonding, so as to provide a continuous low-impedance path and reduce signal reflection and distortion. The conductive piece 3 arranged on the second substrate 2 is isolated from the digital ground line 11 and the analog ground line 12 of the first substrate 1 due to the substrate material, so as to reduce electromagnetic interference and improve signal integrity. The material of the second substrate 2 can refer to the first substrate 1. It should be noted that the type of the second substrate 2 is not specifically limited in the present application, that is, a person skilled in the art can set and adjust the type according to the actual situation. The above is only an exemplary description of the forms in which the second substrate 2 in the present application can be applied, but is not limited to the cases described in the above embodiments. The second substrate 2 can carry the conductive piece 3, and can electrically connect the conductive piece 3 to the digital ground line 11 and the analog ground line 12.

[0067] In some embodiments, in order to improve the isolation effect, enhance the signal integrity, improve the purity of the signal and the stability of the system, the conductive part 3 can be embedded in the second substrate 2, or the conductive part 3 can be arranged on the second surface of the second substrate 2. At this time, the second substrate 2 can be provided with a first conductive via 21, and the first conductive via 21 can be plated with a conductive material such as copper or silver to form a conductive path. The conductive part 3 can be electrically connected to the digital ground wire 11 and the analog ground wire 12 through the first conductive via 21.

[0068] In some embodiments, in order to improve the isolation effect, enhance the signal integrity, improve the purity of the signal and the stability of the system, the digital ground wire 11 and the analog ground wire 12 can be located on the second surface of the first substrate 1 or embedded in the first substrate 1, and at this time, the first substrate 1 can be provided with a second conductive via 14, and the second conductive via 14 can be plated with a conductive material such as copper or silver to form a conductive path. The conductive part 3 can be electrically connected to the digital ground wire 11 and the analog ground wire 12 through the second conductive via 14.

[0069] The first conductive via 21 and the second conductive via 14 can be arranged alternatively or in combination.

[0070] The circuit board provided by an embodiment of the present application utilizes the spacing area 13 between the digital ground wire 11 and the analog ground wire 12 on the first substrate 1 to reduce the interference of the digital ground wire 11 on the analog ground wire 12, improve the purity and high precision of the analog signal; the conductive part 3 is electrically connected to the digital ground wire 11 and the analog ground wire 12 to provide a continuous low-impedance path, reduce signal reflection and distortion. The conductive part 3 arranged on the second substrate 2 is isolated from the digital ground wire 11 and the analog ground wire 12 of the first substrate 1 due to the substrate material, which can reduce electromagnetic interference and improve the integrity of the signal.

[0071] As shown in Figures 5 to 8 In some embodiments, the conductive part 3 can include:

[0072] The conductive channel 31 is opposite to the spacing area 13, and the conductive channel 31 can be electrically connected to the digital ground wire 11 and the analog ground wire 12 respectively. The conductive channel 31 can be used to accommodate the cooling medium 7.

[0073] The conductive channel 31 can adopt a pipeline form, and the conductive channel 31 can have an injection port for injecting the cooling medium 7. After the cooling medium 7 is injected, the injection port is sealed by a sealing plug or welding, so that the cooling medium 7 does not overflow from the injection port, and the conductive channel 31 forms a static cooling system.

[0074] The conductive channel 31 can be made of a material with good electrical and thermal conductivity, such as copper or aluminum. The conductive channel 31 is disposed on the second substrate 2 by welding or bonding. The conductive channel 31 can be straight, serpentine, or irregular in shape, and its specific shape can be designed according to heat dissipation requirements and space constraints. For example, when the heat dissipation requirement is high, the conductive channel 31 can be serpentine to increase the heat dissipation area and improve heat dissipation efficiency; when the heat dissipation requirement is low, the conductive channel 31 can be straight to save space. It should be noted that this application does not specifically limit the type of conductive channel 31, that is, those skilled in the art can set and adjust its type according to actual conditions. The above situation is only an illustrative description of the possible forms in which the conductive channel 31 in this application can be applied, but it is not limited to the situations described in the above embodiments. The conductive channel 31 can accommodate the cooling medium 7 and can cool the digital ground line 11 and the analog ground line 12.

