Semiconductor silicon wafer cleaning device with drying function

Abstract

The utility model discloses a semiconductor silicon wafer cleaning device with a drying function. The semiconductor silicon wafer cleaning device comprises a base, two conveying belts installed on the inner side of the upper end of the base, supporting plates arranged on the conveying belts, a liquid containing box, a water containing box and a hollow plate, wherein the liquid containing box and the water containing box are arranged on the front side of the base, and the hollow plate is fixedly connected with the upper side of the right end of the base. The liquid containing box and the water containing box are each provided with a suction spraying structure, each suction spraying structure comprises a suction pump, a suction pipe, a through pipe and a spray head, and liquid level sensors are embedded in the inner sides of the lower ends of the base, the liquid containing box and the water containing box. According to the cleaning device with the drying function for the semiconductor silicon wafer, conveying, brushing cleaning, overturning and hot air drying can be conveniently conducted on the semiconductor silicon wafer, cleaning liquid spraying and clean water washing can be conveniently conducted before and after brushing, the cleaning efficiency is high, the cleaning effect is good, and the cleaning liquid, the clean water and cleaning water are sensed and displayed so that further treatment can be conveniently conducted.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor silicon wafer cleaning, in particular to a semiconductor silicon wafer cleaning device with drying function. BACKGROUND

[0002] Semiconductor silicon wafer refers to the silicon wafer used for making silicon semiconductor circuit, and in the production process of semiconductor silicon wafer, cleaning device is needed to remove residual photoresist, organic matter produced in dry etching process and thin film material attached to the surface of silicon wafer.

[0003] A kind of semiconductor silicon wafer cleaning device is disclosed in Chinese utility model patent with authorized announcement No.CN213826091U, including support assembly;Roller assembly is arranged on the support assembly, and roller assembly is formed by multiple rollers, and the middle part of roller is opened into limit slot along its circumferential direction;Multiple rollers can be synchronized to be close to clamp silicon wafer in the limit space formed by multiple limit slots, and drive silicon wafer to rotate;Nozzle is arranged above the roller assembly, for spraying liquid to the surface of silicon wafer;Cleaning assembly is arranged on one side of the roller assembly;When the roller assembly drives silicon wafer to rotate, cleaning assembly synchronously cleans the end face, upper surface and lower surface of silicon wafer, the semiconductor silicon wafer cleaning device of the utility model is convenient to operate, and practical, can safely and effectively clean the end face and upper and lower surfaces of silicon wafer, without causing secondary pollution to silicon wafer, improves the cleaning efficiency and cleaning quality of silicon wafer, meets market demand, and has good popularization value.

[0004] But the existing semiconductor silicon wafer cleaning device, in the use process, generally difficult to transport, brush cleaning, turn and hot air drying and a series of complete operation of semiconductor silicon wafer, cleaning efficiency, effect is limited, therefore, we propose a kind of semiconductor silicon wafer cleaning device with drying function, to solve the problems raised in the above. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of semiconductor silicon wafer cleaning device with drying function to solve the problems of the existing semiconductor silicon wafer cleaning device in the above background art, generally difficult to transport, brush cleaning, turn and hot air drying and a series of complete operation of semiconductor silicon wafer in the use process, cleaning efficiency, effect is limited.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of semiconductor silicon wafer cleaning device with drying function, comprising: base, the two conveying belts of installation in the inner side of base upper end, the support plate of setting on conveying belt, the liquid tank and water tank of setting of base front side and the hollow plate of fixed connection of base right end upper side;

[0007] Further comprising:

[0008] The suction spray structure is provided on the liquid tank and the water tank, wherein the suction spray structure comprises a suction pump, a suction pipe, a through pipe and a spray head, the lower end inner side of the base, the liquid tank and the water tank is embeddedly installed with a liquid level sensor, the middle upper side of the base is fixedly connected with a mounting plate, the middle lower side of the mounting plate is fixedly installed with a monitor, the rear upper end inner side of the mounting plate is embeddedly installed with a display and control panel.

[0009] The middle part and the right side of the supporting plate are respectively provided with a brushing cleaning structure and a turning structure, wherein the brushing cleaning structure comprises a brush round plate, a first motor and a receiving plate, the turning structure comprises a turning rod, a clamping groove, a limiting block, a belt, a pressing block, a second motor and a connecting plate, and the brush round plate is clamped and penetrated into the middle part of the upper end of the supporting plate.

