Multi-station carrying table for wafer surface defect detection

Abstract

The utility model belongs to the field of wafer surface defect detection, and particularly relates to a multi-station carrying table for wafer surface defect detection, which comprises a base, a turntable is mounted at the upper end of the base through a bearing, a dismounting mechanism is arranged on the turntable, and an equipment frame is fixedly mounted at the left part of the upper end of the base. Detection equipment is fixedly installed at the upper end of the equipment frame, a laser light emitter is fixedly connected to the lower end of the detection equipment, and a plurality of evenly-distributed fixing plates are fixedly connected to the lower end of the rotating disc. According to the utility model, the turntable, the stop block, the limiting block and other structures are additionally arranged on the base, so that a wafer can be mounted through a plurality of stations on the turntable in the use process, and then the limiting frame is driven by the elastic force of the spring I to extrude the outer side of the wafer so as to extrude and limit the wafer; therefore, the wafers can be sequentially moved to the lower part of the maintenance equipment for detection through the rotation of the turntable, and the detection efficiency can be effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer surface defect detection technology, specifically a multi-station stage for wafer surface defect detection. Background Technology

[0002] Silicon wafers, also known as silicon ingots, are processed from silicon ingots. Millions of transistors can be etched onto silicon wafers using specialized processes. According to patent authorization announcement number CN215493249U, a dual-station wafer defect inspection instrument is disclosed. This utility model discloses a dual-station wafer defect inspection instrument, including a base. A fixing block is fixedly installed at the top center of the base. A worktable is fixedly installed on the top of the fixing block. First placement stages are fixedly installed on both sides of the top of the worktable. Second placement stages, matching the first placement stages, are slidably arranged on both sides of the middle position of the worktable. Protective pads are provided on the top of both the first and second placement stages. This utility model uses a second rotating handle to drive a gear to rotate, thereby causing the first and second L-shaped moving rods on the rack to open to both sides, thus simultaneously moving the bottom laser emitter.

[0003] However, the existing inspection stage uses a dual-station inspection method during wafer inspection, which is inefficient, and the smooth surface of the wafer makes it difficult to handle after clamping. Therefore, improvements to the existing technology are needed. Utility Model Content

[0004] The purpose of this invention is to provide a multi-station stage for wafer surface defect detection, which solves the problems of low efficiency and inconvenience in handling wafers in dual-station detection.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a multi-station stage for wafer surface defect detection, comprising a base, a turntable mounted on the upper end of the base via bearings, a disassembly mechanism on the turntable, an equipment frame fixedly mounted on the upper left of the base, a detection device fixedly mounted on the upper end of the equipment frame, a laser emitter fixedly connected to the lower end of the detection device, multiple evenly distributed fixing plates fixedly connected to the lower end of the turntable, a guide frame fixedly connected to the outer side of the fixing plates, a limit frame slidably connected to the outer side of the guide frame, a spring provided on the outer side of the guide frame, and multiple evenly distributed stops fixedly connected to the upper end of the turntable.

[0006] Preferably, a motor is fixedly installed at the lower end of the base, and the output shaft of the motor is fixedly connected to the connecting shaft of the turntable, so that the motor can drive the turntable to rotate.

[0007] Preferably, one end of the spring is fixedly connected to the limiting frame, and the other end of the spring is fixedly connected to the guide frame. The spring can automatically reset the limiting frame through its elastic force.

[0008] Preferably, the limiting frame is slidably connected to the turntable, and a pull ring is fixedly connected to the outer side of the limiting frame, which can drive the limiting frame to move.

[0009] Preferably, the disassembly mechanism includes a hinge frame, and multiple pairs of evenly distributed hinge frames are fixedly connected to the upper end of the turntable. Each pair of hinge frames is hinged together with a support frame. A pressing cover is fixedly connected to the outside of the support frame. A second spring is provided inside the pressing cover. A limit ring is slidably connected to the lower outer part of the second spring. The support frame is slidably connected to the turntable, and the pressing cover can drive the support frame to deflect.

[0010] Preferably, the limiting ring is fixedly connected to the turntable, one end of the second spring is fixedly connected to the pressing cover, and the other end of the second spring is fixedly connected to the turntable. The second spring can support the pressing cover with its elastic force.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] 1. This utility model adds a turntable, a stop block, and a limiting block to the base. During use, the wafer can be installed through multiple stations on the turntable. Then, the spring force drives the limiting frame to squeeze and limit the wafer on the outside. The wafer can be moved to the bottom of the inspection equipment for inspection by rotating the turntable, which can effectively improve the inspection efficiency.

[0013] 2. This utility model adds a pressing cover, a hinge frame and a support frame to the turntable. During use, the pressing cover can drive the support frame to deflect. When the end of the support frame away from the pressing cover deflects upward, it can support the wafer inside the turntable, making the wafer easier to disassemble. Attached Figure Description

[0014] Figure 1 This is a perspective view of the overall structure of this utility model;

[0015] Figure 2 For the present utility model Figure 1 Local structural magnification Figure 1 ;

[0016] Figure 3 For the present utility model Figure 1 Local structural magnification Figure 2 ;

[0017] Figure 4 For the present utility model Figure 3 A three-dimensional enlarged view of the limit frame;

[0018] Figure 5 For the present utility model Figure 2 Enlarged view of the A-section structure;

[0019] Figure 6 For the present utility model Figure 5 A 3D magnified view of the support frame.