[0075] The cooling medium 7 can be a gaseous cooling medium, such as air or nitrogen. Alternatively, a liquid cooling medium, such as water or ethylene glycol solution, can be used to enhance heat dissipation.

[0076] By providing a cooling medium 7 within the conductive channel 31 to effectively absorb and transfer heat, the temperature of the digital ground line 11 and the analog ground line 12 can be effectively reduced, maintaining the performance of the digital ground line 11 and the analog ground line 12, reducing signal distortion and interference caused by high temperature, and improving signal purity and accuracy.

[0077] like Figure 5 and Figure 9 As shown, in some embodiments, the second substrate 2 may have a groove 311, in which a conductive layer may be disposed; the first substrate 1 may be sealed to the second substrate 2, so that the groove 311 and the first substrate 1 cooperate to form the conductive channel 31.

[0078] The groove 311 can be formed on the second substrate 2 using methods such as laser cutting or injection molding. The conductive layer of the second substrate 2 can be made of materials such as copper or aluminum. The conductive layer can be formed by methods such as electroplating, sputtering, or patch bonding. The first substrate 1 and the second substrate 2 can be connected by methods such as hot pressing or bonding. A sealing material can be applied at the connection point to enhance the sealing of the conductive channel 31 and prevent leakage of the cooling medium 7. The sealing material can be epoxy resin, silicone, etc., to enhance the sealing and insulation of the connection point.

[0079] Part of the conductive layer can extend out of the groove 311 to form a connector 4, which can be electrically connected to the two ground wires by welding or conductive adhesive; or, pins can be provided on the second substrate 2, and the conductive layer can be electrically connected to the two ground wires through the pins.

[0080] The recess 311 type conductive channel 31 can make the overall structure more compact, improve the integration of the circuit board, and reduce the volume of the circuit board. The recess 311 type conductive channel 31 can be processed in a laminated sealing manner, and the processing method is simple.

[0081] As shown in the drawings, Figures 5 to 9 In some embodiments, the second substrate 2 can be configured with a first hole 312 and a second hole 313, both of which can communicate with the conductive channel 31.

[0082] The first hole 312 can communicate with the supply end of the cooling system, and the second hole 313 can communicate with the return end of the cooling system, so that the cooling medium 7 can circulate between the conductive channel 31 and the cooling system.

[0083] The first hole 312 and the second hole 313 can be arranged at intervals. The first hole 312 and the second hole 313 can both be located on the side of the second substrate 2; or the first hole 312 and the second hole 313 can both be located on the first surface of the second substrate 2, at which time the first substrate 1 can be provided with two spaced third holes, and the first hole 312 and the second hole 313 each communicate with a third hole; or the first hole 312 can be arranged on the side of the second substrate 2, and the second hole 313 can be arranged on the first surface of the second substrate 2; or the second hole 313 can be arranged on the side of the second substrate 2, and the first hole 312 can be arranged on the first surface of the second substrate 2. When the recess 311 is linear, the first hole 312 and the second hole 313 can respectively communicate with both ends of the recess 311, so that the cooling medium 7 can enter from one end and flow out from the other end, achieving effective circulation. The first hole 312 can be sealingly connected to the supply end of the cooling system through a hose or a hard pipe, and the second hole 313 can be sealingly connected to the return end of the cooling system through a hose or a hard pipe.

[0084] The cooling system can be a liquid cooling system or a gas cooling system, and the specific structure of the cooling system is mastered by those skilled in the art, which will not be described here.

