Flexible film temperature sensor

Abstract

The utility model provides a flexible film temperature sensor. The sensor comprises a sensor temperature sensing probe, a sensor lead and a lead connection point which are located on the same plane. The sensor temperature sensing probe adopts a double-helix wire, and a first packaging insulating film is packaged outside the double-helix wire; a second packaging insulating film is packaged outside the sensor wire; the sensor wires comprise four wires, and the outmost ring of outgoing line of the double-helix wire is connected with one end of the first wire and one end of the second wire; a secondary outer ring outgoing line of the double-helix wire is connected with one end of a third wire and one end of a fourth wire; the other ends of the first to fourth leads are integrally connected with the first to fourth lead connection points respectively to form a sensor terminal; and the upper surface layer of each connecting point is exposed relative to the second packaging insulating film. The flexible film temperature sensor provided by the utility model has relatively high temperature precision, and can improve the accuracy and reliability of temperature measurement in related application scenes.

Description

TECHNICAL FIELD

[0001] The utility model relates to temperature sensor technical field and temperature measurement field, concretely relates to a kind of temperature sensor based on flexible film, its design is suitable for the measurement and metrological calibration of temperature of sandwich, hot press plate surface, wall surface, complex curved surface and skin surface etc. BACKGROUND

[0002] Hot press is widely used in electronic, plastic, rubber products, photovoltaic and building materials furniture and other industries, and is widely used in modern manufacturing industry. It is mainly used to bond different material layers into composite materials by heating and pressing. With the progress of science and technology and the change of market demand, hot press plays an important role in many industries.

[0003] In the electronics industry, especially in the key fields of semiconductor packaging, printed circuit board (PCB) manufacturing, electronic component assembly, etc. It plays an important role. With the increasing miniaturization and integration of electronic equipment, the manufacturing process of electronic products also increasingly relies on precise temperature control and pressure control. Hot press can provide stable and uniform hot pressing conditions to ensure the high quality and high reliability of electronic components. The hot pressing temperature range of semiconductor packaging, PCB manufacturing and electronic component assembly is generally (150-250) ℃, and the temperature control accuracy is usually required to be within ±1.0 ℃, the temperature uniformity on the heating plate is within 2.0 ℃, and the temperature fluctuation is kept within ±0.5 ℃. For semiconductors and other microelectronic components, too high or too low temperature will affect their internal structure and function, affect the forming quality of materials, and even cause product defects.

[0004] In the rubber product industry, hot press is used as the core production equipment, and the temperature range is generally (100-200) ℃. It is widely used in the molding, vulcanization, mold pressing and other process links of rubber products. The special rubber hot pressing temperature reaches 300 ℃. The temperature error is usually required to be within ±1.0 ℃. Large temperature difference will cause defects on the surface or inside of the finished product, which cannot guarantee the consistency of quality. In the photovoltaic industry, the temperature range of hot press is generally (140-180) ℃, and the temperature control accuracy is usually required to be within ±2.0 ℃. High temperature on the heating plane will cause the warping deformation of the assembly. When hot pressing, too low temperature or large temperature difference on the hot pressing surface will cause the assembly to have broken core, crack and bubble, and even cause the tempered glass to burst, causing the photovoltaic assembly hot press to fail, thereby affecting the production efficiency and yield. In the building materials furniture, plastic and other industries, hot press plays an irreplaceable key role, and its temperature performance also affects the quality of related products.

[0005] Therefore, the periodic calibration of the temperature parameters of the hot press for various industries is the key to ensure the production quality of related products. However, the existing temperature sensors, such as platinum resistance, thermocouple and thermistor, have various problems in the measurement and calibration of the temperature of the hot press. Among them, although the platinum resistance has high temperature precision, the maximum allowable error of a class Pt100 platinum resistance thermometer is: ± (0.15 + 0.002 |t|), the sensor diameter is generally more than 2 mm, but there is a contact problem, and the measurement of the temperature of the hot press plate cannot be closely attached, and cannot bear pressure, and the platinum resistance cannot be used in the hot pressing of the upper and lower plates of the hot press. Because the sensing point of the thermocouple is small and the sensitivity is high, the allowable error is generally ± 1.5 DEG C or ± 0.004 |t|, the conventional diameter is 0.5 mm or 1 mm, and there is also an extremely thin thermocouple, the welding point is spherical, cannot bear pressure, is easy to cause the welding point to fall off, and the cold end is easy to be affected by the environmental temperature fluctuation, and the measurement precision cannot meet the demand of the high-precision temperature measurement of the hot press. The temperature measuring head of the thermistor is generally water drop-shaped, and the measurement precision and accuracy are limited, and it cannot be applied to the calibration of the temperature of the hot pressing plate of the hot press.

