Lifting type wafer transfer device

Abstract

The embodiment of the utility model provides a lifting type wafer transfer device, and relates to the technical field of wafer processing. The lifting type wafer transfer device provided by the utility model comprises a sheet fork, a clamping assembly and a supporting assembly, the sheet fork is a clamp used for bearing a wafer, the clamping assembly is arranged on the sheet fork, and the clamping assembly is used for clamping the wafer; the supporting assembly is arranged on the wafer fork, and the supporting assembly is used for supporting the wafer and enabling a gap to exist between the wafer and the wafer fork. The wafer fork is provided with a symmetry axis, the transfer device further comprises a flow guide structure arranged on the clamping assembly and / or the supporting assembly, and the flow guide structure abuts against the wafer and is used for guiding liquid at the position of the flow guide structure on the wafer to flow in the direction of the symmetry axis. The lifting type wafer transfer device provided by the utility model is used for solving the problem that liquid is accumulated near the clamping piece in the lifting transfer process of the wafer, so that the processing quality of the wafer is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field, specifically, relates to a lifting type wafer transfer device. BACKGROUND

[0002] In the wafer production process, the wafer transfer is an important link. In some process, the wafer needs to be lifted vertically from the container with liquid to transfer.

[0003] However, in the prior art, the liquid is accumulated near the clamping part during the wafer transfer by the wafer fork, forming a dead angle, which affects the processing quality of the wafer. UTILITY MODEL CONTENT

[0004] The utility model discloses a lifting type wafer transfer device, which can improve the problem of liquid accumulation on the wafer surface during wafer lifting and transfer, and improve the wafer processing quality.

[0005] The embodiment of the utility model can be realized as follows:

[0006] The utility model discloses a lifting type wafer transfer device, which comprises a wafer fork, a clamp for carrying a wafer;

[0007] A clamping assembly is arranged on the wafer fork, and the clamping assembly is used for clamping the wafer;

[0008] A supporting assembly is arranged on the wafer fork, and the supporting assembly is used for supporting the wafer and making the wafer have a spacing with the wafer fork;

[0009] The wafer fork has an axis of symmetry, and the transfer device further comprises a flow guide structure arranged on the clamping assembly and / or the supporting assembly, the flow guide structure abuts against the wafer, and is used for guiding the liquid on the wafer at the flow guide structure to flow along the axis of symmetry.

[0010] In the optional embodiment, the flow guide structure comprises a first flow guide part arranged on the supporting assembly, and the first flow guide part is a linear protrusion arranged along the axis of symmetry, so that the supporting assembly and the wafer are in line-face contact.

[0011] In the optional embodiment, the thickness of the supporting assembly near the wafer is less than the thickness of the supporting assembly away from the wafer.

[0012] In the optional embodiment, the angle between the supporting assembly and the wafer plane is 12°-25°.

[0013] In the optional embodiment, the clamping assembly comprises:

[0014] A clamping piece is arranged on the wafer fork, and the clamping piece is used to abut against the wafer;

[0015] An abutting piece is arranged on the wafer fork away from the clamping piece and is used to abut against the wafer, so that the abutting piece and the clamping piece jointly clamp the wafer.

[0016] In an optional embodiment, the clamping piece comprises a clamping portion, the clamping portion has a clamping surface arranged opposite to the abutting piece, and the clamping surface cooperates with the abutting piece to clamp the wafer.

[0017] The clamping surface is in point contact with the wafer.

[0018] In an optional embodiment, the flow guide structure further comprises a second flow guide portion arranged on the clamping portion, and the second flow guide portion is a flow guide groove opened along the direction of the symmetry axis.

[0019] In an optional embodiment, the clamping piece further comprises a supporting portion arranged on the clamping portion close to the wafer.

[0020] The flow guide structure further comprises a third flow guide portion arranged on the supporting portion, and the third flow guide portion is a linear protrusion arranged along the direction of the symmetry axis, so that the supporting portion is in line-face contact with the wafer.

[0021] In an optional embodiment, at least two flow guide grooves are opened on the clamping portion, and the at least two flow guide grooves are respectively located on two sides of the third flow guide portion.

[0022] In an optional embodiment, the abutting piece comprises a connecting rod and a driving portion, the connecting rod is arranged with a groove wheel matched with the wafer at one end of the clamping assembly, the driving portion is arranged on the wafer fork and connected with the connecting rod, and the driving portion is used to drive the connecting rod to be close to or away from the wafer.