[0085] Through the first hole 312 and the second hole 313, the conductive channel 31 and the cooling system together form a circulating cooling system, so that the cooling medium 7 flows uniformly in the conductive channel 31, better taking away heat, enhancing the heat dissipation effect of the conductive channel 31 on the digital ground line 11 and the analog ground line 12, and improving the purity and high precision of the signal.

[0086] As shown in the drawings, Figures 1 to 3 , Figure 9 As shown in the drawings,

[0087] The connecting piece 4 can have a first connecting end 41 and a second connecting end 42 in communication; the first connecting end 41 can be used to communicate with the cooling system;

[0088] The circuit board is selected from at least one of the following combinations;

[0089] The second connecting end 42 can be adapted to the first hole 312, and the second connecting end 42 can be inserted into the first hole 312;

[0090] The second connecting end 42 can be adapted to the second hole 313, and the second connecting end 42 can be inserted into the second hole 313.

[0091] The first connecting end 41 and the second connecting end 42 can be integrally formed; or the first connecting end 41 and the second connecting end 42 can be threadedly connected. The first connecting end 41 can be selected from a quick structure or a threaded joint to realize communication with the supply end or the return end of the cooling system. The second connecting end 42 can be selected from a hard pipe (such as a pipe made of stainless steel or copper), and a sealing ring can be provided outside the hard pipe to realize sealed connection by being inserted into the first hole 312 and / or the second hole 313. Alternatively, the second connecting end 42 can be selected from a flexible pipe (such as a pipe made of silicone or rubber) to realize sealed connection by being inserted into the first hole 312 and / or the second hole 313. In order to enhance the sealing effect, the connection between the second connecting end 42 and the first hole 312 and / or the second hole 313 can be sealed by sealing glue.

[0092] In some embodiments, the number of connecting pieces 4 can be two, the first hole 312 can communicate with the supply end of the cooling system through one connecting piece 4, and the second hole 313 can communicate with the return end of the cooling system through the other connecting piece 4.

[0093] In some embodiments, the number of connecting pieces 4 is one, the connecting piece 4 includes two first connecting ends 41 spaced from each other and two second connecting ends 42 spaced from each other, and each first connecting end 41 communicates with a second connecting end 42. The first hole 312 communicates with the supply end of the cooling system through one second connecting end 42 and one first connecting end 41, and the second hole 313 communicates with the return end of the cooling system through the other second connecting end 42 and the other first connecting end 41, so that the overall structure is more compact.

[0094] In some embodiments, in order to enhance the circulation effect, the number of first holes 312 of the connecting piece 4 can be multiple, the number of second holes 313 of the connecting piece 4 can be multiple, and the number of first connecting ends 41 is the sum of the number of first holes 312 and the number of second holes 313. The number of second connecting ends 42 is equal to and corresponds to the number of first connecting ends 41.

[0095] It should be noted that the type of the connecting piece 4 is not specifically limited in the present application, i.e. a person skilled in the art can set and adjust the type thereof according to actual conditions. The above description is only an exemplary description of the forms in which the connecting piece 4 in the present application can be applied, but is not limited to the cases described in the above embodiments, and the connecting piece 4 can only enable at least one of the first hole and the second hole to be connected to the cooling system.

[0096] The connecting piece 4 enhances the stability of the connection between the first hole 312, the second hole 313 and the cooling system through the cooperation of the first connecting end 41 and the second connecting end 42, facilitates replacement and maintenance, and reduces maintenance time and cost.

[0097] As shown in Figures 1 to 3 In some embodiments, the circuit board is selected from at least one of the following combinations;

[0098] The first side of the first substrate 1 away from the second substrate 2 can be configured with a first electronic element 5, and part of the conductive channels 31 can extend to the first side for heat dissipation of the first electronic element 5.

[0099] The second side of the second substrate 2 away from the first substrate 1 can be configured with a second electronic element 6, and part of the conductive channels 31 can extend to the second side for heat dissipation of the second electronic element 6.

