Machining jig for micro diode packaging
By clamping and limiting the plastic encapsulation box in four directions and rapidly dissipating heat, the problem of plastic encapsulation box position offset in the micro diode packaging device is solved, improving processing stability and heat dissipation effect, and extending the service life of the device.
Patent Information
- Application Number
- CN202423104979.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-17
AI Technical Summary
In existing micro diode packaging devices, the plastic encapsulation box can only be clamped and fixed on the left and right sides during the processing, which can easily lead to front-to-back positional shift and affect processing stability.
A processing fixture for micro diode packaging was designed. The first clamping component and the second clamping component clamp and limit the plastic encapsulation box in four directions. Combined with the heat dissipation component, the plastic encapsulation box is cooled down quickly, thereby improving stability and heat dissipation effect.
It enhances the stability of the plastic sealant during processing, prevents glue spillage, improves processing efficiency, facilitates the maintenance and replacement of heat dissipation fins, and extends the service life of the device.
Smart Images

Figure CN223584642U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of packaging equipment especially relates to a kind of processing fixture for micro diode packaging. BACKGROUND
[0002] Light emitting diode is abbreviated as LED, it is a kind of commonly used light emitting device, and it is light emitting by electron and hole recombination, it is widely used in illumination field, light emitting diode can efficiently convert electric energy into light energy, and it has wide application in modern society, such as illumination, flat panel display, medical device etc., in such light emitting diode production, it needs to be processed through die bonding, baking and wire bonding and encapsulation etc., and encapsulation is mainly the process of dispensing packaging, the surface structure of diode is packaged and protected, so that it keeps stable and safe in use.
[0003] Patent No.: CN 218160303 U discloses a kind of packaging equipment for diode processing, the device is started by water pump and semiconductor refrigerator, water pump can be cooled water after semiconductor refrigerator refrigeration is sent to cooling cavity by inlet pipe, cooling cavity flows when cold water can be cooled to the plastic encapsulation glue in the inner cavity of plastic encapsulation box, improve cooling speed, so that the diode after plastic encapsulation can be faster to carry out next processing, improve work efficiency, however, the device in the process of using, only plastic encapsulation box left and right sides are clamped and fixed, it is prone to cause plastic encapsulation box to shift in front and back position during processing, reduce the stability effect of plastic encapsulation box, affect the subsequent processing of device.
[0004] Therefore, it is necessary to provide a kind of processing fixture for micro diode packaging to solve the above technical problems. INVENTION CONTENTS
[0005] The utility model provides a kind of processing fixture for micro diode packaging, solve the problem that the stability effect of plastic encapsulation box is reduced in the process of using the device of existing part, affect the subsequent processing of device, that plastic encapsulation box left and right sides are clamped and fixed.
[0006] To solve the above technical problems, the utility model provides a kind of processing fixture for micro diode packaging, it includes: workbench, the first clamping component is arranged in the inside of workbench, the second clamping component is arranged in the inside of the first clamping component near bottom, the heat dissipation component is arranged in the inside of the first clamping component near top;
[0007] The first clamping assembly comprises two clamping plates arranged inside the workbench, two drive rods are fixedly arranged on one side of each of the two clamping plates, the other ends of the two drive rods on the same side penetrate through the inside of the workbench and are fixedly arranged with a drive plate, recesses are arranged on the left and right sides of the workbench near the center, and electric push rods for driving the left and right movements of the drive plate are fixedly arranged inside the recesses.
[0008] The second clamping assembly comprises a bidirectional screw rod rotatably arranged inside the clamping plate near the bottom, two adjusting blocks are arranged on the surface of the bidirectional screw rod and are threadedly connected with the bidirectional screw rod, limit blocks are fixedly arranged on the top of the adjusting blocks, and knobs for driving the rotation of the bidirectional screw rod are rotatably arranged on the front side of the bidirectional screw rod.
[0009] The heat dissipation assembly comprises a mounting frame arranged inside the clamping plate near the top, two positioning holes are arranged inside the mounting frame, heat dissipation fins are fixedly arranged on the front and rear sides of the clamping plate, a lifting rod is fixedly arranged on the inside of the clamping plate and at the bottom of the mounting frame, lifting blocks are arranged on the surface of the heat dissipation fins and are slidingly connected with the heat dissipation fins, and positioning rods that are matched with the positioning holes are fixedly arranged on the top of the lifting blocks.
[0010] Preferably, two moving blocks are fixedly arranged on the bottom of each of the clamping plates, and moving grooves for the left and right movements of the moving blocks are arranged inside the workbench.
