Data line with anti-glue overflow structure
By incorporating installation slots, card slots, flow channels, and glue storage slots into the data cable, the problem of glue overflow during data cable processing is solved, achieving anti-overflow glue and stable connection, and ensuring the cleanliness and stability of the circuit board.
Patent Information
- Application Number
- CN202423253559.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-28
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-28
AI Technical Summary
During the manufacturing process of existing data cables, glue overflow can easily occur during the bonding of the plastic shell to the inner and outer molds, resulting in poor appearance and contamination of electronic components.
A data cable with an anti-overflow adhesive structure was designed. By setting up installation grooves, slots, blocks, flow channels, and adhesive storage tanks between the upper and lower mold shells, the adhesive is ensured to flow into the adhesive storage tank. The guide pillars and positioning cylinders achieve precise alignment and stable connection of the mold shells.
This effectively prevents glue overflow, protects the display panel on the circuit board from contamination, improves the stability of the data cable under external force, and reduces the risk of poor circuit contact and display abnormalities.
Smart Images
Figure CN223612749U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic product technical field, especially a data line with anti -overflowing glue structure. BACKGROUND
[0002] Data line, its function is to connect mobile device and computer, to reach data transmission or communication purpose, colloquial point says, it is the passage tool for connecting computer and mobile device to transmit video, ring, picture etc.
[0003] With the rapid development of electronic products, electronic industry technology is changing rapidly, various plastic shell type structure data transmission line material appears frequently, but the processing mode of plastic shell and forming inner and outer mould is to coat glue on the surface of inner and outer mould and then push the plastic shell to the position and bond, and this operation mode causes the overflow of glue to cause the appearance defect phenomenon, and the excess glue is also easy to cause the pollution of the electronic device in the shell, therefore, the utility model provides a data line with anti -overflowing glue structure. UTILITY MODEL CONTENT
[0004] (I) the technical problem solved
[0005] In view of the problems existing in the prior art, the utility model provides a data line with anti -overflowing glue structure.
[0006] (II) technical scheme
[0007] In order to realize the above object, the utility model is realized by the following technical scheme: a data line with anti -overflowing glue structure, including upper mould shell and lower mould shell, be provided with circuit board between the upper mould shell and lower mould shell, the surface of circuit board is installed with display panel, and the both ends of circuit board are installed with the spout, the top of lower mould shell is provided with installation groove, the inner wall lower end of installation groove is provided with lower flow groove, the side wall of installation groove is provided with glue discharge hole, the glue discharge hole is communicated with lower flow groove, the lower end of upper mould shell is fixedly connected with installation block, the lower surface of installation block is provided with upper flow groove, and the size of upper flow groove is adapted to the size of lower flow groove.
[0008] As a preferred scheme of the data line with anti -overflowing glue structure of the utility model, the inner wall both sides of installation groove are provided with the clamping slot, and the both sides of installation block are installed with the clamping block, and the size of clamping block is adapted to the size of clamping slot.
[0009] As a preferred scheme of the data line with anti -overflowing glue structure of the utility model, the number of installation groove and installation block is all set to six groups, and six groups of installation groove and installation block are evenly arranged on the surface of lower mould shell and upper mould shell respectively.
[0010] As a preferred scheme of the data line with the anti-glue overflow structure, the inner wall of the lower mold shell is fixedly connected with a positioning cylinder, the inner wall of the positioning cylinder is slidably connected with a guide column, and the top of the guide column is fixedly connected with the inner wall of the upper mold shell.
[0011] As a preferred scheme of the data line with the anti-glue overflow structure, the inner wall of the lower mold shell is fixedly connected with a positioning cylinder, the inner wall of the positioning cylinder is slidably connected with a guide column, and the top of the guide column is fixedly connected with the inner wall of the upper mold shell.
[0012] As a preferred scheme of the data line with the anti-glue overflow structure, the inner wall of the lower mold shell is fixedly connected with a positioning cylinder, the inner wall of the positioning cylinder is slidably connected with a guide column, and the top of the guide column is fixedly connected with the inner wall of the upper mold shell.
[0013] As a preferred scheme of the data line with the anti-glue overflow structure, the inner wall of the lower mold shell is fixedly connected with a positioning cylinder, the inner wall of the positioning cylinder is slidably connected with a guide column, and the top of the guide column is fixedly connected with the inner wall of the upper mold shell.
[0014] (Three) beneficial effects
[0015] The utility model provides a kind of data line with anti-glue overflow structure. With following beneficial effects:
[0016] 1, by extruding glue into installation groove, then the installation block of upper mold shell lower end is aligned installation groove, then push upper mold shell and insert installation block into installation groove, by the clamping block of installation block two sides and the clamping groove of installation groove inner wall, upper mold shell and lower mold shell can be fixed together, and under the cooperation of upper flow groove and lower flow groove, excess glue will flow into the glue storage groove of lower mold shell through glue discharge hole, by setting glue storage groove, excess glue can be avoided to flow in lower mold shell, so that the display panel on circuit board is not polluted by glue.