[0020] In the diagram: 1. Base; 2. Turntable; 3. Disassembly mechanism; 4. Motor; 5. Equipment frame; 6. Testing equipment; 7. Laser emitter; 8. Fixing plate; 9. Guide frame; 10. Limiting frame; 11. Spring 1; 12. Pull ring; 13. Stop block; 31. Hinge frame; 32. Support frame; 33. Pressing cover; 34. Limiting ring; 35. Spring 2. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 A multi-station stage for wafer surface defect detection includes a base 1, a turntable 2 mounted on the upper end of the base 1 via bearings, a disassembly mechanism 3 on the turntable 2, an equipment frame 5 fixedly mounted on the upper left of the base 1, a detection device 6 fixedly mounted on the upper end of the equipment frame 5, a laser emitter 7 fixedly connected to the lower end of the detection device 6, multiple evenly distributed fixing plates 8 fixedly connected to the lower end of the turntable 2, a guide frame 9 fixedly connected to the outer side of the fixing plates 8, a limit frame 10 slidably connected to the outer side of the guide frame 9, a spring 11 provided on the outer side of the guide frame 9, and multiple evenly distributed stops 13 fixedly connected to the upper end of the turntable 2.

[0023] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4A motor 4 is fixedly installed at the lower end of the base 1. The output shaft of the motor 4 is fixedly connected to the connecting shaft of the turntable 2. The motor 4 can drive the turntable 2 to rotate. One end of the spring 11 is fixedly connected to the limit frame 10, and the other end of the spring 11 is fixedly connected to the guide frame 9. The spring 11 can drive the limit frame 10 to automatically reset through its elastic force. The limit frame 10 is slidably connected to the turntable 2. A pull ring 12 is fixedly connected to the outside of the limit frame 10. The pull ring 12 can drive the limit frame 10 to move.

[0024] Please see Figure 1 , Figure 3 , Figure 5 , Figure 6 The disassembly mechanism 3 includes a hinge frame 31. Multiple pairs of evenly distributed hinge frames 31 are fixedly connected to the upper end of the turntable 2. Each pair of hinge frames 31 is hinged together with a support frame 32. A pressing cover 33 is fixedly connected to the outside of the support frame 32. A second spring 35 is provided inside the pressing cover 33. A limit ring 34 is slidably connected to the lower outer part of the second spring 35. The support frame 32 is slidably connected to the turntable 2. The pressing cover 33 can drive the support frame 32 to deflect. The limit ring 34 is fixedly connected to the turntable 2. One end of the second spring 35 is fixedly connected to the pressing cover 33, and the other end of the second spring 35 is fixedly connected to the turntable 2. The second spring 35 can support the pressing cover 33 with its elastic force.

[0025] The specific implementation process of this utility model is as follows: When in use, pull the pull ring 12, the pull ring 12 drives the limit frame 10 to move and compress the spring 11. Then, place the wafer in the groove of the turntable 2. After placing it in, release the pull ring 12, the spring 11 returns to its original position, and the spring 11 can use its elasticity to drive the limit frame 10 to press against the outside of the wafer, thus completing the clamping of the wafer. Then, start the motor 4, the motor 4 drives the turntable 2 to rotate. During the rotation of the turntable 2, the laser emitter 7 and the work position in front of the operator can be adjusted. After adjustment, the laser emitter 7 can detect the wafer, and the operator can clamp the wafer at the same time.

[0026] When it is necessary to disassemble the wafer, push the pressing cover 33 downward. The pressing cover 33 drives the support frame 32 to deflect and compress the spring 35. During the deflection of the support frame 32, one end of the wafer can be lifted up, making the wafer easier to pick up.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-station stage for wafer surface defect inspection, comprising a base (1), characterized in that: A turntable (2) is mounted on the upper end of the base (1) via a bearing. A disassembly mechanism (3) is provided on the turntable (2). An equipment rack (5) is fixedly mounted on the upper left side of the base (1). A detection device (6) is fixedly mounted on the upper end of the equipment rack (5). A laser emitter (7) is fixedly connected to the lower end of the detection device (6). A plurality of evenly distributed fixed plates (8) are fixedly connected to the lower end of the turntable (2). A guide frame (9) is fixedly connected to the outer side of the fixed plate (8). A limit frame (10) is slidably connected to the outer side of the guide frame (9). A spring (11) is provided on the outer side of the guide frame (9). A plurality of evenly distributed stops (13) are fixedly connected to the upper end of the turntable (2).

2. The multi-station stage for wafer surface defect detection according to claim 1, characterized in that: A motor (4) is fixedly installed at the lower end of the base (1), and the output shaft of the motor (4) is fixedly connected to the connecting shaft of the turntable (2).

3. The multi-station stage for wafer surface defect detection according to claim 1, characterized in that: One end of the spring (11) is fixedly connected to the limiting frame (10), and the other end of the spring (11) is fixedly connected to the guide frame (9).

4. The multi-station stage for wafer surface defect detection according to claim 1, characterized in that: The limiting frame (10) is slidably connected to the turntable (2), and a pull ring (12) is fixedly connected to the outer side of the limiting frame (10).

5. The multi-station stage for wafer surface defect detection according to claim 1, characterized in that: The disassembly mechanism (3) includes a hinge frame (31). Multiple pairs of evenly distributed hinge frames (31) are fixedly connected to the upper end of the turntable (2). Each pair of hinge frames (31) is hinged together with a support frame (32). A pressing cover (33) is fixedly connected to the outside of the support frame (32). A second spring (35) is provided inside the pressing cover (33). A limit ring (34) is slidably connected to the lower outer part of the second spring (35). The support frame (32) is slidably connected to the turntable (2).

6. A multi-station stage for wafer surface defect detection according to claim 5, characterized in that: The limiting ring (34) is fixedly connected to the turntable (2), one end of the second spring (35) is fixedly connected to the pressing cover (33), and the other end of the second spring (35) is fixedly connected to the turntable (2).

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