[0023] The beneficial effects of the wafer transfer device provided in the embodiments of the utility model include:

[0024] By arranging the clamping assembly, the wafer is clamped and fixed on the wafer fork, and then the wafer is supported by the supporting assembly, so that there is a certain spacing between the wafer and the wafer fork, and direct contact between the wafer and the wafer fork is avoided to prevent liquid accumulation; at the same time, the flow guide structure is arranged on the clamping assembly and / or the supporting assembly to guide the liquid on the clamping assembly and the supporting assembly on the wafer, and further prevent liquid accumulation on the wafer; and the effect of improving the wafer processing quality is achieved. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the premise of not paying creative labor.

[0026] Figure 1 A structure schematic view of a lifting type wafer transfer device provided in the present embodiment is shown in the figure.

[0027] Figure 2 A front view of a lifting type wafer transfer device provided in the present embodiment is shown in the figure.

[0028] Figure 3 A side view of a lifting type wafer transfer device provided in the present embodiment is shown in the figure.

[0029] Figure 4 A structure schematic view of a supporting assembly in a lifting type wafer transfer device provided in the present embodiment is shown in the figure.

[0030] Figure 5 A structure schematic view of a supporting assembly in a lifting type wafer transfer device provided in the present embodiment is shown in the figure. Figure 1 An enlarged view of A part in the figure.

[0031] Figure 6 A structure schematic view of a supporting assembly in a lifting type wafer transfer device provided in the present embodiment is shown in the figure.

[0032] Icon: 100 - fork; 110 - symmetry axis; 200 - clamping assembly; 210 - clamping piece; 211 - clamping part; 212 - clamping surface; 213 - supporting part; 220 - abutting piece; 221 - connecting rod; 222 - driving part; 223 - groove wheel; 300 - supporting assembly; 400 - flow guiding structure; 410 - first flow guiding part; 420 - second flow guiding part; 421 - flow guiding groove; 430 - third flow guiding part. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0035] It should be noted that similar reference numbers and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it need not be further defined and explained in subsequent drawings.

[0036] In the description of the present application, it should be noted that if the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, and are merely for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0037] In addition, if the terms "first", "second" and the like appear, they are only used for differentiation in description and cannot be understood as indicating or implying relative importance.

[0038] It should be noted that the features in the embodiments of the present application can be combined with each other without conflict.

[0039] In the processing of wafers, the wafer will be transported between multiple processing stations. Currently, the wafer is clamped and transported by a wafer fork of a transport device deep into a wafer box or a processing tank. In some cases where the wafer needs to be clamped vertically, the wafer fork needs to be vertically pulled down to clamp the wafer. The liquid on the surface of the wafer flows vertically downward under the action of gravity, and the dead angle is formed near the contact between the clamping structure provided on the wafer fork and the wafer, causing the liquid to accumulate. The accumulation of liquid on the wafer affects the photolithography processing, cleaning processing, etching processing, deposition processing of the wafer, and the performance and reliability of the final chip product. For example, in cleaning processing or deposition processing, if the wafer fork needs to clamp the wafer to flow between processing tanks containing different processing liquids, the liquid accumulated in the dead angle will cross-contaminate with the different processing liquids in other processing tanks, and the accumulated liquid will also affect the processing effect of the wafer.

[0040] To solve the above technical problems, the present application provides a lifting type wafer transport device, which is suitable for the field of wafer processing and is used to improve the problem of liquid accumulation at the clamping part when the wafer is clamped by the traditional wafer fork, thereby improving the processing quality of the wafer.

[0041] The overall structure, working principle and technical effects of the lifting type wafer transfer device are described in detail below by means of embodiments and in combination with the drawings.

[0042] The lifting type wafer transfer device comprises a wafer fork 100, a clamping assembly 200 and a supporting assembly 300. The wafer fork 100 is used for carrying a wafer. The clamping assembly 200 is arranged on the wafer fork 100 and is used for clamping the wafer, so as to clamp and fix the wafer on the wafer fork 100. The supporting assembly 300 is also arranged on the wafer fork 100 and is used for supporting the wafer on the wafer fork 100. The supporting assembly 300 causes a gap to exist between the wafer and the wafer fork 100, so as to avoid the wafer from contacting the wafer fork 100, thereby reducing the contact area of the wafer and the wafer fork 100 and reducing the pollution to the wafer. Further, the lifting type wafer transfer device provided by the utility model further comprises a flow guide structure 400 arranged on the clamping assembly 200 and / or the supporting assembly 300. The flow guide structure 400 is in abutment with the wafer. The wafer fork 100 has an axis of symmetry 110. When the wafer is lifted and transferred in a vertical state, the flow guide structure 400 guides the liquid at the contact position between the wafer surface and the clamping assembly 200 and the supporting assembly 300, so that the liquid at the contact position between the wafer and the flow guide structure 400 flows along the axis of symmetry 110, that is, the liquid vertically downwardly flows, thereby avoiding the liquid from accumulating at the clamping assembly 200 and the supporting assembly 300.

