LED lamp bead structure
By using a ball-head structure in the LED chip structure, the light emission angle is expanded and crosstalk is reduced, which solves the problems of low brightness and low angle of the chips, reduces costs and improves the display effect.
Patent Information
- Application Number
- CN202520294906.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-24
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2035-02-24
AI Technical Summary
In the current CHIPRGB four-in-one device packaging process, the light emission angle and brightness of the LEDs are not high, which leads to increased costs and is prone to light crosstalk.
The package with a ball-head structure expands the light emission angle and reduces crosstalk by adjusting the ball-head radius, allowing for smaller chips and fewer dicing processes.
The brightness and beam angle of the LEDs were improved, the cost was reduced, and crosstalk was decreased, resulting in a better display effect.
Smart Images
Figure CN223584651U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to LED device technical field, especially a kind of LED lamp bead structure. BACKGROUND
[0002] With the wide application of display screen technology, and the development of display screen to high definition, full high definition, ultra high definition, the requirement of display screen market to technology is also higher and higher;It also puts forward higher requirements to LED display screen, that is, the anti-collision, brightness, angle, reliability requirements of LED display screen are higher;Then the component of LED display screen becomes more important;One of the important components of display screen, LED lamp bead is one of the most important devices, and it is the component that affects the main performance of LED display screen, so the technical requirements of LED lamp bead are higher, especially the performance requirements of LED lamp bead are higher and higher, so the requirements of main performance of LED lamp bead, such as luminous angle, brightness, airtightness, anti-collision ability, etc.
[0003] At present, in the packaging process of CHIPRGB four-in-one device, the lamp bead is packaged into a plane structure, and the light-emitting angle and brightness of the lamp bead are not high, so high brightness must use large-size chip, which leads to high cost of lamp bead, and at the same time, due to the large size of chip, the size of four-in-one function area is small, which leads to abnormal increase of process technology, in addition, four-in-one is composed of four groups of RGB chips, due to the small size of four-in-one, the distance between each two RGB chips is small, which is easy to appear light mixing phenomenon, so the existing four-in-one must be tangent groove, to avoid light mixing, and then back cut into RGB four-in-one lamp bead. UTILITY MODEL CONTENT
[0004] Therefore, the utility model provides a kind of LED lamp bead structure.
[0005] The utility model provides the following technical scheme: a kind of LED lamp bead structure, comprising:
[0006] base material;
[0007] back circuit, the back circuit is arranged in one side of the base material;
[0008] front circuit, the front circuit is arranged in the side of the base material opposite to the back circuit, and the back circuit is electrically connected with the front circuit;
[0009] light-emitting chip group, a plurality of light-emitting chip groups are arranged on the front circuit;
[0010] The package is arranged above the group of light emitting chips, a surface of the package is composed of a plurality of ball head structures, the number of the ball head structures corresponds to the number of the group of light emitting chips, and the centers of the ball head structures are coaxially arranged with the light emitting centers of the corresponding group of light emitting chips, so as to expand the light emitting angle and reduce light interconnection between the group of light emitting chips.
[0011] Further, the adjacent ball head structures are tangentially arranged.
[0012] Further, a second flat portion is formed between the adjacent ball head structures, and a first flat portion is formed on the outer side of the ball head structure extending to the periphery of the base material.
[0013] Further, the group of light emitting chips is arranged in four groups and is fixed on the front circuit by fixing glue.
[0014] Further, the base material is provided with a mark point close to the side of the back circuit.
[0015] Further, the group of light emitting chips comprises blue light chips, green light chips and red light chips, the red light chip is fixed on the front circuit by silver glue, and the blue light chip and the green light chip are fixed on the front circuit by insulating glue or silver glue.
[0016] The utility model has the advantages that the surface of the package is in a ball head structure, and the radius of the ball head can be adjusted according to a mold; the ball head mode can improve the brightness and the light emitting angle of the lamp bead; different ball head radii have certain light interconnection avoiding effects; the cutting tangent process procedure can be reduced, the cost is reduced, and the lamp bead can use smaller chips to achieve better display effects. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is a plane structure schematic view of the first embodiment of the utility model.
[0018] Figure 2 It is a plane structure schematic view of the second embodiment of the utility model.
[0019] Figure 3 It is a plane structure schematic view of the cooperation of the front circuit and the group of light emitting chips of the utility model.
[0020] Figure 4 It is a plane structure schematic view of the back circuit of the utility model.
[0021] Figure 5 It is a plane structure schematic view of the back circuit and the front circuit of the utility model.
