Silicon wafer cleaning device and silicon wafer grinding equipment

Abstract

The utility model relates to a silicon wafer cleaning device and silicon wafer grinding equipment. The silicon wafer cleaning device comprises a silicon wafer conveying structure, a first cleaning structure and a second cleaning structure, wherein the first cleaning structure and the second cleaning structure are sequentially arranged in the conveying direction of silicon wafers. The silicon wafer transportation structure comprises an adsorption part for adsorbing the first surface of the silicon wafer; the first cleaning structure is used for cleaning a second surface, opposite to the first surface, of the silicon wafer; the second cleaning structure comprises a bearing disc used for bearing the silicon wafer cleaned by the first cleaning structure, and the bearing disc is used for adsorbing the second surface of the silicon wafer. Through the arrangement of the first cleaning structure, before a silicon wafer enters the second cleaning structure and is borne on the bearing disc, the second surface of the silicon wafer is cleaned through the first cleaning structure, namely, the adsorption surface of the silicon wafer and the bearing disc is cleaned firstly; the phenomenon that the adsorption force of the bearing disc to the silicon wafer is affected by residual grinding waste liquid on the second surface of the silicon wafer is avoided, and the phenomenon that the wafer is broken due to insufficient adsorption force of the bearing disc is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor product manufacturing, especially to a silicon wafer cleaning device and silicon wafer grinding equipment. BACKGROUND

[0002] After the edge grinding and other grinding treatments of the silicon wafer chamfering machine are completed, the silicon wafer needs to be cleaned in a cleaning tank. In actual operation, the silicon wafer is cleaned after being adsorbed on a carrier disc in the cleaning tank. However, before the silicon wafer is carried on the carrier disc, there are grinding waste liquid and particles remaining on the back surface of the silicon wafer. The grinding waste liquid and particles on the back surface of the silicon wafer can cause the adsorption pressure of the carrier disc in the cleaning tank to be insufficient, resulting in low adsorption stability of the silicon wafer. The silicon wafer is prone to breakage during high-speed spin-drying. SUMMARY

[0003] To solve the above technical problems, the utility model provides a silicon wafer cleaning device and silicon wafer grinding equipment.

[0004] To achieve the above purpose, the utility model adopts the technical scheme of a silicon wafer cleaning device, which comprises a silicon wafer conveying structure and first and second cleaning structures arranged in sequence along the conveying direction of the silicon wafer.

[0005] The silicon wafer conveying structure comprises an adsorption part for adsorbing the first surface of the silicon wafer.

[0006] The first cleaning structure is used for cleaning the second surface of the silicon wafer, which is arranged opposite to the first surface.

[0007] The second cleaning structure comprises a carrier disc for carrying the silicon wafer cleaned by the first cleaning structure, and the carrier disc is used for adsorbing the second surface of the silicon wafer.

[0008] Optionally, the first cleaning structure comprises a first nozzle for spraying cleaning liquid towards the silicon wafer.

[0009] Optionally, the first cleaning structure comprises a second nozzle for spraying clean gas towards the silicon wafer.

[0010] Optionally, the first cleaning structure further comprises an elastic scraper, and the silicon wafer conveying structure is used for moving the silicon wafer so that the silicon wafer is in contact with the elastic scraper and moves opposite to the scraper, so as to clean the second surface of the silicon wafer by the scraper.

[0011] Optionally, the first cleaning structure comprises a recovery tank for recovering waste liquid after cleaning the silicon wafer.

[0012] Optionally, the second cleaning structure comprises a cleaning tank, and the carrier disc is arranged in the cleaning tank.

[0013] Optionally, the second cleaning structure comprises a third nozzle for spraying cleaning liquid towards the silicon wafer.

[0014] Optionally, the second cleaning structure comprises a fourth nozzle for spraying clean gas towards the silicon wafer.

[0015] The utility model embodiment further provides a grinding equipment, including grinding device, and the silicon wafer cleaning device of above, the silicon wafer transport structure is used to transport the silicon wafer after grinding to the first cleaning structure and washes, then is transported to the second cleaning structure and washes.