[0100] When the conductive channel 31 adopts a pipe type, part of the conductive channels 31 can extend out of the second substrate 2 to the vicinity of the first electronic element 5 on the first side; or, part of the conductive channels 31 can extend out of the second substrate 2 to contact the first electronic element 5 on the first side, so as to achieve better heat dissipation of the first electronic element 5.

[0101] When the conductive channel 31 adopts a groove 311 type, the conductive channel 31 can further include a heat pipe, and the groove 311 can include spaced third and fourth holes, and the two ends of the heat pipe are respectively communicated with the groove 311 through the third and fourth holes. The positions of the third and fourth holes can be set with reference to the positions of the first hole 312 and the second hole 313. The heat pipe can extend to the vicinity of the first electronic element 5 on the first side; or, the heat pipe can extend to contact the first electronic element 5 on the first side, so as to achieve better heat dissipation of the first electronic element 5.

[0102] The extension of the conductive channel 31 to the second side can refer to the extension of the conductive channel 31 to the first side, which will not be described here. The conductive channel 31 can be extended to the first side or the second side, or, in order to enhance the heat dissipation effect of the electronic elements on both sides, the conductive channel 31 can be extended to both the first side and the second side.

[0103] The first electronic component 5 can include one or more of a central processing unit, a graphic processing unit, a memory chip, a power management chip, a wireless module, a connector, a DC-DC converter, an inductor, an operational amplifier, a temperature sensor, and a power connector. The second electronic component 6 can include one or more of a central processing unit, a graphic processing unit, a memory chip, a power management chip, a wireless module, a connector, a DC-DC converter, an inductor, an operational amplifier, a temperature sensor, and a power connector.

[0104] The electrically conductive channel 31 extending to the first side and the second side can effectively dissipate heat from the first electronic component 5 and the second electronic component 6, which not only improves the heat dissipation efficiency, prolongs the service life of the electronic components, improves the reliability and performance of the system, but also optimizes the thermal management and energy consumption.

[0105] As shown in FIG. Figure 10 In some embodiments, the electrically conductive channel 31 can include:

[0106] The electrically conductive pipeline 314 can be embedded in the second substrate 2.

[0107] Part of the electrically conductive pipeline 314 can extend out of the second substrate 2 to form a communication part 315, and the communication part 315 can be configured with an inlet 3151 and an outlet 3152.

[0108] The inlet 3151 can be in communication with the supply end of the cooling system, and the outlet 3152 can be in communication with the return end of the cooling system, so that the cooling medium 7 can circulate between the electrically conductive pipeline 314 and the cooling system.

[0109] The electrically conductive pipeline 314 can be embedded in the second substrate 2 by hot melting or injection molding process. The communication part 315 can include a spaced first sub-communication part and a second sub-communication part, the first sub-communication part can be configured with the inlet 3151, and the second sub-communication part can be configured with the outlet 3152. The first sub-communication part and the second sub-communication part can be in communication with the cooling system through a threaded joint or a quick structure. The positions of the first sub-communication part and the second sub-communication part can be referred to the positions of the first hole 312 and the second hole 313.

[0110] The embedded electrically conductive pipeline 314 can improve the isolation effect, enhance the signal integrity, and improve the purity of the signal and the stability of the system. Through the inlet 3151 and the outlet 3152 of the communication part 315, the electrically conductive pipeline 314 and the cooling system can form a circulating cooling system together, so that the cooling medium 7 flows uniformly in the electrically conductive pipeline 314, better carries away heat, enhances the heat dissipation effect of the electrically conductive channel 31 on the digital ground 11 and the analog ground 12, and improves the purity of the signal and the high precision.

[0111] As Figures 1 to 10As shown, in some embodiments, the circuit board is selected from at least one of the following combinations;

[0112] The cooling medium 7 may include liquid metal;

[0113] The first substrate 1 can be a glass substrate;

[0114] The second substrate 2 can be a glass substrate.