[0010] The upper side of the right end of the base is provided with a hot air blowing structure, wherein the hot air blowing structure comprises a hollow plate, an air suction fan, a hollow plate and a heating pipe, and the air suction fan is installed on the middle part of the left and right ends of the hollow plate.

[0011] Preferably, the upper surface of the conveying belt and the upper surface of the base are in the same horizontal plane, the supporting plate is fixed on the base, and the inner part of the upper end of the base and the inner part of the outer end of the conveying belt are both in a mesh structure.

[0012] Preferably, the suction pump screw is fixed on the liquid tank and the water tank, the middle inner side of the liquid tank and the water tank is nested with a suction pipe in threaded communication with the suction pump, and the front end of the suction pump is threadedly connected with a through pipe.

[0013] Preferably, the outer end of the through pipe is threadedly connected to the outer upper end of the supporting plate, the through pipe is connected with a spray head in the supporting plate, and the spray head is symmetrically arranged about the brush round plate.

[0014] Preferably, the brush round plate is connected with a first motor through a shaft coupling, and the left and right inner sides of the first motor are nested with a receiving plate fixed with the supporting plate.

[0015] Preferably, the turning rod is nested in the upper end of the base, the outer end inner center of the turning rod is symmetrically provided with a clamping groove, the front end of the turning rod is clamped and connected with a limiting block fixed with the base, and the rear end of the single turning rod is nested and attached with a belt.

[0016] Preferably, the left rear side of the belt is provided with a pressing block clamped with the turning rod, the right rear side of the belt is provided with a second motor connected with the turning rod through a shaft coupling, and the second motor is fixed with a connecting plate through a clamp and a screw, and the pressing block and the connecting plate are fixedly connected with the base.

[0017] Preferably, the exhaust fan is provided with a hollow plate screw-fixed hollow plate, and the exhaust fan is provided with a heating pipe embedded in the hollow plate at equal intervals.

[0018] Compared with the prior art, the semiconductor wafer cleaning device with drying function has the advantages that the semiconductor wafer can be conveniently conveyed, brushed, flipped and hot air dried, cleaning liquid spraying and water flushing can be conveniently carried out before and after brushing, the cleaning efficiency is high, the effect is good, the cleaning liquid, water and cleaning water can be sensed and displayed for further processing, and the semiconductor wafer can be conveniently flipped for cleaning and drying on the back surface.

[0019] 1. The base, conveyor belt, support plate and brush disc are provided, the upper end of the base is internally provided with the conveyor belt with the upper surface at the same horizontal plane, the conveyor belt is provided with the brush disc penetrating the support plate, the brush disc is connected with the first motor supported and limited by the supporting plate through the shaft coupling, and therefore the semiconductor wafer can be conveniently conveyed and brushed.

[0020] 2. The base, support plate, liquid tank and water tank are provided, the support plate is fixedly connected to the base, the front side of the base is provided with the liquid tank and the water tank, the liquid tank and the water tank are both screw-fixedly provided with the pump, the pump is externally screw-threadedly connected with the suction pipe and the through pipe, the external end of the suction pipe is in communication connection with the liquid tank and the water tank, the external end of the through pipe is screw-threadedly connected to the support plate, the through pipe is externally communicated with the spray head in the support plate, and therefore the cleaning liquid spraying and water flushing can be conveniently carried out before and after brushing.

[0021] 3. The base, liquid tank, water tank and liquid level sensor are provided, the liquid level sensor is embeddedly installed at the lower end of the base, the liquid tank and the water tank, the rear upper end of the mounting plate fixedly connected to the base is embeddedly installed with the display and control panel, and therefore the cleaning liquid, water and cleaning water can be sensed and displayed for further processing.

[0022] 4. The turnover rod, clamping groove, limiting block and belt are provided, the turnover rod is nestedly clamped to the base at the lower right side of the support plate, the clamping groove is symmetrically formed at the external center of the turnover rod, the limiting block is fixedly connected to the base at the front end of the clamping groove, and the rear end of the clamping groove is linked with the second motor through the belt, and therefore the semiconductor wafer can be conveniently flipped for cleaning and drying on the back surface.