[0011] Preferably, sliding grooves for the front and rear movements of the adjusting blocks are arranged inside each of the clamping plates, and plastic packaging boxes are jointly arranged on one side of the limit blocks near the center of the clamping plate.
[0012] Preferably, first clamping grooves matched with the mounting frame are arranged on the surface of each of the clamping plates, and second clamping grooves matched with the heat dissipation fins are arranged on the surface of each of the clamping plates and on the front and rear sides of the first clamping grooves.
[0013] Preferably, lifting grooves for the up and down movements of the lifting blocks are arranged inside each of the clamping plates, elastic members for driving the lifting blocks to ascend are arranged inside the lifting grooves and on the outer side edges of the lifting rods, and communication holes for the passing of the positioning rods are arranged inside each of the clamping plates.
[0014] Preferably, an encapsulation device is arranged on the top of the workbench, the bottom of the encapsulation device extends to the inside of the workbench and is provided with a material conveying nozzle, and heat dissipation fans are arranged on the left and right sides of the workbench.
[0015] Compared with the related art, the machining jig for micro diode packaging has the following beneficial effects:
[0016] This utility model provides a processing fixture for micro diode packaging. Through the coordinated arrangement of various components of the device, the plastic encapsulation box is clamped and limited in four directions, thereby improving the limiting effect of the device on the plastic encapsulation box, increasing the stability of the plastic encapsulation box during processing, preventing deviation during dispensing that could cause glue to spill, and, in conjunction with the heat dissipation component, facilitating the disassembly of the heat dissipation fins for maintenance and replacement by the operator, ensuring the heat dissipation effect and service life of the device, and greatly improving the practicality of the device. Attached Figure Description
[0017] Figure 1 A schematic diagram of a preferred embodiment of the processing fixture for micro diode packaging provided by this utility model;
[0018] Figure 2 for Figure 1 The diagram shows a side view of the clamping plate.
[0019] Figure 3 for Figure 1 The diagram shows a side sectional view of the heat dissipation component.
[0020] The following are the labeling elements in the diagram: 10. Workbench; 20. First clamping assembly; 21. Clamping plate; 22. Drive rod; 23. Drive plate; 24. Electric push rod; 25. Moving slot; 30. Second clamping assembly; 31. Bidirectional threaded screw; 32. Adjusting block; 33. Limiting block; 34. Knob; 40. Heat dissipation assembly; 41. Mounting bracket; 42. Positioning hole; 43. Heat dissipation fins; 44. Lifting rod; 45. Lifting block; 46. Positioning rod; 47. Elastic element; 50. Sealing device; 60. Cooling fan; 70. Plastic sealing box. Detailed Implementation
[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0022] Please refer to the following: Figure 1 , Figure 2 , Figure 3 ,in, Figure 1 A schematic diagram of a preferred embodiment of the processing fixture for micro diode packaging provided by this utility model; Figure 2 for Figure 1 The diagram shows a side view of the clamping plate. Figure 3 for Figure 1 The diagram shows a side sectional view of the heat dissipation component. A processing fixture for micro diode packaging includes: a worktable 10, a first clamping component 20 disposed inside the worktable 10, a second clamping component 30 disposed inside the first clamping component 20 near the bottom, and a heat dissipation component 40 disposed inside the first clamping component 20 near the top;
[0023] The first clamping assembly 20 comprises two clamping plates 21 arranged inside the workbench 10, two drive rods 22 are fixedly installed on one side of each of the two clamping plates 21, the other ends of the two drive rods 22 located on the same side penetrate the inside of the workbench 10, and a drive plate 23 is fixedly installed, recesses are formed near the center of the left and right sides of the workbench 10, and electric push rods 24 for driving the left and right movement of the drive plate 23 are fixedly installed inside the recesses;
[0024] During use, the micro diode to be packaged is placed in the recess inside the plastic packaging box 70, the electric push rod 24 starts to work, drives the drive plate 23 to move to one side of the workbench 10, the drive plate 23 drives the drive rod 22 to move, and the drive rod 22 drives the clamping plate 21 to move to the center, and the clamping plate 21 clamps the plastic packaging box 70 left and right above.