[0043] The wafer is clamped and fixed on the wafer fork 100 by means of the clamping assembly 200, and the wafer is supported by means of the supporting assembly 300, so that a certain spacing exists between the wafer and the wafer fork 100, thereby avoiding the liquid from accumulating due to the direct contact between the wafer and the wafer fork 100. At the same time, the flow guide structure 400 is arranged on the supporting assembly 300 and / or the clamping assembly 200, so as to guide the liquid at the clamping assembly 200 and the supporting assembly 300 on the wafer, thereby further avoiding the liquid from accumulating on the wafer. In turn, the effect of improving the wafer processing quality is achieved.

[0044] It can be understood that the handle of the wafer fork 100 is connected to a moving device such as a mechanical hand, so as to drive the wafer fork 100 and the wafer on the wafer fork 100 to move during the wafer transfer process. The number of tines of the wafer fork 100 and the tine spacing are designed according to the size of the wafer to be transferred. In order to make the wafer clamped on the wafer fork 100 bear force uniformly, different types of wafer forks 100 all have an axis of symmetry 110. The tines of the wafer fork 100 are symmetrically arranged along the axis of symmetry 110. In this embodiment, the wafer fork 100 having two symmetrical tines is taken as an example for description.

[0045] Please refer to Figure 1 and Figure 4The support assembly 300 is arranged on both prongs of the wafer fork 100, and contacts the upper edge of the wafer during the wafer transfer, and the support assembly 300 is used to support the wafer surface.

[0046] In some optional embodiments, the flow guide structure 400 includes a first flow guide part 410, which is arranged on the support assembly 300, and the first flow guide part 410 is a linear protrusion arranged along the symmetry axis direction, that is, the support assembly 300 becomes thinner from the linear protrusion to both sides, so that the linear protrusion makes the support assembly 300 and the wafer in line contact, reduces the contact area between the support assembly 300 and the wafer, and avoids the accumulation of liquid on the wafer to reduce the pollution to the wafer. When the wafer fork 100 pulls and transfers the wafer in the vertical direction, the first flow guide part 410 is arranged in the vertical direction, so that the two sides of the linear protrusion have a flow guide effect, avoiding the accumulation of liquid at the connection between the wafer and the support assembly 300.

[0047] Please refer to Figure 4 In other optional embodiments, the thickness of the support assembly 300 close to one end of the wafer is smaller than the thickness of the support assembly 300 away from the other end of the wafer, that is, the thickness of the support assembly 300 gradually decreases from top to bottom in the vertical direction, so that the support assembly 300 and the vertical plane form an included angle α. When supporting the wafer, the first flow guide part 410 and the wafer support form a point contact, further reducing the contact area between the wafer and the support assembly 300, and at the same time, it is more conducive to the flow of liquid along the first flow guide part 410, further reducing the possibility of liquid accumulation on the wafer.

[0048] Further, please refer to Figure 4 In order to reduce the contact area between the wafer and the support assembly 300 as much as possible while ensuring that the support assembly 300 can stably support the wafer, in some optional embodiments, the thickness of the support assembly 300 gradually decreases from top to bottom, and the included angle α between the first flow guide part 410 on the support assembly 300 and the wafer plane is 12°-25°.

[0049] Please refer to Figure 1 - Figure 3 In this embodiment, the clamping assembly 200 includes a clamping piece 210 and a resisting piece 220, the clamping piece 210 is arranged at the end of both prongs of the wafer fork 100, and the clamping piece 210 is used to resist the lower two side edges of the wafer. The resisting piece 220 is arranged on the wafer fork 100 and located away from the clamping piece 210 of the wafer fork 100, and the resisting piece 220 is used to resist the upper edge of the wafer. Therefore, through the cooperation of the clamping piece 210 and the resisting piece 220, the wafer is clamped and fixed on the wafer fork 100.