[0023] 5. The hollow plate, exhaust fan, hollow plate and heating pipe are provided, the hollow plate is fixedly connected to the upper right end of the base, the exhaust fan is embeddedly installed at the left upper end and the right upper end of the hollow plate, the hollow plate is screw-fixedly provided with the hollow plate at the upper side of the exhaust fan, and the exhaust fan is provided with the heating pipe embedded in the hollow plate at equal intervals at the lower side of the exhaust fan, and therefore the hot air drying of the cleaned semiconductor wafer can be conveniently carried out. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a front view of the sectional structure of the utility model;

[0025] Figure 2 is a top view of the sectional structure of the utility model;

[0026] Figure 3 is the utility model Figure 1 is an enlarged structure diagram of the middle A part;

[0027] Figure 4 is a front view of the sectional structure of the liquid tank and the water tank of the utility model;

[0028] Figure 5 is a side view of the sectional structure of the brush round plate and the supporting plate of the utility model;

[0029] Figure 6 is a whole structure diagram of the turning rod and the belt of the utility model.

[0030] In the figure: 1, base; 2, conveying belt; 3, supporting plate; 4, liquid tank; 5, water tank; 6, pump; 7, pumping pipe; 8, through pipe; 9, spray head; 10, liquid level sensor; 11, mounting plate; 12, monitor; 13, brush round plate; 14, first motor; 15, receiving plate; 16, turning rod; 17, clamping groove; 18, limiting block; 19, belt; 20, pressing block; 21, second motor; 22, connecting plate; 23, hollow plate; 24, exhaust fan; 25, hollow plate; 26, heating pipe; 27, display and control panel. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0032] Please refer to Figures 1-6The utility model provides a technical scheme: a cleaning device with drying function for semiconductor silicon wafer, including base 1, conveyer belt 2, support plate 3, liquid tank 4, water tank 5, pump 6, pump pipe 7, through pipe 8, shower nozzle 9, liquid level sensor 10, mounting plate 11, monitor 12, brush round plate 13, first motor 14, receiving plate 15, turnover rod 16, clamping groove 17, limit block 18, belt 19, pressure block 20, second motor 21, connecting plate 22, hollow plate 23, exhaust fan 24, openwork plate 25, heating pipe 26 and display control panel 27, two conveyer belts 2 of base 1 upper end inboard installation, the support plate 3 set up on conveyer belt 2, the liquid tank 4 and water tank 5 of base 1 front side setting and the hollow plate 23 of fixed connection of base 1 right end upper side, the liquid tank 4 and water tank 5 all are provided with suction spray structure, wherein suction spray structure includes pump 6, pump pipe 7, through pipe 8 and shower nozzle 9, and the lower end inboard of base 1, liquid tank 4 and water tank 5 all are inlaidly installed with liquid level sensor 10, and the middle part upper side of base 1 is fixedly connected with mounting plate 11, and the middle part lower side of mounting plate 11 is fixedly installed with monitor 12, the middle part and right side of support plate 3 are provided with brush cleaning structure and turning structure respectively, wherein brush cleaning structure includes brush round plate 13, first motor 14 and receiving plate 15, turning structure includes turnover rod 16, clamping groove 17, limit block 18, belt 19, pressure block 20, second motor 21 and connecting plate 22, and brush round plate 13 is clamped and penetrated in the upper end middle part inboard of support plate 3, the right end top of base 1 is provided with hot air drying structure, wherein hot air drying structure includes hollow plate 23, exhaust fan 24, openwork plate 25 and heating pipe 26, and exhaust fan 24 is installed in the middle part inboard of the left and right two ends of hollow plate 23. Specific embodiment one

[0034] When using the cleaning device with drying function for semiconductor silicon wafer, as Figure 1 、 Figure 2 and Figure 5 , the display control panel 27 inlaidly installed at the upper end inboard of the mounting plate 11 fixedly connected to the middle part of the base 1 is controlled to control the conveyer belt 2 installed at the upper end inboard of the base 1 to work, so that the conveyer belt 2 at the same level as the upper surface of the base 1 can convey the placed semiconductor silicon wafer, the first motor 14 supported in the receiving plate 15 is controlled to work through the display control panel 27, so that the first motor 14 drives the brush round plate 13 connected through the coupling below to rotate under the clamping and limiting of the support plate 3, so as to brush and clean the semiconductor silicon wafer conveyed below;