[0006] Therefore, it is necessary to develop a flexible thin film temperature sensor with high temperature precision, which is suitable for sandwich temperature measurement and metrological calibration. Practical new type content

[0007] The utility model discloses a kind of flexible thin film temperature sensors, the sensor includes the sensor temperature sensing probe and sensor wire etched integrally in the same copper foil plane;

[0008] The technical scheme of the utility model is:

[0009] The utility model provides a flexible thin film temperature sensor, the sensor includes the sensor temperature sensing probe and sensor wire etched integrally in the same copper foil plane;

[0010] The sensor temperature sensing probe adopts double helix wire, and is externally packaged with a first packaging insulating film;

[0011] The sensor wire includes a first wire, a second wire, a third wire and a fourth wire, and is externally packaged with a second packaging insulating film.

[0012] The outermost circle of the double helix wire is connected to one end of the first wire and the second wire; the next outermost circle of the double helix wire is connected to one end of the third wire and the fourth wire; the other end of the first wire, the second wire, the third wire and the fourth wire are respectively connected to the first wire connection point, the second wire connection point, the third wire connection point and the fourth wire connection point, forming a sensor terminal; and the upper surface of each connection point is in a bare state relative to the second packaging insulating film.

[0013] Further, the double helix wire is provided with a first packaging insulating film, the width of the double helix wire is consistent, the wire spacing between each circle is equal, and the two end points of the spiral structure lead-out wire are on the same side.

[0014] Further, the diameter of the first packaging insulating film is 24 mm, the diameter of the double helix wire is 20 mm, the width is 0.1±0.02 mm, and the wire spacing is 0.1±0.02 mm.

[0015] Further, the double helix wire, the first wire, the second wire, the third wire and the fourth wire are all made of copper foil etching, and the thickness of the copper foil is 12.5μm; the length of the first wire, the second wire, the third wire and the fourth wire is 300mm, and the width is 4mm.

[0016] Further, the connection signal of the first wire connection point is +I, the connection signal of the second wire connection point is -I, the connection signal of the third wire connection point is +V, and the connection signal of the fourth wire connection point is -V.

[0017] Further, the first packaging insulating film is made of high-temperature-resistant PI film with a thickness of 50μm.

[0018] Further, the sensor further comprises a sensor terminal reinforcing plate, which is located at the sensor terminal and tightly adheres to the second packaging insulating film at the bottom of the sensor wire; the sensor terminal reinforcing plate is made of PI film.

[0019] Further, the sensor temperature sensing probe is clamped between the upper heating plate of the hot press and the lower heating plate of the hot press, and is used to collect the temperature parameters of the hot press; the sensor terminal is provided with a terminal block, and the terminal points on the terminal block are respectively connected to the first wire connection point, the second wire connection point, the third wire connection point and the fourth wire connection point; the terminal block is connected to a temperature reading collector through four-core wires.

[0020] Further, the second packaging insulating film comprises an upper packaging insulating film and a lower packaging insulating film, and is made of PI film with a thickness of 50μm.

[0021] Further, the overall thickness H1 of the upper encapsulation insulating film, the lower encapsulation insulating film and the sensor wire after encapsulation is 0.12mm.

[0022] The utility model discloses the beneficial effect of having:

[0023] The utility model provides a flexible film temperature sensor has higher temperature precision, is applicable to the temperature measurement and measurement calibration of sandwich, hot press board surface, wall surface, complex curved surface and skin surface etc.

[0024] The sensor temperature sensing probe of the utility model is double helical line structure, adopts ultra -thin pure copper foil to carry out etching processing and forms, is processed into helical line structure of equal interval, equal width, realizes the temperature sensing probe resistance maximization in unit area.

[0025] The sensor upper and lower encapsulation insulating film of the utility model adopts high temperature resistant PI film, has better insulation and protection performance, guarantees the stability of double helical line structure, has better thermal conductivity, temperature measurement response speed is far greater than Pt100, has better temperature resistance, can be used for 250 DEG C temperature measurement in short time, can be used for long -term below 200 DEG C.

[0026] The thickness of the sensor temperature sensing probe of the utility model after encapsulation is 0.12mm, is plane temperature measurement mode, has the temperature measurement ability of surface contact far more than thermocouple or Pt100, and when measuring sandwich, hot press board surface, wall surface, complex curved surface and skin surface, will not affect the normal work of wall surface, the normal hot pressing of hot press board surface, will not lead to sensor damage or damage the surface of the equipment under test.