[0016] Optionally, the grinding device comprises a grinding tank, and the grinding tank is provided with a grinding structure for grinding the silicon wafer;

[0017] The first cleaning structure comprises a recovery tank adjacent to the grinding tank, the recovery tank is provided with a first nozzle for spraying cleaning liquid towards the second surface of the silicon wafer, a second nozzle for spraying clean gas towards the second surface of the silicon wafer, and an elastic scraper for cleaning the second surface of the silicon wafer;

[0018] The second cleaning structure comprises a cleaning tank adjacent to the recovery tank, the cleaning tank is provided with a carrier plate for carrying the silicon wafer washed by the first cleaning structure, and the carrier plate is used for adsorbing the second surface of the silicon wafer, and the second cleaning structure further comprises a third nozzle for spraying cleaning liquid towards the first surface of the silicon wafer, and a fourth nozzle for spraying clean gas towards the first surface of the silicon wafer.

[0019] The utility model has the advantages that: through the setting of the first cleaning structure, before the silicon wafer enters the second cleaning structure and is carried on the carrier plate, the second surface of the silicon wafer is cleaned by the first cleaning structure first, that is, the adsorption surface of the carrier plate is cleaned first, so that the adsorption force of the carrier plate on the silicon wafer is not affected by the residual grinding waste liquid on the second surface of the silicon wafer, and the occurrence of broken pieces caused by insufficient adsorption force of the carrier plate is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 Fig. 1 shows a schematic diagram of a silicon wafer grinding equipment according to an embodiment of the utility model;

[0021] Figure 2 Fig. 2 shows a schematic diagram of a first cleaning structure according to an embodiment of the utility model. DETAILED DESCRIPTION

[0022] In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the following will be combined with the drawings of the embodiments of the present disclosure to make a clear and complete description of the technical solutions of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present disclosure.

[0023] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the ordinary meaning understood by a person of ordinary skill in the art to which the present disclosure pertains. The terms "first", "second" and similar terms used in the present disclosure do not denote any order, quantity or importance, but are used to distinguish different components. Similarly, the terms "one", "a" or "the" and similar terms do not denote a quantity restriction, but mean that there is at least one. The terms "include", "contain" and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, without excluding other elements or objects. The terms "connect" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "upper", "lower", "left", "right" and the like are only used to represent relative positional relationships, and when the absolute positions of the described objects are changed, the relative positional relationships can also be changed accordingly.

[0024] The features "parallel", "vertical" and "same" and the like used in the embodiments of the present disclosure include the strictly "parallel", "vertical", "same" and the like, and "approximately parallel", "approximately vertical", "approximately same" and the like with a certain tolerance, which, considering the measurement and the tolerance related to the measurement of a specific quantity (for example, the limitation of a measurement system), represents the acceptable deviation range for a specific value determined by a person of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0025] With reference to Figure 1 and Figure 2 , the present embodiment provides a silicon wafer cleaning device, which comprises a silicon wafer conveying structure, and a first cleaning structure and a second cleaning structure arranged in sequence along the conveying direction of the silicon wafer;

[0026] The silicon wafer conveying structure comprises an adsorption part 4 for adsorbing a first surface of the silicon wafer 100;

[0027] The first cleaning structure is used for cleaning a second surface of the silicon wafer 100, which is arranged opposite to the first surface;

[0028] The second cleaning structure comprises a bearing disc 8 for bearing the silicon wafer 100 cleaned by the first cleaning structure, and the bearing disc 8 is used for adsorbing the second surface of the silicon wafer 100.