[0035] Since the pump 6 is externally threaded connected with the pump pipe 7 nested in the liquid tank 4 and the water tank 5, the pump 6 is externally threaded connected with the through pipe 8 nested in the support plate 3, thus the pump 6 screwed on the liquid tank 4 or the water tank 5 is controlled to work through the display control panel 27, so that the pump pipe 7 externally threaded connected with the pump 6 can pump the cleaning liquid in the liquid tank 4 or the water in the water tank 5 into the through pipe 8, and then into the spray head 9 connected with the outer end of the through pipe 8, so that the cleaning liquid or the water can be sprayed downward through the spray head 9, thereby facilitating the cleaning liquid spraying or the water washing of the semiconductor silicon wafer before and after brushing. Specific embodiment two

[0037] In use of the semiconductor silicon wafer cleaning device with drying function, such as Figure 1 , Figure 2 , Figure 3 and Figure 6 , the turnover rod 16 nested and clamped with the base 1 is arranged on the right side of the conveying belt 2, the outer end of the turnover rod 16 is internally and centrally symmetrical to the clamping groove 17, thus the second motor 21 fixedly connected to the rear side of the right end of the base 1 is controlled to work through the display control panel 27, so that the second motor 21 drives the turnover rod 16 connected with the front side of the second motor 21 through the shaft coupling to rotate under the limiting block 18 clamped with the front end of the turnover rod 16, since the single turnover rod 16 is nested and clamped with the belt 19 on the outer side of the rear end, the left end of the belt 19 is arranged with the pressing block 20 clamped with the turnover rod 16, and the pressing block 20 is fixedly connected with the base 1, thus the single turnover rod 16 is driven to rotate under the clamping and limiting of the limiting block 18 and the pressing block 20 by the belt 19, thereby facilitating the turnover of the semiconductor silicon wafer conveyed in the clamping groove 17, so that the semiconductor silicon wafer can be brushed and cleaned on the other side;

[0038] The hollow plate 23 with the exhaust fan 24 installed on the inner side of the middle part is fixedly connected to the right end of the base 1, the hollow plate 25 is screwed and fixed above the exhaust fan 24, and the heating pipe 26 is embedded and installed at equal intervals below the inner side of the lower end of the hollow plate 23, thus the exhaust fan 24 and the heating pipe 26 are controlled to work through the display control panel 27, so that the exhaust fan 24 blows the air heated by the heating pipe 26 to the semiconductor silicon wafer turned over below, thereby achieving the purpose of drying the semiconductor silicon wafer after cleaning by hot air, and thus the device can clean the semiconductor silicon wafer with high efficiency and good effect. Specific embodiment three

[0040] In use of the semiconductor silicon wafer cleaning device with drying function, such as Figure 1 , Figure 2 and Figure 4The upper end of the base 1 and the outer end of the conveying belt 2 are both provided with a mesh structure, so that the cleaning water formed after the cleaning liquid and the clean water are used can be collected. The lower end of the base 1, the liquid tank 4 and the water tank 5 are all embedded with liquid level sensors 10, so that the liquid level sensors 10 can be controlled by the display control panel 27 to sense the cleaning liquid, the clean water and the cleaning water, and the display control panel 27 can display the data sensed by the liquid level sensors 10, so that the cleaning liquid and the clean water in the liquid tank 4 and the water tank 5 can be added in time, and the cleaning water collected in the base 1 can be discharged and treated;

[0041] The middle lower side of the mounting plate 11 is fixedly provided with a monitor 12 located obliquely above the support plate 3, so that the conveying of the semiconductor silicon wafer can be monitored, and the display control panel 27 can control the operation of the conveying belt 2, the pump 6, the first motor 14 and the second motor 21, so that the conveying of the semiconductor silicon wafer can be controlled to be located below the nozzle 9 to receive the cleaning liquid, below the brush disc 13 to be brushed, and in the clamping groove 17 to be flipped by the flipping rod 16. The above-mentioned electrical elements are all prior art and will not be described in detail.