[0115] The cooling metal can be gallium, indium, or tin, among others. Liquid metals have low resistance, effectively reducing energy loss along the conductive path and improving the overall conductivity of the system. This reduces signal transmission losses, improving signal integrity and purity. Furthermore, liquid metals have extremely high thermal conductivity, rapidly carrying away heat and improving heat dissipation efficiency.

[0116] The glass substrate can be made of optical glass, quartz glass, or borosilicate glass, etc. The low dielectric constant of the glass substrate reduces signal loss during transmission, improving signal integrity and purity. The glass substrate also has good thermal conductivity, allowing for rapid heat transfer to the conductive pipe 314, thus improving heat dissipation efficiency.

[0117] The first substrate 1 and the second substrate 2 can be either glass substrates or both glass substrates. When the circuit board includes other substrates, the other substrates can also be glass substrates.

[0118] One embodiment of this application provides an electronic device, including:

[0119] Cooling system;

[0120] like Figures 1 to 10 The circuit board shown includes:

[0121] The first substrate 1 has a digital ground line 11 and an analog ground line 12, with a gap region 13 between the digital ground line 11 and the analog ground line 12;

[0122] The second substrate 2 has a conductive element 3, which is opposite to the interval region 13. The conductive element 3 is electrically connected to the digital ground line 11 and the analog ground line 12 respectively. The conductive element 3 is a conductive channel 31 capable of accommodating the cooling medium 7.

[0123] The cooling system is connected to the conductive channel 31 so that the cooling medium 7 can circulate between the conductive channel 31 and the cooling system.

[0124] An electronic device according to one embodiment of this application may be a mobile phone, a computer, an industrial control device, an in-vehicle information system, etc.

[0125] The cooling system can be connected to the electronic device's housing via bolts or clamps, ensuring the various components of the cooling system are securely mounted inside the device and allowing the cooling medium 7 to circulate smoothly between the conductive channel 31 and the cooling system. The design of the cooling system's piping can effectively cool high-power components such as memory modules and hard drives, improving the overall heat dissipation efficiency and stability of the electronic device. The cooling system can be either a liquid cooling system or a gas cooling system. The specific structure of the cooling system is well-known to those skilled in the art and will not be described further here.

[0126] An embodiment of this application provides an electronic device that utilizes a gap region 13 between the digital ground line 11 and the analog ground line 12 on a first substrate 1 of a circuit board to reduce interference between the digital ground line 11 and the analog ground line 12, thereby improving the purity and accuracy of the analog signal. A conductive element 3 is electrically connected to the digital ground line 11 and the analog ground line 12, providing a continuous low-impedance path and reducing signal reflection and distortion. The conductive element 3 disposed on the second substrate 2, due to the isolation provided by the substrate material between it and the digital ground line 11 and the analog ground line 12 of the first substrate 1, reduces electromagnetic interference and improves signal integrity. By providing a cooling medium 7 within the conductive channel 31, the conductive channel 31 and the cooling system together form a circulating cooling system, allowing the cooling medium 7 to flow uniformly within the conductive channel 31, better removing heat and enhancing the heat dissipation effect of the conductive channel 31 on the digital ground line 11 and the analog ground line 12, thus improving the purity and accuracy of the signal.

[0127] like Figures 1 to 3 As shown, in some embodiments, at least one of the first substrate 1 and the second substrate 2 is configured with electronic components, including one or more of a central processing unit, a graphics processor, a memory chip, a power management chip, a wireless module, a connector, a DC-DC converter, an inductor, an operational amplifier, a temperature sensor, and a power connector, and the conductive channel 31 is capable of dissipating heat from at least one of the electronic components.

[0128] When electronic components are disposed on the second surface of the first substrate 1, a portion of the conductive channel 31 extends to the first side for heat dissipation of the electronic components. For example, for high-heat-generating components such as central processing units (CPUs) and graphics processing units (GPUs), the conductive channel 31 can be positioned close to the heat-generating components through a reasonable layout. In practical designs, the conductive channel 31 can be designed as a branched structure, with two branches extending to the heat dissipation areas of the CPU and GPU. When electronic components are disposed on the second surface of the second substrate 2, a portion of the conductive channel 31 extends to the second side for heat dissipation of the electronic components.