[0029] In the related art, the silicon wafer is cleaned, and generally only the second cleaning structure is provided. The silicon wafer treated by grinding and the like is directly transported to the second cleaning structure by the silicon wafer transportation structure for cleaning. The bearing disc 8 and a cleaning part are arranged in the second cleaning structure. The bearing disc 8 is used for adsorbing the silicon wafer, and the back surface (i.e. the second surface) of the silicon wafer is in contact with the bearing disc 8. The bearing disc 8 adsorbs the silicon wafer and drives the silicon wafer to rotate. In the rotating process, the silicon wafer is cleaned and / or dried by the cleaning part. However, since the silicon wafer treated by grinding and the like is directly transported to the bearing disc 8 by the silicon wafer transportation structure, the back surface of the silicon wafer has residual grinding liquid and particles and other pollutants. This can cause the adsorption pressure of the bearing disc 8 to be insufficient, reduce the connection stability between the bearing disc 8 and the silicon wafer, the bearing disc 8 cannot completely adsorb the silicon wafer, and the silicon wafer is prone to breakage under high-speed rotation. Therefore, there are many broken pieces when the silicon wafer is cleaned. To solve this problem, the silicon wafer cleaning device provided in the embodiment adds the first cleaning structure. After the silicon wafer treated by grinding and the like is adsorbed by the silicon wafer transportation structure, before the silicon wafer is transported to the bearing disc 8 of the second cleaning structure, the second surface (i.e. the surface of the silicon wafer used for contacting the bearing disc 8 of the second cleaning structure) of the silicon wafer is cleaned by the first cleaning structure. The residual grinding liquid and particles and other pollutants on the second surface of the silicon wafer are removed, the connection stability between the silicon wafer and the bearing disc 8 is improved, the occurrence of broken pieces in the process of cleaning the silicon wafer by the second cleaning structure is avoided, and the product yield is improved.

[0030] For example, the adsorption part 4 can comprise a mechanical arm and an adsorption disc arranged at the end of the mechanical arm.

[0031] In an exemplary embodiment, the first cleaning structure comprises a first nozzle 5 for spraying cleaning liquid towards the silicon wafer.

[0032] For example, the cleaning liquid can be ultrapure water, but is not limited thereto.

[0033] It should be understood that the first cleaning structure further comprises a storage part for storing the cleaning liquid, and a pump for providing high-pressure cleaning liquid to the first nozzle 5.

[0034] In an exemplary embodiment, the first cleaning structure comprises a second nozzle 6 for spraying clean gas towards the silicon wafer.

[0035] By spraying clean gas towards the silicon wafer through the second nozzle 6, the grinding liquid and particles and other pollutants on the second surface of the silicon wafer can be removed, and the silicon wafer is dried.

[0036] For example, the second nozzle 6 sprays inert dry clean gas to avoid damaging the silicon wafer.

[0037] In some embodiments, the first cleaning structure comprises a first nozzle 5 for spraying cleaning liquid towards the silicon wafer, and a second nozzle 6 for spraying clean gas towards the silicon wafer. The first nozzle 5 and the second nozzle 6 are arranged in sequence in the transport direction of the silicon wafer transport structure, i.e. the silicon wafer transport structure first transports the silicon wafer into the working range of the first nozzle 5, then the first nozzle 5 sprays cleaning liquid towards the silicon wafer for cleaning, and then the silicon wafer transport structure transports the silicon wafer into the working range of the second nozzle 6, and the second nozzle 6 further cleans the silicon wafer and dries the silicon wafer.

[0038] It should be noted that the number of the first nozzles 5 and the number of the second nozzles 6 can be set according to actual needs.

[0039] It should be noted that during the cleaning of the second surface of the silicon wafer by the first cleaning structure, the silicon wafer transport structure is always in the adsorbed state of adsorbing the silicon wafer, i.e. the silicon wafer transport structure suspends the silicon wafer above the first cleaning structure by the adsorption force of the adsorption part 4, so as to facilitate the cleaning of the second surface of the silicon wafer by the first cleaning structure.

[0040] It should be noted that the first cleaning structure can be provided with at least one first nozzle 5, and the cleaning range of the at least one first nozzle 5 is greater than or equal to the area of the second surface of the silicon wafer, so that the first nozzle 5 can effectively clean the second surface of the silicon wafer.

[0041] For example, the first cleaning structure can be provided with at least one second nozzle 6, and the cleaning range of the at least one second nozzle 6 is greater than or equal to the area of the second surface of the silicon wafer, so that the second nozzle 6 can effectively clean the second surface of the silicon wafer.