[0022] The labels in the drawings are: 1 - substrate, 2 - back circuit, 21 - first pin, 22 - second pin, 23 - third pin, 24 - fourth pin, 25 - fifth pin, 26 - sixth pin, 27 - seventh pin, 28 - eighth pin, 3 - light emitting chip set, 31 - blue light chip, 32 - green light chip, 33 - red light chip, 34 - connecting line, 41 - package, 42 - ball head structure, 43 - first planar part, 44 - second planar part, 5 - front circuit, 51 - first die bonding area, 52 - first wire bonding area, 53 - second wire bonding area, 54 - third wire bonding area, 55 - second die bonding area, 56 - fourth wire bonding area, 57 - fifth wire bonding area, 58 - sixth wire bonding area, 59 - seventh wire bonding area, 510 - eighth wire bonding area, 511 - ninth wire bonding area, 512 - tenth wire bonding area, 6 - mark point. DETAILED DESCRIPTION
[0023] For the convenience of understanding the present application, the present application will be described more fully with reference to the accompanying drawings, in which several embodiments of the present application are shown. However, the present application can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. It will be apparent that the scope of the present application is not limited to the embodiments set forth herein.
[0024] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. In addition, when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. The terms "vertical", "horizontal", "left", "right", and the like as used herein are for the purpose of illustration only.
[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this description, the terms "may" and "can" include any one of, or all of, possible combination of the items that they describe.
[0026] An LED lamp bead structure, comprising:
[0027] a substrate 1;
[0028] Specifically, the substrate 1 can use a BT substrate.
[0029] a back circuit 2;
[0030] Specifically, as Figure 4 and Figure 5As shown, the back surface circuit 2 is arranged on one side of the substrate 1; the back surface circuit 2 comprises a first pin 21, a second pin 22, a third pin 23, a fourth pin 24, a fifth pin 25, a sixth pin 26, a seventh pin 27 and an eighth pin 28;
[0031] The front surface circuit 5;
[0032] Specifically, as shown in Figure 3 and Figure 5 The front surface circuit 5 is arranged on the side of the substrate 1 opposite to the back surface circuit 2, and the back surface circuit 2 is electrically connected with the front surface circuit 5; wherein the front surface circuit 5 comprises a first die bonding area 51, a first wire bonding area 52, a second wire bonding area 53, a third wire bonding area 54, a second die bonding area 55, a fourth wire bonding area 56, a fifth wire bonding area 57, a sixth wire bonding area 58, a seventh wire bonding area 59, an eighth wire bonding area 510 and a ninth wire bonding area 511; it can be understood that the first die bonding area 51 is electrically connected with the second pin 22, the first wire bonding area 52 is electrically connected with the first pin 21, the second wire bonding area 53 is electrically connected with the eighth pin 28, the third wire bonding area 54 is electrically connected with the seventh pin 27, the second die bonding area 55 is electrically connected with the sixth pin 26, the fourth wire bonding area 56 is electrically connected with the fifth pin 25, the fifth wire bonding area 57 is electrically connected with the fourth pin 24, the sixth wire bonding area 58 is electrically connected with the third pin 23, the seventh wire bonding area 59 is electrically connected with the seventh pin 27, the eighth wire bonding area 510 is electrically connected with the first pin 21, the ninth wire bonding area 511 is electrically connected with the third pin 23, and the tenth wire bonding area 512 is electrically connected with the fifth pin 25.
[0033] The light emitting chip group 3,
[0034] Specifically, as shown in Figure 3As shown, the front circuit 5 is provided with a plurality of the light emitting chip groups 3; the light emitting chip groups 3 are provided with four groups and are fixed on the front circuit 5 by fixing glue; wherein two groups of the light emitting chip groups 3 are arranged on the two sides of the first die-bonding area 51, and two groups of the light emitting chip groups 3 are arranged on the two sides of the second die-bonding area 55; the light emitting chip groups 3 include blue light chips 31, green light chips 32 and red light chips 33; the light emitting chip groups 3 arranged on the first die-bonding area 51, one group of the blue light chips 31 and the green light chips 32 in the group are fixed on the first die-bonding area 51 by insulating glue, one electrode end of the blue light chip 31 and the green light chip 32 is respectively electrically connected with the first die-bonding area 51 through two connecting lines 34, and the other electrode end of the blue light chip 31 and the green light chip 32 is respectively electrically connected with the sixth wire bonding area 58 and the fifth wire bonding area 57 through two connecting lines 34, in other embodiments, the blue light chip 31 and the green light chip 32 can be fixed on the first die-bonding area 51 by silver glue, and are electrically connected with the first die-bonding area 51 by the silver glue, the red light chip 33 in the group is fixed on the first die-bonding area 51 by silver glue, and one electrode end of the red light chip 33 is electrically connected with the first die-bonding area 51 by the silver glue, and the other electrode end of the red light chip 33 is electrically connected with the tenth wire bonding area 512 through a connecting line 34; the other group of the light emitting chip groups 3 arranged on the first die-bonding area 51, one electrode end of the blue light chip 31 and the green light chip 32 is also electrically connected with the first die-bonding area 51 through silver glue or connecting lines 34, the other electrode end of the blue light chip 31 and the green light chip 32 is electrically connected with the first wire bonding area 52 and the second wire bonding area 53 through connecting lines 34, one electrode end of the red light chip 33 is electrically connected with the first die-bonding area 51 through silver glue, and the other electrode end is electrically connected with the seventh wire bonding area 59 through a connecting line 34.