[0017] 2, by setting guide column and positioning cylinder, when assembling upper mold shell and lower mold shell, guide column slides along positioning cylinder, accurate guiding effect is achieved, accurate alignment between upper mold shell and lower mold shell is ensured, so that each corresponding installation groove, installation block, clamping groove and clamping block can be more smoothly assembled, by setting fixed hole on the two sides of circuit board, when data line is pulled, shaken and the like, circuit board is not easy to displace, the relative position of display panel and two end sockets and the like mounted on its surface is stabilized, the probability of causing line contact failure, display abnormality and the like due to circuit board loosening is reduced. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.
[0019] Figure 1 is a structural schematic diagram of the whole of the present application;
[0020] Figure 2 is a structural schematic diagram of the plug-in head in the present application;
[0021] Figure 3 is a structural schematic diagram of the overflow-preventing frame and the glue storage groove in the present application;
[0022] Figure 4 is a structural schematic diagram of the guide column in the present application;
[0023] Figure 5 is a structural schematic diagram of the circuit board in the present application;
[0024] Figure 6 is an enlarged view of A in the present application Figure 3 ;
[0025] Figure 7 is an enlarged view of B in the present application Figure 4 .
[0026] In the drawings, 1 is an upper mold shell, 2 is a lower mold shell, 3 is a circuit board, 4 is a display panel, 5 is a socket, 6 is a plug-in head, 7 is a fixing hole, 8 is a positioning cylinder, 9 is an overflow-preventing frame, 10 is a mounting groove, 11 is a clamping groove, 12 is a lower flow-through groove, 13 is a glue discharging hole, 14 is a guide column, 15 is a mounting block, 16 is a clamping block, 17 is an upper flow-through groove, 18 is a display window, and 19 is a glue storage groove. DETAILED DESCRIPTION
[0027] The technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings of the embodiments of the present application.
[0028] Embodiment 1
[0029] Referring to Figure 1 , Figure 5 , Figure 6 and Figure 7For the first embodiment of the utility model, this embodiment provides a data line with anti overflow glue structure, including upper mould shell 1 and lower mould shell 2, be provided with circuit board 3 between upper mould shell 1 and lower mould shell 2, the surface of circuit board 3 is equipped with display panel 4, and both ends of circuit board 3 are equipped with socket 5, the top of lower mould shell 2 is provided with mounting groove 10, the inner wall lower end of mounting groove 10 is provided with lower flow groove 12, the sidewall of mounting groove 10 is provided with glue discharge hole 13, glue discharge hole 13 is communicated with lower flow groove 12, the lower end of upper mould shell 1 is fixedly connected with mounting block 15, the lower surface of mounting block 15 is provided with upper flow groove 17, and the size of upper flow groove 17 is adapted to the size of lower flow groove 12.
[0030] Specifically, the inner wall of mounting groove 10 is provided with clamping groove 11 on both sides, and the two sides of mounting block 15 are provided with clamping block 16, the size of clamping block 16 is adapted to the size of clamping groove 11, the number of mounting groove 10 and mounting block 15 is six groups, and six groups of mounting groove 10 and mounting block 15 are evenly arranged on the surface of lower mould shell 2 and upper mould shell 1 respectively, the inner wall lower surface of lower mould shell 2 is fixedly connected with overflow prevention frame 9, and overflow prevention frame 9 is formed with glue storage groove 19 between the inner wall of lower mould shell 2.
[0031] Further, first, circuit board 3 is placed into lower mould shell 2, then glue is extruded into mounting groove 10, then mounting block 15 at the lower end of upper mould shell 1 is aligned with mounting groove 10, then upper mould shell 1 is pushed to insert mounting block 15 into mounting groove 10, clamping block 16 arranged on both sides of mounting block 15 and clamping groove 11 formed on the inner wall of mounting groove 10 can fix upper mould shell 1 and lower mould shell 2 together, and under the cooperation of upper flow groove 17 and lower flow groove 12, excess glue can flow into glue storage groove 19 of lower mould shell 2 through glue discharge hole 13, and by arranging glue storage groove 19, excess glue can be prevented from flowing in lower mould shell 2, so that display panel 4 on circuit board 3 is not polluted by glue.
[0032] Embodiment 2
[0033] Refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 For the second embodiment of the utility model, the inner wall of lower mould shell 2 is fixedly connected with positioning cylinder 8, the inner wall of positioning cylinder 8 is slidably connected with guide column 14, and the top of guide column 14 is fixedly connected with the inner wall of upper mould shell 1.
[0034] Specifically, one side of socket 5 is provided with wire insertion head 6, the top of upper mould shell 1 is provided with display window 18, both sides of circuit board 3 are provided with fixing hole 7, and fixing hole 7 is slidably connected with the surface of guide column 14.