[0027] The sensor temperature sensing probe of the utility model and first, second, third, fourth wire are one whole copper foil etching, do not exist the resistance problem caused by welding point etc., measure the resistance of temperature sensing probe through four wire system, have higher measurement precision.

[0028] The first, second, third, fourth wire connection point of the sensor of the utility model and the wiring plug -in row realize quick plug -in use, are more convenient connection mode, avoid welding, be applicable to the popular use of large area.

[0029] The other features and advantages of the utility model will be described in detail in the following specific embodiment part. BRIEF DESCRIPTION OF DRAWINGS

[0030] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description thereof taken in conjunction with the accompanying drawings, in which like reference numerals refer to like elements in the several views. In the drawings:

[0031] Figure 1 Fig. 1 shows a schematic diagram of the overall structure of a sensor according to an embodiment of the present application.

[0032] Figure 2 Fig. 2 shows a schematic diagram of the temperature-sensing probe structure of a sensor according to an embodiment of the present application.

[0033] Figure 3 Fig. 3 shows a side view of the overall structure of a sensor according to an embodiment of the present application.

[0034] Figure 4 Fig. 4 shows a schematic diagram of the use state of a sensor according to an embodiment of the present application.

[0035] In the drawings: 1, temperature-sensing probe of sensor; 2, second encapsulation insulating film; 3, first wire; 4, second wire; 5, third wire; 6, fourth wire; 7, sensor terminal reinforcing plate; 8, first wire connection point; 9, second wire connection point; 10, third wire connection point; 11, fourth wire connection point; 12, upper heating plate of hot press; 13, lower heating plate of hot press; 14, terminal block; 15, four-core wire; 16, temperature reading acquisition instrument;

[0036] 101, double helix wire; 102, first encapsulation insulating film;

[0037] 201, upper encapsulation insulating film; 202, lower encapsulation insulating film. DETAILED DESCRIPTION

[0038] Preferred embodiments of the present application will be described in greater detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it is understood that the present application can be embodied in various forms and should not be limited by the embodiments set forth herein.

[0039] As shown in Figure 1 the present application provides a flexible thin-film temperature sensor, which has the following structure: a temperature-sensing probe 1 of a sensor, an encapsulation insulating film 2, a first wire 3, a second wire 4, a third wire 5, a fourth wire 6, a sensor terminal reinforcing plate 7, a first wire connection point 8, a second wire connection point 9, a third wire connection point 10, and a fourth wire connection point 11.

[0040] In the embodiment, the sensor temperature sensing probe 1 is etched from a 12.5 μm thick pure copper foil, adopts a double helix structure, the helix line width is consistent, the spacing between each coil is equal, the two end points of the helix structure lead-out wire are on the same side, and the maximum resistance value of the helix line structure in a unit area is realized.

[0041] In the embodiment, the helix line structure of the sensor temperature sensing probe 1 and the first wire 3, the second wire 4, the third wire 5 and the fourth wire 6 are etched from a 12.5 μm thick pure copper foil; the first wire 3, the second wire 4, the third wire 5 and the fourth wire 6 have a consistent width of 4 mm and a length of 300 mm; the outermost coil lead-out wire of the double helix wire 101 of the sensor temperature sensing probe 1 is connected with the first wire 3 and the second wire 4; the next outer coil lead-out wire of the double helix wire 101 of the sensor temperature sensing probe 1 is connected with the third wire 5 and the fourth wire 6, and the connection points are in the same plane without welding points; the first wire 3, the second wire 4, the third wire 5 and the fourth wire 6 are connected with the first wire connection point 8, the second wire connection point 9, the third wire connection point 10 and the fourth wire connection point 11 in sequence, and belong to the same plane with the helix line structure of the sensor temperature sensing probe 1; the width of the first wire connection point 8, the second wire connection point 9, the third wire connection point 10 and the fourth wire connection point 11 is 1 mm, the spacing is 1 mm, and the upper surface layer of each connection point is in a bare state without covering the packaging insulating film 2; the resistance value of the sensor temperature sensing probe 1 is measured by a four-wire method, in which the first wire connection point 8 connected measurement signal is +I, the second wire connection point 9 connected signal is -I, the third wire connection point 10 connected signal is +V and the fourth wire connection point 11 connected signal is -V.