[0042] It should be noted that the first nozzle 5 and the second nozzle 6 can be provided with an adjusting valve for adjusting the spraying time and the spraying intensity of the corresponding nozzle.

[0043] In an exemplary embodiment, the first cleaning structure further comprises an elastic scraper 7, and the silicon wafer transport structure is used to move the silicon wafer so that the silicon wafer contacts the elastic scraper 7 and moves relative to the elastic scraper 7, so as to clean the second surface of the silicon wafer by the elastic scraper 7.

[0044] Exemplarily, the material of the elastic scraper 7 can be rubber to avoid damage to the silicon wafer, but is not limited thereto.

[0045] Exemplarily, the length of the elastic scraper 7 in the first direction is greater than or equal to the diameter of the silicon wafer, and the first direction is perpendicular to the conveying direction of the silicon wafer.

[0046] In some embodiments, the elastic scraper 7 is arranged between the second nozzle 6 and the second cleaning structure, that is, the second surface of the silicon wafer is cleaned by the first nozzle 5 first, then by the second nozzle 6, and then by the elastic scraper 7. After the first cleaning of the silicon wafer by the first nozzle 5, the second cleaning of the silicon wafer by the elastic scraper 7, and the third cleaning of the silicon wafer by the second nozzle 6, the first nozzle 5, the second nozzle 6, and the elastic scraper 7 cooperate to effectively clean the second surface of the silicon wafer, and can avoid damage to the silicon wafer due to excessive particles on the silicon wafer under the scraping force of the elastic scraper 7.

[0047] In some embodiments, the elastic scraper 7 is arranged between the first nozzle 5 and the second nozzle 6, that is, the second surface of the silicon wafer is cleaned by the first nozzle 5 first, then by the elastic scraper 7, and then by the second nozzle 6. After the first cleaning of the silicon wafer by the first nozzle 5, the second cleaning of the silicon wafer by the elastic scraper 7, and the third cleaning of the silicon wafer by the second nozzle 6, the elastic scraper 7 is arranged after the first nozzle 5, and there is cleaning liquid on the silicon wafer, which reduces the friction between the elastic scraper 7 and the silicon wafer, thereby reducing the damage of the elastic scraper 7 to the silicon wafer. The first nozzle 5, the second nozzle 6, and the elastic scraper 7 cooperate to effectively clean the second surface of the silicon wafer, and can avoid damage to the silicon wafer due to excessive particles on the silicon wafer under the scraping force of the elastic scraper 7.

[0048] Exemplarily, the first cleaning structure includes a recovery tank 2 for recovering waste liquid after cleaning the silicon wafer.

[0049] Exemplarily, the first nozzle 5 and / or the second nozzle 6 can be arranged on the side wall of the recovery tank 2.

[0050] Exemplarily, the elastic scraper 7 can be arranged at the opening of the recovery tank 2 and connected between the two oppositely arranged side walls of the recovery tank 2.

[0051] Exemplarily, the elastic scraper 7 can be arranged at a middle position of the recovery groove 2 in the conveying direction of the silicon wafer, and the first nozzle 5 and the second nozzle 6 are arranged at opposite sides of the elastic scraper 7, respectively.

[0052] Exemplarily, a through hole 11 is arranged at the bottom of the recovery groove 2, and the through hole 11 is connected to a waste liquid recovery structure through a pipeline.

[0053] In an exemplary embodiment, the second cleaning structure includes a cleaning groove 3, and the cleaning groove 3 is arranged with the carrier disc 8. The carrier disc 8 includes a carrier surface, and the carrier surface is arranged to adsorb the silicon wafer by adsorption and to be adsorbed and connected to the second surface of the silicon wafer.

[0054] After the first cleaning structure cleans the second surface of the silicon wafer, the waste liquid and the particles and other contaminants on the second surface of the silicon wafer are removed, the adsorption force between the carrier disc 8 and the silicon wafer is improved, the connection stability between the carrier disc 8 and the silicon wafer is enhanced, and the occurrence of fragments caused by the silicon wafer deviating or separating from the carrier disc 8 during the cleaning process is avoided.