[0042] The technical solutions described in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalent ones. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A cleaning device for semiconductor silicon wafers with drying function, comprising: The base (1), the two conveying belts (2) installed on the inner side of the upper end of the base (1), the support plate (3) arranged on the conveying belt (2), the liquid containing box (4) and the water containing box (5) arranged on the front side of the base (1), and the hollow plate (23) fixedly connected to the upper side of the right end of the base (1); It is characterized in that it further comprises: The liquid containing box (4) and the water containing box (5) are provided with suction spray structures, wherein the suction spray structure comprises a suction pump (6), a suction pipe (7), a through pipe (8) and a spray head (9), and the inner side of the lower end of the base (1), the liquid containing box (4) and the water containing box (5) is embeddedly installed with a liquid level sensor (10), and the upper side of the middle part of the base (1) is fixedly connected with a mounting plate (11), and the lower side of the middle part of the mounting plate (11) is fixedly installed with a monitor (12), and the inner side of the rear upper end of the mounting plate (11) is embeddedly installed with a display and control panel (27); The middle part and the right side of the support plate (3) are respectively provided with a brushing cleaning structure and a turning structure, wherein the brushing cleaning structure comprises a brush round plate (13), a first motor (14) and a receiving plate (15), the turning structure comprises a turning rod (16), a clamping groove (17), a limiting block (18), a belt (19), a pressing block (20), a second motor (21) and a connecting plate (22), and the brush round plate (13) is clamped and penetrates into the inner side of the middle part of the upper end of the support plate (3); The right end of the base (1) is provided with a hot air blowing structure, wherein the hot air blowing structure comprises a hollow plate (23), a suction fan (24), a hollow plate (25) and a heating pipe (26), and the suction fan (24) is installed on the inner side of the middle part of the hollow plate (23).

2. The cleaning device for semiconductor silicon wafers with drying function according to claim 1, characterized in that: The upper surface of the conveying belt (2) and the upper surface of the base (1) are in the same horizontal plane, the support plate (3) is fixed on the base (1), and the inner part of the upper end of the base (1) and the inner part of the outer end of the conveying belt (2) are both in a mesh structure.

3. The cleaning device for semiconductor silicon wafers with drying function according to claim 1, characterized in that: The suction pump (6) is screw-fixed on the liquid containing box (4) and the water containing box (5), the inner side of the middle part of the liquid containing box (4) and the water containing box (5) is nested with a suction pipe (7) in threaded communication with the suction pump (6), and the front end of the suction pump (6) is threadedly connected with a through pipe (8).

4. The cleaning device for semiconductor silicon wafers with drying function according to claim 1, characterized in that: The outer end of the through pipe (8) is threadedly connected to the inner side of the outer upper end of the support plate (3), the through pipe (8) is connected with a spray head (9) in the support plate (3), and the spray head (9) is symmetrically arranged about the brush round plate (13).

5. The cleaning device for semiconductor silicon wafers with drying function according to claim 1, characterized in that: The first motor (14) is connected to the brush round plate (13) through a shaft coupling, and the inner side of the left and right ends of the first motor (14) is nested with a receiving plate (15) fixed to the support plate (3).

6. The cleaning device for semiconductor silicon wafers with drying function according to claim 1, characterized in that: The turning rod (16) is nested on the inner side of the upper end of the base (1), the inner part of the outer end of the turning rod (16) is centrally provided with a clamping groove (17), the front end of the turning rod (16) is clamped and connected with a limiting block (18) fixed to the base (1), and the rear end of the single turning rod (16) is nested with a belt (19).

7. The cleaning device for semiconductor silicon wafers with drying function according to claim 1, characterized in that: The left end rear side of the belt (19) is provided with a pressing block (20) engaged with the turnover rod (16), and the right end rear side of the belt (19) is provided with a second motor (21) connected with the turnover rod (16) through a shaft coupling, and the second motor (21) is fixed with a connecting plate (22) through a clamp and a screw, and the pressing block (20) and the connecting plate (22) are fixedly connected with the base (1).

8. The cleaning device for semiconductor silicon wafers with drying function according to claim 1, characterized in that: The hollow plate (23) is screw-fixed with the hollow plate (25) on the suction fan (24), and the heating pipes (26) are inlaidly installed on the hollow plate (23) below the suction fan (24) at equal intervals.

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