A tinning bath structure for electronic component leads
By setting up direct contact between copper busbars and solder bars in the tin plating bath, the structure of the tin plating bath is optimized, solving the problem of high energy consumption in the existing technology and achieving improved conductivity and reduced energy consumption.
Patent Information
- Application Number
- CN202422734047.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-11
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-11-11
AI Technical Summary
Existing tin plating baths consume a lot of energy when increasing the current to ensure tin layer adhesion, and the poor conductivity of titanium leads to increased energy consumption.
A copper busbar is installed inside the tin plating bath to connect with a solder rod. The conductivity is improved by direct contact between the solder rod and the copper busbar. The wiring is fixed by a support stud and a fixing nut. The wiring is covered by a cover, thus optimizing the structure of the tin plating bath.
It improves the conductivity of the tin plating bath, reduces energy consumption, ensures stable adhesion of the tin layer on the copper-clad steel wire, and reduces power consumption.
Smart Images
Figure CN223607405U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of wire rod processing, and specifically relates to a tinning groove structure for electronic component lead wire. BACKGROUND
[0002] The tinned copper clad steel wire has a tin layer on the surface, so that it has good electric conductivity, oxidation resistance, corrosion resistance, welding performance and high strength, and is widely used in communication and electronic fields. After production, the copper clad steel wire is sent into a tinning groove for tinning. The existing tinning groove stores plating solution, and a titanium plate is arranged at the bottom of the tinning groove. A titanium strip is connected to the titanium plate, the titanium strip extends outward to the outside of the tinning groove and is connected to a copper bar, the copper bar is connected to the positive electrode of a power supply, and then a tin plate is placed on the titanium plate for dissolution and electroplating. Since the tinned copper clad steel wire used for electronic component lead wire needs to have high hardness, the current in the tinning groove needs to be increased so that tin ions can be better adsorbed on the copper clad steel wire to avoid the tin layer from falling off. Since the electric conductivity of titanium is relatively weak compared with other common metals, more electric energy needs to be consumed when the current of the plating solution in the tinning groove is increased. SUMMARY
[0003] The utility model provides a tinning groove structure for electronic component lead wire to solve the technical problems of the prior art.
[0004] To solve the above technical problems, the utility model adopts the technical scheme of:
[0005] A tinning groove structure for electronic component lead wire, comprising a tinning groove, the tinning groove stores plating solution, copper bars are arranged on the inner side wall of the tinning groove above the plating solution, the copper bars are connected to the wiring of the positive electrode of a power supply, the surface of the copper bars is uniformly distributed with tin rods, the surface of the tin rods is provided with a pressing plate, mounting studs are arranged on both sides of the copper bars, the mounting studs pass through the pressing plate, the end of the mounting stud is connected to a compression nut, a spring is arranged between the compression nut and the pressing plate, a guide plate is connected to the inner side wall of the tinning groove, a guide hole is formed in the guide plate, and the tin rods pass through the guide hole.
[0006] Further, support studs are connected to the copper bars, the support studs are locked by lock nuts through the side wall of the tinning groove, a connector is arranged on the wiring of the positive electrode of the power supply, the connector is sleeved on the support stud, a fixing nut is connected to the support stud, and the fixing nut locks the connector of the wiring of the positive electrode of the power supply.
[0007] Further, a cover is arranged on the outer side wall of the tinning groove, and the cover covers the connection between the wiring of the positive electrode of the power supply and the support stud.
[0008] Compared with the prior art, the tinning groove structure for electronic component lead wire of the utility model directly connects the tin rods and the copper bars, improves the electric conductivity, and reduces the energy consumption. Attached Figure Description
[0009] Figure 1 This is a schematic diagram of the structure of this utility model;
[0010] Among them, 1. Tin plating tank, 2. Copper busbar, 3. Wiring, 4. Support stud, 5. Locking nut, 6. Copper wire connector, 7. Fixing nut, 8. Cover, 9. Solder bar, 10. Pressure plate, 11. Guide plate, 12. Mounting stud, 13. Pressure nut, 14. Spring. Detailed Implementation
[0011] The technical solutions in the embodiments of this utility model will be clearly and completely described below.
[0012] like Figure 1 As shown, a tin plating tank structure for electronic component leads includes a tin plating tank 1 containing a plating solution. Copper busbars 2 are spaced apart on the inner wall of the tin plating tank 1 above the plating solution. The copper busbars 2 are connected to a power supply positive terminal wire 3. A support stud 4 is connected to the copper busbar 2. The support stud 4 passes through the side wall of the tin plating tank 1 and is locked by a locking nut 5. A copper wire connector 6 is provided on the power supply positive terminal wire 3. The copper wire connector 6 is sleeved on the support stud 4. A fixing nut 7 is connected to the support stud 4, and the fixing nut 7 locks the copper wire connector 6 of the power supply positive terminal wire.
[0013] A cover 8 is provided on the outer wall of the tin plating tank 1. The cover 8 covers the connection between the wiring 3 of the positive terminal of the power supply and the support stud 4 to prevent the wiring from being exposed.
[0014] The surface of the copper busbar 2 is evenly distributed with solder rods 9. A pressure plate 10 is provided on the surface of the solder rods 9. The pressure plate 10 presses down on the upper end of the solder plate 9. A guide plate 11 is connected to the inner side wall of the tin plating tank 1. A guide hole is provided on the guide plate 11. The solder rods 9 pass through the guide hole and the lower half of the solder rods 9 is fixed.
[0015] In this embodiment, mounting studs 12 are provided on both sides of the copper busbar 2. The mounting studs 12 pass through the pressure plate 10. A clamping nut 13 is connected to the end of the mounting stud 12. A spring 14 is provided between the clamping nut 13 and the pressure plate 10. The solder bar 9 is pressed by the elastic force of the spring 14. When replacing the solder bar, the pressure plate 10 can be opened and the solder bar 9 can be pulled out.
[0016] This utility model is not limited to the embodiments described. Those skilled in the art can still make some modifications or changes without departing from the spirit and scope of this utility model. Therefore, the scope of protection of this utility model shall be determined by the scope defined in the claims.
Claims
1. A tinning bath structure for electronic component leads, characterized by: The application relates to a tinning tank, which comprises a tinning tank, a plating solution stored in the tinning tank, copper bars installed on the inner side wall of the tinning tank in intervals above the plating solution, wire connection of the copper bars with a positive pole of a power supply, tin rods uniformly distributed on the surface of the copper bars, pressing plates arranged on the surface of the tin rods, mounting studs arranged on the two sides of the copper bars, the mounting studs penetrating through the pressing plates, compression nuts connected with the end portions of the mounting studs, springs arranged between the compression nuts and the pressing plates, guide plates connected with the inner side wall of the tinning tank, guide holes formed in the guide plates, and the tin rods penetrating through the guide holes.
2. A tinning bath configuration for electronic component leads as defined in claim 1, characterized in that: Support studs are connected with the copper bars, the support studs are locked through the side wall of the tinning tank through locking nuts, a joint is arranged on the wire of the positive pole of the power supply, the joint is sleeved on the support stud, a fixing nut is connected with the support stud, and the fixing nut locks the joint of the wire of the positive pole of the power supply.
3. A tinning bath configuration for electronic component leads as defined in claim 2, characterized in that: A cover is arranged on the outer side wall of the tinning tank, and the cover covers the connection position of the wire of the positive pole of the power supply and the support stud.