[0055] In an exemplary embodiment, the second cleaning structure includes a third nozzle 9 for spraying cleaning liquid towards the silicon wafer.

[0056] The cleaning liquid can be ultrapure water, but is not limited thereto.

[0057] In an exemplary embodiment, the second cleaning structure includes a fourth nozzle 10 for spraying clean gas towards the silicon wafer.

[0058] The clean gas is inert dry clean gas, which can clean and dry the silicon wafer and does not react with the silicon wafer, thereby avoiding damage to the silicon wafer.

[0059] In an exemplary embodiment, the second cleaning structure includes a third nozzle 9 for spraying cleaning liquid towards the silicon wafer, and a fourth nozzle 10 for spraying clean gas towards the silicon wafer.

[0060] During the cleaning operation of the silicon wafer, the third nozzle 9 can be used to spray cleaning liquid towards the silicon wafer for cleaning, and then the fourth nozzle 10 can be used to blow the silicon wafer to clean and dry the silicon wafer.

[0061] It should be noted that the number of the third nozzle 9 and the number of the fourth nozzle 10 can be set according to actual needs, and one or more of each can be arranged.

[0062] It should be noted that the third nozzle 9 and the fourth nozzle 10 can be provided with adjusting valves for adjusting the spraying time and the spraying intensity of the corresponding nozzles.

[0063] Exemplarily, the second cleaning structure further comprises a rotating structure for controlling the rotation of the carrier disc 8 during the cleaning of the silicon wafer, so as to drive the silicon wafer carried on the carrier disc 8 to rotate, thereby effectively cleaning the silicon wafer.

[0064] Exemplarily, the rotating structure can comprise a rotating shaft connected to the bottom of the carrier disc 8, and a motor for controlling the rotation of the rotating shaft.

[0065] In an exemplary embodiment, the silicon wafer cleaning device comprises the first cleaning structure and the second cleaning structure, the first cleaning structure comprises the recovery tank 2, the second cleaning structure comprises the cleaning tank 3, and the recovery tank 2 and the cleaning tank 3 are connected together. The recovery tank 2 and the cleaning tank 3 can be detachably connected or fixedly connected, which is not limited herein.

[0066] The embodiment of the utility model further provides a grinding equipment, including grinding device, and above-mentioned silicon wafer cleaning device, the silicon wafer transport structure is used to transport the silicon wafer after grinding to the first cleaning structure and is cleaned, then is transported to the second cleaning structure and is cleaned.

[0067] In this embodiment, after the silicon wafer is ground, the first surface of the silicon wafer is adsorbed by the adsorption part 4 in the silicon wafer transport structure to transport the silicon wafer, before being cleaned by the second cleaning structure, the silicon wafer is transported above the first cleaning structure first, the second surface of the silicon wafer is cleaned by the first cleaning structure, then the silicon wafer is transported to the carrier disc 8 of the second cleaning structure, the carrier disc 8 adsorbs the second surface of the silicon wafer by adsorption force, and then the silicon wafer is cleaned.

[0068] In an exemplary embodiment, the grinding device comprises a grinding tank 1, and a grinding structure for grinding the silicon wafer is arranged in the grinding tank 1.

[0069] The first cleaning structure comprises a recovery tank 2 arranged adjacent to the grinding tank 1, a first nozzle 5 arranged in the recovery tank 2 for spraying cleaning liquid towards the second surface of the silicon wafer, a second nozzle 6 for spraying clean gas towards the second surface of the silicon wafer, and an elastic scraper 7 for cleaning the second surface of the silicon wafer.

[0070] The second cleaning structure comprises a cleaning tank 3 arranged adjacent to the recovery tank 2, the cleaning tank 3 is internally provided with a carrier disc 8 for carrying the silicon wafer cleaned by the first cleaning structure, the carrier disc 8 is used for adsorbing the second surface of the silicon wafer, and the second cleaning structure further comprises a third nozzle 9 for spraying cleaning liquid towards the first surface of the silicon wafer and a fourth nozzle 10 for spraying clean gas towards the first surface of the silicon wafer.