[0025] The second clamping assembly 30 comprises a double-thread screw rod 31 rotatably arranged inside the clamping plate 21 near the bottom, two adjusting blocks 32 are sleeved on the surface of the double-thread screw rod 31 and are in threaded connection with the double-thread screw rod 31, limit blocks 33 are fixedly installed on the top of the adjusting blocks 32, and knobs 34 for driving the rotation of the double-thread screw rod 31 are rotatably arranged on the front side of the double-thread screw rod 31;
[0026] The knob 34 is manually rotated to drive the double-thread screw rod 31 to rotate, so that the two adjusting blocks 32 move to the center, the adjusting block 32 drives the limit block 33 to move, and the limit block 33 clamps and limits the front and back sides of the plastic packaging box 70, thereby improving the limiting effect of the device on the plastic packaging box 70, increasing the stability of the plastic packaging box 70 during processing, and preventing deviation during glue dispensing to cause glue to spill out.
[0027] The heat dissipation assembly 40 comprises a mounting frame 41 arranged inside the clamping plate 21 near the top, two positioning holes 42 are formed in the inside of the mounting frame 41, heat dissipation fins 43 are fixedly installed on the front and back sides of the inside of the clamping plate 21, a lifting rod 44 is fixedly installed on the inside of the clamping plate 21 and located at the bottom of the mounting frame 41, a lifting block 45 is sleeved on the surface of the heat dissipation fin 43 and is in sliding connection with the heat dissipation fin 43, and a positioning rod 46 adapted to the positioning hole 42 is fixedly installed on the top of the lifting block 45;
[0028] After the plastic packaging work is completed, the heat dissipation fan 60 starts to work, cooperates with the multiple heat dissipation fins 43 attached to the left and right sides of the plastic packaging box 70 to quickly conduct heat, cools down the plastic packaging glue in the inner cavity of the plastic packaging box 70, improves the cooling speed, after the task is completed, the lifting block 45 is pulled downward to slide downward on the surface of the lifting rod 44 and squeeze the elastic element 47 to shrink, the lifting block 45 drives the positioning rod 46 to be separated from the inside of the positioning hole 42, so that the heat dissipation fin 43 can be conveniently disassembled by the worker for maintenance and replacement, and the heat dissipation effect and service life of the device are ensured.
[0029] The bottom of the clamping plate 21 is fixedly provided with two moving blocks, and the inner side of the workbench 10 is provided with moving grooves for the left and right movement of the moving blocks.
[0030] The inner side of the clamping plate 21 is provided with sliding grooves for the forward and backward movement of the adjusting blocks 32, and the limiting blocks 33 are jointly and closely arranged on one side of the center of the clamping plate 21 and are provided with plastic packaging boxes 70.
[0031] The surface of the clamping plate 21 is provided with first clamping grooves matched with the mounting frames 41, and the surface of the clamping plate 21 and located on the left and right sides of the first clamping grooves is provided with second clamping grooves matched with the heat dissipation fins 43.
[0032] The inner side of the clamping plate 21 is provided with lifting grooves for the upward and downward sliding movement of the lifting blocks 45, the inner side of the lifting grooves and located on the outer side edge of the lifting rod 44 is provided with elastic members 47 for driving the upward movement of the lifting blocks 45, and the inner side of the clamping plate 21 is provided with communication holes for the passage of the positioning rods 46.
[0033] The top of the workbench 10 is provided with a packaging device 50, the bottom of the packaging device 50 extends to the inner side of the workbench 10 and is provided with a material conveying nozzle, and the left and right sides of the workbench 10 are provided with heat dissipation fans 60.
[0034] The working principle of the processing jig for micro diode packaging provided by the utility model is as follows:
[0035] First step: in the process of using the device, the micro diode to be packaged is placed into the recess in the plastic packaging box 70, the electric push rod 24 starts to work, drives the driving plate 23 to move to one side of the workbench 10, the driving plate 23 drives the driving rod 22 to move, the driving rod 22 drives the clamping plate 21 to move to the center, and the clamping plate 21 above clamps the plastic packaging box 70 left and right, manually rotates the knob 34, drives the bidirectional screw rod 31 to rotate, makes two adjusting blocks 32 move to the center, the adjusting blocks 32 drive the limiting blocks 33 to move, and clamp and limit the front and back sides of the plastic packaging box 70, so that the limiting effect of the device on the plastic packaging box 70 is improved, the stability of the plastic packaging box 70 in the processing process is increased, and deviation of glue spilling during glue dispensing is prevented;
[0036] Second step: after the plastic packaging work is completed, the heat dissipation fan 60 starts to work, cooperates with the multiple heat dissipation fins 43 closely arranged on the left and right sides of the plastic packaging box 70 to quickly conduct heat, cools the plastic packaging glue in the inner cavity of the plastic packaging box 70, improves the cooling speed, after the task is completed, the lifting block 45 is pulled downward, slides downward on the surface of the lifting rod 44, and the elastic member 47 is squeezed to shrink, the lifting block 45 drives the positioning rod 46 to separate from the inner side of the positioning hole 42, so that the heat dissipation fin 43 can be conveniently disassembled for maintenance and replacement, and the heat dissipation effect and service life of the device are ensured.