[0129] One or more electronic components can be arranged in at least one of the first substrate 1 and the second substrate 2, and the diversified arrangement can effectively meet different requirements of different electronic devices in function and performance, and has a wider application range. The at least one electronic component can be cooled through the conductive channel 31 and the cooling system, and the stability of the electronic component is improved.

[0130] So far, the embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein according to the above description.

[0131] Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or some technical features can be replaced equivalently without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way.

Claims

1. A circuit board, characterized in that, include: A first substrate has a digital ground line and an analog ground line, with a gap between the digital ground line and the analog ground line; The second substrate has a conductive element opposite to the interval region, and the conductive element is electrically connected to the digital ground line and the analog ground line respectively.

2. The circuit board according to claim 1, characterized in that, The conductive element includes: A conductive channel, opposite to the interval region, is electrically connected to the digital ground wire and the analog ground wire respectively, and is used to contain the cooling medium.

3. The circuit board according to claim 2, characterized in that, The second substrate has a groove, and a conductive layer is disposed in the groove; the first substrate and the second substrate are sealed together, so that the groove and the first substrate cooperate to form the conductive channel.

4. The circuit board according to claim 3, characterized in that, The second substrate is provided with a first hole and a second hole, both of which are in communication with the conductive channel; The first hole can be connected to the supply end of the cooling system, and the second hole can be connected to the return end of the cooling system, so that the cooling medium can circulate between the conductive channel and the cooling system.

5. The circuit board according to claim 4, characterized in that, Also includes: A connector having a first connecting end and a second connecting end; the first connecting end is used to communicate with the cooling system. The circuit board is selected from at least one of the following combinations; The second connecting end is adapted to the first hole, and the second connecting end is inserted into the first hole; The second connecting end is adapted to the second hole, and the second connecting end is inserted into the second hole.

6. The circuit board according to claim 2, characterized in that, The circuit board is selected from at least one of the following combinations; A first electronic component is disposed on a first side of the first substrate away from the second substrate, and a portion of the conductive channel extends to the first side for heat dissipation of the first electronic component. The second electronic component is disposed on a second side of the second substrate away from the first substrate, and a portion of the conductive channel extends to the second side for heat dissipation of the second electronic component.

7. The circuit board according to claim 2, characterized in that, The conductive channel includes: Conductive conduits are embedded in the second substrate; A portion of the conductive conduit extends out of the second substrate to form a connecting portion, the connecting portion being provided with an inlet and an outlet; The inlet can be connected to the supply end of the cooling system, and the outlet can be connected to the return end of the cooling system, so that the cooling medium can circulate between the conductive pipeline and the cooling system.

8. The circuit board according to claim 2, characterized in that, The circuit board is selected from at least one of the following combinations; The cooling medium includes liquid metal; The first substrate is a glass substrate; The second substrate is a glass substrate.

9. An electronic device, characterized in that, include: Cooling system; Circuit board, including: A first substrate has a digital ground line and an analog ground line, with a gap between the digital ground line and the analog ground line; The second substrate has a conductive element opposite to the interval region. The conductive element is electrically connected to the digital ground line and the analog ground line respectively. The conductive element is a conductive channel capable of accommodating a cooling medium. The cooling system is connected to the conductive channel so that the cooling medium can circulate between the conductive channel and the cooling system.

10. The electronic device according to claim 9, characterized in that, At least one of the first and second substrates is configured with electronic components, including one or more of a central processing unit, a graphics processor, a memory chip, a power management chip, a wireless module, a connector, a DC-DC converter, an inductor, an operational amplifier, a temperature sensor, and a power connector, and the conductive channel is capable of dissipating heat from at least one of the electronic components.

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