[0042] In the embodiment, the second packaging insulating film 2 is a high-temperature-resistant PI film, and the maximum temperature resistance can reach 300℃. The upper and lower two high-temperature-resistant PI films are fused and packaged by a hot pressing process, and are used to fix the helix line structure of the above-mentioned sensor temperature sensing probe 1, the first wire 3, the second wire 4, the third wire 5, the fourth wire 6, the first wire connection point 8, the second wire connection point 9, the third wire connection point 10 and the fourth wire connection point 11; the thickness of the high-temperature-resistant PI film is 50 μm, the overall thickness of the sensor after packaging of the upper and lower two high-temperature-resistant PI films is 0.12 mm; and insulation and waterproof are realized, and the sensor can be bent below 90° and has flexibility.

[0043] In the embodiment, the sensor terminal reinforcing plate 7 is a PI film with a thickness of 0.3 mm, closely adheres to the lower layer of the sensor terminal insulation layer, has the same size as the lower layer of the sensor terminal insulation layer, and has a length of 20 mm, and is used to enhance the hardness of the first wire connecting point 8, the second wire connecting point 9, the third wire connecting point 10, and the fourth wire connecting point 11, and facilitates pluggable connection with the wire terminal.

[0044] As shown in Figure 2 The structure diagram of the sensor temperature sensing probe of the utility model is composed of the first packaging insulation film 102 of the temperature sensing probe and the double helix wire 101 of the temperature sensing probe.

[0045] In the embodiment, the diameter L2 of the first packaging insulation film 102 of the temperature sensing probe is 24 mm, the diameter L1 of the double helix wire 101 of the temperature sensing probe is 20 mm, the width W1 of the double helix wire is 0.1±0.02 mm, the spacing W2 between the double helix wires is 0.1±0.02 mm, and both are equidistant, so that the target resistance of the double helix wire processed according to the size of the utility model can reach a resistance of the temperature sensing probe of 22.5Ω or more under the condition of 20℃.

[0046] As shown in Figure 3 The overall structure side view of the sensor of the utility model is composed of the upper packaging insulation film 201, the lower packaging insulation film 202, the sensor wire, the first wire connecting point 8, the second wire connecting point 9, the third wire connecting point 10, the fourth wire connecting point 11, and the sensor terminal reinforcing plate 7.

[0047] In the embodiment, the upper packaging insulation film 201 and the lower packaging insulation film 202 are both high-temperature-resistant PI films with a thickness of 50μm, and the overall thickness H1 of the sensor after packaging of the upper and lower high-temperature-resistant PI films is 0.12 mm; the sensor wire and the aforementioned sensor temperature sensing probe 1 are both made of pure copper foils with a thickness of 12.5μm and are integrally etched; the sensor wire connecting points are located on the upper layer of the sensor and are the side views of the first wire connecting point 8, the second wire connecting point 9, the third wire connecting point 10, and the fourth wire connecting point 11, are raised welding points on the sensor wire, the welding points are 5 mm long and 50μm high, and the surface is not covered by the upper packaging insulation film 201; the sensor terminal reinforcing plate 7 has a length of 20 mm and a thickness of 0.3 mm, closely adheres to the lower packaging insulation film 202 of the sensor terminal, and has the same size as the lower layer of the insulation layer.

[0048] As shown in Figure 4 The use diagram of the sensor of the utility model is composed of the sensor temperature sensing probe 1, the upper heating plate 12 of the hot press, the lower heating plate 13 of the hot press, the sensor wire connecting point, the sensor terminal reinforcing plate 7, the wire plug-in row 14, the four-core wire 15, and the temperature reading collection instrument 16.

[0049] In the embodiment, the upper heating plate 12 and the lower heating plate 13 of the hot press are typical application scenarios of the sensor of the utility model, the upper heating plate 12 and the lower heating plate 13 of the hot press are uniformly provided with temperature control functions, the surface temperature is generally (100-300) DEG C, and pressure is provided, and the pressure is generally not more than 100 kpa; the flexible film temperature sensor of the utility model has a thickness of 0.12 mm, can measure the internal temperature of the two plate surfaces under the compaction of the upper heating plate 12 and the lower heating plate 13 of the hot press, and supports the measurement of the maximum heating plate surface not more than the diameter of 600 mm or the center point temperature of the length x width size of 600 mm x 600 mm.