[0050] Please refer toFigure 5 And Figure 6 In the embodiment, the clamping member 210 includes a clamping portion 211 arranged at the end of the prong of the wafer fork 100, the clamping portion 211 protrudes from the plane of the wafer fork 100, and the clamping portion 211 has a clamping surface 212 arranged opposite to the abutting member 220. The clamping surface 212 abuts against the lower edge of the wafer, so that the wafer is fixed by the cooperation of the clamping surface 212 and the abutting member 220. Further, the clamping surface 212 is arranged obliquely, that is, there is an included angle β between the clamping surface 212 and the horizontal plane, and the end of the clamping surface 212 close to the wafer fork 100 is low, and the end of the clamping surface 212 far away from the wafer fork 100 is high. By arranging the clamping surface 212 as an inclined surface, and the end of the clamping surface 212 close to the wafer fork 100 is low, and the end of the clamping surface 212 far away from the wafer fork 100 is high, on the one hand, when the wafer is clamped on the clamping portion 211, the clamping surface 212 plays a limiting effect on the wafer, avoiding the wafer moving away from the wafer fork 100 and disengaging from the clamping portion 211, and improving the fixing effect of the wafer during the transfer process; on the other hand, the contact area between the clamping surface 212 and the wafer is reduced, avoiding the accumulation of liquid on the clamping surface 212.

[0051] Please refer to Figure 5 And Figure 6 In the embodiment, due to the included angle β between the clamping surface 212 on the clamping portion 211 and the horizontal plane, liquid is easy to accumulate on the top of the clamping portion 211 when the wafer is pulled out of the cavity. Based on this, in some other optional embodiments, the flow guide structure 400 further includes a second flow guide portion 420, and the second flow guide portion 420 includes a flow guide groove 421 arranged on the clamping portion 211. The flow guide groove 421 is arranged in the length direction of the symmetry axis 110, that is, when the wafer fork 100 vertically pulls and transfers the wafer, the flow guide groove 421 is arranged on the clamping portion 211 in the vertical direction. Further, the liquid accumulated on the top of the clamping portion 211 is discharged through the flow guide groove 421.

[0052] Please refer to Figure 5 And Figure 6Further, the clamping piece 210 further comprises a supporting part 213, in the embodiment, the supporting part 213 is arranged on both prongs of the prong fork 100, and the supporting part 213 is arranged at one end of the clamping part 211 close to the wafer. In other optional embodiments, the lifting type wafer transfer device further comprises a third flow guide part 430, and the third flow guide part 430 is a linear protrusion arranged along the length direction of the symmetry axis 110. The third flow guide part 430 makes the wafer and the supporting part 213 in line-surface contact, reduces the contact area between the supporting part 213 and the wafer, and reduces the possibility of liquid accumulation at the contact position of the wafer and the supporting part 213. Meanwhile, when the prong fork 100 vertically lifts and transfers the wafer, the third flow guide part 430 on the supporting part 213 is arranged in the vertical direction, thereby playing a flow guide role on the liquid on the wafer and avoiding liquid accumulation at the connection position of the wafer and the supporting part 213.

[0053] Further, please refer to Figure 5 and Figure 6 In some optional embodiments, the thickness of the supporting part 213 close to one end of the clamping part 211 is greater than the thickness of the supporting part 213 away from the other end of the clamping part 211. That is, in the vertical direction, the thickness of the supporting part 213 gradually increases from top to bottom. Through the above arrangement, the supporting part 213 can stably support the wafer while minimizing the contact area between the wafer and the supporting part 213, thereby achieving the effect of reducing the liquid accumulation at the connection position of the wafer and the supporting part 213.

[0054] Further, please refer to Figure 5 and Figure 6 In order to improve the flow guiding effect of the second flow guide part 420 on the clamping part 211, in other optional embodiments, at least two flow guide grooves 421 are arranged on the clamping part 211, and the at least two flow guide grooves 421 are respectively located on both sides of the third flow guide part 430, so that the liquid guided by the third flow guide part 430 enters the flow guide grooves 421 and is discharged. Through the cooperation of the second flow guide part 420 and the third flow guide part 430, the flow guiding effect is improved. Meanwhile, further, the clamping part 211 is divided into a plurality of clamping sub-parts by the at least two flow guide grooves 421, and the clamping sub-parts located on both sides of the at least two flow guide grooves 421 are chamfered at one end close to the wafer. On the one hand, the chamfered arrangement makes the clamping surface 212 and the wafer in point contact, further reducing the contact area between the wafer and the clamping surface 212; on the other hand, the chamfered arrangement facilitates the liquid to slide off the clamping part 211, improves the flow guiding effect on the liquid, and further reduces the possibility of liquid accumulation on the wafer.