[0037] Compared with the related art, the processing jig for micro diode packaging has the following beneficial effects:
[0038] Through the cooperation of each part of the device, the four directions of the plastic sealing box 70 are clamped and limited, thereby improving the limiting effect of the device on the plastic sealing box 70, increasing the stability of the plastic sealing box 70 during the processing process, preventing deviation during glue dispensing to cause glue to splash out, cooperating with the effect of the heat dissipation assembly 40, facilitating the maintenance and replacement of the heat dissipation fins 43 by the staff, guaranteeing the heat dissipation effect and service life of the device, and greatly improving the practicability of the device.
[0039] The above is only an embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent process conversion using the utility model specification and drawing contents, or direct or indirect application in other related technical fields, are also included in the patent protection range of the utility model.
Claims
1. A processing tool for micro-diode packaging, characterized by, Include: Workbench (10), the inner side of the workbench (10) is provided with a first clamping assembly (20), the inner side of the first clamping assembly (20) is provided with a second clamping assembly (30) near the bottom, and the inner side of the first clamping assembly (20) is provided with a heat dissipation assembly (40) near the top; The first clamping assembly (20) comprises two clamping plates (21) arranged in the inner side of the workbench (10), two driving rods (22) are fixedly installed on the side away from each other of the two clamping plates (21), the other ends of the two driving rods (22) located on the same side penetrate the inner side of the workbench (10), and a driving plate (23) is fixedly installed; recesses are formed in the inner sides of the workbench (10) near the center, and electric push rods (24) for driving the left and right movements of the driving plate (23) are fixedly installed in the inner sides of the recesses. The second clamping assembly (30) comprises a double-thread screw rod (31) rotatably arranged in the inner side of the clamping plate (21) near the bottom, two adjusting blocks (32) are sleeved on the surface of the double-thread screw rod (31) and are in threaded connection with the double-thread screw rod (31), a limiting block (33) is fixedly installed on the top of the adjusting block (32), and knobs (34) for driving the rotation of the double-thread screw rod (31) are rotatably arranged on the front sides of the double-thread screw rod (31). The heat dissipation assembly (40) comprises a mounting bracket (41) arranged in the inner side of the clamping plate (21) near the top, two positioning holes (42) are formed in the inner side of the mounting bracket (41), heat dissipation fins (43) are fixedly installed on the inner sides of the clamping plates (21), a lifting rod (44) is fixedly installed on the inner side of the clamping plate (21) and located at the bottom of the mounting bracket (41), a lifting block (45) is sleeved on the surface of the heat dissipation fin (43) and is in sliding connection with the heat dissipation fin (43), and a positioning rod (46) matched with the positioning hole (42) is fixedly installed on the top of the lifting block (45).
2. The processing tool for micro-diode packaging of claim 1, wherein, Two moving blocks are fixedly installed on the bottom of the clamping plate (21), and moving grooves (25) are formed in the inner side of the workbench (10) and can be used for the left and right movements of the moving blocks.
3. The processing tool for micro-diode packaging of claim 1, wherein, A plastic package box (70) is arranged on one side of the limiting block (33) near the center of the clamping plate (21).
4. The processing tool for micro-diode packaging of claim 1, wherein, First clamping slots matched with the mounting bracket (41) are formed in the surfaces of the clamping plates (21), and second clamping slots matched with the heat dissipation fins (43) are formed in the surfaces of the clamping plates (21) and located on the front and rear sides of the first clamping slots.
5. The processing tool for micro-diode packaging of claim 1, wherein, A lifting groove is formed in the inner side of the clamping plate (21) and can be used for the up and down sliding movements of the lifting block (45), a resilient member (47) for driving the lifting block (45) to rise is arranged in the inner side of the lifting groove and located on the outer side edge of the lifting rod (44), and a communication hole is formed in the inner side of the clamping plate (21) and can be used for the passing of the positioning rod (46).
6. The processing tool for micro-diode packaging of claim 1, wherein, The workbench (10) top is provided with a packaging device (50), the bottom of the packaging device (50) extends to the inside of the workbench (10), and is provided with a feeding nozzle, and the left and right sides of the workbench (10) are provided with heat dissipation fans (60).
Citation Information
Patent Citations
Packaging equipment for diode processing
CN218160303U