[0050] In the embodiment, the sensor wire connecting point and the sensor wiring end reinforcing plate 7 end are connected with the wiring plug-in row 14 and can be tightly clamped; the wiring plug-in row 14 is a concave slot, the inner upper end is a contact point corresponding to the sensor wire connecting point; the wiring plug-in row 14 is connected with the temperature reading collection instrument 16 through the four-core wire 15 to measure the resistance change of the sensor temperature sensing probe 401; wherein the temperature reading collection instrument 16 has a resistance measurement range of (0-50) Ω, a measurement resolution of 0.001 Ω, and a measurement accuracy better than ±0.01 Ω.

[0051] The above has described the various embodiments of the utility model, the above description is exemplary, is not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes are obvious to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A flexible thin film temperature sensor characterized by The sensor comprises a sensor temperature sensing probe (1) and a sensor wire, which are integrally etched on the same copper foil plane; The sensor temperature sensing probe (1) adopts a double helix wire (101) which is externally encapsulated by a first encapsulating insulating film (102); The sensor wire comprises a first wire (3), a second wire (4), a third wire (5) and a fourth wire (6), and is externally encapsulated by a second encapsulating insulating film (2). The sensor wire is provided with wire connecting points, including a first wire connecting point (8), a second wire connecting point (9), a third wire connecting point (10) and a fourth wire connecting point (11). The outermost circle of the double helix wire (101) is connected to one end of the first wire (3) and the second wire (4); the next outermost circle of the double helix wire (101) is connected to one end of the third wire (5) and the fourth wire (6); the other ends of the first wire (3), the second wire (4), the third wire (5) and the fourth wire (6) are respectively connected to the first wire connecting point (8), the second wire connecting point (9), the third wire connecting point (10) and the fourth wire connecting point (11) to form a sensor wire end; and the upper surface of each connecting point is exposed relative to the second encapsulating insulating film (2).

2. The flexible thin-film temperature sensor of claim 1, wherein, The double helix wire (101) is externally provided with the first encapsulating insulating film (102), the width of the double helix wire (101) is consistent, the wire spacing between each circle is equal, and the two end points of the spiral structure lead-out wire are on the same side.

3. The flexible thin-film temperature sensor of claim 2, wherein, The diameter of the first encapsulating insulating film (102) is 24 mm, the diameter of the double helix wire (101) is 20 mm, the width is 0.1±0.02 mm, and the wire spacing is 0.1±0.02 mm.

4. The flexible thin-film temperature sensor of claim 1, wherein, The double helix wire (101), the first wire (3), the second wire (4), the third wire (5) and the fourth wire (6) are all etched from copper foil, and the thickness of the copper foil is 12.5 μm; the length of the first wire (3), the second wire (4), the third wire (5) and the fourth wire (6) is all 300 mm, and the width is all 4 mm.

5. The flexible thin-film temperature sensor of claim 1, wherein, The first wire connecting point (8) is connected to a signal of +I, the second wire connecting point (9) is connected to a signal of -I, the third wire connecting point (10) is connected to a signal of +V, and the fourth wire connecting point (11) is connected to a signal of -V.

6. The flexible thin-film temperature sensor of claim 1, wherein, The first encapsulating insulating film (102) adopts a high-temperature-resistant PI film with a thickness of 50 μm.

7. The flexible thin-film temperature sensor of claim 1, wherein, The sensor further comprises a sensor wire end reinforcing plate (7) which is located at the sensor wire end and closely adheres to the second encapsulating insulating film (2) at the bottom of the sensor wire; the sensor wire end reinforcing plate (7) adopts a PI film.

8. The flexible thin-film temperature sensor of claim 1, wherein, The sensor temperature sensing probe (1) is clamped between the upper heating plate (12) and the lower heating plate (13) of the hot press, used for collecting the temperature parameters of the hot press, the wiring end of the sensor is sleeved with a wiring distribution board (14), and the wiring points on the wiring distribution board (14) are connected with the first wire connecting point (8), the second wire connecting point (9), the third wire connecting point (10) and the fourth wire connecting point (11) respectively; the wiring distribution board (14) is connected to the temperature reading collector (16) through the four-core wire (15).

9. The flexible thin-film temperature sensor of claim 1, wherein, The second packaging insulation film (2) comprises an upper packaging insulation film (201) and a lower packaging insulation film (202), and PI film is adopted, and the thicknesses of the upper packaging insulation film (201) and the lower packaging insulation film (202) are both 50 μm.

10. The flexible thin-film temperature sensor of claim 9, wherein, The overall thickness H1 of the upper packaging insulation film (201), the lower packaging insulation film (202) and the sensor wire after packaging is 0.12 mm.

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