[0055] Please refer to Figure 1 and Figure 2In the embodiment, the abutting member 220 comprises a connecting rod 221 and a driving part 222, the connecting rod 221 is arranged in a Y shape, two forked ends of the Y-shaped connecting rod 221 extend towards the wafer, and a groove wheel 223 adapted to the wafer is arranged at one end of the connecting rod 221 close to the wafer. The driving part 222 is arranged on the wafer fork 100 and located at one end of the connecting rod 221 away from the wafer, the driving part 222 is connected with the connecting rod 221, and the driving part 222 is used for driving the connecting rod 221 to be close to or away from the wafer. The driving part 222 can be a servo motor, an electric cylinder, a linear motor or other structures capable of driving the connecting rod 221 to move linearly.

[0056] In summary, the implementation principle of the lifting type wafer transfer device is as follows: the wafer is clamped and fixed on the wafer fork 100 through the clamping assembly 200, and the wafer is supported through the supporting assembly 300, so that a certain gap exists between the wafer and the wafer fork 100, and liquid accumulation caused by direct contact between the wafer and the wafer fork 100 is avoided; at the same time, the liquid at the clamping assembly 200 and the supporting assembly 300 on the wafer is guided through the flow guide structure 400 arranged on the clamping assembly 200 and / or the supporting assembly 300, and liquid accumulation on the wafer is further avoided; and the effect of improving the wafer processing quality is achieved.

[0057] The above is only a specific implementation manner of the utility model, but the protection scope of the utility model is not limited to this, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the utility model, and all the changes or replacements should be covered in the protection scope of the utility model.

Claims

1. A puller wafer transfer device, comprising: The utility model relates to a wafer carrier for carrying a wafer, a clamping assembly arranged on the wafer carrier for clamping the wafer, and a supporting assembly arranged on the wafer carrier for supporting the wafer and leaving a space between the wafer and the wafer carrier, wherein the wafer carrier has an axis of symmetry, and the wafer carrier further comprises a flow guide structure arranged on the clamping assembly and / or the supporting assembly, the flow guide structure being in contact with the wafer and being used to guide the flow of liquid on the wafer at the flow guide structure along the axis of symmetry. The flow guide structure comprises a first flow guide part arranged on the supporting assembly, the first flow guide part being a linear protrusion arranged along the axis of symmetry so that the supporting assembly is in line-face contact with the wafer. The thickness of the supporting assembly at the end close to the wafer is less than the thickness of the supporting assembly at the end away from the wafer. The angle between the supporting assembly and the plane of the wafer is 12°-25°. The clamping assembly comprises a clamping part arranged on the wafer carrier and being in contact with the wafer, and a contact part arranged at the end of the wafer carrier away from the clamping part and being in contact with the wafer so that the contact part and the clamping part jointly clamp the wafer.

2. The apparatus according to claim 1, wherein The clamping part comprises a clamping surface arranged opposite to the contact part, the clamping surface and the contact part cooperating to clamp the wafer.

3. The apparatus according to claim 2, wherein The flow guide structure further comprises a second flow guide part arranged on the clamping part, the second flow guide part being a flow guide groove opened along the axis of symmetry.

4. The apparatus according to claim 3, wherein The clamping part further comprises a supporting part arranged at the end of the clamping part close to the wafer.

5. The apparatus according to claim 1, wherein The flow guide structure further comprises a third flow guide part arranged on the supporting part, the third flow guide part being a linear protrusion arranged along the axis of symmetry so that the supporting part is in line-face contact with the wafer. The flow guide groove is opened on the clamping part in at least two, and the at least two flow guide grooves are respectively located on the two sides of the third flow guide part. The contact part comprises a connecting rod and a driving part, the connecting rod being provided at the end close to the clamping assembly with a groove wheel adapted to the wafer, and the driving part being arranged on the wafer carrier and connected with the connecting rod, the driving part being used to drive the connecting rod to be close to or away from the wafer.

6. The single wafer transfer apparatus of claim 5 wherein: ​ ​ 7. The apparatus according to claim 6, wherein ​ 8. The single wafer transfer apparatus of claim 7 wherein: ​ ​ 9. The single wafer transfer apparatus of claim 8 wherein, ​ 10. The single wafer transfer apparatus of claim 5 wherein: ​

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