[0071] For example, along the transport direction of the silicon wafer, the grinding tank 1, the recovery tank 2 and the cleaning tank 3 are sequentially connected, and the grinding tank 1, the recovery tank 2 and the cleaning tank 3 can be detachably connected or fixedly connected.

[0072] The following points need to be explained:

[0073] (1) The drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, and other structures can be referred to the general design.

[0074] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of a layer or region is exaggerated or reduced, that is, these drawings are not drawn according to the actual proportion. It can be understood that when an element such as a layer, film, region or substrate is referred to as being located "on" or "under" another element, the element can be "directly" located on or under another element or there can be an intermediate element.

[0075] (3) In the case of no conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0076] It can be understood that the above implementation is only an exemplary implementation adopted for illustrating the principle of the present application, however, the present application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present application, and these modifications and improvements are also regarded as the protection scope of the present application.

Claims

1. A silicon wafer cleaning apparatus, characterized by comprising: The silicon wafer cleaning device comprises a silicon wafer conveying structure, a first cleaning structure and a second cleaning structure arranged in sequence along the conveying direction of the silicon wafer. The silicon wafer conveying structure comprises an adsorption part for adsorbing the first surface of the silicon wafer. The first cleaning structure is used for cleaning the second surface of the silicon wafer opposite to the first surface. The second cleaning structure comprises a carrying disc for carrying the silicon wafer cleaned by the first cleaning structure, and the carrying disc is used for adsorbing the second surface of the silicon wafer.

2. The silicon wafer cleaning apparatus of claim 1, wherein The first cleaning structure comprises a first nozzle for spraying cleaning liquid towards the silicon wafer.

3. The silicon wafer cleaning apparatus of claim 1, wherein The first cleaning structure comprises a second nozzle for spraying clean gas towards the silicon wafer.

4. The silicon wafer cleaning apparatus of claim 1, wherein The first cleaning structure further comprises an elastic scraper, and the silicon wafer conveying structure is used for moving the silicon wafer so that the silicon wafer is in contact with the elastic scraper and moves opposite to the scraper to clean the second surface of the silicon wafer by the scraper.

5. The silicon wafer cleaning apparatus of claim 1, wherein The first cleaning structure comprises a recovery groove for recovering waste liquid after cleaning the silicon wafer.

6. The silicon wafer cleaning apparatus of claim 1, wherein The second cleaning structure comprises a cleaning groove, and the carrying disc is arranged in the cleaning groove.

7. The silicon wafer cleaning apparatus of claim 6, wherein The second cleaning structure comprises a third nozzle for spraying cleaning liquid towards the silicon wafer.

8. The silicon wafer cleaning apparatus of claim 6, wherein The second cleaning structure comprises a fourth nozzle for spraying clean gas towards the silicon wafer.

9. A silicon wafer polishing apparatus characterized by comprising: The silicon wafer cleaning device comprises a grinding device and the silicon wafer cleaning device of any one of claims 1-8, and the silicon wafer conveying structure is used for conveying the ground silicon wafer to the first cleaning structure for cleaning and then to the second cleaning structure for cleaning.

10. The apparatus of claim 9 wherein, The grinding device comprises a grinding groove, and the grinding groove is provided with a grinding structure for grinding the silicon wafer. The first cleaning structure comprises a recovery groove arranged adjacent to the grinding groove, and the recovery groove is provided with a first nozzle for spraying cleaning liquid towards the second surface of the silicon wafer, a second nozzle for spraying clean gas towards the second surface of the silicon wafer, and an elastic scraper for cleaning the second surface of the silicon wafer. The second cleaning structure comprises a cleaning groove arranged adjacent to the recovery groove, and the cleaning groove is provided with a carrying disc for carrying the silicon wafer cleaned by the first cleaning structure, and the carrying disc is used for adsorbing the second surface of the silicon wafer, and the second cleaning structure further comprises a third nozzle for spraying cleaning liquid towards the first surface of the silicon wafer and a fourth nozzle for spraying clean gas towards the first surface of the silicon wafer.

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