[0035] Further, by setting the guide column 14 and the positioning cylinder 8, when assembling the upper mold shell 1 and the lower mold shell 2, the guide column 14 slides along the positioning cylinder 8, which can play an accurate guiding role, ensuring the accurate alignment between the upper mold shell 1 and the lower mold shell 2, so that the corresponding mounting groove 10 and the mounting block 15, the clamping groove 11 and the clamping block 16 and other matching structures can be more smoothly assembled. By opening the fixing hole 7 on both sides of the circuit board 3, when the data line is pulled, shaken or other conditions, the circuit board 3 is not easy to displace, ensuring the relative position stability of the display panel 4 and the two end jacks 5 and other components mounted on the surface of the circuit board 3, reducing the probability of causing poor line contact, display abnormalities and other faults due to the loosening of the circuit board 3.
[0036] Working principle: first, the placement operation of the circuit board 3 is performed, the circuit board 3 is accurately placed into the lower mold shell 2, then the glue is squeezed into the mounting groove 10, providing a medium for the fixed bonding of the upper mold shell 1 and the lower mold shell 2, then the upper mold shell 1 is taken, the mounting block 15 at the lower end of the upper mold shell 1 is aligned with the mounting groove 10 of the lower mold shell 2, and then the upper mold shell 1 is slowly pushed, the mounting block 15 is stably inserted into the mounting groove 10, in this process, the clamping block 16 on both sides of the mounting block 15 is tightly matched with the clamping groove 11 on the inner wall of the mounting groove 10, and the two are clamped with each other, not only realizing the firm fixing of the upper mold shell 1 and the lower mold shell 2, but also ensuring the stability of the connection between the two, at the same time, the upper through groove 17 on the lower surface of the mounting block 15 of the upper mold shell 1 is matched and connected with the lower through groove 12 in the mounting groove 10 of the lower mold shell 2, when the amount of glue injected is slightly excessive, the excess glue can flow into the glue storage groove 19 through the glue discharge hole 13 connected with the lower through groove 12, and the excess glue can be prevented from flowing disorderly in the lower mold shell 2 by the overflow prevention frame 9 on one side of the glue storage groove 19, thereby avoiding the pollution risk of the glue to the display panel 4 on the circuit board 3, and in the process of inserting the upper mold shell 1 into the lower mold shell 2, by setting the guide column 14 and the positioning cylinder 8, when assembling the upper mold shell 1 and the lower mold shell 2, the guide column 14 slides along the positioning cylinder 8, which can play an accurate guiding role, ensuring the accurate alignment between the upper mold shell 1 and the lower mold shell 2, so that the corresponding mounting groove 10 and the mounting block 15, the clamping groove 11 and the clamping block 16 and other matching structures can be more smoothly assembled.
[0037] It should be noted that in this paper, relational terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between the entities or operations.
Claims
1. A data line with anti-glue-overflow structure, comprising an upper die shell (1) and a lower die shell (2), characterized in that: The upper mold shell (1) and the lower mold shell (2) are provided with a circuit board (3), the surface of the circuit board (3) is mounted with a display panel (4), and both ends of the circuit board (3) are mounted with a socket (5), the top of the lower mold shell (2) is provided with a mounting groove (10), the inner wall of the mounting groove (10) is provided with a lower flow groove (12) at the lower end, the side wall of the mounting groove (10) is provided with a glue discharging hole (13), the glue discharging hole (13) is communicated with the lower flow groove (12), and the lower end of the upper mold shell (1) is fixedly connected with a mounting block (15).
2. The data line with anti-overflow glue structure according to claim 1, characterized in that: The inner wall of the mounting groove (10) is provided with a clamping groove (11) on both sides, and the two sides of the mounting block (15) are provided with a clamping block (16), and the size of the clamping block (16) is matched with the size of the clamping groove (11).
3. The data line with anti-overflow glue structure according to claim 1, characterized in that: The number of the mounting groove (10) and the mounting block (15) is six, and six groups of the mounting groove (10) and the mounting block (15) are evenly arranged on the surfaces of the lower mold shell (2) and the upper mold shell (1).
4. The data line with anti-overflow glue structure according to claim 1, characterized in that: The inner wall of the lower mold shell (2) is fixedly connected with a positioning cylinder (8), the inner wall of the positioning cylinder (8) is slidably connected with a guide column (14), and the top of the guide column (14) is fixedly connected with the inner wall of the upper mold shell (1).
5. The data line with anti-overflow glue structure according to claim 1, characterized in that: The lower surface of the inner wall of the lower mold shell (2) is fixedly connected with a overflow preventing frame (9), and the overflow preventing frame (9) and the inner wall of the lower mold shell (2) form a glue storage groove (19).
6. The data line with anti-overflow glue structure according to claim 1, characterized in that: One side of the socket (5) is provided with a wire plug (6), and the top of the upper mold shell (1) is provided with a display window (18).
7. The data line with anti-overflow glue structure according to claim 1, characterized in that: Both sides of the circuit board (3) are provided with a fixing hole (7), and the fixing hole (7) is slidably connected with the surface of the guide column (14).