[0035] The two groups of the light emitting chip groups 3 on the second die-bonding area 55, one electrode end of the blue light chip 31 and the green light chip 32 in the two groups of the light emitting chip groups 3 is electrically connected with the second die-bonding area 55 through connecting lines 34 or silver glue, the other electrode end of the blue light chip 31 in the two groups is respectively electrically connected with the eighth wire bonding area 510 and the ninth wire bonding area 511 through connecting lines 34, the other electrode end of the green light chip 32 in the two groups is respectively electrically connected with the second wire bonding area 53 and the fifth wire bonding area 57 through connecting lines 34, one electrode end of the red light chip 33 of the two groups of the light emitting chip groups 3 on the second die-bonding area 55 is electrically connected with the second die-bonding area 55 through silver glue, and the other electrode end of the red light chip 33 in the two groups is respectively electrically connected with the third wire bonding area 54 and the fourth wire bonding area 56 through connecting lines 34.
[0036] The package 41,
[0037] Specifically, the encapsulant 41 is arranged above the group of light emitting chips 3, a surface of the encapsulant 41 is composed of a plurality of ball head structures 42, the number of the ball head structures 42 corresponds to the number of the group of light emitting chips 3, and the center of the ball head structure 42 is coaxially arranged with the light emitting center corresponding to the group of light emitting chips 3, for expanding the light emitting angle and reducing light cross talk between the group of light emitting chips 3; the encapsulant 41 is formed by a molding process, the radius of the ball head structure 42 can be adjusted based on a mold to achieve different light diffusion effects, in this embodiment, as shown in Figure 1 , the adjacent ball head structures 42 are arranged tangentially; in other embodiments, as shown in Figure 2 , the second flat portion 44 is formed between the adjacent ball head structures 42, and the first flat portion 43 is formed on the outer side of the ball head structure 42 extending to the periphery of the substrate 1.
[0038] Further, as shown in Figure 4 , the mark point 6 is arranged on the side of the substrate 1 close to the back circuit 2, the mark point 6 is used as the basis for machine vision system identification and positioning, to ensure that the components can be accurately and correctly mounted to the specified position.
[0039] In summary, the surface of the encapsulant 41 is in the ball head structure 42, and the radius of the ball head can be adjusted according to the mold, the ball head mode can improve the brightness and light emitting angle of the lamp bead, different ball head radii have certain light cross talk avoidance effects, thereby reducing the cutting tangent process procedure and reducing the cost, and the lamp bead can also use smaller chips to achieve better display effect.
[0040] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0041] The above-described embodiments only express several implementation manners of the present application, the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.
Claims
1. An LED lamp bead structure, characterized in that, The application relates to a backplane circuit, which comprises the following parts: a substrate; a back circuit arranged on one side of the substrate; a front circuit arranged on the other side of the substrate, the back circuit being electrically connected with the front circuit; a plurality of groups of light emitting chips arranged on the front circuit; a package arranged above the groups of light emitting chips, the surface of the package being composed of a plurality of ball head structures, the number of the ball head structures corresponding to the number of the groups of light emitting chips, and the center of each ball head structure being coaxially arranged with the light emitting center of the corresponding group of light emitting chips, so as to expand the light emitting angle and reduce light interconnection between the groups of light emitting chips.
2. The LED lamp bead structure according to claim 1, characterized in that, The ball head structures are tangentially arranged between adjacent ball head structures.
3. The LED lamp bead structure according to claim 1, wherein, A second flat part is arranged between adjacent ball head structures, and a first flat part is arranged on the outer side of the ball head structures and extends to the periphery of the substrate.
4. The LED lamp bead structure of claim 1, wherein, The groups of light emitting chips are arranged in four groups and are fixed on the front circuit by fixing glue.
5. The LED lamp bead structure according to claim 1, wherein, Mark points are arranged on the side of the substrate close to the back circuit.
6. The LED lamp bead structure according to claim 4, wherein, The groups of light emitting chips comprise blue light chips, green light chips and red light chips, the red light chips are fixed on the front circuit by silver glue, and the blue light chips and the green light chips are fixed on the front circuit by insulating glue or silver glue.